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市场调查报告书
商品编码
1500566
薄膜封装市场:按沉积技术、基板类型、应用、最终用途产业划分 - 2024-2030 年全球预测Thin-film Encapsulation Market by Deposition Technologies (Inorganic Layers, Organic Layers), Substrate Type (Glass, Metal, Plastic), Application, End-Use Industry - Global Forecast 2024-2030 |
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薄膜封装市场规模预计2023年为3.1296亿美元,预计2024年将达3.4207亿美元,2030年将达5.9908亿美元,复合年增长率为9.71%。
薄膜封装 (TFE) 是指使用超薄层在敏感电子设备周围形成屏障,例如有机发光二极体(OLED) 显示器、软性电子产品和太阳能板。该技术对于保护组件免受湿气和氧气侵入至关重要,湿气和氧气侵入会显着降低设备性能和寿命。推动 TFE 扩大使用的关键因素包括对柔性和可穿戴电子产品的需求迅速增长、智慧型手机和电视中 OLED 技术的采用增加以及 TFE 材料和製程的持续进步。然而,TFE技术面临扩充性和高成本,特别是对于大规模生产而言。解决这些限制需要继续研究更高效的沉积技术,例如原子层沉积 (ALD) 和化学气相沉积 (CVD),这将降低成本,并且可以提高扩充性。为了与旋转性和折迭式智慧型手机以及快速增长的物联网 (IoT) 设备等新技术集成,先进的薄膜封装可确保在各种操作环境中的灵活性、耐用性和长寿命。
主要市场统计 | |
---|---|
基准年[2023] | 31296万美元 |
预测年份 [2024] | 34207万美元 |
预测年份 [2030] | 59908万美元 |
复合年增长率(%) | 9.71% |
区域洞察
在美国,特别是美国,TFE市场的特点是对穿戴式装置和软性显示器的高需求,这正在推动先进封装技术的采用。生产尤其以创新主导,重点是由专注于尖端 TFE 解决方案的老牌公司和新创公司主导的新兴企业。在庞大的消费性电子产业的推动下,以韩国、日本和中国等国家主导的亚太地区在数量上主导着 TFE 市场。在广泛的政府措施以及庞大的供应商和製造商生态系统的支持下,该地区展现出快速的生产规模扩大能力、具有竞争力的製造成本和新技术的快速采用率。欧洲、中东和非洲地区在先进技术实施和调查方法之间取得了良好的平衡,欧洲国家在加强 OLED 照明、太阳能发电和软性电子产品等多种应用的 TFE 方法方面做出了重大贡献。欧洲、中东和非洲地区的公司经常强调永续和环保的生产流程,以符合该地区严格的环境法规。
FPNV定位矩阵
FPNV 定位矩阵对于评估供应商在薄膜封装市场的定位至关重要。此矩阵提供了对供应商的全面评估,并检查了与商务策略和产品满意度相关的关键指标。这种详细的评估使用户能够根据自己的要求做出明智的决定。根据评估结果,供应商被分为代表其成功程度的四个像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市场占有率分析
市场占有率分析是一种综合工具,可对薄膜封装市场供应商的现状进行深入而详细的评估。透过仔细比较和分析供应商的贡献,您可以更深入地了解每个供应商的绩效以及他们在争夺市场占有率时面临的挑战。这些贡献包括整体收益、客户群和其他关键指标。此外,该分析还提供了对该行业竞争性质的宝贵见解,包括在研究基准年期间观察到的累积、分散主导地位和合併特征等因素。有了这些详细信息,供应商可以做出更明智的决策并製定有效的策略,以在市场竞争中保持领先地位。
策略分析与建议
策略分析对于寻求在全球市场站稳脚跟的组织至关重要。对目前在薄膜封装市场中的地位进行全面评估,使公司能够做出符合其长期愿望的明智决策。此关键评估涉及对组织的资源、能力和整体绩效进行彻底分析,以确定核心优势和需要改进的领域。
[199 Pages Report] The Thin-film Encapsulation Market size was estimated at USD 312.96 million in 2023 and expected to reach USD 342.07 million in 2024, at a CAGR 9.71% to reach USD 599.08 million by 2030.
Thin-film encapsulation (TFE) refers to the use of ultra-thin layers to create a barrier around sensitive electronic equipment, such as organic light-emitting diode (OLED) displays, flexible electronics, and solar panels. This technology is pivotal in protecting components from moisture and oxygen infiltration, which can significantly degrade device performance and longevity. The major factors driving the expansion of TFE use include the burgeoning demand for flexible and wearable electronics, the increasing adoption of OLED technology in smartphones and televisions, and the continuous advancements in TFE materials and processes. However, TFE technologies face challenges, particularly in terms of scalability and high cost for high-volume manufacturing. Addressing these restraints requires ongoing research into more efficient deposition techniques, such as atomic layer deposition (ALD) and chemical vapor deposition (CVD), that promise to lower costs and enhance scalability. The integration with emerging technologies such as rollable and foldable smartphones, as well as the burgeoning Internet of Things (IoT) devices, is expected to necessitate advanced thin-film encapsulation solutions to ensure flexibility, durability, and longevity in varying operational environments.
KEY MARKET STATISTICS | |
---|---|
Base Year [2023] | USD 312.96 million |
Estimated Year [2024] | USD 342.07 million |
Forecast Year [2030] | USD 599.08 million |
CAGR (%) | 9.71% |
Regional Insights
In the Americas, particularly the United States, the TFE market is characterized by a high demand for wearable devices and flexible displays, which drives the adoption of advanced encapsulation technologies. Production is notably innovation-driven, with a strong emphasis on R&D, led by established companies and startups focusing on cutting-edge TFE solutions. APAC, led by countries including South Korea, Japan, and China, dominates the TFE market in terms of volume, fueled by the massive consumer electronics industry. The region showcases a rapid production scale-up capability, competitive manufacturing costs, and a fast adoption rate of new technologies, supported by extensive government initiatives and a vast ecosystem of suppliers and manufacturers. The EMEA region presents a balanced mix of advanced technological adoption and research-oriented approaches, with significant contributions from European countries in enhancing TFE methodologies for diverse applications, including OLED lighting, photovoltaics, and flexible electronics. Companies in EMEA often emphasize sustainable and eco-friendly production processes, aligning with stringent regional environmental regulations.
Market Insights
The market dynamics represent an ever-changing landscape of the Thin-film Encapsulation Market by providing actionable insights into factors, including supply and demand levels. Accounting for these factors helps design strategies, make investments, and formulate developments to capitalize on future opportunities. In addition, these factors assist in avoiding potential pitfalls related to political, geographical, technical, social, and economic conditions, highlighting consumer behaviors and influencing manufacturing costs and purchasing decisions.
FPNV Positioning Matrix
The FPNV positioning matrix is essential in evaluating the market positioning of the vendors in the Thin-film Encapsulation Market. This matrix offers a comprehensive assessment of vendors, examining critical metrics related to business strategy and product satisfaction. This in-depth assessment empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success, namely Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The market share analysis is a comprehensive tool that provides an insightful and in-depth assessment of the current state of vendors in the Thin-film Encapsulation Market. By meticulously comparing and analyzing vendor contributions, companies are offered a greater understanding of their performance and the challenges they face when competing for market share. These contributions include overall revenue, customer base, and other vital metrics. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With these illustrative details, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Recent Developments
Trio Partners to Commercialize Encapsulation on Perovskite Solar Cells
Verde Technologies Inc. established a visionary partnership with Northern Illinois University (NIU) and the esteemed U.S. based Department of Energy's National Renewable Energy Laboratory (NREL) to commercialize a cutting-edge encapsulation solution, leveraging atomic layer deposition (ALD) and spatial atomic layer deposition (sALD) technologies. The cutting-edge solution stands out for its potential to deliver unparalleled thin-film encapsulations with remarkable performance improvements. [Published On: 2023-08-29]
NICHICON Announces Partnership with PowerFilm Inc. to Use Thin-Film Solar Technology to Power the SLB Battery
Nichicon Corporation collaborated with PowerFilm, Inc., to harness the potential of thin-film solar technology in combination with our cutting-edge SLB Series Lithium Titanate Oxide (LTO) Batteries. This collaboration signifies providing an integrated energy solution optimized for IoT edge devices that enhances efficiency and convenience in power management. [Published On: 2023-06-13]
Strategy Analysis & Recommendation
The strategic analysis is essential for organizations seeking a solid foothold in the global marketplace. Companies are better positioned to make informed decisions that align with their long-term aspirations by thoroughly evaluating their current standing in the Thin-film Encapsulation Market. This critical assessment involves a thorough analysis of the organization's resources, capabilities, and overall performance to identify its core strengths and areas for improvement.
Key Company Profiles
The report delves into recent significant developments in the Thin-film Encapsulation Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Aixtron SE, AMS Technologies AG, Angstrom Engineering Inc., Applied Materials, Inc., BASF SE, Beneq Oy, Coat-X SA, Encapsulix SAS, Ergis S.A., Kateeva, Inc., LG Chem Ltd., Lotus Applied Technology, Meyer Burger Technology AG, Samsung Electronics Co., Ltd., SNU PRECISION CO., LTD, Tesa SE by Beiersdorf AG, Toppan Printing Co., Ltd., Toray Industries Inc., Universal Display Corporation, and Veeco Instruments Inc..
Market Segmentation & Coverage