全球晶圆基板上晶片封装（COWOS）市场，2025-2029年

全球晶圆基板晶片（COWOS）市场预计在 2024-2029 年预测期内达到 14.023 亿美元，复合年增长率为 9.4%。

本报告对全球晶圆基板基板（COWOS）市场进行了全面分析，涵盖市场规模和预测、趋势、成长要素、挑战，以及对约 25 家公司的供应商分析。

本报告对当前市场格局、最新趋势和驱动因素以及整体市场环境进行了最新分析。市场成长的驱动因素包括人工智慧 (AI) 和高效能运算 (HPC) 需求的爆炸性成长、摩尔定律放缓和异质整合的兴起，以及资料中心基础设施的快速扩张。

本研究采用客观的方法，结合一手和二手讯息，包括来自主要行业相关人员的意见。报告包含全面的市场规模数据、区域細項分析、供应商格局以及对主要企业的分析。报告提供历史数据和预测数据。

研究指出，采用有机基板的封装解决方案多样化是未来几年推动全球晶片基板（COWOS）市场成长的主要因素之一。此外，更大尺寸的中介层和封装的普及，以及混合键结和真正3D堆迭技术的演进，预计也将显着提升市场需求。

目录

第一章执行摘要

第二章 Technavio 分析

• 价格、生命週期、顾客购买篮、采用率和购买标准分析
• 投入与差异化因素的重要性
• 混淆来源
• 驱动因素和挑战的影响

第三章 市场情势

• 市场生态系统
• 市场特征
• 价值链分析

第四章 市场规模

• 市场定义
• 市场区隔分析
• 2024年市场规模
• 2024-2029年市场展望

第五章 市场规模表现

• 2019-2023年全球晶片基板（COWOS）市场
• 2019-2023年技术细分市场分析
• 2019-2023年组件细分市场分析
• 2019-2023年最终用户细分市场分析
• 2019-2023年区域细分市场分析
• 2019-2023年国家细分市场分析

第六章 定性分析

• 人工智慧的影响：全球晶圆基板晶片基板（COWOS）市场

第七章五力分析

• 五力分析概述
• 买方的议价能力
• 供应商的议价能力
• 新进入者的威胁
• 替代品的威胁
• 竞争威胁
• 市场状况

8. 按技术分類的市场细分

• 比较：按技术
• CoWoS S
• CoWoS R
• CoWoS L
• 按技术分類的市场机会

9. 按组件进行市场细分

• 比较：按组件
• GPU
• CPU
• FPGA
• 其他的
• 按组件分類的市场机会

第十章 按最终用户进行市场细分

• 比较：按最终用户
• 云端服务供应商
• 公司
• 政府机构
• 其他的
• 按最终用户分類的市场机会

第十一章 客户情况

第十二章 区域情势

• 区域细分
• 区域比较
• 亚太地区
  • 台湾
  • 韩国
  • 中国
  • 日本
  • 新加坡
  • 澳洲
• 北美洲
  • 美国
  • 加拿大
  • 墨西哥
• 欧洲
  • 德国
  • 法国
  • 义大利
  • 英国
  • 荷兰
  • 西班牙
• 南美洲
  • 巴西
  • 智利
  • 阿根廷
• 中东和非洲
  • 以色列
  • 阿拉伯聯合大公国
  • 沙乌地阿拉伯
  • 南非
  • 埃及
• 各区域的市场机会

第十三章：驱动因素、挑战与机会

• 市场驱动因素
• 市场挑战
• 驱动因素和挑战的影响
• 市场机会

第十四章 竞争格局

• 概述
• 竞争格局
• 令人困惑的局面
• 产业风险

第十五章 竞争分析

• 公司简介
• 企业排名指数
• 公司市场定位
• Advanced Micro Devices Inc.
• Alchip Technologies Ltd.
• Amkor Technology Inc.
• ASE Technology Holding Co. Ltd.
• GlobalFoundries
• Intel Corp.
• Jiangsu Changdian Technology Co. Ltd.
• Micron Technology Inc.
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd.
• Sanechips Co. Ltd.
• SK hynix Co. Ltd.
• Taiwan Semiconductor Co. Ltd.
• Tongfu Microelectronics Co.
• United Microelectronics Corp.

第十六章附录

The global chip-on-wafer-on-substrate (cowos) market is forecasted to grow by USD 1402.3 mn during 2024-2029, accelerating at a CAGR of 9.4% during the forecast period. The report on the global chip-on-wafer-on-substrate (cowos) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by explosive demand from artificial intelligence and high performance computing, slowing of moores law and rise of heterogeneous integration, rapid expansion of data center infrastructure.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global chip-on-wafer-on-substrate (cowos) market is segmented as below:

By Technology

• CoWoS S
• CoWoS R
• CoWoS L

By Component

• GPU
• CPU
• FPGA
• Others

By End-User

• Cloud service providers
• Enterprises
• Government organizations
• Others

Geography

• APAC
  • Taiwan
  • South Korea
  • China
  • Japan
  • Singapore
  • Australia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • Italy
  • UK
  • The Netherlands
  • Spain
• South America
  • Brazil
  • Chile
  • Argentina
• Middle East and Africa
  • UAE
  • South Africa
  • Egypt
• Rest of World (ROW)

This study identifies the diversification of packaging solutions with organic substrates as one of the prime reasons driving the global chip-on-wafer-on-substrate (cowos) market growth during the next few years. Also, adoption of larger interposers and package sizes and evolution towards hybrid bonding and true 3d stacking will lead to sizable demand in the market.

The report on the global chip-on-wafer-on-substrate (cowos) market covers the following areas:

• Global chip-on-wafer-on-substrate (cowos) market sizing
• Global chip-on-wafer-on-substrate (cowos) market forecast
• Global chip-on-wafer-on-substrate (cowos) market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global chip-on-wafer-on-substrate (cowos) market vendors that include Advanced Micro Devices Inc., Alchip Technologies Ltd., Amkor Technology Inc., ASE Technology Holding Co. Ltd., GlobalFoundries, Intel Corp., Jiangsu Changdian Technology Co. Ltd., Micron Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd., Sanechips Co. Ltd., SK hynix Co. Ltd., Taiwan Semiconductor Co. Ltd., Tongfu Microelectronics Co., United Microelectronics Corp.. Also, the global chip-on-wafer-on-substrate (cowos) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Technology
  • Executive Summary - Chart on Market Segmentation by Component
  • Executive Summary - Chart on Market Segmentation by End-user
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2024
• 4.4 Market outlook: Forecast for 2024-2029

5 Historic Market Size

• 5.1 Global Chip-On-Wafer-On-Substrate (CoWoS) Market 2019 - 2023
  • Historic Market Size - Data Table on Global Chip-On-Wafer-On-Substrate (CoWoS) Market 2019 - 2023 ($ million)
• 5.2 Technology segment analysis 2019 - 2023
  • Historic Market Size - Technology Segment 2019 - 2023 ($ million)
• 5.3 Component segment analysis 2019 - 2023
  • Historic Market Size - Component Segment 2019 - 2023 ($ million)
• 5.4 End-user segment analysis 2019 - 2023
  • Historic Market Size - End-user Segment 2019 - 2023 ($ million)
• 5.5 Geography segment analysis 2019 - 2023
  • Historic Market Size - Geography Segment 2019 - 2023 ($ million)
• 5.6 Country segment analysis 2019 - 2023
  • Historic Market Size - Country Segment 2019 - 2023 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI in global chip-on-wafer-on-substrate (CoWoS) market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2024 and 2029
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2024 and 2029
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2024 and 2029
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2024 and 2029
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2024 and 2029
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2024 and 2029
• 7.7 Market condition

8 Market Segmentation by Technology

• 8.1 Market segments
• 8.2 Comparison by Technology
• 8.3 CoWoS S - Market size and forecast 2024-2029
• 8.4 CoWoS R - Market size and forecast 2024-2029
• 8.5 CoWoS L - Market size and forecast 2024-2029
• 8.6 Market opportunity by Technology
  • Market opportunity by Technology ($ million)

9 Market Segmentation by Component

• 9.1 Market segments
• 9.2 Comparison by Component
• 9.3 GPU - Market size and forecast 2024-2029
• 9.4 CPU - Market size and forecast 2024-2029
• 9.5 FPGA - Market size and forecast 2024-2029
• 9.6 Others - Market size and forecast 2024-2029
• 9.7 Market opportunity by Component
  • Market opportunity by Component ($ million)

10 Market Segmentation by End-user

• 10.1 Market segments
• 10.2 Comparison by End-user
• 10.3 Cloud service providers - Market size and forecast 2024-2029
• 10.4 Enterprises - Market size and forecast 2024-2029
• 10.5 Government organizations - Market size and forecast 2024-2029
• 10.6 Others - Market size and forecast 2024-2029
• 10.7 Market opportunity by End-user
  • Market opportunity by End-user ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2024-2029
  • 12.3.1 Taiwan - Market size and forecast 2024-2029
  • 12.3.2 South Korea - Market size and forecast 2024-2029
  • 12.3.3 China - Market size and forecast 2024-2029
  • 12.3.4 Japan - Market size and forecast 2024-2029
  • 12.3.5 Singapore - Market size and forecast 2024-2029
  • 12.3.6 Australia - Market size and forecast 2024-2029
• 12.4 North America - Market size and forecast 2024-2029
  • 12.4.1 US - Market size and forecast 2024-2029
  • 12.4.2 Canada - Market size and forecast 2024-2029
  • 12.4.3 Mexico - Market size and forecast 2024-2029
• 12.5 Europe - Market size and forecast 2024-2029
  • 12.5.1 Germany - Market size and forecast 2024-2029
  • 12.5.2 France - Market size and forecast 2024-2029
  • 12.5.3 Italy - Market size and forecast 2024-2029
  • 12.5.4 UK - Market size and forecast 2024-2029
  • 12.5.5 The Netherlands - Market size and forecast 2024-2029
  • 12.5.6 Spain - Market size and forecast 2024-2029
• 12.6 South America - Market size and forecast 2024-2029
  • 12.6.1 Brazil - Market size and forecast 2024-2029
  • 12.6.2 Chile - Market size and forecast 2024-2029
  • 12.6.3 Argentina - Market size and forecast 2024-2029
• 12.7 Middle East and Africa - Market size and forecast 2024-2029
  • 12.7.1 Israel - Market size and forecast 2024-2029
  • 12.7.2 UAE - Market size and forecast 2024-2029
  • 12.7.3 Saudi Arabia - Market size and forecast 2024-2029
  • 12.7.4 South Africa - Market size and forecast 2024-2029
  • 12.7.5 Egypt - Market size and forecast 2024-2029
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Explosive demand from artificial intelligence and high performance computing
  • Slowing of Moores law and rise of heterogeneous integration
  • Rapid expansion of data center infrastructure
• 13.2 Market challenges
  • Limited production capacity and supply chain bottlenecks
  • High manufacturing cost and complexity
  • Thermal management and power delivery challenges
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2024 and 2029
• 13.4 Market opportunities
  • Diversification of packaging solutions with organic substrates
  • Adoption of larger interposers and package sizes
  • Evolution towards hybrid bonding and true 3D stacking

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 Advanced Micro Devices Inc.
  • Advanced Micro Devices Inc. - Overview
  • Advanced Micro Devices Inc. - Business segments
  • Advanced Micro Devices Inc. - Key news
  • Advanced Micro Devices Inc. - Key offerings
  • Advanced Micro Devices Inc. - Segment focus
  • SWOT
• 15.5 Alchip Technologies Ltd.
  • Alchip Technologies Ltd. - Overview
  • Alchip Technologies Ltd. - Product / Service
  • Alchip Technologies Ltd. - Key offerings
  • SWOT
• 15.6 Amkor Technology Inc.
  • Amkor Technology Inc. - Overview
  • Amkor Technology Inc. - Business segments
  • Amkor Technology Inc. - Key news
  • Amkor Technology Inc. - Key offerings
  • Amkor Technology Inc. - Segment focus
  • SWOT
• 15.7 ASE Technology Holding Co. Ltd.
  • ASE Technology Holding Co. Ltd. - Overview
  • ASE Technology Holding Co. Ltd. - Business segments
  • ASE Technology Holding Co. Ltd. - Key offerings
  • ASE Technology Holding Co. Ltd. - Segment focus
  • SWOT
• 15.8 GlobalFoundries
  • GlobalFoundries - Overview
  • GlobalFoundries - Product / Service
  • GlobalFoundries - Key offerings
  • SWOT
• 15.9 Intel Corp.
  • Intel Corp. - Overview
  • Intel Corp. - Business segments
  • Intel Corp. - Key news
  • Intel Corp. - Key offerings
  • Intel Corp. - Segment focus
  • SWOT
• 15.10 Jiangsu Changdian Technology Co. Ltd.
  • Jiangsu Changdian Technology Co. Ltd. - Overview
  • Jiangsu Changdian Technology Co. Ltd. - Product / Service
  • Jiangsu Changdian Technology Co. Ltd. - Key offerings
  • SWOT
• 15.11 Micron Technology Inc.
  • Micron Technology Inc. - Overview
  • Micron Technology Inc. - Business segments
  • Micron Technology Inc. - Key news
  • Micron Technology Inc. - Key offerings
  • Micron Technology Inc. - Segment focus
  • SWOT
• 15.12 Powertech Technology Inc.
  • Powertech Technology Inc. - Overview
  • Powertech Technology Inc. - Business segments
  • Powertech Technology Inc. - Key offerings
  • Powertech Technology Inc. - Segment focus
  • SWOT
• 15.13 Samsung Electronics Co. Ltd.
  • Samsung Electronics Co. Ltd. - Overview
  • Samsung Electronics Co. Ltd. - Business segments
  • Samsung Electronics Co. Ltd. - Key news
  • Samsung Electronics Co. Ltd. - Key offerings
  • Samsung Electronics Co. Ltd. - Segment focus
  • SWOT
• 15.14 Sanechips Co. Ltd.
  • Sanechips Co. Ltd. - Overview
  • Sanechips Co. Ltd. - Product / Service
  • Sanechips Co. Ltd. - Key offerings
  • SWOT
• 15.15 SK hynix Co. Ltd.
  • SK hynix Co. Ltd. - Overview
  • SK hynix Co. Ltd. - Product / Service
  • SK hynix Co. Ltd. - Key news
  • SK hynix Co. Ltd. - Key offerings
  • SWOT
• 15.16 Taiwan Semiconductor Co. Ltd.
  • Taiwan Semiconductor Co. Ltd. - Overview
  • Taiwan Semiconductor Co. Ltd. - Product / Service
  • Taiwan Semiconductor Co. Ltd. - Key news
  • Taiwan Semiconductor Co. Ltd. - Key offerings
  • SWOT
• 15.17 Tongfu Microelectronics Co.
  • Tongfu Microelectronics Co. - Overview
  • Tongfu Microelectronics Co. - Product / Service
  • Tongfu Microelectronics Co. - Key offerings
  • SWOT
• 15.18 United Microelectronics Corp.
  • United Microelectronics Corp. - Overview
  • United Microelectronics Corp. - Product / Service
  • United Microelectronics Corp. - Key offerings
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations