市场调查报告书
商品编码
1636033
2025-2033 年按 IC 类型、应用程式和地区分類的音讯 IC 市场Audio IC Market by IC Type, Application, and Region 2025-2033 |
2024年全球音讯ICIMARC Group规模达366亿美元。专业音响产业不断增长的产品需求、设备小型化的不断发展趋势以及节能音讯设备製造技术的不断进步是推动市场发展的一些关键因素。
音频集成电路是一种分离的半导体元件,具有一组集成的电路,可执行音频换能器或前级放大器的功能。它是一个执行音讯电路所有基本功能的单晶片,包括放大、滤波和输入/输出电路。通常,与分离式音讯电路相比,这种单晶片设计可提供增强的音质、更低的功耗和更低的製造成本。音频 IC 放大器的主要功能是在不影响频率或任何波长的情况下将讯号的振动增加到最大范围,并有助于提高系统的效率。该晶片主要由内建音讯放大器、音讯处理器、MEMS麦克风和子系统组成。音讯积体电路 (IC) 种类繁多,例如音讯放大器、音讯 DSP、转换器和处理器。音讯积体电路有很多用途,例如汽车音讯、专业音讯、智慧家庭和便携式设备。
全球市场主要由专业音响产业不断增长的产品需求所推动。这可以归因于媒体和通讯行业的大幅成长。与此一致的是,消费性电子设备、智慧家电和高品质音讯设备在大众中的广泛采用正在增加产品的使用量。此外,具有更好用户体验的节能和创新音讯设备製造领域的技术不断进步,导致对音讯 IC 的需求不断增加。设备小型化的不断发展趋势导致了专用 CPU 和子系统的开发,以整合电源以适应电脑的紧凑尺寸和重量。此外,互联设备和物联网 (IoT) 技术的快速发展导致音讯 IC 越来越多地整合到各种工业应用中。除此之外,无线和智慧基础设施的日益普及,以及商业活动对高清音讯的需求不断增加,也推动了市场的发展。对 SoC 的需求不断增长以及整合音讯设备所涉及的技术缺陷和问题正在成为音讯 IC 市场成长的主要限制。相较之下,VR技术的众多创新以及对车载媒体娱乐系统不断增长的需求正在创造积极的市场前景。推动市场发展的其他一些因素包括快速城市化、工业 4.0 的出现、可支配收入水准的提高以及广泛的研发 (R&D) 活动。
The global audio IC market size reached USD 36.6 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 62.0 Billion by 2033, exhibiting a growth rate (CAGR) of 5.72% during 2025-2033. Escalating product demand in the professional audio industry, growing trend of device miniaturization, and continual technological advancements in the manufacturing of energy-efficient audio devices represent some of the key factors driving the market.
An audio integrated circuit is a discrete semiconductor device with an integrated set of circuits that perform the function of an audio transducer or a preamplifier. It is a single chip that performs all the essential functions of an audio circuit, including amplification, filtering, and input/output circuitry. Typically, this single-chip design provides enhanced sound quality, lower power consumption, and reduced manufacturing costs as compared to discrete audio circuits. The primary function of audio IC amplifier is to increase vibrations to the maximum range of signals without impacting frequency or any wavelength and help improve the efficiency of a system. The chip is primarily composed of built-in audio amplifier, audio processor, MEMS microphone, and subsystems. There is a wide range of audio integrated circuits (ICs), like audio amplifiers, audio DSPs, converters, and processors. There are many uses for audio integrated circuits, like automotive audio, professional audio, smart homes, and portable devices.
The global market is primarily driven by the escalating product demand in the professional audio industry. This can be attributed to considerable growth in the media and communications sector. In line with this, the widespread adoption of consumer electronics devices, smart home appliances and advanced quality audio devices among the masses are augmenting the product uptake. Moreover, continual technological advancements in the manufacturing of energy-efficient and innovative audio devices with better user experience are resulting in an increased demand for audio ICs. The growing trend of device miniaturization is resulting in the development of application-specific CPUs and subsystems to incorporate the power to accommodate the compact size and weight of the computer. Additionally, rapid advancements in connected devices and the Internet of Things (IoT) technologies are resulting in the growing integration of audio ICs into a variety of industrial applications. Besides this, the increasing penetration of wireless and smart infrastructure, along with increased demand for high-definition audio at commercial events, is also propelling the market. The augmenting demand for SoC and technical flaws and problems involved with integrating audio devices are acting as major growth restraints for the audio IC market. In contrast, numerous innovations in the VR technology and increasing demand for on-board media entertainment systems is creating a positive market outlook. Some of the other factors contributing to the market include rapid urbanization, the advent of Industry 4.0, inflating disposable income levels and extensive research and development (R&D) activities.
IC Type Insights
Audio Amplifier
Audio DSP
Audio Codecs
Microphone IC
Application Insights
Mobile Phones
Computer and Tablets
Headphones
Home Entertainment Systems
Automotive
Smart Home and IoT Devices
Wearables
Others
Regional Insights
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and Middle East and Africa. According to the report, Asia Pacific was the largest market for audio IC. Some of the factors driving the Asia Pacific audio IC market include the increasing penetration of wireless and smart infrastructure, rapid urbanization, growing trend of device miniaturization, etc.
Competitive Landscape
The report has also provided a comprehensive analysis of the competitive landscape in the global audio IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Analog Devices Inc., Cirrus Logic Inc., Infineon Technologies AG, NXP Semiconductors N.V., onsemi, Renesas Electronics Corporation, ROHM Co. Ltd., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Corporation, etc.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.