Embedded World 2024：活动报告分析师的要点

本报告总结了 IoT Analytics 分析师团队从 2024 年嵌入式世界 (EW) 博览会上收集的主要亮点（媒体分析/关键公告）和 17 个详细见解。 这项见解是基于超过 45 个展位参观和超过 35 次个人访谈。 四位分析师参加了为期三天的活动。

范例视图

范例视图

报告内容：

• 摘要与重点：整体印象、主题焦点、主题重点、主要演示
• 工业运算设备 OEM 比较：AsusIoT、Advantech、Axiomtek、Eurotech、Cincoze、NexAIoT
• 17 个主要趋势和详细见解：包括案例研究/证据点和访谈要点
  • 一般人工智慧见解
  • 晶片组级边缘人工智慧：低功耗晶片组、CPU、GPU、NPU、设备端人工智慧推理流程、边缘人工智慧推理、NPU 集成
  • 硬体层面的边缘AI：本地AI模型训练硬体、AI-in-a-box、GPU与工业PC（IPC）/控制器结合、智慧远端资讯处理网关、TinyML
  • 连接与相关模组： 5G RedCap、AI IoT 晶片组
  • 其他见解：永续发展、区域网关

上市公司

AMD Analog Devices ASUS IoT Advantech Axiomtek Eurotech NVIDIA Aetina MediaTek Intel Subaru NXP Semiconductors ST Imagination Technologies Alif Semiconductor Infineon Technologies SiFive

Synaptics IBASE Technology TDK Eseye Quectel SG Wireless Sequence Ceva Variscite Avnet STMicroelectronics PUFsecurity InvenSense Qt Innominds Blackberry

目录

• 1.活动概述
• 2.摘要/主要见解
• 3.主题演讲亮点
• 4.重要公告/发布
• 5.工业电脑OEM厂商比较
• 6.详细见解
• 7.关于 IoT 分析

A report presenting key highlights and in-depth insights assembled by the IoT Analytics analyst team from one of the world's leading fairs for the embedded community.

SAMPLE VIEW

The "Embedded World 2024 Event Report-Analyst Takeaways" contains a comprehensive summary of the key highlights (media analysis and key announcements) and 17 in-depth insights assembled by the IoT Analytics analyst team from the Embedded World (EW) fair 2024. The insights are based on >45 booth visits and >35 individual interviews. Four analysts were present for a total of three days.

SAMPLE VIEW

This document's main purpose is for our readers to keep up with the latest IoT developments and stay ahead of the tidal changes in current market trends.

The report includes:

• Summary & key highlights (General impressions, topic focus, keynote highlights, key announcements)
• Comparison of industrial compute device OEMs (AsusIoT, Advantech, Axiomtek, Eurotech, Cincoze, NexAIoT)
• 17 key trends and in-depth insights with examples/proof-points and interview highlights.
  • General AI insights
  • Edge AI at the chipset level (low-power chipsets, CPUs, GPUs, NPUs, on-device AI inferencing processes, AI inference at the edge, NPU integration)
  • Edge AI at the hardware level (hardware for on-premises AI model training, AI-in-a-box, GPUs paired with industrial PCs (IPCs)/controllers, intelligent telematics gateways, TinyML)
  • Connectivity and related modules (5G RedCap, AI IoT chipsets)
  • Other insights (sustainability, zonal gateways)

Companies mentioned:

Table of Contents

• 1. Event overview
• 2. Summary and key insights
• 3. Highlights from the keynotes
• 4. Important announcements/launches
• 5. Comparison of industrial compute OEMs
• 6. In-depth insights
• 7. About IoT Analytics