查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1599594

焊线机设备市场：按类型、焊线材质、最终用户划分 - 全球预测 2025-2030

Wire Bonder Equipment Market by Type (Ball Bonders, Stud-bump Bonders, Wedge Bonders), Wire Material (Aluminium, Copper, Gold), End-User - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 199 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

2023年焊线机设备市场价值为9.5776亿美元，预计到2024年将达到10.2671亿美元，复合年增长率为7.40%，到2030年将达到15.7967亿美元。

焊线机设备在半导体製造中至关重要，有助于透过细线实现半导体元件和外部电路之间的电气互连。该设备在电子製造链中发挥着至关重要的作用，支持从家用电子电器到通讯再到汽车领域等各种行业使用的设备的生产。对小型电子产品不断增长的需求和物联网 (IoT) 的扩展推动了对焊接线机设备的需求。应用范围涵盖针对半导体封装的特定需求而客製化的各种键合技术，包括热超音波、超音波、楔形和球键结。

主要市场统计
基准年[2023] 95776万美元
预测年份 [2024] 10.2671 亿美元
预测年份 [2030] 15.7967 亿美元
复合年增长率（%） 7.40%

焊线机设备市场受到半导体技术快速进步、对高性能和紧凑型电子设备的需求快速增长以及电子设备生产中严格的品质要求等因素的显着影响。系统级封装 (SiP) 等先进封装解决方案的发展以及 3D 微电子技术的日益普及，为高效、多功能键合设备的创新和投资打开了大门。为了利用这些机会，企业需要增加对自动化、精密工程和节能技术的研发投资。

然而，这个市场面临一些限制，包括高昂的资本投资成本、与现有製造流程的复杂整合以及由于新技术和材料的快速发展而导致的技术过时的影响。供应链脆弱性和地缘政治紧张局势带来了进一步的营运挑战。为了克服这些障碍并促进成长，创新必须包括增强设备的机器学习和人工智慧能力以进行预测性维护，提高设备对不同应用的适应性，并尽量减少对环境的影响。市场状况 製造商在全球电子产品生产的动态格局中处于有利地位，因为市场的性质要求技术实施和策略伙伴关係关係具有灵活性和远见。

市场动态：快速发展的焊线机设备市场的关键市场洞察

供需的动态交互作用正在改变焊线机设备市场。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时也能帮助企业了解消费行为及其对製造业的影响。

  • 市场驱动因素
    • 各行业对半导体的需求不断增加
    • 电子设备小型化趋势日益明显
    • 更多采用工业 4.0 原则和智慧製造方法
  • 市场限制因素
    • 与焊线机设备相关的高初始投资
  • 市场机会
    • 持续研发引线引线接合法技术
    • 全球5G基础设施快速成长
  • 市场问题
    • 键合材料与焊线机设备的相容性问题

波特五力：驾驭焊线机设备市场的策略工具

波特的五力框架是了解焊线机设备市场竞争格局的关键工具。波特的五力框架描述了评估公司竞争和探索策略机会的清晰方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解焊线机设备市场的外部影响

外部宏观环境因素在塑造焊线机设备市场的绩效动态发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并帮助他们做出积极主动的决策。

市场占有率分析：了解焊线机设备市场的竞争状况

对焊线机设备市场的详细市场占有率分析可以对供应商的业绩进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示自己的竞争定位。该分析揭示了市场集中、细分和整合的趋势，为供应商提供了製定策略决策所需的见解，以应对日益激烈的竞争。

FPNV 定位矩阵：焊线机设备市场供应商的绩效评估

FPNV定位矩阵是评估焊线机设备市场供应商的重要工具。此矩阵允许业务组织根据供应商的商务策略和产品满意度评估供应商，从而做出符合其目标的明智决策。这四个象限使您能够清晰、准确地划分供应商，以确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析与建议：绘製焊线机设备市场的成功之路

对于旨在加强其在全球市场的影响力的公司来说，对焊线机设备市场的策略分析至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

该报告对涵盖关键焦点细分市场的市场进行了全面分析。

1.市场渗透率：对当前市场环境的详细审查，主要企业的广泛资料，评估他们在市场中的影响力和整体影响力。

2. 市场开拓：辨识新兴市场的成长机会，评估现有细分市场的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、主要产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，以帮助相关人员做出明智的决策。

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品和地区提供最佳投资机会？

3.塑造市场的关键技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 各行业对半导体的需求增加
      • 电子设备小型化新趋势
      • 更多采用工业 4.0 原则和智慧製造实践
    • 抑制因素
      • 与焊线机设备相关的高初始投资
    • 机会
      • 持续研发引线引线接合法技术
      • 全球5G基础设施快速成长
    • 任务
      • 黏合材料与焊线机设备的相容性问题
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治
    • 经济
    • 社会
    • 科技
    • 法律
    • 环境

第六章焊线机设备市场：依类型

  • 介绍
  • 球焊机
  • 螺柱凸块接合机
  • 楔形接合机

第七章焊线机设备市场：依线材分类

  • 介绍
  • 铝
  • 铜
  • 金子
  • 银

第八章焊接线机设备市场：依最终用户分类

  • 介绍
  • 航太
  • 车
  • 电子设备/电气设备
  • 活力

第九章 北美、南美焊线机设备市场

  • 介绍
  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十章亚太焊线机设备市场

  • 介绍
  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章 欧洲、中东和非洲焊线机设备市场

  • 介绍
  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • Accelonix Ltd.
  • ASMPT Ltd
  • BE Semiconductor Industries NV
  • Bergen Group
  • Corintech Ltd
  • Custom Interconnect Limited
  • DIAS Automation（HK）Ltd.
  • F & K DELVOTEC Bondtechnik GmbH
  • F&S BONDTEC Semiconductor GmbH
  • Guangzhou Minder-Hightech Co.,ltd
  • Hesse GmbH
  • Hybond Inc.
  • KAIJO corporation
  • Kulicke and Soffa Industries, Inc.
  • Mech-El Industries, Inc.
  • Micro Point Pro Ltd.
  • MTI Instruments, Inc.
  • Palomar Technologies
  • Prolyx Microelectronics Private Limited
  • Questar Products International, Inc.
  • TEC Associates Inc.
  • TPT Wire Bonder GmbH & Co.
  • WestBond, Inc.
  • Yamaha Robotics Holdings
Product Code: MRR-2A0283E256A8

The Wire Bonder Equipment Market was valued at USD 957.76 million in 2023, expected to reach USD 1,026.71 million in 2024, and is projected to grow at a CAGR of 7.40%, to USD 1,579.67 million by 2030.

Wire bonder equipment is pivotal in semiconductor manufacturing, facilitating the electrical interconnection between semiconductor devices and external circuitry through fine wires. This equipment plays an essential role in the electronics manufacturing chain, supporting the production of devices used in diverse industries, from consumer electronics to telecommunications and automotive sectors. The necessity for wire bonder equipment primarily stems from the growing demand for miniaturized electronics and the expansion of the Internet of Things (IoT), which collectively drive volume production in semiconductor facilities. The application scope spans a variety of bonding techniques such as thermosonic, ultrasonic, wedge, and ball bonding, tailored to specific semiconductor packaging needs.

KEY MARKET STATISTICS
Base Year [2023] USD 957.76 million
Estimated Year [2024] USD 1,026.71 million
Forecast Year [2030] USD 1,579.67 million
CAGR (%) 7.40%

The market for wire bonder equipment is heavily influenced by factors such as rapid advancements in semiconductor technology, a surge in demand for high-performance and small-sized electronic devices, and stringent quality requirements in electronics production. Opportunities exist in the ongoing evolution towards advanced packaging solutions like system-in-packages (SiP) and the increasing adoption of 3D microelectronics, opening avenues for innovation and investment in highly efficient, versatile bonding equipment. To capitalize on these opportunities, companies should enhance R&D investments in automation, precision engineering, and energy-efficient technologies.

However, the market faces several limitations, including high capital investment costs, complex integration with existing manufacturing processes, and susceptibility to technological obsolescence as new methods and materials evolve rapidly. Supply chain vulnerabilities and geopolitical tensions further pose operational challenges. To counter these hurdles and promote growth, innovations must focus on enhancing machine learning and AI capabilities in equipment for predictive maintenance, improving the adaptability of equipment for diverse applications, and minimizing environmental impact. The nature of the market demands agility and foresight in both technology adoption and strategic partnerships, positioning wire bonder equipment manufacturers advantageously in the dynamic landscape of global electronics production.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Wire Bonder Equipment Market

The Wire Bonder Equipment Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing demand for semiconductors across industries
    • Emerging trend towards miniaturization in electronics devices
    • Increasing adoption of Industry 4.0 principles and smart manufacturing practices
  • Market Restraints
    • High initial investment associated with wire bonder equipment
  • Market Opportunities
    • Ongoing research and development in wire bonding technologies
    • Rapid growth of the 5G infrastructure globally
  • Market Challenges
    • Bonding material compatibility issues with wire bonder equipment

Porter's Five Forces: A Strategic Tool for Navigating the Wire Bonder Equipment Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Wire Bonder Equipment Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Wire Bonder Equipment Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Wire Bonder Equipment Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Wire Bonder Equipment Market

A detailed market share analysis in the Wire Bonder Equipment Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Wire Bonder Equipment Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Wire Bonder Equipment Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Wire Bonder Equipment Market

A strategic analysis of the Wire Bonder Equipment Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Wire Bonder Equipment Market, highlighting leading vendors and their innovative profiles. These include Accelonix Ltd., ASMPT Ltd, BE Semiconductor Industries N.V., Bergen Group, Corintech Ltd, Custom Interconnect Limited, DIAS Automation (HK) Ltd., F & K DELVOTEC Bondtechnik GmbH, F&S BONDTEC Semiconductor GmbH, Guangzhou Minder-Hightech Co.,ltd, Hesse GmbH, Hybond Inc., KAIJO corporation, Kulicke and Soffa Industries, Inc., Mech-El Industries, Inc., Micro Point Pro Ltd., MTI Instruments, Inc., Palomar Technologies, Prolyx Microelectronics Private Limited, Questar Products International, Inc., TEC Associates Inc., TPT Wire Bonder GmbH & Co., WestBond, Inc., and Yamaha Robotics Holdings.

Market Segmentation & Coverage

This research report categorizes the Wire Bonder Equipment Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Ball Bonders, Stud-bump Bonders, and Wedge Bonders.
  • Based on Wire Material, market is studied across Aluminium, Copper, Gold, and Silver.
  • Based on End-User, market is studied across Aerospace, Automotive, Electronics & Electricals, and Energy.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing demand for semiconductors across industries
      • 5.1.1.2. Emerging trend towards miniaturization in electronics devices
      • 5.1.1.3. Increasing adoption of Industry 4.0 principles and smart manufacturing practices
    • 5.1.2. Restraints
      • 5.1.2.1. High initial investment associated with wire bonder equipment
    • 5.1.3. Opportunities
      • 5.1.3.1. Ongoing research and development in wire bonding technologies
      • 5.1.3.2. Rapid growth of the 5G infrastructure globally
    • 5.1.4. Challenges
      • 5.1.4.1. Bonding material compatibility issues with wire bonder equipment
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Wire Bonder Equipment Market, by Type

  • 6.1. Introduction
  • 6.2. Ball Bonders
  • 6.3. Stud-bump Bonders
  • 6.4. Wedge Bonders

7. Wire Bonder Equipment Market, by Wire Material

  • 7.1. Introduction
  • 7.2. Aluminium
  • 7.3. Copper
  • 7.4. Gold
  • 7.5. Silver

8. Wire Bonder Equipment Market, by End-User

  • 8.1. Introduction
  • 8.2. Aerospace
  • 8.3. Automotive
  • 8.4. Electronics & Electricals
  • 8.5. Energy

9. Americas Wire Bonder Equipment Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Wire Bonder Equipment Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Wire Bonder Equipment Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Accelonix Ltd.
  • 2. ASMPT Ltd
  • 3. BE Semiconductor Industries N.V.
  • 4. Bergen Group
  • 5. Corintech Ltd
  • 6. Custom Interconnect Limited
  • 7. DIAS Automation (HK) Ltd.
  • 8. F & K DELVOTEC Bondtechnik GmbH
  • 9. F&S BONDTEC Semiconductor GmbH
  • 10. Guangzhou Minder-Hightech Co.,ltd
  • 11. Hesse GmbH
  • 12. Hybond Inc.
  • 13. KAIJO corporation
  • 14. Kulicke and Soffa Industries, Inc.
  • 15. Mech-El Industries, Inc.
  • 16. Micro Point Pro Ltd.
  • 17. MTI Instruments, Inc.
  • 18. Palomar Technologies
  • 19. Prolyx Microelectronics Private Limited
  • 20. Questar Products International, Inc.
  • 21. TEC Associates Inc.
  • 22. TPT Wire Bonder GmbH & Co.
  • 23. WestBond, Inc.
  • 24. Yamaha Robotics Holdings

LIST OF FIGURES

  • FIGURE 1. WIRE BONDER EQUIPMENT MARKET RESEARCH PROCESS
  • FIGURE 2. WIRE BONDER EQUIPMENT MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES WIRE BONDER EQUIPMENT MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES WIRE BONDER EQUIPMENT MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. WIRE BONDER EQUIPMENT MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. WIRE BONDER EQUIPMENT MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. WIRE BONDER EQUIPMENT MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. WIRE BONDER EQUIPMENT MARKET DYNAMICS
  • TABLE 7. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY BALL BONDERS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY STUD-BUMP BONDERS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY WEDGE BONDERS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY ALUMINIUM, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY COPPER, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY GOLD, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY SILVER, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY ELECTRONICS & ELECTRICALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL WIRE BONDER EQUIPMENT MARKET SIZE, BY ENERGY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 26. ARGENTINA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 27. ARGENTINA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 29. BRAZIL WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 30. BRAZIL WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 31. CANADA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 32. CANADA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 33. CANADA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 34. MEXICO WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. MEXICO WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 36. MEXICO WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 37. UNITED STATES WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 38. UNITED STATES WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 39. UNITED STATES WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 40. UNITED STATES WIRE BONDER EQUIPMENT MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 41. ASIA-PACIFIC WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. ASIA-PACIFIC WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 43. ASIA-PACIFIC WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 44. ASIA-PACIFIC WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 45. AUSTRALIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 46. AUSTRALIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 47. AUSTRALIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 48. CHINA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 49. CHINA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 50. CHINA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 51. INDIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. INDIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 53. INDIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 54. INDONESIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 55. INDONESIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 56. INDONESIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 57. JAPAN WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 58. JAPAN WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 59. JAPAN WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 60. MALAYSIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 61. MALAYSIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 62. MALAYSIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 63. PHILIPPINES WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 64. PHILIPPINES WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 65. PHILIPPINES WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 66. SINGAPORE WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 67. SINGAPORE WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 68. SINGAPORE WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 69. SOUTH KOREA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 70. SOUTH KOREA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 71. SOUTH KOREA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 72. TAIWAN WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 73. TAIWAN WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 74. TAIWAN WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 75. THAILAND WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 76. THAILAND WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 77. THAILAND WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 78. VIETNAM WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. VIETNAM WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 80. VIETNAM WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 81. EUROPE, MIDDLE EAST & AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 82. EUROPE, MIDDLE EAST & AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 83. EUROPE, MIDDLE EAST & AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 84. EUROPE, MIDDLE EAST & AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 85. DENMARK WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 86. DENMARK WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 87. DENMARK WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 88. EGYPT WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 89. EGYPT WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 90. EGYPT WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 91. FINLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 92. FINLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 93. FINLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 94. FRANCE WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 95. FRANCE WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 96. FRANCE WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 97. GERMANY WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 98. GERMANY WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 99. GERMANY WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 100. ISRAEL WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 101. ISRAEL WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 102. ISRAEL WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 103. ITALY WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 104. ITALY WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 105. ITALY WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 106. NETHERLANDS WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 107. NETHERLANDS WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 108. NETHERLANDS WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 109. NIGERIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 110. NIGERIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 111. NIGERIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 112. NORWAY WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 113. NORWAY WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 114. NORWAY WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 115. POLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 116. POLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 117. POLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 118. QATAR WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 119. QATAR WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 120. QATAR WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 121. RUSSIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 122. RUSSIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 123. RUSSIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 124. SAUDI ARABIA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 125. SAUDI ARABIA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 126. SAUDI ARABIA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 127. SOUTH AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 128. SOUTH AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 129. SOUTH AFRICA WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 130. SPAIN WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 131. SPAIN WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 132. SPAIN WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 133. SWEDEN WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 134. SWEDEN WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 135. SWEDEN WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 136. SWITZERLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 137. SWITZERLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 138. SWITZERLAND WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 139. TURKEY WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 140. TURKEY WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 141. TURKEY WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 142. UNITED ARAB EMIRATES WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 143. UNITED ARAB EMIRATES WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED ARAB EMIRATES WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED KINGDOM WIRE BONDER EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED KINGDOM WIRE BONDER EQUIPMENT MARKET SIZE, BY WIRE MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED KINGDOM WIRE BONDER EQUIPMENT MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 148. WIRE BONDER EQUIPMENT MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 149. WIRE BONDER EQUIPMENT MARKET, FPNV POSITIONING MATRIX, 2023