2024-2032 年按技术（孔技术、表面贴装技术、细间距技术）、应用（消费性电子、医疗、汽车、电信等）和地区分類的贴片机市场报告

2023年全球贴片机市场规模达63亿美元。展望未来， IMARC Group预计到2032年市场规模将达到98亿美元，2024-2032年复合年增长率（CAGR）为4.8%。对笔记型电脑和智慧型手机的需求不断增长、网路普及率不断提高以及消费性电子产业的扩张是推动市场的一些关键因素。

对笔记型电脑和智慧型手机的需求不断增长，促进了市场成长

对笔记型电脑和智慧型手机的需求不断增长是贴片机市场成长的重要推动力。笔记型电脑和智慧型手机是现代生活不可或缺的一部分，随着技术进步和连接变得更加重要，它们的受欢迎程度持续飙升。贴片机是一种拾取机器，用于将电子元件（例如积体电路 (IC)、电阻器、电容器和其他晶片）精确贴装到印刷电路板 (PCB) 上。这些机器在製造过程中发挥着至关重要的作用，可确保精确有效地放置元件，从而生产出高品质的电子设备。随着人们越来越依赖这些设备进行通讯、生产力、娱乐和资讯访问，对更先进、更强大的设备的需求不断增长。电子商务的扩张和数位平台的兴起也促进了笔记型电脑和智慧型手机需求的增加。为了满足不断增长的需求，笔记型电脑和智慧型手机製造商正在不断扩大生产能力。这反过来又推动了对贴片机的需求，将其作为将电子元件组装到 PCB 上的重要设备。贴片机可实现高速、自动化和精确的元件贴装，确保高效生产并满足电子设备的需求。

报告涵盖了市场结构、主要参与者的市场份额、参与者定位、最佳制胜策略、竞争仪表板和公司评估象限等竞争分析。此外，也提供了所有主要公司的详细资料。由于市场成长缓慢和退出障碍较高，市场结构较为分散，只有少数小型和大型参与者在该行业运作。由于市场成长温和、产品差异化和转换成本低、市场集中、资本投资高，贴片机产业新进者数量适中。

什么是贴片机？

晶片安装技术是各行业实现更高封装密度的实用解决方案。晶片安装最初是作为传统的通孔技术 (THT) 引入，现已发展为表面贴装技术 (SMT)，以及随后的细间距技术 (FPT)。如今，汽车、电信、医疗和电子等多个行业的製造商都依靠 SMT 和 THT 组合将晶片安装到基板上。表面贴装技术 (SMT) 的出现彻底改变了晶片安装工艺，允许更小的元件尺寸并提高自动化程度。 SMT 涉及将组件直接安装到 PCB 表面，无需钻孔。该技术可实现更高的封装密度并改善电气性能。透过 SMT，製造商可以实现电子设备内更大的小型化并优化空间利用率。细间距技术 (FPT) 代表了晶片安装的进一步进步。它指的是安装具有极小间距尺寸的组件的能力，从而允许它们之间的间距更紧密。 FPT 对于生产高密度电子设备至关重要，其中最小化组件之间的距离对于实现增强的性能和功能至关重要。

穿戴式科技的显着成长促进了市场成长

穿戴式科技的成长是贴片机市场扩张的重要推手。近年来，智慧手錶、健身追踪器、扩增实境 (AR) 眼镜和智慧服装等穿戴式装置非常受欢迎。这些设备提供各种功能，从健康监测和健身追踪到通讯和娱乐。对穿戴式科技日益增长的需求推动了对先进晶片安装能力的需求。穿戴式装置通常结构紧凑，需要微型组件，包括积体电路、感测器和其他电子组件。贴片机对于将这些小型且复杂的组件组装到穿戴式装置的 PCB 上至关重要，以确保精确的放置和可靠的性能。小型化是可穿戴技术的一个重要方面，因为这些设备需要重量轻、不引人注目且佩戴舒适。贴片机使製造商能够透过将微小元件精确地放置到紧凑的 PCB 上来实现所需的小型化水平。此功能对于满足穿戴式装置的设计要求并为使用者提供无缝舒适的体验至关重要。穿戴式装置功能的不断增长也推动了对贴片机的需求。

穿戴式装置变得越来越复杂，融入了生物辨识感测器、无线连接、GPS 追踪和节能处理器等先进功能。这些复杂的功能需要整合多个电子元件，而贴片机可以有效处理这些电子元件。此外，物联网（IoT）生态系统的扩张与穿戴式科技的发展密切相关。穿戴式装置通常充当物联网网路中的资料收集点或介面装置。他们收集资料并将其传输到其他连接的设备或云端平台。贴片机能够生产可靠、高效的可穿戴设备，这些设备可以无缝整合到物联网网路中，从而促进物联网市场的整体成长。医疗保健产业是从穿戴式科技中受益匪浅的产业之一，其应用包括远端病患监控、健身和健康追踪以及药物依从性。近年来，对穿戴式健康监测设备的需求尤其激增。贴片机在组装精确健康监测所需的复杂组件方面发挥着至关重要的作用，从而能够生产可靠且高性能的可穿戴医疗设备。

贴片机市场趋势：

近年来，在笔记型电脑和智慧型手机需求不断增长、网路连线激增以及家用电子产品自动化等多种因素的推动下，消费性电子产业出现了显着增长。贴片机用于将半导体元件组装到消费性电子产品的印刷电路板 (PCB) 上，其整体需求正在大幅增长。笔记型电脑和智慧型手机的日益普及是贴片机需求增加的主要驱动力。这些设备已成为通讯、生产力和娱乐的重要工具，促使消费者升级到最新型号。因此，消费性电子产品製造商需要高效、精确的贴片机来组装为这些设备供电的复杂电路和组件。此外，物联网（IoT）和智慧家庭技术的广泛应用增加了对贴片机的需求。此外，随着家用电子产品的自动化和互连化，对紧凑、高效的晶片组和 PCB 的需求也随之增加。贴片机能够生产更小、更复杂的电子设备，确保无缝自动化和连接性。消费性电子产业的小型化趋势是推动贴片机需求的另一个因素。随着消费者需要更小、更便携的设备，製造商被迫在保持高性能的同时减少积体电路的尺寸。贴片机有助于将这些紧凑的电子元件组装到 PCB 上，从而能够生产时尚且功能强大的小工具和穿戴式装置。硬体开发商正在投资开发新技术，以满足对先进消费性电子产品不断增长的需求。这些创新旨在以相似的成本参数管理更多的电路和组件。贴片机将复杂的电子元件高效、准确地组装到 PCB 上，在此过程中发挥至关重要的作用。

本报告回答的关键问题

• 2023年全球贴片机市场规模有多大？
• 2024-2032年全球贴片机市场预计成长率为何？
• 推动全球贴片机市场的关键因素是什么？
• COVID-19 对全球贴片机市场有何影响？
• 基于技术的全球贴片机市场的细分情况如何？
• 根据应用，全球贴片机市场的细分如何？
• 全球贴片机市场的重点区域有哪些？
• 全球贴片机市场的主要参与者/公司有哪些？

目录

第一章：前言

第 2 章：范围与方法

• 研究目的
• 利害关係人
• 资料来源
  • 主要资源
  • 二手资料
• 市场预测
  • 自下而上的方法
  • 自上而下的方法
• 预测方法

第 3 章：执行摘要

第 4 章：简介

• 概述
• 主要行业趋势

第 5 章：全球贴片机市场

• 市场概况
• 市场业绩
• COVID-19 的影响
• 市场区隔：按技术
• 市场区隔：按应用
• 市场区隔：按地区
• 市场预测

第 6 章：市场区隔：依技术

• 孔技术
  • 市场走向
  • 市场预测
• 表面贴装技术
  • 市场走向
  • 市场预测
• 细间距技术
  • 市场走向
  • 市场预测

第 7 章：市场区隔：按应用

• 消费性电子产品
  • 市场走向
  • 市场预测
• 医疗的
  • 市场走向
  • 市场预测
• 汽车
  • 市场走向
  • 市场预测
• 电信
  • 市场走向
  • 市场预测
• 其他的
  • 市场走向
  • 市场预测

第 8 章：市场区隔：按地区

• 亚太地区
  • 市场走向
  • 市场预测
• 欧洲
  • 市场走向
  • 市场预测
• 北美洲
  • 市场走向
  • 市场预测
• 中东和非洲
  • 市场走向
  • 市场预测
• 拉丁美洲
  • 市场走向
  • 市场预测

第 9 章：SWOT 分析

• 概述
• 优势
• 弱点
• 机会
• 威胁

第 10 章：价值链分析

第 11 章：波特五力分析

• 概述
• 买家的议价能力
• 供应商的议价能力
• 竞争程度
• 新进入者的威胁
• 替代品的威胁

第 12 章：价格分析

第13章：竞争格局

• 市场结构
• 关键参与者
• 关键参与者简介
  • Hitachi
  • Samsung
  • Panasonic
  • Juki
  • ASM Pacific Technology
  • Canon
  • Essemtec
  • Ohashi Engineering
  • Nordson
  • Sony
  • Sun Electronic Industries Corporation
  • TOA

Abstract

The global chip mounter market size reached US$ 6.3 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 9.8 Billion by 2032, exhibiting a growth rate (CAGR) of 4.8% during 2024-2032. The increasing demand for laptops and smartphones, the rising internet penetration, and the expansion of the consumer electronics industry represent some of the key factors driving the market.

The Increasing Demand for Laptops and Smartphones Augmenting the Market Growth

The increasing demand for laptops and smartphones is a significant driver behind the growth of the chip mounter market. Laptops and smartphones are integral parts of modern life, and their popularity continues to soar as technology advances and connectivity becomes more essential. Chip mounter, a pick-and-place machine, is assembled to accurately place electronic components, such as integrated circuits (ICs), resistors, capacitors, and other chips, onto printed circuit boards (PCBs). These machines play a critical role in manufacturing by ensuring precise and efficient placement of components, enabling the production of high-quality electronic devices. As people increasingly depend on these devices for communication, productivity, entertainment, and access to information, the need for more advanced and capable devices continues to grow. The expansion of e-commerce and the rise of digital platforms have also contributed to the increased demand for laptops and smartphones. To meet the growing demand, manufacturers of laptops and smartphones are continually scaling up their production capacities. This, in turn, drives the demand for chip mounters as essential equipment for assembling electronic components onto PCBs. Chip mounters enable high-speed, automated, and precise component placement, ensuring efficient production and meeting the demand for electronic devices.

Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. The market structure is fragmented with a few number of small and large players operating in the industry due to moderate market growth and high exit barriers. The volume of new entrants is moderate in the chip mounter industry due to the moderate market growth, low product differentiation and switching costs, concentrated market, and high capital investment.

What is Chip Mounter?

The chip mounting technology is a practical solution for achieving higher packaging densities in various industries. Initially introduced as the conventional Through Hole Technology (THT), chip mounting has evolved into Surface Mount Technology (SMT) and, subsequently, Fine Pitch Technology (FPT). Today, manufacturers across multiple sectors, including automotive, telecommunications, medical, and electronics, rely on a combination of SMT and THT for mounting chips onto substrates. The advent of Surface Mount Technology (SMT) revolutionized the chip mounting process by allowing for smaller component sizes and increased automation. SMT involves mounting components directly onto the surface of a PCB, eliminating the need for drilled holes. This technique enables higher packaging densities and improved electrical performance. With SMT, manufacturers can achieve greater miniaturization and optimize space utilization within electronic devices. Fine Pitch Technology (FPT) represents a further advancement in chip mounting. It refers to the ability to mount components with extremely small pitch sizes, allowing for tighter spacing between them. FPT is crucial in producing high-density electronic devices, where minimizing the distance between components is essential for achieving enhanced performance and functionality.

Significant Growth in the Wearable Technology Augmenting the Market Growth

The growth in wearable technology is a significant driver behind the expansion of the chip mounter market. Wearable devices, such as smartwatches, fitness trackers, augmented reality (AR) glasses, and smart clothing, have gained immense popularity in recent years. These devices offer various functionalities, from health monitoring and fitness tracking to communication and entertainment. The increasing demand for wearable technology is fueling the need for advanced chip mounting capabilities. Wearable devices are typically compact and require miniaturized components, including integrated circuits, sensors, and other electronic components. Chip mounters are crucial in assembling these small and intricate components onto the wearable device's PCBs, ensuring precise placement and reliable performance. Miniaturization is a vital aspect of wearable technology, as these devices need to be lightweight, unobtrusive, and comfortable to wear. Chip mounters enable manufacturers to achieve the desired level of miniaturization by accurately placing tiny components onto compact PCBs. This capability is essential for meeting the design requirements of wearable devices and providing users with a seamless and comfortable experience. The growing functionalities of wearable devices also contribute to the demand for chip mounters.

Wearables are becoming increasingly sophisticated, incorporating advanced features such as biometric sensors, wireless connectivity, GPS tracking, and energy-efficient processors. These complex functionalities require integrating multiple electronic components, which chip mounters can efficiently handle. Furthermore, the expansion of the Internet of Things (IoT) ecosystem is closely linked to the growth of wearable technology. Wearable devices often serve as data collection points or interface devices within IoT networks. They gather and transmit data to other connected devices or cloud platforms. Chip mounters enable the production of reliable and efficient wearable devices that can seamlessly integrate into IoT networks, contributing to the overall growth of the IoT market. The healthcare sector is one industry that benefits significantly from wearable technology, with applications including remote patient monitoring, fitness and wellness tracking, and medication adherence. The demand for wearable health monitoring devices, in particular, has surged in recent years. Chip mounters play a vital role in assembling the intricate components required for accurate health monitoring, enabling the production of reliable and high-performance wearable healthcare devices.

Chip Mounter Market Trends:

The consumer electronics industry has witnessed significant growth in recent years, driven by several factors, such as the increasing demand for laptops and smartphones, the proliferation of internet connectivity, and the automation of household electronic goods. Chip mounters, utilized in assembling semiconductor components onto printed circuit boards (PCBs) in consumer electronics, are experiencing a considerable increase in overall demand. The rising popularity of laptops and smartphones is a primary driver behind the increased demand for chip mounters. These devices have become essential tools for communication, productivity, and entertainment, driving consumers to upgrade to the latest models. As a result, manufacturers of consumer electronics require efficient and precise chip mounters to assemble the intricate circuitry and components that power these devices. Additionally, the widespread utilization of the Internet of Things (IoT) and smart home technology has increased the demand for chip mounters. Furthermore, the need for compact and efficient chipsets and PCBs rises as household electronic goods become automated and interconnected. Chip mounters enable the production of smaller, more sophisticated electronic devices, ensuring seamless automation and connectivity. The miniaturization trend in the consumer electronics industry is another factor driving the demand for chip mounters. As consumers demand smaller and more portable devices, manufacturers are compelled to reduce the size of integrated circuits while maintaining high performance. Chip mounters facilitate the assembly of these compact electronic components onto PCBs, enabling the production of sleek and powerful gadgets and wearables. Hardware developers are investing in developing new techniques and technologies to keep up with the growing demand for advanced consumer electronics. These innovations aim to manage more circuitry and components within similar cost parameters. Chip mounters play a crucial role in this process by efficiently and accurately assembling complex electronic components onto PCBs.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global chip mounter market report, along with forecasts at the global and regional level from 2024-2032. Our report has categorized the market based on technology and application.

Technology Insights:

Hole Technology

Surface Mount Technology

Fine Pitch Technology

The report has provided a detailed breakup and analysis of the chip mounter market based on the technology. This includes hole technology, surface mount technology, and fine pitch technology. According to the report, surface mount technology represented the largest segment due to the increasing trend in the miniaturization of electronics and rising demand for wearable devices. On the other hand, the growing focus on IoT (Internet of Things) in smart home applications has further augmented the demand for IC chips, thereby stimulating the adoption of the technology.

Application Insights:

Consumer Electronics

Medical

Automotive

Telecommunication

Others

A detailed breakup and analysis of the chip mounter market based on the application have also been provided in the report. This includes consumer electronics, medical, automotive, telecommunication, and others. According to the report, telecommunication accounted for the largest market share. High investments in technologies, such as wireless communication and satellite, are fueling the demand for chips in the telecommunication market. High-power RF devices are being used in infrastructure applications, such as cellphone base stations. On the other hand, the increase in the demand for phones and the high replacement cost of smartphones has further escalated the telecommunication market where improved power management and signal conversion requisition have raised the demand for chip mounters.

Regional Insights:

Asia Pacific

Europe

North America

Middle East and Africa

Latin America

The report has also provided a comprehensive analysis of all the major regional markets, which include Asia Pacific, Europe, North America, the Middle East and Africa, and Latin America. According to the report, Asia Pacific was the largest market for chip mounter. The high manufacturing competence of China has made the region the world's biggest buyer and importer of chips. The governments of various countries are also supporting the industry with the development of several start-up companies. Besides this, the centralization of the production of electronic systems in China has also boosted the market in this region. The flourishing industrial market due to the ongoing push for safer and smarter cities in the Asia-Pacific region has induced the demand for semiconductors, especially in security, automation, solid-state lighting, and transportation segment, thereby accelerating the growth of the chip mounter market.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global chip mounter market. Some of the companies covered in the report include:

Hitachi

Samsung

Panasonic

Juki

ASM Pacific Technology

Canon

Essemtec

Ohashi Engineering

Nordson

Sony

Sun Electronic Industries Corporation

TOA

Please note that this only represents a partial list of companies and the complete list has been provided in the report.

Key Questions Answered in This Report

• 1. What was the size of the global chip mounter market in 2023?
• 2. What is the expected growth rate of the global chip mounter market during 2024-2032?
• 3. What are the key factors driving the global chip mounter market?
• 4. What has been the impact of COVID-19 on the global chip mounter market?
• 5. What is the breakup of the global chip mounter market based on the technology?
• 6. What is the breakup of the global chip mounter market based on the application?
• 7. What are the key regions in the global chip mounter market?
• 8. Who are the key players/companies in the global chip mounter market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Chip Mounter Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Breakup by Technology
• 5.5 Market Breakup by Application
• 5.6 Market Breakup by Region
• 5.7 Market Forecast

6 Market Breakup by Technology

• 6.1 Hole Technology
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Surface Mount Technology
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Fine Pitch Technology
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Application

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Medical
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Automotive
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Telecommunication
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Region

• 8.1 Asia Pacific
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Europe
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 North America
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast
• 8.4 Middle East and Africa
  • 8.4.1 Market Trends
  • 8.4.2 Market Forecast
• 8.5 Latin America
  • 8.5.1 Market Trends
  • 8.5.2 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Hitachi
  • 13.3.2 Samsung
  • 13.3.3 Panasonic
  • 13.3.4 Juki
  • 13.3.5 ASM Pacific Technology
  • 13.3.6 Canon
  • 13.3.7 Essemtec
  • 13.3.8 Ohashi Engineering
  • 13.3.9 Nordson
  • 13.3.10 Sony
  • 13.3.11 Sun Electronic Industries Corporation
  • 13.3.12 TOA

List of Figures

• Figure 1: Global: Chip Mounter Market: Major Drivers and Challenges
• Figure 2: Global: Chip Mounter Market: Sales Value (in Billion US$), 2018-2023
• Figure 3: Global: Chip Mounter Market: Breakup by Technology (in %), 2023
• Figure 4: Global: Chip Mounter Market: Breakup by Application (in %), 2023
• Figure 5: Global: Chip Mounter Market: Breakup by Region (in %), 2023
• Figure 6: Global: Chip Mounter Market Forecast: Sales Value (in Billion US$), 2024-2032
• Figure 7: Global: Chip Mounter Industry: SWOT Analysis
• Figure 8: Global: Chip Mounter Industry: Value Chain Analysis
• Figure 9: Global: Chip Mounter Industry: Porter's Five Forces Analysis
• Figure 10: Global: Chip Mounter (Hole Technology) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 11: Global: Chip Mounter (Hole Technology) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 12: Global: Chip Mounter (Surface Mount Technology) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 13: Global: Chip Mounter (Surface Mount Technology) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 14: Global: Chip Mounter (Fine Pitch Technology) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 15: Global: Chip Mounter (Fine Pitch Technology) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 16: Global: Chip Mounter (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 17: Global: Chip Mounter (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 18: Global: Chip Mounter (Medical) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 19: Global: Chip Mounter (Medical) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 20: Global: Chip Mounter (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 21: Global: Chip Mounter (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 22: Global: Chip Mounter (Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 23: Global: Chip Mounter (Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 24: Global: Chip Mounter (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 25: Global: Chip Mounter (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 26: Asia Pacific: Chip Mounter Market: Sales Value (in Million US$), 2018 & 2023
• Figure 27: Asia Pacific: Chip Mounter Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 28: Europe: Chip Mounter Market: Sales Value (in Million US$), 2018 & 2023
• Figure 29: Europe: Chip Mounter Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 30: North America: Chip Mounter Market: Sales Value (in Million US$), 2018 & 2023
• Figure 31: North America: Chip Mounter Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 32: Middle East and Africa: Chip Mounter Market: Sales Value (in Million US$), 2018 & 2023
• Figure 33: Middle East and Africa: Chip Mounter Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 34: Latin America: Chip Mounter Market: Sales Value (in Million US$), 2018 & 2023
• Figure 35: Latin America: Chip Mounter Market Forecast: Sales Value (in Million US$), 2024-2032

List of Tables

• Table 1: Global: Chip Mounter Market: Key Industry Highlights, 2023 & 2032
• Table 2: Global: Chip Mounter Market Forecast: Breakup by Technology (in Million US$), 2024-2032
• Table 3: Global: Chip Mounter Market Forecast: Breakup by Application (in Million US$), 2024-2032
• Table 4: Global: Chip Mounter Market Forecast: Breakup by Region (in Million US$), 2024-2032
• Table 5: Global: Chip Mounter Market Structure
• Table 6: Global: Chip Mounter Market: Key Players