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SMT 贴装设备市场:按设备、应用分类 - 2024-2030 年全球预测SMT Placement Equipment Market by Equipment (Cleaning Equipment, Inspection Equipment, Placement Equipment), Application (Aerospace & Defence, Automotive, Consumer Electronics) - Global Forecast 2024-2030 |
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预计2023年SMT贴装设备市场规模为13.2亿美元,预计2024年将达14.2亿美元,2030年将达21.9亿美元,复合年增长率为7.44%。
表面黏着技术(SMT) 贴装设备在电子产业中至关重要,因为它可以将电子元件高效、精确地组装到 PCB(电子设备的建构模组)上。电子元件包括电阻器、电容器、二极体和积体电路。随着家用电子电器和汽车产业的不断增长,电子元件小型化的趋势需要高效的製造方法,例如SMT贴装设备。世界各国政府正在采取各种措施支持PCB产业在各个领域的发展,例如建立PCB技术研发中心、鼓励创新和进步。另一方面,SMT贴片设备的引进和实施面临高成本、技术复杂、熟练劳动力缺乏的挑战。然而,这些限制可以透过进一步的技术改进和增加培训和开发支出来解决。 SMT 贴装设备软体的进步不断改进印刷电路基板製造流程。此外,智慧製造正在迅速发展,智慧製造利用物联网(IoT)、人工智慧(AI)和机器人等先进技术来自动化和优化PCB的製造流程。此外,由于新技术的出现以及对高品质、高效和永续製造流程的需求不断增加,SMT贴装设备的未来预计将创造利润丰厚的商机。
主要市场统计 | |
---|---|
基准年[2023] | 13.2亿美元 |
预测年份 [2024] | 14.2亿美元 |
预测年份 [2030] | 21.9亿美元 |
复合年增长率(%) | 7.44% |
利用维修和再加工设备对有缺陷的设备零件进行再加工
SMT 生产线清洗设备旨在保持印刷电路基板(PCB) 在焊接过程之前和之后不受污染。清洗设备专门满足电子元件组件的高可靠性需求,其中高性能和安全性至关重要。检测设备对于品管至关重要,它使用从自动光学检测 (AOI) 到 X 射线系统等多种技术。在 SMT 生产线上,贴装设备对于在印刷基板准确贴装元件非常重要。速度、精度和弹性对于满足现代电子製造的需求至关重要。维修设备是用于修復组装PCB中的缺陷和问题的专用设备。维修和返工设备提供了返工焊点、更换有缺陷的零件以及挽救有价值的电子设备免受小缺陷所需的工具。网版印刷设备在放置元件之前将焊膏涂布在 PCB 上。焊接设备包括形成焊点的各种技术,例如回流焊接炉和波峰焊接设备。
SMT 贴装设备在各个应用产业的多种用途
在航太和国防领域,精度、可靠性和耐用性至关重要。航太和国防工业的 SMT 设备必须支援组装能够承受恶劣条件的高度可靠的电子设备。汽车产业需要能够支援汽车电子生产的 SMT 设备,其特点是安全性、连接性和自动化方面的进步。消费性电子产品是一个快速发展的领域,对紧凑、高效能设备的需求很高。家用电子电器领域的SMT贴装设备必须提供高速度、高精度以及高效贴装小型元件的能力。医疗用电子设备製造需要能够实现高精度和清洁度的SMT设备。在通讯领域,需要SMT设备支援高速通讯设备和基础设施需求。
区域洞察
SMT 部署设备的区域格局多种多样,亚太地区、北美和欧洲发生了重要的战略活动。这些国家正在透过发展工厂和製造单位的智慧机械和智慧製造来发展半导体和电子元件的生产。这些地区正在透过扩大和加强我们的地理足迹来扩大国内半导体和电子元件的生产。亚太地区在 SMT 贴装设备全球销售额中所占的份额最大且最高。中国、日本、韩国、台湾等国家是拥有大量拥有AMT贴片设备製造能力的玩家的主要国家。此外,北美是加强国内半导体生产和创新的重要市场,以供应创新汽车、医疗设备、航太和国防领域所需的 PCB。
欧洲也是一个拥有多家製造商的地区,例如德国、瑞士和英国等国家。随着竞争对手汽车製造商设定了积极的生产目标,欧洲的汽车产量和销售量不断增加,推动了对自动化设备的需求,以改善晶片製造流程。此外,南美洲和非洲国家正在经历缓慢的成长,并处于开发阶段,以确保与印刷电路基板(PCB) 製造商的广泛合作和合同,并部署自适应 SMT 贴装设备。
FPNV定位矩阵
FPNV定位矩阵对于评估SMT贴装设备市场至关重要。我们检视与业务策略和产品满意度相关的关键指标,以对供应商进行全面评估。这种深入的分析使用户能够根据自己的要求做出明智的决策。根据评估,供应商被分为四个成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市场占有率分析
市场占有率分析是一种综合工具,可对 SMT 贴装设备市场供应商的现状进行深入而详细的研究。全面比较和分析供应商在整体收益、基本客群和其他关键指标方面的贡献,以便更好地了解公司的绩效及其在争夺市场占有率时面临的挑战。此外,该分析还提供了对该行业竞争特征的宝贵见解,包括在研究基准年观察到的累积、分散主导地位和合併特征等因素。这种详细程度的提高使供应商能够做出更明智的决策并制定有效的策略,从而在市场上获得竞争优势。
1. 市场渗透率:提供有关主要企业所服务的市场的全面资讯。
2. 市场开拓:我们深入研究利润丰厚的新兴市场,并分析其在成熟细分市场的渗透率。
3. 市场多元化:提供有关新产品发布、开拓地区、最新发展和投资的详细资讯。
4.竞争评估与资讯:对主要企业的市场占有率、策略、产品、认证、监管状况、专利状况、製造能力等进行全面评估。
5. 产品开发与创新:提供对未来技术、研发活动和突破性产品开发的见解。
1.SMT贴片设备市场的市场规模及预测为何?
2.SMT贴装设备市场预测期间需要考虑投资的产品、细分市场、应用和领域有哪些?
3.SMT贴片设备市场的技术趋势和法规结构是什么?
4.SMT贴片设备市场主要厂商的市场占有率为何?
5.进入SMT贴片设备市场的合适型态和策略手段是什么?
[185 Pages Report] The SMT Placement Equipment Market size was estimated at USD 1.32 billion in 2023 and expected to reach USD 1.42 billion in 2024, at a CAGR 7.44% to reach USD 2.19 billion by 2030.
Surface mount technology (SMT) placement equipment is essential in the electronics industry as it allows for the efficient and accurate assembly of electronic components onto the PCBs, which are the building blocks of electronic devices. The electronic components can include resistors, capacitors, diodes, integrated circuits, and other components. The consumer electronics and automotive industries are growing, and there is a need for efficient manufacturing methods, such as SMT placement equipment, due to the popularity of miniaturization of the electronic components. Governments worldwide are taking various initiatives to support the development of the PCB industry in different sectors by establishing research & development (R&D) centers for PCB technology to encourage innovation and advancements. On the other hand, the high cost, technical complexities, and non-availability of skilled workers for deploying and installing the SMT placement equipment are challenging the adoption and implementation of SMT placement equipment. However, these limitations can be solved with further technological improvements and more spending on training and development. There are ongoing software advancements in SMT placement equipment, which are contributing to the improvement of the manufacturing process of PCBs. Additionally, there is a rapid inclination and advances in smart manufacturing, which uses advanced technologies such as the Internet of Things (IoT), artificial intelligence (AI), and robotics to automate and optimize the manufacturing process of PCBs. Moreover, the future of SMT placement equipment is expected to create lucrative opportunities, with new technologies emerging and increasing demand for high-quality, efficient, and sustainable manufacturing processes.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 1.32 billion |
Estimated Year [2024] | USD 1.42 billion |
Forecast Year [2030] | USD 2.19 billion |
CAGR (%) | 7.44% |
Equipment: Utilization of repair and rework equipments for reworking defective components
Cleaning equipment in the SMT line is designed to ensure that printed circuit boards (PCBs) are free of contaminants before and after the soldering process. Cleaning equipment caters to the need for high reliability in electronic assemblies, particularly in high-performance and safety-critical applications. Inspection equipment is critical in quality control, with technologies ranging from Automated Optical Inspection (AOI) to X-ray systems. At the SMT line, placement equipment is responsible for accurately placing components on PCBs. Speed, precision, and flexibility are crucial for meeting the demands of modern electronics production. Repair equipment is specialized for fixing defects and issues in assembled PCBs. Repair and rework equipment provides necessary tools for reworking solder joints, replacing defective components, and salvaging valuable electronics from minor faults. Screen printing equipment applies solder paste to PCBs before component placement, a critical step for ensuring strong solder joints. Soldering equipment encompasses a range of technologies for forming solder joints, including reflow ovens and wave soldering machines.
Application: Diverse applications of SMT placement equipment across industries
In the Aerospace & Defence sector, precision, reliability, and durability are paramount. SMT equipment for Aerospace & Defence industries must support the assembly of high-reliability electronics that can withstand extreme conditions. The automotive sector demands SMT equipment that can support automotive electronics production featuring advancements in safety, connectivity, and automation. Consumer electronics is a rapidly evolving segment with a high demand for compact, high-performance devices. SMT placement equipment for the consumer electronics sector needs to offer high speed, precision, and the ability to place small components efficiently. Medical electronics manufacturing requires SMT equipment that can deliver high precision and cleanliness. The telecommunication sector seeks SMT equipment to support high-speed communication devices and infrastructure demand.
Regional Insights
The geographic landscape for SMT placement equipment is diverse, with significant strategic activities in the Asia-Pacific, North America, and Europe. The countries are developing semiconductor and electronic component production owing to the development of intellectual machines and smart manufacturing in the factories and manufacturing units. These regions are proliferating their domestic semiconductor and electronic component production by expanding and enhancing their geographical footprint. APAC is the largest and highest market share for SMT placement equipment for most global sales. Countries such as China, Japan, South Korea, and Taiwan are the major countries with a significant number of players and manufacturing capacity for AMT placement equipment. Furthermore, North America is a significant market to strengthen domestic semiconductor production and innovation to supply necessary PCBs for innovative automotive, medical equipment, and aerospace & defense sectors.
Europe is another region with several manufacturers based in countries such as Germany, Switzerland, and the United Kingdom. The production and sales of cars have increased in Europe due to aggressive output objectives established by rival automakers, increasing the demand for automated equipment to improve chip manufacturing processes. Moreover, South American and African countries are witnessing slow growth and are still in the development phase for capturing the extensive collaborations and agreements with printed circuit board (PCB) manufacturers to deploy adaptive SMT placement equipment.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the SMT Placement Equipment Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the SMT Placement Equipment Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the SMT Placement Equipment Market, highlighting leading vendors and their innovative profiles. These include Autotronik-SMT GmbH, Beijing Huawei Silkroad Electronic Technology Co., Ltd., Beijing Torch Co., Ltd., DDM Novastar, Inc., ESO Electronic Service Ottenbreit GmbH, Essemtec AG, Europlacer Limited, Faroad Intelligent Equipment, Fritsch GmbH, Fuji Corporation, Hangzhou TronStol Technology Co., Ltd., Hanwha Group, Heller Industries, Inc., Hillmancurtis, Hitachi, Ltd., IBE SMT Equipment, LLC, Juki Corporation, Kulicke and Soffa Industries, Inc., Manncorp Inc., Mirae Corporation, Mycronic AB, Nordson Corporation, Panasonic Corporation, Ren Thang Co., Ltd., SumiLax SMT Technologies Pvt. Ltd., Universal Instruments Corporation, Versatec, LLC, Wenzhou Yingxing Technology Co., Ltd., Yamaha Motor Co., Ltd., and Zhejiang Neoden Technology Co.,Ltd.
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the SMT Placement Equipment Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the SMT Placement Equipment Market?
3. What are the technology trends and regulatory frameworks in the SMT Placement Equipment Market?
4. What is the market share of the leading vendors in the SMT Placement Equipment Market?
5. Which modes and strategic moves are suitable for entering the SMT Placement Equipment Market?