市场调查报告书
商品编码
1379196
2023-2028 年按类型(电容器、电阻器、光伏电池、加热器等)、最终用户(汽车、医疗保健、消费性电子产品、基础设施等)和地区分類的厚膜装置市场报告Thick Film Devices Market Report by Type (Capacitors, Resistors, Photovoltaic cells, Heaters, and Others), End-user (Automotive, Healthcare, Consumer Electronics, Infrastructure, and Others), and Region 2023-2028 |
2022年全球厚膜装置市场规模达1,196.1亿美元。展望未来, IMARC Group预计到2028年市场规模将达到2,495.2亿美元,2022-2028年复合年增长率(CAGR)为13.0%。对薄膜装置的需求不断增加,以促进与多种基材的高相容性,对消费性电子产品的需求不断增长,以及电子元件小型化趋势的转变,是推动市场的一些关键因素。
厚膜元件是指在陶瓷或玻璃基板上沉积厚厚的电阻、导电或介电材料层而製造的电子元件。厚膜沉积技术有助于创建复杂的电子电路和元件。厚膜装置具有相对较厚的材料层,可靠性高,材料表现出良好的附着力和对环境因素的抵抗力。它们具有良好的导电性、介电常数、导热性、TCR(电阻温度係数)以及在较宽温度范围内的稳定性。这些特性可实现多个电路元件的整合和更高的功率处理能力。此外,它们可高度客製化,以满足特定的电气和机械要求,并与各种基材材料相容。因此,它们广泛应用于电子电路、混合微电子和积体电路製造应用。
全球市场的主要推动力是对薄膜装置的需求不断增长,以促进电气和电子行业中多种基材的高相容性。这可以归因于消费性电子产品和工业电子产品的需求不断增长。与此一致的是,电子元件小型化趋势的转变导致需要在单一基板上整合多种功能,这正在推动市场的发展。此外,在众多工业应用中需要结合类比和数位电路的混合电路的日益普及正在推动全球范围内的产品需求。汽车产量的快速扩张以及汽车电子整合度的不断提高进一步推动了市场。除此之外,生物感测器、穿戴式装置、起搏器和植入式装置等各种医疗设备製造中产品的快速利用正在创造利润丰厚的市场机会。此外,製造流程、材料科学和设计技术的不断进步导致高性能、坚固、耐腐蚀产品的出现,为市场提供了动力。除此之外,工业自动化系统的日益普及导致薄膜装置在控制、感测和监控应用中的使用不断增加,这反过来又推动了市场的发展。促进市场发展的其他一些因素包括物联网应用和设备的使用不断增加、电信业的大幅成长以及政府鼓励国内製造业的有利措施。
The global thick film devices market size reached US$ 119.61 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 249.52 Billion by 2028, exhibiting a growth rate (CAGR) of 13.0% during 2022-2028. The augmenting need for film devices facilitating high compatibility with multiple substrates, the accelerating demand for consumer electronics, and the shifting trend towards miniaturization of electronic components represent some of the key factors driving the market.
Thick film devices refer to electronic components that are fabricated through a deposition of a thick layer of resistive, conductive, or dielectric material onto a ceramic or glass substrate. The thick film deposition technique assists in the creation of complex electronic circuits and components. Thick film devices have a relatively thick layer of material with high reliability, with materials that exhibit good adhesion and resistance to environmental factors. They are characterized by good electrical conductivity, dielectric constant, thermal conductivity, TCR (Temperature Coefficient of Resistance) and stability over a wide temperature range. These properties enable the integration of multiple circuit elements and higher power handling capabilities. Additionally, they are highly customizable to meet specific electrical and mechanical requirements and are compatible with a wide range of substrate materials. As a result, they are extensively used in electronic circuits, hybrid microelectronics, and integrated circuit manufacturing applications.
The global market is primarily driven by the augmenting need for film devices facilitating high compatibility with multiple substrates in the electrical and electronics industry. This can be attributed to the accelerating demand for consumer electronics as well as industrial electronics. In line with this, the shifting trend towards miniaturization of electronic components resulting in the need for integration of multiple functions on a single substrate is fueling the market. Moreover, the rising adoption of hybrid circuits requiring a combination of analog and digital circuitry in numerous industrial applications is propelling the product demand on the global level. The market is further driven by the rapid expansion of automotive production, coupled with the rising integration of electronics in vehicles. Apart from this, rapid product utilization in the manufacturing of various medical devices such as biosensors, wearable devices, pacemakers, and implantable devices are creating lucrative opportunities in the market. Furthermore, continual technological advancements in the manufacturing processes, material science and design techniques leading to the advent of high-performance, robust, corrosion-resistant product variants are providing an impetus to the market. In addition to this, the growing adoption of industrial automation systems is resulting in the increasing usage of thin film devices in control, sensing, and monitoring applications, which, in turn, is providing a boost to the market. Some of the other factors contributing to the market include the increasing usage of IoT applications and devices, considerable growth in the telecommunications industry, and favorable government initiatives encouraging domestic manufacturing.
IMARC Group provides an analysis of the key trends in each segment of the global thick film devices market, along with forecasts at the global, regional, and country levels from 2023-2028. Our report has categorized the market based on type and end-user.
Capacitors
Resistors
Photovoltaic cells
Heaters
Others
The report has provided a detailed breakup and analysis of the thick film devices market based on the type. This includes capacitors, resistors, photovoltaic cells, heaters, and others. According to the report, capacitors represented the largest segment.
Automotive
Healthcare
Consumer Electronics
Infrastructure
Others
A detailed breakup and analysis of the thick film devices market based on the end-user has also been provided in the report. This includes automotive, healthcare, consumer electronics, infrastructure, and others. According to the report, automotive accounted for the largest market share.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for thick film devices. Some of the factors driving the Asia Pacific thick film devices market included considerable growth in the electrical and electronics industry, widespread adoption of smart devices, rising trend of device miniaturization, inflating disposable income levels, etc.
The report has also provided a comprehensive analysis of the competitive landscape in the global thick film devices market. The detailed profiles of all major companies have been provided. Some of the companies covered include Bourns Inc., Ferro Techniek BV, KOA Speer Electronics Inc. (KOA Corporation), Panasonic Corporation, Rohm Semiconductor GmbH, Samsung Electronics Co. Ltd., TE Connectivity Ltd, Thermo Heating Elements LLC, Vishay Intertechnology Inc., Watlow Electric Manufacturing Co., Wurth Elektronik GmbH & Co. KG., YAGEO Corp., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.