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市场调查报告书
商品编码
1434596

3D IC 和 2.5D IC封装市场：按技术、最终用户、应用划分 - 2024-2030 年全球预测

3D IC & 2.5D IC Packaging Market by Technology (2.5D, 3D TSV, 3D Wafer-Level Chip-Scale Packaging), End User (Automotive, Consumer Electronics, Industrial Sector), Application - Global Forecast 2024-2030
出版日期: | 出版商: 360iResearch | 英文 196 Pages | 商品交期: 最快1-2个工作天内

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预计2023年3D IC和2.5D IC封装市场规模为923.6亿美元，2024年达到1,181.9亿美元，2030年达5,214.9亿美元，复合年增长率为28.05%。

全球3D IC和2.5D IC封装市场

主要市场统计
基准年[2023] 923.6亿美元
预测年份 [2024] 1181.9亿美元
预测年份 [2030] 5214.9亿美元
复合年增长率（%） 28.05%
3D IC &2.5D IC封装市场-IMG1

FPNV定位矩阵

FPNV定位矩阵对于评估3D IC和2.5D IC封装市场至关重要。我们检视与业务策略和产品满意度相关的关键指标，以对供应商进行全面评估。这种深入的分析使用户能够根据自己的要求做出明智的决策。根据评估，供应商被分为四个成功程度不同的像限：前沿（F）、探路者（P）、利基（N）和重要（V）。

市场占有率分析

市场占有率分析是一款综合工具，可对 3D IC 和 2.5D IC封装市场供应商的现状进行深入而详细的研究。全面比较和分析供应商在整体收益、基本客群和其他关键指标方面的贡献，以便更好地了解公司的绩效及其在争夺市场占有率时面临的挑战。此外，该分析还提供了对该行业竞争特征的宝贵见解，包括在研究基准年观察到的累积、分散主导地位和合併特征等因素。这种详细程度的提高使供应商能够做出更明智的决策并制定有效的策略，从而在市场上获得竞争优势。

该报告对以下几个方面提供了宝贵的见解：

1-市场渗透率：提供有关主要企业所服务的市场的全面资讯。

2-市场开拓：我们深入研究利润丰厚的新兴市场并分析其在成熟细分市场的渗透率。

3- 市场多元化：提供有关新产品发布、开拓地区、最新发展和投资的详细资讯。

4-竞争力评估与资讯：对主要企业的市场占有率、策略、产品、认证、监管状况、专利状况、製造能力等进行全面评估。

5- 产品开发与创新：提供对未来技术、研发活动和突破性产品开发的见解。

本报告解决了以下关键问题：

1-3D IC和2.5D IC封装市场的市场规模和预测是多少？

在2-3D IC和2.5D IC封装市场的预测期间内，有哪些产品、细分市场、应用和领域需要考虑投资？

3-3D IC和2.5D IC封装市场的技术趋势和法律规范是什么？

4-3D IC和2.5D IC封装市场主要厂商的市场占有率是多少？

5-进入3D IC和2.5D IC封装市场合适的型态和策略手段是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 电子产品的先进设计要求
      • 电子设备小型化趋势日益明显
      • 游戏机和平板智慧型手机的扩展
    • 抑制因素
      • 提高整合度会带来散热问题
    • 机会
      • 对高阶运算、资料中心和伺服器的需求不断增长
      • 引进製造商的创新产品与先进包装
    • 任务
      • 3D IC 和 2.5D IC 的单位成本较高
  • 市场区隔分析
  • 市场趋势分析
  • 高通膨的累积效应
  • 波特五力分析
  • 价值炼和关键路径分析
  • 法律规范

第六章 3D IC 和 2.5D IC封装市场：依技术分类

  • 2.5D
  • 3D TSV
  • 3D晶圆级晶片规模封装

第 7 章 3D IC 与 2.5D IC封装市场：依最终使用者划分

  • 车
  • 家用电器
  • 工业部门
  • 医疗设备
  • 军事和航太
  • 智慧科技
  • 通讯

第 8 章 3D IC 和 2.5D IC封装市场：依应用分类

  • 成像和光电
  • LED
  • 逻辑
  • 记忆
  • MEMS/感测器
  • 光电
  • RF

第九章美洲3D IC和2.5D IC封装市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十章亚太3D IC和2.5D IC封装市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章 欧洲、中东和非洲3D IC和2.5D IC封装市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争形势

  • FPNV定位矩阵
  • 市场占有率分析：主要企业
  • 主要企业竞争情境分析

第13章竞争产品组合

  • 主要公司简介
    • 3M Company
    • Amkor Technology, Inc.
    • ASE Technology Holding Co, Ltd.
    • Broadcom Inc.
    • Fujitsu Limited
    • Intel Corporation
    • International Business Machines Corporation
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • MonolithIC 3D Inc.
    • Samsung Electronics Co. Ltd
    • STMicroelectronics NV
    • Texas Instruments Incorporated
    • Tezzaron Semiconductor Corporation
    • Toshiba Electronic Devices & Storage Corporation
    • United Microelectronics Corporation
    • Xilinx Inc.
  • 主要产品系列

第十四章附录

  • 讨论指南
  • 关于许可证和定价
Product Code: MRR-4369010656DB

[196 Pages Report] The 3D IC & 2.5D IC Packaging Market size was estimated at USD 92.36 billion in 2023 and expected to reach USD 118.19 billion in 2024, at a CAGR 28.05% to reach USD 521.49 billion by 2030.

Global 3D IC & 2.5D IC Packaging Market

KEY MARKET STATISTICS
Base Year [2023] USD 92.36 billion
Estimated Year [2024] USD 118.19 billion
Forecast Year [2030] USD 521.49 billion
CAGR (%) 28.05%
3D IC & 2.5D IC Packaging Market - IMG1

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the 3D IC & 2.5D IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the 3D IC & 2.5D IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the 3D IC & 2.5D IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amkor Technology, Inc., ASE Technology Holding Co, Ltd., Broadcom Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., MonolithIC 3D Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..

Market Segmentation & Coverage

This research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Technology
    • 2.5D
    • 3D TSV
    • 3D Wafer-Level Chip-Scale Packaging
  • End User
    • Automotive
    • Consumer Electronics
    • Industrial Sector
    • Medical Devices
    • Military & Aerospace
    • Smart Technologies
    • Telecommunication
  • Application
    • Imaging & Optoelectronics
    • LED
    • Logic
    • Memory
    • MEMS/Sensors
    • Photonics
    • RF
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the 3D IC & 2.5D IC Packaging Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the 3D IC & 2.5D IC Packaging Market?

3. What are the technology trends and regulatory frameworks in the 3D IC & 2.5D IC Packaging Market?

4. What is the market share of the leading vendors in the 3D IC & 2.5D IC Packaging Market?

5. Which modes and strategic moves are suitable for entering the 3D IC & 2.5D IC Packaging Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Limitations
  • 1.7. Assumptions
  • 1.8. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. 3D IC & 2.5D IC Packaging Market, by Region

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Demand for advanced design in electronic products
      • 5.1.1.2. Increasing inclination to miniaturization of electronic devices
      • 5.1.1.3. Augment of gaming devices and tablet smartphones
    • 5.1.2. Restraints
      • 5.1.2.1. Greater levels of integration causes thermal issues
    • 5.1.3. Opportunities
      • 5.1.3.1. Rising demand for high-end computing, data centers, and servers
      • 5.1.3.2. Advent of innovative products from manufacturers and advanced packaging
    • 5.1.4. Challenges
      • 5.1.4.1. High cost per unit of 3D IC and 2.5D IC
  • 5.2. Market Segmentation Analysis
  • 5.3. Market Trend Analysis
  • 5.4. Cumulative Impact of High Inflation
  • 5.5. Porter's Five Forces Analysis
    • 5.5.1. Threat of New Entrants
    • 5.5.2. Threat of Substitutes
    • 5.5.3. Bargaining Power of Customers
    • 5.5.4. Bargaining Power of Suppliers
    • 5.5.5. Industry Rivalry
  • 5.6. Value Chain & Critical Path Analysis
  • 5.7. Regulatory Framework

6. 3D IC & 2.5D IC Packaging Market, by Technology

  • 6.1. Introduction
  • 6.2. 2.5D
  • 6.3. 3D TSV
  • 6.4. 3D Wafer-Level Chip-Scale Packaging

7. 3D IC & 2.5D IC Packaging Market, by End User

  • 7.1. Introduction
  • 7.2. Automotive
  • 7.3. Consumer Electronics
  • 7.4. Industrial Sector
  • 7.5. Medical Devices
  • 7.6. Military & Aerospace
  • 7.7. Smart Technologies
  • 7.8. Telecommunication

8. 3D IC & 2.5D IC Packaging Market, by Application

  • 8.1. Introduction
  • 8.2. Imaging & Optoelectronics
  • 8.3. LED
  • 8.4. Logic
  • 8.5. Memory
  • 8.6. MEMS/Sensors
  • 8.7. Photonics
  • 8.8. RF

9. Americas 3D IC & 2.5D IC Packaging Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific 3D IC & 2.5D IC Packaging Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. FPNV Positioning Matrix
  • 12.2. Market Share Analysis, By Key Player
  • 12.3. Competitive Scenario Analysis, By Key Player

13. Competitive Portfolio

  • 13.1. Key Company Profiles
    • 13.1.1. 3M Company
    • 13.1.2. Amkor Technology, Inc.
    • 13.1.3. ASE Technology Holding Co, Ltd.
    • 13.1.4. Broadcom Inc.
    • 13.1.5. Fujitsu Limited
    • 13.1.6. Intel Corporation
    • 13.1.7. International Business Machines Corporation
    • 13.1.8. Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 13.1.9. MonolithIC 3D Inc.
    • 13.1.10. Samsung Electronics Co. Ltd
    • 13.1.11. STMicroelectronics NV
    • 13.1.12. Texas Instruments Incorporated
    • 13.1.13. Tezzaron Semiconductor Corporation
    • 13.1.14. Toshiba Electronic Devices & Storage Corporation
    • 13.1.15. United Microelectronics Corporation
    • 13.1.16. Xilinx Inc.
  • 13.2. Key Product Portfolio

14. Appendix

  • 14.1. Discussion Guide
  • 14.2. License & Pricing

LIST OF FIGURES

  • FIGURE 1. 3D IC & 2.5D IC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. 3D IC & 2.5D IC PACKAGING MARKET DYNAMICS
  • FIGURE 7. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 8. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2030 (%)
  • FIGURE 10. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 12. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 14. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 16. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 21. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
  • FIGURE 22. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023

LIST OF TABLES

  • TABLE 1. 3D IC & 2.5D IC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 6. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 7. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 8. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 10. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 18. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 26. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 27. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 29. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 30. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 31. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 32. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 33. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 34. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 35. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 36. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 37. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 39. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 40. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 41. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 42. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 43. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 45. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 46. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 47. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 49. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 50. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 51. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 52. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 54. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 56. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 57. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 58. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 59. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 60. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 62. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 63. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 64. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 65. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 66. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 67. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 69. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 70. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 71. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 72. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 74. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 75. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 76. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 77. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 78. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 81. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 82. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 83. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 84. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 86. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 87. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 89. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 90. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 91. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 92. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 93. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 94. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 97. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 98. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 99. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 100. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 102. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 103. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 104. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 105. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 106. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 107. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 109. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 110. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 111. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 112. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 113. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 114. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 115. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 116. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 117. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 118. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 119. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 120. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 121. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 122. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 123. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 124. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 125. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 126. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 127. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 128. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 129. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 130. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 131. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 132. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 133. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 134. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 135. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 136. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 137. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 138. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 139. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 140. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 141. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 142. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 143. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 144. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 145. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 148. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 149. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 150. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 151. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 152. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
  • TABLE 153. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 154. 3D IC & 2.5D IC PACKAGING MARKET LICENSE & PRICING