市场调查报告书
商品编码
1468423
Wi-Fi 晶片组市场报告(按产品(智慧型手机、平板电脑、PC、接入点设备、连网家庭设备等)、频段(单频段、双频段、三频段)、MIMO 配置(SU-MIMO、MU -MIMO)) ,以及地区 2024-2032Wi-Fi Chipset Market Report by Product (Smartphones, Tablets, PCs, Access Point Equipment, Connected Home Devices, and Others), Band (Single Band, Dual Band, Tri Band), MIMO Configuration (SU-MIMO, MU-MIMO), and Region 2024-2032 |
IMARC Group年,全球 Wi-Fi 晶片组市场规模达到 199 亿美元。
Wi-Fi技术利用无线发射器和晶片组将资讯传送到行动装置以实现无线联网。这些晶片组可存取 Wi-Fi 热点,使用户无需标准电缆即可存取网路服务。由于晶片的单位成本通常较低,因此这些晶片主要用于路由器、笔记型电脑和蜂窝电话,也可以用于区域网路(LAN)中的电脑或工作站。随着物联网(IoT)应用的不断增长,这些晶片组现在也被整合到空调、热水器、洗衣机和电视等家用电器中。
由于智慧型手机和行动装置在全球的高度普及,Wi-Fi 技术的使用量激增。此外,全球各国政府正在开发配备公共 Wi-Fi 网路的智慧城市,以支持教育和医疗保健等各种服务部门。这些因素正在增加 Wi-Fi 在家庭、办公室以及公共场所的使用,从而增加 Wi-Fi 晶片组的销售量。此外,与传统电信业者相比,行动宽频语音 (VOMBB) 因其高音质、降低成本和节能能力而受到消费者的青睐,这也刺激了全球对 Wi-Fi 服务的需求。
The global Wi-Fi chipset market size reached US$ 19.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 25.9 Billion by 2032, exhibiting a growth rate (CAGR) of 2.9% during 2024-2032.
The Wi-Fi technology uses wireless transmitter and chipset to send information to mobile devices for wireless networking. These chipsets access Wi-Fi hotspots to enable the users to access networked services without the requirement of standard cables. Since the per-unit cost of a chip is usually low, these chips are mostly used in routers, computer laptops and cellular phones, and can also be used in computers or workstations in a local area network (LAN). With the growing applications of the Internet of Things (IoT), these chipsets are now also being incorporated in home appliances like air-conditioners, water heaters, washing machines and televisions.
Owing to the high penetration of smartphones and mobile devices across the globe, Wi-Fi technology has experienced a surge in its usage. Additionally, governments across the globe are developing smart cities with public Wi-Fi networks to support various service sectors such as education and healthcare. These factors are augmenting the use of Wi-Fi in homes, offices as well as public places, thereby increasing the sales of Wi-Fi chipsets. Moreover, voice over mobile broadband (VOMBB) is being preferred by consumers over traditional telecom carriers owing to its high audio quality, reduced cost and power savings ability, which is also catalysing the demand for Wi-Fi services worldwide.
IMARC Group provides an analysis of the key trends in each sub-segment of the global Wi-Fi chipset market report, along with forecasts at the global and regional level from 2024-2032. Our report has categorized the market based on product, band and MIMO configuration.
Smartphones
Tablets
PCs
Access Point Equipment
Connected Home Devices
Others
Single Band
Dual Band
Tri Band
SU-MIMO
MU-MIMO
North America
Europe
Asia Pacific
Middle East and Africa
Latin America
The report has also analysed the competitive landscape of the market with some of the key players being Qualcomm Technologies, Intel Corporation, Texas Instruments Inc, Stmicroelectronics, Mediatek, Samsung Electronics, Marvell Technology Group Ltd, Cypress Semiconductor Corporation, Quantenna Communications, Peraso Technologies, Atmel Corporation, Celeno Communications, Espressif, Broadcom-Qualcomm, etc.