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热界面材料市场:2023-2028 年全球产业趋势、份额、规模、成长、机会与预测Thermal Interface Materials Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 |
2022年全球热界面材料市场规模达32亿美元。展望未来,IMARC集团预计到2028年市场规模将达到55亿美元,2023-2028年复合年增长率(CAGR)为9.4%。对高效热管理解决方案的需求不断增长、新的 TIM 配方和技术的开发、对电子设备的需求不断增长、电子元件的小型化以及半导体技术的快速进步是推动市场发展的一些因素。
热界面材料 (TIM) 对于在各种电子设备的两个表面之间有效传递热量至关重要。它们的主要功能是填充微处理器、功率电晶体、LED 模组以及散热器或散热器等组件之间的间隙和气穴,确保最大程度的散热。它们被设计成具有高导热性和低热阻,以促进热传递。它们有不同的形式,包括导热油脂、导热垫、相变材料和黏合剂。每种类型的 TIM 都有独特的属性和应用,可满足特定的要求。 TIM 的重要性在于其降低热阻和防止过热的能力,过热会对电子设备的性能、可靠性和使用寿命产生负面影响。透过促进高效散热,TIM 有助于保持最佳工作温度、防止热节流并增强整体系统效能。
全球市场主要由智慧型手机、笔记型电脑和汽车电子等电子设备的使用不断增长所推动。与此一致的是,半导体技术的快速进步,包括更高的功率密度和增加的组件整合度,对市场做出了重大贡献。此外,电动车产量的增加需要有效的热管理来处理电池、电力电子设备和马达产生的热量,这对市场产生了积极影响。除此之外,不断成长的资料中心基础设施正在刺激市场。此外,提高电子设备能源效率的需求不断增长,加速了产品的采用,因为它们有助于防止过热、降低功耗并提高整体能源效率。此外,不断增加的研发力度导致了新型 TIM 配方的开发,这些配方具有更高的导热性、可靠性和易用性,为市场提供了许多机会。此外,汽车和航空航太等各行业的监管标准和准则要求有效的热管理以确保安全性和可靠性,从而促进市场成长。
消费性电子产业显着成长
消费性电子产业的大幅成长对市场产生了有利的影响。消费性电子产业涵盖广泛的设备,包括智慧型手机、平板电脑、笔记型电脑、游戏机、智慧家居设备和穿戴式科技。随着该产业的扩张,对 TIM 的需求也随之增加。消费性电子设备变得越来越紧凑、功能强大且节能。然而,这些进步也会在设备内产生更多热量。 TIM 在有效散发热量、确保电子元件的正常运作和使用寿命方面发挥着至关重要的作用。此外,消费者对设备性能和可靠性也有了更高的期望。过热会降低效能、系统故障甚至安全隐忧。因此,製造商优先考虑使用 TIM 进行有效热管理,以满足消费者对高效冷却解决方案的需求。此外,新型创新消费性电子设备的推出不断推动对先进 TIM 配方的需求,以提高导热性、可靠性和易用性。消费性电子产业的持续成长和创新对市场做出了巨大贡献。
提高对热相关问题的认识
人们越来越意识到过热对设备性能和使用寿命的不利影响,这正在加强市场。随着技术的进步和设备变得更加紧凑和强大,热量管理变得至关重要。与热相关的问题会降低效能、系统故障,甚至安全隐忧。人们对这些问题的认识不断增强,促使製造商、工程师和消费者优先考虑使用 TIM 进行有效的热管理。业界专业人士越来越认识到选择合适的 TIM 来优化散热并确保电子元件可靠运作的重要性。此外,消费者越来越了解热对设备性能和使用寿命的影响。他们寻求能够承受苛刻任务而不会过热或经历热节流的电子设备。因此,设备製造商整合了高品质的 TIM,以增强传热并保持最佳工作温度,从而提高消费者满意度和产品可靠性。人们对热相关议题的认识不断提高,以及对高效、可靠的电子设备的渴望,推动了消费性电子、汽车、电信和资料中心等各行业对 TIM 的采用和需求。
高效能运算的需求不断增长
对高效能运算 (HPC) 不断增长的需求正在培育市场。人工智慧、机器学习、资料分析和科学模拟等 HPC 应用程式需要强大的处理器和先进的硬体配置,从而产生大量热量。高效的热管理对于 HPC 系统保持最佳性能并防止过热至关重要。 TIM 促进高效能处理器、显示卡、其他元件和散热器或冷却解决方案之间的热传递。随着金融、医疗保健、研究和娱乐等行业对 HPC 的需求持续增长,对先进 TIM 的需求也在增加。这些材料必须具有高导热性、低热阻和可靠性,以满足 HPC 应用的需求。此外,HPC 技术的不断进步,例如更强大的处理器和 GPU 的开发,促进了对能够处理更高热负载并提供高效热管理的先进 TIM 配方的需求。对高效能运算不断增长的需求以及 TIM 在确保热效率方面的关键作用是推动市场发展的关键因素。
IMARC Group 提供了全球热界面材料市场报告各细分市场主要趋势的分析,以及 2023-2028 年全球、区域和国家层面的预测。我们的报告根据产品类型和应用对市场进行了分类。
胶带和薄膜
弹性垫
润滑脂和黏合剂
相变材料
金属基材料
其他的
润滑脂和黏合剂主导市场
该报告根据产品类型对市场进行了详细的细分和分析。这包括胶带和薄膜、弹性垫、油脂和黏合剂、相变材料、金属基材料等。根据该报告,润滑脂和黏合剂代表了最大的部分。
润滑脂和黏合剂因其导热性、易于使用以及填充组件之间的间隙和空隙的能力而广泛应用于各个行业。它们通常用于电子设备中,以促进组件和散热器之间的热传递,确保有效的热管理并防止过热。
全球电动车生产率的大幅提高是推动润滑脂和黏合剂需求的重要因素。电动车的电池、电力电子设备和马达产生大量热量。润滑脂和黏合剂可提供有效的导热性,并有助于散热这些组件,从而有助于提高整体性能和使用寿命。
电信
电脑
医疗设备
工业机械
耐久性消费品
汽车电子
其他的
计算机占最大市场份额
报告还提供了基于应用程式的详细市场细分和分析。这包括电信、电脑、医疗设备、工业机械、耐用消费品、汽车电子等。报告称,计算机占据了最大的市场份额。
随着电脑技术的不断进步以及对高效能运算设备的需求不断增加,对有效热管理解决方案的需求变得至关重要。电脑经常使用热界面材料来增强散热,提高处理器、显示卡、记忆体模组等组件的整体热性能。这些材料有助于有效地将这些组件产生的热量传递到散热器或其他冷却机制,防止过热并确保最佳运作。
随着电脑系统变得更加强大和紧凑,散热挑战也随之加剧。电子元件的小型化导致更高的功率密度和增加的热量产生。这就需要使用先进的热界面材料,以在不同条件下提供卓越的导热性、低热阻和可靠的性能。此外,对游戏电脑、资料中心和云端运算基础设施不断增长的需求进一步推动了电脑领域热界面材料的采用。保持稳定的工作温度和提高能源效率的需求推动了市场的成长,促使製造商开发创新的热界面材料,以满足电脑产业不断变化的需求。
北美洲
美国
加拿大
亚太地区
中国
日本
印度
韩国
澳洲
印尼
其他的
欧洲
德国
法国
英国
义大利
西班牙
俄罗斯
其他的
拉丁美洲
巴西
墨西哥
其他的
中东和非洲
亚太地区表现出明显的主导地位,占据最大的热界面材料市场份额
该报告还对所有主要区域市场进行了全面分析,其中包括北美(美国和加拿大);亚太地区(中国、日本、印度、韩国、澳洲、印尼等);欧洲(德国、法国、英国、义大利、西班牙、俄罗斯等);拉丁美洲(巴西、墨西哥等);以及中东和非洲。
由于快速的工业化、技术进步以及主要电子和半导体製造中心的存在,亚太地区是热界面材料市场的主要市场。亚太地区是电子设备和组件的几个主要国家、主要生产商和消费者的所在地。该地区在消费性电子、汽车和电信领域的主导地位推动了对有效热管理解决方案的需求,以确保电子系统的最佳性能和可靠性。
此外,亚太地区城市化趋势的不断发展、可支配收入的增长以及中产阶级人口的不断扩大,促使智慧型手机、笔记型电脑和游戏机等电子设备的使用量不断增加。这反过来又刺激了对热界面材料的需求,以解决与这些设备相关的热挑战。此外,该地区日益关注能源效率、环境永续性以及有关电子产品热管理的法规,进一步推动了市场的发展。亚太地区的製造商正在投资研发活动,开发具有高导热率、低热阻和环保特性的先进热界面材料。
顶级热界面材料公司透过创新解决方案和广泛的研发工作在推动市场发展方面发挥着至关重要的作用。这些公司处于开发先进热界面材料的前沿,以满足各行业不断变化的需求。他们在研发方面投入巨资,以提高产品的导热性、耐用性和可靠性。他们与製造商和客户密切合作,了解他们的需求并针对热管理挑战开发客製化解决方案。此外,这些公司专注于扩展其产品组合,以提供适合不同应用和行业的各种热界面材料。他们也强调协作和策略伙伴关係,以利用互补的技术和专业知识,使他们能够提供全面的热管理解决方案。透过不断的创新、优质的产品和强大的客户关係,这些顶级热界面材料公司透过制定行业标准并满足各行业对高效热管理解决方案不断增长的需求来推动市场发展。
3M公司
陶氏公司
汉高股份公司
霍尼韦尔国际公司
铟泰公司
北川工业美国公司
莱尔德科技公司
迈图高性能材料公司
派克汉尼汾公司
扎尔曼科技有限公司
2021 年 7 月,陶氏推出 DOWSIL TC-4551 CV 填缝剂、DOWSIL TC-2035 CV 黏合剂和 DOWSIL TC-4060 GB250 热凝胶。这些硅基热界面材料针对电动和混合动力车的电子应用。
2022年4月,信越化学株式会社推出了专为电动车应用而设计的新型热界面硅橡胶板。
2022年5月,Arieca与ROHM Co., Ltd.达成联合研究协议,为电动车市场开发下一代热界面材料。
The global thermal interface materials market size reached US$ 3.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 5.5 Billion by 2028, exhibiting a growth rate (CAGR) of 9.4% during 2023-2028. The increasing demand for efficient thermal management solutions, the development of new TIM formulations and technologies, the rising demand for electronic devices, the miniaturization of electronic components, and the rapid technological advancements in semiconductor technology are some factors propelling the market.
Thermal interface materials (TIMs) are critical in efficiently transferring heat between two surfaces in various electronic devices. Their primary function is filling gaps and air pockets between components, such as microprocessors, power transistors, LED modules, and heat sinks or spreaders, ensuring maximum heat dissipation. They are designed to have high thermal conductivity and low thermal resistance to facilitate heat transfer. They are available in different forms, including thermal greases, pads, phase change materials, and adhesives. Each type of TIM has unique properties and applications, catering to specific requirements. The importance of TIMs lies in their ability to reduce thermal resistance and prevent overheating, which can negatively impact electronic devices, performance, reliability, and lifespan. By facilitating efficient heat dissipation, TIMs help maintain optimal operating temperatures, prevent thermal throttling, and enhance overall system performance.
The global market is majorly driven by the growing use of electronic devices, such as smartphones, laptops, and automotive electronics. In line with this, the rapid advancements in semiconductor technology, including higher power densities and increased component integration, are significantly contributing to the market. Furthermore, the increasing production of electric vehicles requires effective thermal management to handle the heat generated by batteries, power electronics, and electric motors, positively influencing the market. Apart from this, the rising data center infrastructure is catalyzing the market. Moreover, the escalating need to improve energy efficiency in electronic devices accelerates product adoption, as they help prevent overheating, reduce power consumption, and enhance overall energy efficiency. Besides, the increasing research and development efforts led to the development of new TIM formulations with improved thermal conductivity, reliability, and ease of application, offering numerous opportunities for the market. Additionally, the regulatory standards and guidelines in various industries, such as automotive and aerospace, mandate effective thermal management to ensure safety and reliability, contributing to the market growth.
Significant growth in the consumer electronics industry
Considerable growth in the consumer electronics industry is favorably impacting the market. The consumer electronics sector encompasses a wide range of devices, including smartphones, tablets, laptops, gaming consoles, smart home devices, and wearable technology. As this industry expands, the demand for TIMs rises in parallel. Consumer electronic devices are becoming increasingly compact, powerful, and energy-efficient. However, these advancements also generate more heat within the devices. TIMs play a crucial role in effectively dissipating this heat, ensuring the proper functioning and longevity of the electronic components. Moreover, consumers have higher expectations for device performance and reliability. Overheating can reduce performance, system failures, and even safety hazards. Therefore, manufacturers prioritize effective thermal management using TIMs to meet consumer demands for efficient cooling solutions. Additionally, the introduction of new and innovative consumer electronic devices constantly drives the need for advanced TIM formulations that offer improved thermal conductivity, reliability, and ease of application. The continuous growth and innovation in the consumer electronics industry significantly contribute to the market.
Increasing awareness regarding heat-related issues
The increasing awareness regarding the adverse effects of overheating on device performance and lifespan is strengthening the market. As technology advances and devices become more compact and powerful, managing heat becomes critical. Heat-related issues can reduce performance, system failures, and even safety hazards. The growing awareness of these issues has prompted manufacturers, engineers, and consumers to prioritize effective thermal management using TIMs. Industry professionals increasingly recognize the importance of selecting appropriate TIMs to optimize heat dissipation and ensure the reliable operation of electronic components. Furthermore, consumers are becoming more informed about the impact of heat on device performance and lifespan. They seek electronic devices that can withstand demanding tasks without overheating or experiencing thermal throttling. As a result, device manufacturers integrate high-quality TIMs to enhance heat transfer and maintain optimal operating temperatures, improving consumer satisfaction and product reliability. The increasing awareness of heat-related issues and the desire for efficient and reliable electronic devices drive the adoption and demand for TIMs in various industries, including consumer electronics, automotive, telecommunications, and data centers.
Growing demand for high-performance computing
The growing demand for high-performance computing (HPC) is fostering the market. HPC applications, such as artificial intelligence, machine learning, data analytics, and scientific simulations, require powerful processors and advanced hardware configurations that generate substantial heat. Efficient thermal management is crucial in HPC systems to maintain optimal performance and prevent overheating. TIMs facilitate heat transfer between high-performance processors, graphics cards, other components, and heat sinks or cooling solutions. As the demand for HPC continues to rise across industries, such as finance, healthcare, research, and entertainment, the need for advanced TIMs increases. These materials must have high thermal conductivity, low thermal resistance, and reliability to meet the demands of HPC applications. Additionally, the ongoing advancements in HPC technologies, such as the development of more powerful processors and GPUs, catalyze the need for advanced TIM formulations that can handle higher heat loads and provide efficient thermal management. The growing demand for high-performance computing and the critical role of TIMs in ensuring thermal efficiency is a key factor propelling the market.
IMARC Group provides an analysis of the key trends in each segment of the global thermal interface materials market report, along with forecasts at the global, regional and country levels from 2023-2028. Our report has categorized the market based on product type and application.
Tapes and Films
Elastomeric Pads
Greases and Adhesives
Phase Change Materials
Metal Based Materials
Others
Greases and adhesives dominate the market
The report has provided a detailed breakup and analysis of the market based on product type. This includes tapes and films, elastomeric pads, greases and adhesives, phase change materials, metal based materials, and others. According to the report, greases and adhesives represented the largest segment.
Greases and adhesives are widely used in various industries for their thermal conductivity, ease of application, and ability to fill gaps and voids between components. They are commonly used in electronic devices to facilitate heat transfer between components and heat sinks, ensuring efficient thermal management and preventing overheating.
A considerable rise in electric vehicle production rates across the globe is a significant factor driving the demand for greases and adhesives. Electric vehicles generate substantial heat from batteries, power electronics, and motors. Greases and adhesives provide effective thermal conductivity and help dissipate heat in these components, contributing to overall performance and longevity.
Telecom
Computer
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics
Others
Computer holds the largest share of the market
A detailed breakup and analysis of the market based on the application have also been provided in the report. This includes telecom, computer, medical devices, industrial machinery, consumer durables, automotive electronics, and others. According to the report, computer accounted for the largest market share.
The need for effective thermal management solutions has become crucial with the continuous advancement in computer technology and the increasing demand for high-performance computing devices. Computers often use thermal interface materials to enhance heat dissipation and improve the overall thermal performance of components such as processors, graphics cards, and memory modules. These materials help to efficiently transfer heat generated by these components to heat sinks or other cooling mechanisms, preventing overheating and ensuring optimal operation.
As computer systems become more powerful and compact, the thermal challenges intensify. The miniaturization of electronic components leads to higher power densities and increased heat generation. This necessitates using advanced thermal interface materials that offer superior thermal conductivity, low thermal resistance, and reliable performance under varying conditions. Moreover, the growing demand for gaming PCs, data centers, and cloud computing infrastructure further drives the adoption of thermal interface materials in the computer segment. The need to maintain stable operating temperatures and improve energy efficiency fuels the market growth, prompting manufacturers to develop innovative thermal interface materials that can meet the evolving demands of the computer industry.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Asia Pacific exhibits a clear dominance, accounting for the largest thermal interface materials market share
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa.
The Asia Pacific region is a major market for thermal interface materials market due to rapid industrialization, technological advancements, and the presence of major electronics and semiconductor manufacturing hubs. Asia Pacific is home to several key countries, major producers, and consumers of electronic devices and components. The region's dominance in the consumer electronics, automotive, and telecommunications sectors drives the need for effective thermal management solutions to ensure optimal performance and reliability of electronic systems.
Furthermore, the rising trend of urbanization, growing disposable incomes, and expanding middle-class population in the Asia Pacific region contribute to the increased adoption of electronic devices such as smartphones, laptops, and gaming consoles. This, in turn, fuels the demand for thermal interface materials to address the thermal challenges associated with these devices. Moreover, the region's increasing focus on energy efficiency, environmental sustainability, and regulations regarding thermal management in electronics further catalyzes the market. Manufacturers in the Asia Pacific are investing in research and development activities to develop advanced thermal interface materials that offer high thermal conductivity, low thermal resistance, and environmental friendliness.
Top thermal interface materials companies are crucial in catalyzing the market through innovative solutions and extensive research and development efforts. These companies are at the forefront of developing advanced thermal interface materials that cater to the evolving needs of various industries. They invest heavily in research and development to enhance their products' thermal conductivity, durability, and reliability. They work closely with manufacturers and customers to understand their requirements and develop tailored solutions for thermal management challenges. Additionally, these companies focus on expanding their product portfolios to offer a wide range of thermal interface materials suitable for different applications and industries. They also emphasize collaboration and strategic partnerships to leverage complementary technologies and expertise, enabling them to deliver comprehensive thermal management solutions. Through their continuous innovation, quality products, and strong customer relationships, these top thermal interface materials companies are propelling the market by setting industry standards and meeting the growing demand for efficient thermal management solutions across various sectors.
3M Company
Dow Inc.
Henkel AG & Co. KGaA
Honeywell International Inc.
Indium Corporation
Kitagawa Industries America Inc.
Laird Technologies Inc.
Momentive Performance Materials Inc.
Parker-Hannifin Corporation
Zalman Tech Co. Ltd.
In July 2021, Dow launched DOWSIL TC-4551 CV Gap Filler, DOWSIL TC-2035 CV Adhesive, and DOWSIL TC-4060 GB250 Thermal Gel. These silicone-based thermal interface materials are aimed at electronics applications for electric and hybrid-electric vehicles.
In April 2022, Shin-Etsu Chemical Co., Ltd. launched a new thermal interface silicone rubber sheet designed for applications in electric vehicles.
In May 2022, Arieca partnered with ROHM Co., Ltd. for a joint research agreement to develop next-generation thermal interface materials for the EV market.