市场调查报告书
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1115043
2022-2028 年全球集成无源器件市场规模、份额、行业趋势分析报告(按应用、最终用户(汽车、家用电器、医疗保健、其他))、区域展望和预测Global Integrated Passive Devices Market Size, Share & Industry Trends Analysis Report By Application, By End User (Automotive, Consumer Electronics, Healthcare and Others), By Regional Outlook and Forecast, 2022 - 2028 |
到 2028 年,集成无源器件的全球市场规模预计将达到 36 亿美元,在预测期内以 10.9% 的复合年增长率增长。
在电子系统的组装中,集成的无源器件可以被封装,用作裸片、芯片,甚至可以三维(3D)堆迭在其他 IPD 和有源集成电路之上。我有。电子封装中使用的标准直插式 (SIL)、SIP 或其他封装(DIL、DIP、QFN、芯片级封装/CSP、晶圆级封装/WLP 等)是集成无源器件的典型。它是一种封装。集成无源器件还充当模块基板,使其成为芯片组模块、多芯片模块、混合模块等的组件。
IPD 基板是玻璃、覆盖有介电层(例如二氧化硅)的硅、层状陶瓷(低温共烧陶瓷/LTCC、高温共烧陶瓷/HTCC)、氧化铝/氧化铝陶瓷、共烧陶瓷。有时会使用硬质材料,例如(LTCC、HTCC)。基板也可以是柔性的,例如 Kapton、FR4 或类似的聚□亚胺层压板,或其他合适的多聚体,例如封装中介层(也称为有源中介层)。忽略和理解基板和潜在封装对 IPD 性能的影响有利于电子系统的设计。
COVID-19 影响分析
COVID-19 的爆发及其对无源电子元件的影响降低了整个供应链在元件和原材料製造层面的功能水平。这表明无源集成器件在许多国家和地区的销售额都在下降。另一方面,该地区的日本贸易公司和相关公司持平。通过在单个硅片上集成耦合器、谐波滤波器、耦合器和阻抗匹配器等多个功能模块,可以在提高器件性能的同时使无源元件集成器件更小。
市场增长因素
在消费品领域扩大 IPD 的使用
IPD 技术最常见的用途之一是在白色家电中。研究表明,集成无源器件广泛应用于消费电子行业,包括数字电视、机顶盒、智能手机、平板电脑和便携式媒体播放器等产品。由于近年来对智能手机的高需求,需要将许多功能打包到一个紧凑的外形中,因此出现了集成无源器件。智能手机配备了许多功能,例如 Wi-Fi、蓝牙、定位系统和短距离无线通信。
迈向 5G 网络时代
5G有望投入实际使用。 IPD 嵌入在平衡不平衡转换器、滤波器和双工器等物品中,并且必须为 5G 做好准备。电信行业尤其将从 IPD 的加入中受益,因为它们可以减少电信基础设施设备的尺寸和能耗。到2022年,预计5G用户数将达到8900万,IPD市场增长潜力可期。用于 5G 的 IPD 射频滤波器由高效的 3D Glass Solutions 製造。此外,预计到 2021 年,美国、日本、韩国、英国、德国和中国将引入 5G 技术,并有望支持后续集成无源市场的扩张。
市场製约因素
集成无源器件比分立元件更昂贵
与分立元件相比,集成无源器件的高成本阻碍了其市场。然而,随着行业巨头努力降低 IPD 的价格,长期影响可能很小。此外,重要的是以低成本製造以提高盈利能力。然而,传统的印刷电路板是用于分立元件,而不是用于 IPD。将传统印刷电路板用于 IPD 会产生额外成本。一个分立元件的 IPD 成本为 1:31 (1.5 x 1.5)。这部分是由于分立元件的商品化和广泛使用。
应用前景
集成无源器件市场按应用细分为静态/电磁对抗、高频、LED 照明和数字/混合信号。静电放电/电磁干扰 (ESD/EMI) 保护部分将在 2021 年占据集成无源器件市场的最高收入份额。这是因为在手机中采用这些无源集成元件是扩大这一市场的主要因素。在接下来的九年中,EMS 和 EMI 保护产品领域预计将显着增长。这些解决方案避免了传输损耗并改善了信号接收。
最终用户展望
集成无源器件市场按最终用途细分为汽车、消费电子产品、医疗保健等。 2021 年,消费电子部门在集成无源器件市场中取得了可观的收入份额。集成无源设备市场扩张的主要驱动力是智能手机和其他物联网设备的日益普及。此外,芯片小型化等技术发展使电子产品小型化成为可能,这也是手机、LED电视、平板电脑和笔记本电脑等消费电子设备越来越普及的原因。
地区概览
对北美、欧洲、亚太地区和 LAMEA 地区的集成无源器件市场进行了分析。 2021 年,欧洲部门在集成无源器件市场的收入份额最高。 Infineon Technologies AG、STMicroelectronics 和 IPDiA 等主要供应商在该地区提供基于高效研发的尖端产品,并为增长做出了贡献。此外,这一发展为医疗保健、汽车和电子等各个行业做出了贡献,在该地区产生了大量投资。
The Global Integrated Passive Devices Market size is expected to reach $3.6 billion by 2028, rising at a market growth of 10.9% CAGR during the forecast period.
The integrated passive device (IPD), also known as the integrated passive component (IPC), or embedded passive component (EPC), is an electronic component that combines resistors, capacitors, inductors, coils/chokes, microstrip lines, impedance matching components, baluns, or any combination of these components in the same package or on the same substrate. Even though the distinction between incorporated and integrated passives is technically ambiguous, integrated passives are occasionally referred to as embedded passives.
In both situations, passives are implemented on the same substrate or in-between dielectric layers. Resistor, capacitor, resistor-capacitor, coil/inductor (RCL), and resistor-capacitor networks are the first types of IPDs. Additionally, passive transformers can be created as integrated passive devices, such as by stacking two coils on top of one another and separating them with a thin layer of dielectric. When the substrate is silicon or another semiconductor like gallium arsenide, diodes (PN, PIN, Zener, etc.) can occasionally be integrated into it with integrated passives (GaAs).
In an electronic system assembly, integrated passive devices may be packaged, used as bare dies or chips, or even stacked in three dimensions (3D) on top of other IPDs or active integrated circuits. Standard in Line (SIL), SIP, or any other packages (such as DIL, DIP, QFN, chip-scale package/CSP, wafer level package/WLP, etc.) used in electronic packaging are typical packages for integrated passives. Integrated passives can also serve as a module substrate, making them a component of chipset modules, multi-chip modules, and hybrid modules.
The substrate for IPDs can be stiff materials like glass, silicon covered with a dielectric layer like silicon dioxide, layered ceramics (low temperature co-fired ceramic/LTCC, high-temperature, and high co-fired ceramic/HTCC), aluminum oxide/alumina ceramic, and co-fired ceramics (LTCC, HTCC). The substrate can also be flexible, such as a laminate made of Kapton, FR4, or a similar polyimide, or any other suitable polyposis, such as a package interposer (also known as an active interposer). The ability to ignore or understand the impact of the substrate and potential package on the performance of IPDs is advantageous for the design of electronics systems.
COVID-19 Impact Analysis
The COVID-19 outbreak and its effects on passive electronic components resulted in lower functioning levels throughout the supply chain at the components and raw materials manufacturing levels. This indicates a decline in the sales of passive integrated devices across numerous countries and regions. On the other hand, the Japanese traders and associated businesses in the area stayed the same. By combining several functional blocks, such as couplers, harmonic filters, couplers, and impedance matching devices, into a single silicon wafer, integrated passive devices can miniaturize devices while improving device performance.
Market Growth Factors
Ipd Is Becoming More Widely Used In Consumer Goods
One of the IPD technology's most common uses is in white goods. According to research, integrated passive devices are widely used in the consumer electronics industry, which includes products like digital TVs, set-top boxes, smartphones, tablets, and portable media players. Since there has been such a high demand for smartphones in recent years, integrated passive devices have emerged as a result of the necessity for many features to be crammed into a compact form factor. Numerous functions, including Wi-Fi, Bluetooth, the positioning system, near-field communication, and others, are available on smartphones.
The Upcoming Era Of The 5g Network
5G is anticipated to be commercially available. IPDs must be incorporated into items like baluns, filters, and diplexers to make them 5G compliant. The telecom industry in particular would benefit from the integration of IPDs since it would assist reduce the size and energy consumption of telecom infrastructure items. By 2022, the 5G market is anticipated to have 89 million subscriptions, which would present a growth potential for the IPD market. 5G IPD RF filters with great efficiency have been created by 3D Glass Solutions. In addition, 5G technology is expected to be implemented in the US, Japan, South Korea, UK, Germany, and China by 2021, which is projected to support the expansion of the market for integrated passive devices in the ensuing years.
Market Restraining Factors
Ipds Are More Expensive Than Discrete Components
The market for integrated passive devices is being constrained by IPDs' high cost when compared to discrete components. Long-term effects are anticipated to be minimal because major companies in this industry are working to bring down the price of IPDs. To optimize profitability, low-cost manufacturing is also crucial. Traditional printed circuit boards, however, are not specified for IPDs; rather, they are for individual discrete components. Using traditional PCBs with IPDs results in additional costs. A single discrete component's cost to IPD is 1:31 (1.5 X 1.5). This is partly because discrete components have become commodities and are widely used.
Application Outlook
On the basis of Application, The Integrated Passive Devices market is segmented into Electrostatic discharge/electromagnetic interference (ESD/EMI) Protection, Radio frequency, LED lighting, and Digital & mixed-signal IPD. The Electrostatic discharge/electromagnetic interference (ESD/EMI) Protection segment acquired the highest revenue share in the integrated passive device market in 2021. It is due to the adoption of these passive integrated components in mobile phones is a major driver of this market's expansion. Over the next nine years, it is anticipated that the EMS and EMI protection product segments would experience significant growth. These solutions avoid transmission loss and enhance signal reception.
End-Use Outlook
Based on End-use, The Integrated Passive Devices market is classified into Automotive, Consumer electronics, Healthcare, and Others. The consumer electronics segment recorded a substantial revenue share in the integrated passive device market in 2021. The main driver of the market expansion for integrated passive devices is the rising adoption of smartphones and other IoT devices. Additionally, technological developments like smaller chips have made it possible for electrical gadgets to be smaller, which helps to explain why consumer electronics like mobile phones, LED televisions, tablets, and laptops are becoming more and more popular.
Regional Outlook
Region wise, The Integrated Passive Devices market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Europe segments procured the highest revenue share in the integrated passive device market in 2021. Key vendors like Infineon Technologies AG, STMicroelectronics, and IPDiA that provide cutting-edge products based on efficient research and development are present in this region, which contributes to the growth. Additionally, the developments serve a variety of industries, including healthcare, automobile, and electronics, generating significant investment in this region.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Infineon Technologies AG, Jiangsu Changjing Electronics Technology Co., Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ON Semiconductor Corporation, Murata Manufacturing Co., Ltd., Johanson Technology, Inc., and OnChip Devices, Inc.
Market Segments covered in the Report:
By Application
By End User
By Geography
Companies Profiled
Unique Offerings from KBV Research
List of Figures