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2024-2032 年有机硅灌封胶市场报告(依固化技术、应用、最终用途产业及地区划分)Silicone Potting Compounds Market Report by Curing Technique, Application, End Use Industry, and Region 2024-2032 |
2023 年,全球有机硅灌封胶市场规模达到 10.828 亿美元。 展望未来, IMARC Group预计到 2032 年,市场规模将达到 15.905 亿美元,2024-2032 年复合年增长率 (CAGR) 为 4.2%。
有机硅灌封胶是一种液体材料,用于用固体化合物填充电子元件或组件,以保护其免受周围环境的影响。热固性塑胶、环氧树脂、聚氨酯和硅橡胶凝胶是常用的有机硅灌封化合物。这些化合物一旦施加、固化和硬化,就会将电子元件封装在固体中,从而提供防潮、振动、热、污染和物理衝击的屏障。它们可以使用手动或自动计量混合分配 (MMD) 设备应用于电源变压器、电路板、继电器、放大器、线圈和铁氧体磁芯。它们还提供广泛的工作温度和硬度范围,广泛应用于各个行业,包括电子、航空航太、汽车、能源、船舶和太阳能。
全球电子产业的显着成长是创造积极市场前景的关键因素之一。硅灌封化合物广泛用于涂覆工业电子元件,例如电容器、螺线管、工业磁铁、梁黏合元件、微处理器和储存设备。此外,对消费性电子产品和小型设备不断增长的需求也推动了市场的成长。导热灌封胶提供了将热量从发热源消散到紧凑设备中金属外壳的有效方法。与此一致的是,这些复合材料在航空航太工业中广泛采用的减震和耐腐蚀性也促进了市场的成长。此外,各种产品创新,例如紫外线 (UV) 固化有机硅灌封化合物的开发,也是其他成长诱导因素。这些化合物具有增强的绝缘性能、黏合强度和更低的能耗。其他因素,包括快速工业化以及广泛的研发(R&D)活动,预计将推动市场成长。
The global silicone potting compounds market size reached US$ 1,082.8 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,590.5 Million by 2032, exhibiting a growth rate (CAGR) of 4.2% during 2024-2032.
Silicone potting compounds are liquid materials used to fill electronic components or assemblies with solid compounds for protection against the surrounding environment. Thermosetting plastics, epoxy, polyurethane and silicon rubber gels are among the commonly used silicone potting compounds. These compounds, once applied, cured and hardened, encase the electronic components in a solid mass that provides a barrier against moisture, vibration, heat, contamination and physical shocks. They can be applied to power transformers, circuit boards, relays, amplifiers, coils and ferrite cores using manual or automated meter-mix-dispense (MMD) equipment. They also provide a wide operating temperature and hardness range and are widely used across various industries, including electronics, aerospace, automotive, energy, marine and solar power.
Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Silicon potting compounds are widely used for coating industrial electronic components, such as capacitors, solenoids, industrial magnets, beam bonded components, microprocessors and memory devices. Moreover, the increasing demand for consumer electronics and miniaturized devices is providing a thrust to the growth of the market. Thermally conductive potting compounds offer effective pathways to dissipate the heat from a heat-generating source to a metal enclosure in compact devices. In line with this, the widespread adoption of these composites in the aerospace industry for shock insulation and corrosion resistance is also contributing to the market growth. Additionally, various product innovations, such as the development of ultraviolet (UV)-cured silicone potting compounds, are acting as other growth-inducing factors. These compounds offer enhanced insulation properties, bond strength and lower energy consumption. Other factors, including rapid industrialization, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global silicone potting compounds market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on curing technique, application and end use industry.
UV Curing
Thermal Curing
Room Temperature Curing
Electricals
Capacitors
Transformers
Cable Joints
Industrial Magnets
Solenoids
Others
Electronics
Surface Mount Packages
Beam Bonded Components
Memory Devices and Microprocessors
Others
Consumer Electronics
Aerospace
Automotive
Energy and Power
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Altana AG, CHT Germany GmbH, Dymax Corporation, Henkel AG & Co. KGaA, Hernon Manufacturing Inc, Master Bond Inc., MG Chemicals, Novagard Solutions, Parker-Hannifin Corp. and The Dow Chemical Company (Dow Inc).