市场调查报告书
商品编码
1513724
全球第三代半导体产业发展及主要企业产品策略Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies |
宽能带隙化合物半导体也称为第三代半导体材料,具有耐高压、耐高温、高频工作等优异特性。近年来,随着净零排放的趋势,世界各国都开始关注第三代半导体的重要性,例如降低功耗、提高能源效率。第三代半导体在提高能源效率方面的优势引起全世界的关注。虽然欧洲、美国和日本公司是第三代半导体产品和应用市场的领导者,但中国和韩国在该领域崛起。
本报告分析了全球各地(欧洲、美国、东亚(包括日本、韩国、中国))第三代半导体产业的发展趋势,以及调查全球各大公司在该领域的发展策略。
Wide-bandgap compound semiconductors, also known as third-generation semiconductor materials, possess excellent characteristics such as high voltage resistance, high-temperature tolerance, and high-frequency operation. In recent years, with the trend toward net-zero emissions, countries around the world have noticed the importance of third-generation semiconductors in reducing power consumption and improving energy efficiency. The advantages of third-generation semiconductors in enhancing energy efficiency have garnered global attention. European, US and Japanese companies are the leaders in the third-generation semiconductor products and applications market, while China and South Korea are emerging in this field. This report provides an overview of the development trends in the third-generation semiconductor industry in Europe, the US, and East Asia - including Japan, Korea, and China - and further explores the deployment strategies of leading companies in this arena worldwide.