共封装光学元件 (CPO) 与光互连专利格局分析 (2026)

主要特点

• 包含 80 多张投影片的 PDF 文件
• Excel 文件（包含 1300 多个专利族）
• 全球专利趋势，包括专利揭露趋势随时间的变化以及申请国家/地区
• 知识产权领域的主要专利持有人和新进入者
• 主要进入者的智慧财产权地位和专利组合的相对实力
• 自 2020 年以来专利持有人智慧财产权领导地位的变化
• 主要进入者的智慧财产权概况（专利组合概述、技术覆盖范围、地理覆盖范围、重要专利和近期智慧财产权活动）
• 包含本报告分析的所有专利的 Excel 资料库（带有指向更新后的线上资料库的超连结）。

共封装光元件 (CPO) 是新一代电子产品的关键基础技术。

人工智慧 (AI) 正在重塑产业格局，推动前所未有的数据成长，并加速对节能运算的需求。资料量的指数级成长需要硬体创新，特别是透过重新思考资料中心架构，以实现更快的运算速度、更低的功耗、更高的效能和更低的延迟。在此背景下，硅光子技术已成为取代传统铜互连、实现高速光资料传输的关键技术。随着对数据密集型计算的需求持续增长，半导体行业已构建了庞大的专利组合，旨在将光子系统和电子系统整合到封装层级。这些发明共同凸显了产业从传统电互连向光输入/输出 (I/O) 架构的转型，从而在运算和网路平台上实现更高的频宽、更低的延迟和更高的能源效率。其中一项最重要的进展是共封装光学元件 (CPO)，这是一种创新的封装技术，它将光学元件直接放置在电子设备内部或附近，从而最大限度地提高效率和可扩展性。

过去十年，CPO 和光学 I/O 技术已成为先进半导体封装的关键基础技术，导致专利申请活动激增，并显着改变了智慧财产权 (IP) 的竞争格局。虽然主要专利持有者已在美国、中国和欧洲巩固了其智慧财产权地位，但纯粹的专利持有者也已进入专利领域。现在，对于在半导体先进封装行业运营的公司而言，从智慧财产权的角度仔细审视技术和竞争格局至关重要。

为此，KnowMade 发布了一份新的专利格局报告，该报告以可视化的方式呈现了塑造这一快速发展领域的专利活动和竞争动态。报告从 1300 多个专利族（发明）中选取了 4000 多项独立专利。本报告旨在深入分析当前的智慧财产权活动、主要智慧财产权参与者的地位、其专利涵盖的应用领域，以及专利组合如何支持其市场策略。

了解关键趋势及主要智慧财产权参与者的智慧财产权地位及策略

透过专利分析，我们阐明了智慧财产权参与者的地位，并阐明了其智慧财产权组合增强策略。我们重点关注竞争对手的专利申请活动及其限制自由实施 (FTO) 的能力，识别有潜力的新进入者，并预测未来的智慧财产权领导者。智慧财产权竞争分析应反映参与者对先进半导体封装市场进入和业务发展策略的愿景。

本报告全面概​​述了与 CPO 和光 I/O 技术相关的竞争格局和最新技术趋势。本报告涵盖智慧财产权 (IP) 趋势和关键发展，包括专利申请、专利持有人、申请国、专利技术和目标应用。报告中还列出了知识产权领域的领导企业和最活跃的专利申请者，并重点介绍了该领域中知名度较低的公司和新晋企业。此外，该报告还列出了 270 多项在关键技术市场中地域覆盖范围最广的关键发明。

动态的智慧财产权环境：主要参与者的地位与纯专利厂商的演变

台积电和英特尔引领专利格局，不断增加专利申请活动，并在关键国家扩大发明保护范围。身为先驱者，英特尔正采取积极的策略来维护其专利权益。随后，台积电和其他专注于智慧财产权领域的公司（Lightmatter、Celestial AI、Ayar Labs 和 Avicena Tech）也加入了智慧财产权领域，并建立了策略性专利组合。

近年来，越来越多的智慧财产权企业进入智慧财产权领域，包括 OSAT（半导体封装测试外包）公司和材料供应商。

本报告概述了智慧财产权领域主要新兴企业的智慧财产权组合，并介绍了相关的发明和技术。

实用 Excel 专利资料库

本报告附带一个内容丰富的 Excel 资料库，其中包含本研究分析的所有专利。它包含专利资讯（编号、日期、所有者、标题、摘要、法律状态等）以及指向更新的线上资料库（来源文件、法律状态等）的超连结。

本报告中提及的公司（节录）

英特尔、台积电、华为、博通、思科、Lightmatter、Avicena、Celestial AI、Rockley Photonics、Ayar Labs、Ranovus、三星集团、英伟达、Teramount、中兴通讯、Resonac、Marvell、诺基亚、甲骨文、美光、Senkobet、VTT Technologies、锐捷网路、Eliyan、三菱电机、LIPAC、RTX Corporation、惠普（惠普发展）、紫光集团（UnilC）、扬州新力积体电路、瞻博网路、苏州奇点光子智慧科技、华工科技、NCAP、CEA、ASTAR、住友电工、江电科技、苹果、GlobalFoundries、日木、Nuble Technology、Lightelligence、浙江凌鑫光电科技、康宁、中山美索科技、Nano Photonics、广本威科技、无锡互连技术研究院、李宏电子、永江实验室、中芯国际、清华大学、天天半导体、Elphic、Lightip Technology、NTT -日本电报电话公司、群创光电、上海希智科技、联合测试组装中心、科克大学学院、Lumentum、汉阳大学、古河电气、瑞泰科技、杭州广智源科技、东莞立讯精密、PICadvanced、SPIL、武汉光谷资讯光电创新中心、MACOM Technology Solutions、Ciena、MaxLine AI、Browave、迅云电子科技、Xperi/Adeia、香港科技大学、工研院

目录

引言

执行摘要

专利概览

• 知识产权动态
• 依公司部门划分的专利揭露趋势
• 主要专利受让人（一般专利、核心发明、动态）
• 主要知识产权参与者时间轴
• 主要智慧财产权所有者及其目前法律地位
• 智慧财产权领导地位（2020 年及 2025 年一般专利、2025 年核心发明）
• 有效专利（1. 专利的地域范围（一般发明、核心发明））
• 国内与全球智慧财产权策略（全球智慧财产权与核心发明）
• 具有策略地域范围的专利族

用于选择专利受让人的智慧财产权概况

关于每位参与者：

• 专利组合概览（知识产权动态、细分、法律地位、地理范围等）
• 重要专利描述
  • Inte
  • TSMC
  • Avicena
  • Samsun
  • Cisco
  • ASE Group
  • Broadcom (Avago)
  • Ayar Labs
  • Celestial AI
  • Lightmatter

附录

• 专利检索、选择与分析研究方法
• 术语表

KNOWMADE 简报

Key Features

• PDF with > 80 slides
• Excel file > 1,300 patent families
• Global patenting trends, including time evolution of patent publications, countries of patent filings, etc.
• Main patent assignees and IP newcomers
• Key players' IP position and the relative strength of their patent portfolio
• IP leadership evolution of patent assignees since 2020
• IP profile of key players (patent portfolio overview, technical coverage, geographical coverage, notable patents, recent IP activity)
• Excel database containing all patents analyzed in the report, including hyperlinks to an updated online database.

Co-packaged optics is now a key enabler of next-gen electronics

Artificial intelligence (AI) is reshaping industries at their core, fueling unprecedented data growth and accelerating the demand for energy-efficient computing. As data volumes surge, hardware innovation has become essential, particularly in rethinking data center architectures to deliver faster computation, lower power consumption, higher performance, and reduced latency. In this context, silicon photonics has emerged as a pivotal technology, replacing traditional copper interconnects with high-speed, light-based data transmission. As demand for data-intensive computing continues to rise, the semiconductor industry has built a substantial portfolio of patents aimed at integrating photonic and electronic systems at the package level. Together, these inventions highlight the industry's transition from conventional electrical interconnects to optical input/output (I/O) architectures that unlock higher bandwidth, lower latency, and improved energy efficiency across compute and networking platforms. Among the most significant advances is Co-Packaged Optics (CPO), an innovative packaging approach that brings optical components directly into or near electronic devices to maximize efficiency and scalability.

Over the past 10 years, CPO and optical I/O technologies has become a key enabler of advanced semiconductor packaging, leading to a strong increase in patenting activity and a significant evolution of the competitive intellectual property (IP) landscape. Major patent owners have strengthened their IP positions in the US, China, and Europe, while pure players have entered the patent landscape. It is now crucial for companies operating in the semiconductor advanced packaging industry to closely examine the technology and competitive landscape from an IP perspective.

In this context, KnowMade is releasing a new patent landscape report to map the patent activity and competitive dynamics shaping this rapidly evolving field. Over 4,000 individual patents from more than 1,300 patent families (inventions) have been selected. This report aims to provide insights into current IP activities, the positions of key IP players, the applications they target in their patents, and how their patent portfolios can support their market strategies.

Understanding the main trends, the key players' IP position and IP strategy

Through patent analysis, we describe the position of IP players, unveil their strategies to strengthen their IP portfolio, highlight their capability to limit the patenting activity and freedom-to-operate of other firms, identify promising new players, and forecast what would be the future IP leaders. IP competition analysis should reflect the vision of players with a strategy to enter and develop their business in the advanced semiconductor packaging market.

In this report, we provide a comprehensive overview of the competitive IP landscape and latest technological developments related to CPO and optical I/O technology. The report covers IP dynamics and key trends in terms of patents applications, patent assignees, filing countries, patented technologies, and targeted applications. It also identifies the IP leaders, most active patent applicants, and sheds light on under-the-radar companies and new players in this field. Besides, we have identified over 270 key inventions that are most critical in terms of geographic coverage in key technology markets.

A dynamic IP landscape: evolution of leading players' positions and pure players

TSMC and Intel are leading the patent landscape, increasing patenting activity, and expanding invention protection in key countries. As pioneer Intel has adopted an aggressive strategy to assert its patents. Later TSMC and pure players (Lightmatter, Celestial AI, Ayar Labs, Avicena Tech) joined the IP landscape and developed strategic portfolios.

In recent years, more IP players have become involved in the IP landscape, and OSATs and materials suppliers have entered the IP arena.

In this report, we provide an overview of the IP portfolios held by the key players emerging from the IP landscape and describe the related inventions and technologies.

Useful Excel patent database

This report includes an extensive Excel database with all patents analyzed in this study, including patent information (numbers, dates, assignees, title, abstract, legal status, etc.) and hyperlinks to an updated online database (original documents, legal status, etc.).

Companies mentioned in the report (non-exhaustive)

Intel, TSMC, Huawei, Broadcom, Cisco, Lightmatter, Avicena, Celestial AI, Rockley Photonics, Ayar Labs, Ranovus, Samsung Group, NVIDIA, Teramount, ZTE, Resonac, Marvell, Nokia, Oracle, Micron, Senko Group, VTT, Alphabet, Accelink Technologies, Ruijie Networks, Eliyan, Mitsubishi Electric, LIPAC, RTX Corporation, HP - Hewlett Packard Development, UnilC (Tsinghua Unigroup), Yangzhou Xinli Integrated Circuit, Juniper, Suzhou Singularity Photon Intelligent Technology, Huagong Tech, NCAP, CEA, ASTAR, Sumitomo Electric, JCET Group, Apple, GlobalFoundries, ASE Group, Nubis communications, Amkor Technology, Lightelligence, Zhejiang Lingxin Optoelectronics Technology, Corning, Zhongshan Meisu Technology, Nano Photonics, Guangbenwei Technology, Wuxi institute of interconnect technology, Li Hong Electronic, Yongjiang Laboratory, SMIC, Tsinghua University, Sky Semiconductor, Elphic, Lightip Technologie, NTT - Nippon Telegraph & Telephone, Innolux, Shanghai Xizhi Technology, United Test and Assembly Center, University College Cork, Lumentum, Hanyang University, Furukawa Electric, Raytek, Hangzhou Guangzhiyuan Technology, Dongguan Luxshare Technology, PICadvanced, SPIL, Wuhan Optics Valley Information Optoelectronics Innovation Center, MACOM Technology Solutions, Ciena, MaxLinear, AIP - Advanced Integrated Photonics, Lyte AI, Browave, Xunyun Electronic Technology, Xperi/Adeia, HKUST - Hong Kong University of Science And Technology, ITRI - Industrial Technology Research Institute.

TABLE OF CONTENTS

INTRODUCTION

• Context and objectives of the report
• Scope of the report
• Definitions
• Reading guide
• Excel database

EXECUTIVE SUMMARY

PATENT LANDSCAPE OVERVIEW

• IP dynamics
• Time evolution of patent publications by company HQ
• Main patent assignees (general, core inventions, dynamics)
• Timeline of main IP players
• Main IP players and current legal status of their patents
• IP leadership (general 2020 & 2025, 2025 core inventions)
• Geographic coverage of active patents (general, core inventions)
• Domestic vs. Global IP strategies (global IP and core inventions)
• Patent families with a strategic geographic coverage

IP PROFILE OF A SELECTION OF PATENT ASSIGNEE

For each player:

• Patent portfolio overview (IP dynamics, segments, legal status, geographic coverage, etc.)
• Description of notable patents
  • Inte
  • TSMC
  • Avicena
  • Samsun
  • Cisco
  • ASE Group
  • Broadcom (Avago)
  • Ayar Labs
  • Celestial AI
  • Lightmatter

ANNEX

• Methodology for patent search, selection and analysis
• Terminology

KNOWMADE PRESENTATION