封面
市场调查报告书
商品编码
1746839

日本热界面材料市场报告(按产品类型、应用和地区)2025-2033

Japan Thermal Interface Material Market Report by Product Type, Application, and Region 2025-2033

出版日期: | 出版商: IMARC | 英文 120 Pages | 商品交期: 5-7个工作天内

价格
简介目录

2024年,日本热界面材料市场规模达2.33亿美元。展望未来, IMARC Group预计到2033年,该市场规模将达到5.152亿美元,2025-2033年期间的复合年增长率(CAGR)为9.2%。市场成长主要源自于几个关键驱动因素,包括对有效热管理解决方案的需求日益增长、热界面材料(TIM)配方和技术的持续进步,以及对电子设备的需求日益增长。

热界面材料 (TIM) 在各种电子设备内两个表面之间有效传导热量方面发挥着至关重要的作用。其主要作用是填充缝隙,消除微处理器、功率电晶体、LED 模组以及散热器或扩散器等组件之间可能存在的气穴,从而确保最高效的散热。这些材料经过特殊设计,具有高导热性和低热阻,从而促进热量的无缝传递。透过促进高效散热,TIM 有助于维持最佳工作温度,防止热节流,并提升整个系统的整体效能。

日本热界面材料市场趋势:

日本热界面材料市场正经历强劲成长,这得益于电子设备格局和工业需求不断发展变化相契合的一系列因素。一个重要的驱动因素是电子设备使用量的不断增长,包括智慧型手机、笔记型电脑和汽车电子设备。这些设备正成为现代生活不可或缺的一部分,对高效能的热管理解决方案的需求也日益增长。此外,以更高的功率密度和更高的组件整合度为标誌的半导体技术的快速发展,对市场产生了重大影响。这一趋势推动了对先进热界面材料 (TIM) 解决方案的需求,以有效散发这些复杂电子元件产生的热量。向电动车 (EV) 的转变是另一个驱动力。电动车的生产需要有效的热管理解决方案来解决电池、电力电子设备和电动马达产生的热量。资料中心基础设施的扩张,以及资料储存和处理需求的不断增长,进一步催化了市场的成长。此外,提高电子设备能源效率的需求也推动了热界面材料 (TIM) 的采用。此外,持续的研发工作已促成新型TIM配方的开发,其导热性、可靠性和易用性均有所提升。这些创新为市场创造了巨大的成长机会。此外,汽车和航太等各行业的监管标准和指南都要求有效的热管理,以确保安全性和可靠性,预计这将在未来几年推动区域市场的发展。

日本热界面材料市场细分:

产品类型洞察:

  • 胶带和薄膜
  • 弹性垫
  • 油脂和黏合剂
  • 相变材料
  • 金属基材料
  • 其他的

应用程式洞察:

  • 电信
  • 电脑
  • 医疗器材
  • 工业机械
  • 耐久性消费品
  • 汽车电子
  • 其他的

竞争格局:

市场研究报告也对市场竞争格局进行了全面分析。报告涵盖了市场结构、关键参与者定位、最佳制胜策略、竞争仪錶板和公司评估象限等竞争分析。此外,报告还提供了所有主要公司的详细资料。一些关键参与者包括:

  • 富士聚合物工业株式会社
  • 汉高日本有限公司(Henkel AG & Co. KGaA)
  • 稔株式会社
  • 信越化学工业株式会社

本报告回答的关键问题:

  • 日本热界面材料市场迄今表现如何?未来几年将如何表现?
  • COVID-19 对日本热界面材料市场有何影响?
  • 日本热界面材料市场按产品类型分類的状况如何?
  • 日本热界面材料市场按应用分類的分布如何?
  • 日本热界面材料市场的价值链分为哪些阶段?
  • 日本热界面材料的关键驱动因素和挑战是什么?
  • 日本热界面材料市场的结构是怎么样的?主要参与者有哪些?
  • 日本热界面材料市场的竞争程度如何?

本报告回答的关键问题:

  • 日本热界面材料市场迄今表现如何?未来几年将如何表现?
  • COVID-19 对日本热界面材料市场有何影响?
  • 日本热界面材料市场按产品类型分類的状况如何?
  • 日本热界面材料市场按应用分類的分布如何?
  • 日本热界面材料市场的价值链分为哪些阶段?
  • 日本热界面材料的关键驱动因素和挑战是什么?
  • 日本热界面材料市场的结构是怎么样的?主要参与者有哪些?
  • 日本热界面材料市场的竞争程度如何?

目录

第一章:前言

第二章:范围与方法

  • 研究目标
  • 利害关係人
  • 资料来源
    • 主要来源
    • 次要来源
  • 市场评估
    • 自下而上的方法
    • 自上而下的方法
  • 预测方法

第三章:执行摘要

第四章:日本热界面材料市场-简介

  • 概述
  • 市场动态
  • 产业趋势
  • 竞争情报

第五章:日本热界面材料市场格局

  • 历史与当前市场趋势(2019-2024)
  • 市场预测(2025-2033)

第六章:日本热界面材料市场-细分:依产品类型

  • 胶带和薄膜
    • 概述
  • 弹性垫
    • 概述
  • 油脂和黏合剂
    • 概述
  • 相变材料
    • 概述
  • 金属基材料
    • 概述
  • 其他的

第七章:日本热界面材料市场-细分:依应用

  • 电信
    • 概述
  • 电脑
    • 概述
  • 医疗器材
    • 概述
  • 工业机械
    • 概述
  • 耐久性消费品
    • 概述
  • 汽车电子
    • 概述
  • 其他的

第八章:日本热界面材料市场-竞争格局

  • 概述
  • 市场结构
  • 市场参与者定位
  • 最佳获胜策略
  • 竞争仪錶板
  • 公司评估象限

第九章:关键参与者简介

  • Fuji Polymer Industries Co. Ltd.
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events
  • Henkel Japan Ltd. (Henkel AG & Co. KGaA)
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events
  • Minoru Co. Ltd.
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events
  • Shin-Etsu Chemical Co. Ltd.
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events

第十章:日本热界面材料市场-产业分析

  • 驱动因素、限制因素和机会
    • 概述
    • 驱动程式
    • 限制
    • 机会
  • 波特五力分析
    • 概述
    • 买家的议价能力
    • 供应商的议价能力
    • 竞争程度
    • 新进入者的威胁
    • 替代品的威胁
  • 价值链分析

第 11 章:附录

简介目录
Product Code: SR112025A19284

Japan thermal interface material market size reached USD 233.0 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 515.2 Million by 2033, exhibiting a growth rate (CAGR) of 9.2% during 2025-2033. The market is experiencing growth due to several key drivers, including a growing need for effective thermal management solutions, ongoing advancements in thermal interface material (TIM) formulations and technologies, and the increasing demand for electronic devices.

Thermal interface material (TIMs) play a crucial role in effectively conducting heat between two surfaces within various electronic devices. Their primary function involves filling gaps and eliminating air pockets that may exist between components, such as microprocessors, power transistors, LED modules, and heat sinks or spreaders, to ensure the most efficient dissipation of heat. These materials are specifically engineered to possess high thermal conductivity and low thermal resistance, facilitating the seamless transfer of heat. By promoting efficient heat dissipation, TIMs aid in maintaining optimal operational temperatures, preventing thermal throttling, and enhancing the overall performance of the entire system.

Japan Thermal Interface Material Market Trends:

The Japan thermal interface material market is experiencing robust growth, driven by a convergence of factors that align with the evolving landscape of electronic devices and industrial requirements. A significant driver is the increasing use of electronic devices, encompassing smartphones, laptops, and automotive electronics. These devices are becoming integral to modern life, necessitating efficient thermal management solutions. Furthermore, the rapid advancements in semiconductor technology, marked by higher power densities and increased component integration, have a substantial impact on the market. This trend drives the demand for advanced TIM solutions to effectively dissipate the heat generated by these sophisticated electronic components. The shift toward electric vehicles (EVs) is another driving force. The production of EVs requires effective thermal management solutions to address the heat generated by batteries, power electronics, and electric motors. The expansion of data center infrastructure, driven by the increasing demand for data storage and processing, further catalyzes the market's growth. Additionally, the need to improve energy efficiency in electronic devices is promoting the adoption of TIMs. Moreover, ongoing research and development efforts have led to the development of new TIM formulations with improved thermal conductivity, reliability, and ease of application. These innovations create numerous growth opportunities for the market. Furthermore, regulatory standards and guidelines in various industries, such as automotive and aerospace, mandate effective thermal management to ensure safety and reliability, which is expected to fuel the regional market in the coming years.

Japan Thermal Interface Material Market Segmentation:

Product Type Insights:

  • Tapes and Films
  • Elastomeric Pads
  • Greases and Adhesives
  • Phase Change Materials
  • Metal Based Materials
  • Others

Application Insights:

  • Telecom
  • Computer
  • Medical Devices
  • Industrial Machinery
  • Consumer Durables
  • Automotive Electronics
  • Others

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the key players include:

  • Fuji Polymer Industries Co. Ltd.
  • Henkel Japan Ltd. (Henkel AG & Co. KGaA)
  • Minoru Co. Ltd.
  • Shin-Etsu Chemical Co. Ltd.

Key Questions Answered in This Report:

  • How has the Japan thermal interface material market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the Japan thermal interface material market?
  • What is the breakup of the Japan thermal interface material market on the basis of product type?
  • What is the breakup of the Japan thermal interface material market on the basis of application?
  • What are the various stages in the value chain of the Japan thermal interface material market?
  • What are the key driving factors and challenges in the Japan thermal interface material?
  • What is the structure of the Japan thermal interface material market and who are the key players?
  • What is the degree of competition in the Japan thermal interface material market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Japan Thermal Interface Material Market - Introduction

  • 4.1 Overview
  • 4.2 Market Dynamics
  • 4.3 Industry Trends
  • 4.4 Competitive Intelligence

5 Japan Thermal Interface Material Market Landscape

  • 5.1 Historical and Current Market Trends (2019-2024)
  • 5.2 Market Forecast (2025-2033)

6 Japan Thermal Interface Material Market - Breakup by Product Type

  • 6.1 Tapes and Films
    • 6.1.1 Overview
    • 6.1.2 Historical and Current Market Trends (2019-2024)
    • 6.1.3 Market Forecast (2025-2033)
  • 6.2 Elastomeric Pads
    • 6.2.1 Overview
    • 6.2.2 Historical and Current Market Trends (2019-2024)
    • 6.2.3 Market Forecast (2025-2033)
  • 6.3 Greases and Adhesives
    • 6.3.1 Overview
    • 6.3.2 Historical and Current Market Trends (2019-2024)
    • 6.3.3 Market Forecast (2025-2033)
  • 6.4 Phase Change Materials
    • 6.4.1 Overview
    • 6.4.2 Historical and Current Market Trends (2019-2024)
    • 6.4.3 Market Forecast (2025-2033)
  • 6.5 Metal Based Materials
    • 6.5.1 Overview
    • 6.5.2 Historical and Current Market Trends (2019-2024)
    • 6.5.3 Market Forecast (2025-2033)
  • 6.6 Others
    • 6.6.1 Historical and Current Market Trends (2019-2024)
    • 6.6.2 Market Forecast (2025-2033)

7 Japan Thermal Interface Material Market - Breakup by Application

  • 7.1 Telecom
    • 7.1.1 Overview
    • 7.1.2 Historical and Current Market Trends (2019-2024)
    • 7.1.3 Market Forecast (2025-2033)
  • 7.2 Computer
    • 7.2.1 Overview
    • 7.2.2 Historical and Current Market Trends (2019-2024)
    • 7.2.3 Market Forecast (2025-2033)
  • 7.3 Medical Devices
    • 7.3.1 Overview
    • 7.3.2 Historical and Current Market Trends (2019-2024)
    • 7.3.3 Market Forecast (2025-2033)
  • 7.4 Industrial Machinery
    • 7.4.1 Overview
    • 7.4.2 Historical and Current Market Trends (2019-2024)
    • 7.4.3 Market Forecast (2025-2033)
  • 7.5 Consumer Durables
    • 7.5.1 Overview
    • 7.5.2 Historical and Current Market Trends (2019-2024)
    • 7.5.3 Market Forecast (2025-2033)
  • 7.6 Automotive Electronics
    • 7.6.1 Overview
    • 7.6.2 Historical and Current Market Trends (2019-2024)
    • 7.6.3 Market Forecast (2025-2033)
  • 7.7 Others
    • 7.7.1 Historical and Current Market Trends (2019-2024)
    • 7.7.2 Market Forecast (2025-2033)

8 Japan Thermal Interface Material Market - Competitive Landscape

  • 8.1 Overview
  • 8.2 Market Structure
  • 8.3 Market Player Positioning
  • 8.4 Top Winning Strategies
  • 8.5 Competitive Dashboard
  • 8.6 Company Evaluation Quadrant

9 Profiles of Key Players

  • 9.1 Fuji Polymer Industries Co. Ltd.
    • 9.1.1 Business Overview
    • 9.1.2 Product Portfolio
    • 9.1.3 Business Strategies
    • 9.1.4 SWOT Analysis
    • 9.1.5 Major News and Events
  • 9.2 Henkel Japan Ltd. (Henkel AG & Co. KGaA)
    • 9.2.1 Business Overview
    • 9.2.2 Product Portfolio
    • 9.2.3 Business Strategies
    • 9.2.4 SWOT Analysis
    • 9.2.5 Major News and Events
  • 9.3 Minoru Co. Ltd.
    • 9.3.1 Business Overview
    • 9.3.2 Product Portfolio
    • 9.3.3 Business Strategies
    • 9.3.4 SWOT Analysis
    • 9.3.5 Major News and Events
  • 9.4 Shin-Etsu Chemical Co. Ltd.
    • 9.4.1 Business Overview
    • 9.4.2 Product Portfolio
    • 9.4.3 Business Strategies
    • 9.4.4 SWOT Analysis
    • 9.4.5 Major News and Events

10 Japan Thermal Interface Material Market - Industry Analysis

  • 10.1 Drivers, Restraints, and Opportunities
    • 10.1.1 Overview
    • 10.1.2 Drivers
    • 10.1.3 Restraints
    • 10.1.4 Opportunities
  • 10.2 Porters Five Forces Analysis
    • 10.2.1 Overview
    • 10.2.2 Bargaining Power of Buyers
    • 10.2.3 Bargaining Power of Suppliers
    • 10.2.4 Degree of Competition
    • 10.2.5 Threat of New Entrants
    • 10.2.6 Threat of Substitutes
  • 10.3 Value Chain Analysis

11 Appendix