市场调查报告书
商品编码
1471390
薄晶圆市场:按技术、晶圆尺寸、製程、应用划分 - 2024-2030 年全球预测Thin Wafer Market by Technology (Dicing, Grinding, Polishing), Wafer Size (125 mm, 200 mm, 300 mm), Process, Application - Global Forecast 2024-2030 |
※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。
预计2023年薄晶圆市场规模为104.7亿美元,预计2024年将达113亿美元,2030年将达到178.9亿美元,复合年增长率为7.94%。
薄晶圆是厚度显着减小的半导体基板,通常从几μm到小于100μm。硅等超薄半导体材料切片是积体电路 (IC) 和各种电子机械系统 (MEMS) 製造中的基本组件。薄晶圆的需求主要是由家用电子电器市场对更薄、更强大的设备的需求所推动的。此外,半导体技术的进步、物联网设备的普及以及汽车产业向电动和自动驾驶汽车的转变也推动了对薄晶圆的需求。此外,晶圆加工技术的创新可以在不牺牲耐用性或功能的情况下实现更薄的基板,这也推动了市场的成长。然而,晶圆减薄製程的技术限制可能会影响半导体装置的完整性和性能。此外,严格的环境法规影响半导体材料的生产和处置。然而,主要参与者正在开发具有成本效益且环保的晶圆製造工艺,以符合永续性法规和标准。此外,我们正在探索硅的潜在替代品,以更低的成本和环境影响提供类似或增强的性能,并提高薄晶圆的机械强度,以减少製造和组装中的损坏,从而为硅提供新的成长途径。
主要市场统计 | |
---|---|
基准年[2023] | 104.7亿美元 |
预测年份 [2024] | 113亿美元 |
预测年份 [2030] | 178.9亿美元 |
复合年增长率(%) | 7.94% |
研磨製程不断改进,使技术晶圆厚度与电子设备的精确要求相匹配
切割是将晶圆切割或划片成单一晶粒或晶片的过程,然后用于各种电子设备。此製程需要高精度,以避免损坏晶圆上的电路。现代切割技术包括隐形切割和雷射切割,这两种技术都旨在减少机械应力并提高可用晶片的产量比率。切割对于晶圆上积体电路 (IC) 的分离至关重要,并决定了半导体装置的最终输出和功能。电路製造后,研磨用于减薄晶圆。这是实现所需厚度的重要步骤,特别是对于需要薄型材以实现高效散热或弹性的设备。此製程使用研磨材料以机械方式减少晶圆的厚度。这是一项艰鉅的任务,需要精确控制,以防止晶圆破裂或变得太薄,导致晶片无法使用。选择正确的研磨和轮圈对于保持晶圆主动层的完整性非常重要。研磨后的晶圆表面可能会出现微裂纹和其他缺陷,从而影响晶片性能。抛光或化学机械平坦化 (CMP) 是一种使晶圆表面光滑并消除这些缺陷的製程。此步骤对于确保半导体装置的功能和可靠性至关重要,并为后续製造步骤中的复杂材料分层准备晶圆。
应用 对支援先进 3D 配置的储存晶片中的薄晶圆的新兴需求
CMOS 影像感测器 (CIS) 技术可提高成像性能,并透过薄晶圆加工实现更智慧的设备设计。更薄的晶圆使背照式技术成为可能,从而提高小型相机模组中的光收集效率和影像品质。中介层,特别是用于 3D 整合技术的中介层,利用薄晶圆提供连接多个半导体装置的平台,在减少空间的同时提高电气性能。此应用中的薄晶圆有助于实现更高密度的互连和更好的温度控管。在高亮度 LED 的生产中,采用薄晶圆来提高光提取和热性能。此应用利用厚度减小的优势,最大限度地减少缺陷并提高 LED 装置的效率和寿命。随着执行基本运算功能的逻辑晶片朝向更小的几何形状和 3D 结构发展,它们越来越多地使用薄晶圆。薄晶圆可实现更高的封装密度和更快的讯号传输速率。晶圆更薄的趋势旨在提高处理器速度并降低功耗。包括 3D NAND快闪记忆体存在内的记忆体技术的进步,利用薄晶圆垂直堆迭记忆体单元,显着增加储存容量,同时减少占地面积。这种方法需要对晶圆进行精确减薄,以确保可靠性和性能。微机电系统 (MEMS) 装置整合了机械和电气元件,在灵敏度、可靠性和外形尺寸方面受益于薄晶圆技术。更薄的外形有利于MEMS与其他半导体装置的集成,并扩大了应用潜力。无线通讯必不可少的射频设备使用薄晶圆来减少讯号损失并提高设备效率。薄度对于高频应用至关重要,可以实现更小、更强大的设备。
区域洞察
美洲地区在半导体和电子设备领域取得了多项进展,其特点是拥有强大且高度发展的技术框架。美国是硅谷的所在地,许多新兴企业和老牌公司正在推动晶圆技术的进步。北美市场的特点是对先进消费性电子产品、电动车和可再生能源技术的高需求,这正在影响薄晶圆的规格和应用。欧盟 (EU) 国家在汽车、可再生能源和物联网等产业中表现出对永续性和采用先进技术的强烈倾向,推动了对先进薄晶圆解决方案的需求。欧盟的研究和创新框架,加上学术机构和半导体产业之间的合作,正在加速这一领域的发展。有关电子和半导体品质和性能的严格法规和标准的存在也为薄晶圆的发展提供了标准化框架。中东地区重点关注石油以外的多元化,正在投资半导体等技术,创造新的机会。亚太地区凭藉其强劲的半导体产业占据了全球薄晶圆市场的大部分。由于家用电子电器的高需求以及政府对半导体製造的支持,中国、日本和印度等主要国家处于领先地位。作为世界製造地的中国和印度对行动装置、穿戴式装置和汽车的薄晶圆表现出巨大的需求。由于其蓬勃发展的电子市场和提高半导体生产的倡议,印度正在经历快速成长。
FPNV定位矩阵
FPNV定位矩阵对于评估薄晶圆市场至关重要。我们检视与业务策略和产品满意度相关的关键指标,以对供应商进行全面评估。这种深入的分析使用户能够根据自己的要求做出明智的决策。根据评估,供应商被分为四个成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市场占有率分析
市场占有率分析是一种综合工具,可以对薄晶圆市场供应商的现状进行深入而深入的研究。全面比较和分析供应商在整体收益、基本客群和其他关键指标方面的贡献,以便更好地了解公司的绩效及其在争夺市场占有率时面临的挑战。此外,该分析还提供了对该行业竞争特征的宝贵见解,包括在研究基准年观察到的累积、分散主导地位和合併特征等因素。详细程度的提高使供应商能够做出更明智的决策并制定有效的策略,从而在市场上获得竞争优势。
1. 市场渗透率:提供有关主要企业所服务的市场的全面资讯。
2. 市场开拓:我们深入研究利润丰厚的新兴市场,并分析其在成熟细分市场的渗透率。
3. 市场多元化:提供有关新产品发布、开拓地区、最新发展和投资的详细资讯。
4.竞争评估与资讯:对主要企业的市场占有率、策略、产品、认证、监管状况、专利状况、製造能力等进行全面评估。
5. 产品开发与创新:提供对未来技术、研发活动和突破性产品开发的见解。
1.薄晶圆市场规模及预测如何?
2.在薄晶圆市场的预测期间内,有哪些产品、细分市场、应用和领域需要考虑投资?
3.薄晶圆市场的技术趋势和法规结构是什么?
4.薄晶圆市场主要厂商的市场占有率为何?
5.进入薄晶圆市场的合适型态和策略手段是什么?
[188 Pages Report] The Thin Wafer Market size was estimated at USD 10.47 billion in 2023 and expected to reach USD 11.30 billion in 2024, at a CAGR 7.94% to reach USD 17.89 billion by 2030.
A thin wafer refers to a semiconductor substrate with a significantly reduced thickness, typically ranging from a few micrometers to less than 100 micrometers. These ultra-thin slices of semiconductor material, such as silicon, are foundational components in the fabrication of integrated circuits (ICs) and various microelectromechanical systems (MEMS). The demand for thin wafers is primarily driven by the consumer electronics market's need for thinner, more powerful devices. Furthermore, advancements in semiconductor technology, the proliferation of IoT devices, and the automotive industry's shift towards electric and autonomous vehicles have also propelled the need for thin wafers. Additionally, innovations in wafer processing techniques that allow for thinner substrates without sacrificing durability or functionality have also bolstered market growth. However, technical limitations in wafer thinning processes may affect the integrity and performance of semiconductor devices. Furthermore, stringent environmental regulations impact the production and disposal of semiconductor materials. However, key players are developing cost-effective and environmentally friendly wafer manufacturing processes to comply with sustainability regulations and standards. Additionally, exploring alternative materials that could substitute silicon, offering similar or enhanced properties at a reduced cost or environmental impact, and innovations to enhance the mechanical strength of thin wafers to prevent damage during manufacturing and assembly can provide new avenues of growth for the industry.
KEY MARKET STATISTICS | |
---|---|
Base Year [2023] | USD 10.47 billion |
Estimated Year [2024] | USD 11.30 billion |
Forecast Year [2030] | USD 17.89 billion |
CAGR (%) | 7.94% |
Technology: Advancements to improve the grinding process in order to prepare the wafer's thickness for the precise demands of electronic devices
Dicing is the process of cutting or scribing the wafer into individual dies or chips, which can then be used in various electronic devices. This process requires high precision to avoid damaging the circuits on the wafer. Modern dicing techniques include stealth dicing and laser dicing, both of which aim to reduce mechanical stress and improve the yield of usable chips. Dicing is critical for the separation of integrated circuits (ICs) on the wafer, dictating the final output and functionality of semiconductor devices. Grinding is used to thin down the wafer after the fabrication of circuits. It's an essential step to achieve the desired thickness, especially for devices that require thin profiles for efficient heat dissipation or flexibility. This process involves mechanically reducing the wafer's thickness using abrasive materials. It is a challenging process that requires precise control to prevent the wafer from breaking or becoming too thin, which could render the chips unusable. Choosing the correct grinding wheel and parameters is crucial for maintaining the integrity of the wafer's active layer. After grinding, the wafer surfaces may have micro-cracks or other defects that could impair the performance of the chips. Polishing, or chemical mechanical planarization (CMP), is a process that smoothens the wafer's surface, removing these imperfections. This step is vital for ensuring the functionality and reliability of the semiconductor devices, as it prepares the wafer for the complex layering of materials in subsequent manufacturing stages.
Application: Emerging need for thin wafers in memory chips to support advanced 3D configurations
CMOS image sensor (CIS) technology benefits significantly from thin wafer processing to enhance imaging performance and enable sleeker device designs. Thinning the wafer allows for backside illumination technology, which improves light collection efficiency and image quality in compact camera modules. Interposers, particularly those utilized in 3D integration technologies, rely on thin wafers to provide a platform for connecting multiple semiconductor devices, improving electrical performance while reducing space. Thin wafers in this application facilitate denser interconnections and better thermal management. In the production of high-brightness LEDs, thin wafers are employed to enhance light extraction and thermal performance. This application leverages the reduced thickness to minimize defects and improve the efficiency and longevity of LED devices. Logic chips, which perform basic computational functions, are increasingly leveraging thin wafers as they move towards smaller geometries and 3D structures. Thin wafers enable higher packing density and faster signal transmission speeds. The trend towards thinner wafers aims to enhance processor speed and reduce power consumption. Advancements in memory technology, including 3D NAND flash, utilize thin wafers to stack memory cells vertically, significantly increasing storage capacity while reducing footprint. This approach requires precise wafer thinning to ensure reliability and performance. Micro-electromechanical systems (MEMS) devices integrate mechanical and electrical components and benefit significantly from thin wafer technology in terms of sensitivity, reliability, and form factor. Thinning facilitates the integration of MEMS with other semiconductor devices, expanding their application potential. RF devices, essential for wireless communication, use thin wafers to reduce signal loss and improve device efficiency. The reduced thickness is critical for high-frequency applications, enabling smaller, more powerful devices.
Regional Insights
The Americas region features a robust and highly developed technological framework with several advancements in the realm of semiconductors and electronic devices. The presence of Silicon Valley in the U.S. presents a conducive landscape for innovations where numerous startups and established companies drive advancements in wafer technology. North America's market is distinctly characterized by high demand for advanced consumer electronics, electric vehicles, and renewable energy technologies, influencing thin wafer specifications and usage. European Union (EU) countries show a strong inclination towards sustainability and advanced technology adoption in industries such as automotive, renewable energy, and IoT, which fuels the demand for sophisticated thin wafer solutions. The EU's framework for research and innovation, coupled with collaboration between academic institutions and the semiconductor industry, accelerates developments in this sector. The presence of stringent regulations and standards pertaining to the quality and performance of electronic devices and semiconductors also provides a standardized framework for the progress of thin wafers. The Middle East, with its growing emphasis on diversification from oil, is investing in technology sectors, including semiconductors, presenting new opportunities. The Asia Pacific region represents a significant portion of the global thin wafer market, attributed to its robust semiconductor industry. Leading countries such as China, Japan, and India are at the forefront, driven by high consumer electronics demand and governmental support for semiconductor manufacturing. China and India, being global manufacturing hubs, showcase massive demand for thin wafers in mobile devices, wearables, and automobiles. India is experiencing rapid growth due to its burgeoning electronics market and initiatives to boost semiconductor production.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Thin Wafer Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Thin Wafer Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Thin Wafer Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Aixtron SE, Atecom Technology Co., Ltd., Brewer Science, Inc., Chipmetrics Oy, DISCO Corporation, EV Group, Globalwafers Co., Ltd., Hangzhou Semiconductor Wafer Co., Ltd ., LDK Solar High-Tech Co., Ltd., Okmetic Oy, ROHM Co., Ltd. by KYOCERA AVX, Shin-Etsu Chemical Co., Ltd., Siltronic AG, Siltronix Silicon Technologies, SK Siltron Co., Ltd., Soitec, SPTS Technologies Ltd., Sumco Corporation, SUSS MicroTec SE, UniversityWafer, Inc., Virginia Semiconductor Inc., and Wafer World Inc..
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Thin Wafer Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Thin Wafer Market?
3. What are the technology trends and regulatory frameworks in the Thin Wafer Market?
4. What is the market share of the leading vendors in the Thin Wafer Market?
5. Which modes and strategic moves are suitable for entering the Thin Wafer Market?