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晶圆探针台市场 - 2023-2028 年预测
市场调查报告书
商品编码
1295332

晶圆探针台市场 - 2023-2028 年预测

Wafer Prober Market - Forecasts from 2023 to 2028
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 110 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

晶圆探针台市场预计到 2028 年将达到 18.46 亿美元，较 2021 年估计的 11.96 亿美元市场规模以 6.40% 的复合年增长率增长。

晶圆探测器是一种用于在半导体开发和製造过程中对晶圆进行电气检查的系统。然而，在经济不确定的情况下，由于消费者需求疲软，半导体行业的增长率预计将下降，从而影响晶圆探针台市场。

在电子测量中，使用探针和探针卡将来自测量仪器和测量设备的信号发送到晶圆上的专用设备，然后将信号发回。晶圆探针用于操纵晶圆与器件的预期表面接触。

晶圆探针还用于半导体开发中原型 IC 的特性测试、可靠性测试和缺陷检测。器件工艺评估涉及TEG（测试元件组）的高精度测量和评估，包括IC晶体管、互连件和其他IC元件。

此外，市场分为全自动、半自动和手动。每种类型都满足半导体行业的不同需求。全自动晶圆探针台以其高精度、精密度和速度而闻名，使其成为大批量生产环境的理想选择。另一方面，半自动晶圆探针台在精度和灵活性之间提供了良好的平衡，并且比手动探针台更准确。手动晶圆探针台适用于小批量生产、研发和学术机构。

律师事务所对机器学习实施的需求不断增长正在推动市场。

信息和通信技术的兴起以及向数字社会的过渡将在短期内增加对半导体的需求。因此，对半导体製造设备的技术要求变得越来越复杂且难以满足。除了工艺扩展之外，3D 堆迭在业界越来越受欢迎，因为它可以实现大量设备和异构组件的高级封装。

对电子设备的需求不断增长正在加速晶圆探测器市场的发展。

这是因为这些设备严重依赖半导体芯片。晶圆探针台在半导体芯片集成到电子设备之前测试和验证半导体芯片的性能和功能，确保它们满足所需的质量和可靠性标准。製造商正在投资更先进的晶圆探针技术，以满足对高性能芯片不断增长的需求。

市场趋势：

  • 2021 年 8 月，Tokyo Electron Ltd. 宣布推出下一代 300mm 晶圆探针台 Prexa(TM)。
  • 全自动低温晶圆探针机制在4 开尔文温度以下运行，2021 年6 月，由领先的半导体测试和测量提供商FormFactor 开发，该技术公司为全球安全和人类发现做出贡献与诺斯罗普格鲁曼公司的合作使其可加速超导计算应用的开发。
  • Semi-Probe 是一家领先的全自动晶圆探针製造商，为 MEM 提供晶圆探针。该公司于2020年6月发布的“全自动真空探测系统”为150mm可编程，并配备防振台。它具有物料搬运单元、预对准器和末端执行器。SEMISHARE宣布A12全自动晶圆探测机于2022年7月量产。展出的最先进的A12探针台包括自动晶圆展开和装载、全微米级闭环运动管理、晶圆自动精确针对准、自动精确光学测量、快速反馈交互和数据信息。它包括处理等创新。

从地区来看，亚太市场由于良好的市场发展而不断增长。

亚太地区是半导体技术的先驱，以其最先进的半导体製造设备而闻名，在台湾、中国、日本和韩国设有製造基地。该地区是Taiwan Semiconductor Manufacturing Co、Samsung Electronics、SK Hynix、HI Silicon等大公司的所在地。亚太地区进一步分为中国、日本、韩国、台湾等。

主要市场参与者包括 Advantest Corporation、Teradyne Inc.、FormFactor Inc.、Tokyo Electron Ltd. (TEL) 和 MPI Corporation。Advantest Corporation 和 Teradyne, Inc. 是全球领先的自动测试设备 (ATE) 和晶圆探测解决方案供应商。同时，FormFactor Inc. 是探针卡和探针台领域的知名参与者。

目录

第 1 章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场细分
  • 货币
  • 先决条件
  • 基准年和预测年的时间表

第二章研究方法论

  • 调查数据
  • 调查过程

第三章执行摘要

  • 调查亮点

第四章市场动态

  • 市场驱动力
  • 市场製约因素
  • 波特五力分析

5.晶圆探针市场，按类型

  • 介绍
  • 全自动
  • 半自动
  • 手动的

第六章晶圆探针台市场：按地区

  • 介绍
  • 美洲
    • 按类型
    • 按国家
  • 欧洲、中东/非洲
    • 按类型
    • 按国家
  • 亚太地区
    • 按类型
    • 按国家

第七章竞争环境及分析

  • 主要公司及战略分析
  • 初创企业和市场盈利能力
  • 併购 (M&As)、协议与合作
  • 供应商竞争力矩阵

第八章公司简介

  • FormFactor
  • Micronics Japan Co., Ltd.
  • SV Probe
  • Hprobe
  • MPI Corporation
  • Advantest Corporation
  • Tokyo Electron
  • SemiProbe
  • Technoprobe
  • Semidice
简介目录
Product Code: KSI061613015

The wafer prober market is expected to grow at a CAGR of 6.40% from an estimated market size of US$1.196 billion in 2021 to reach US$1.846 billion in 2028.

Wafer prober is a system used in the semiconductor development and manufacturing process for the electrical testing of wafers. Although the semiconductor sector growth rate is expected to decline due to weak consumer demand amidst uncertain economic conditions, affecting the wafer prober market.

In electronic measurement, the signal from the measuring instrument or measuring device is sent with a probe or probe card to a special device on the wafer, and the signal is sent back. Wafer probes are used to manipulate the wafer so that it can touch the intended surface of the device.

In addition, wafer probes are used to test prototype ICs' properties, reliability testing, and defect detection in semiconductor development. Device and process evaluation involves high-precision measurement and assessment of the Test Element Group (TEG), including transistors, interconnects, and other IC component elements for ICs.

Moreover, the market is segmented into fully automatic, semi-automatic, and manual. Each type caters to the different needs of the semiconductor industry. Fully Automatic wafer probers are known for their high precision, accuracy, and speed, making them ideal for mass-production environments. In contrast, semi-automatic wafer probers balance precision and flexibility and are more accurate than manual probers. Manual wafer probers are suitable for low-volume production, research and development, and academic institutions.

The growing demand for semiconductors is driving the wafer prober market.

The rise of information and communication technologies and the ongoing transition to a digital society will increase demand for semiconductors in the short term. As a result, the technological requirements for semiconductor manufacturing equipment are becoming increasingly sophisticated and difficult to meet. In addition to process scaling, 3D stacking is gaining popularity in the industry as it enables advanced packaging that includes many devices and heterogeneous components.

The increasing demand for electronic devices is accelerating the wafer prober market.

This is because these devices are heavily reliant on semiconductor chips. Wafer probers test and verify the performance and functionality of semiconductor chips before they are integrated into electronic devices, ensuring that they meet the required standards for quality and reliability. Manufacturers are investing in more advanced wafer prober technologies to keep up with the growing demand for high-performance chips.

Market Developments:

  • In August 2021, Tokyo Electron Limited announced the launch of Prexa™, the next generation 300mm wafer prober.
  • In June 2021, a fully automated cryogenic wafer probe mechanism operating at 4 Kelvin and below was made available by FormFactor, a leading semiconductor test, and measurement provider, in partnership with Northrop Grumman Corporation, a technology company dedicated to global security and human discovery, to speed the development of superconducting compute applications.
  • Semiprobe is one of the leading fully-automated wafer probe manufacturers that supply wafer probes to MEMs. The company's Fully Automatic Vacuum Probing System, launched in June 2020, is 150 mm programmable and has a vibration isolation table. The device has a material handling unit, pre-aligner, and end-effector. SEMISHARE introduced the A12 fully-automatic wafer probing machine for mass production in July 2022; the state-of-the-art A12 probe station on display includes innovations such as automatic wafer unfolding and loading, micron-level full-closed-loop motion management, automatic, accurate needle alignment of Wafer, automatic and precise optical measurement, high-speed feedback interaction, and data information processing.

Based on geography, the Asia Pacific market is growing due to favorable developments.

The Asia Pacific has been a pioneer in semiconductor technology, with manufacturing units located in Taiwan, China, Japan, and South Korea, known for their advanced semiconductor fabrication facilities. The region has the presence of several key companies like Taiwan Semiconductor Manufacturing Co, Samsung Electronics, SK Hynix, and HI Silicon, among others. The Asia Pacific region is further analyzed into China, Japan, South Korea, Taiwan, and others.

Major market players include Advantest Corporation, Teradyne Inc., FormFactor Inc., Tokyo Electron Limited (TEL), and MPI Corporation. Advantest Corporation and Teradyne Inc. are leading global providers of automatic test equipment (ATE) and wafer probing solutions. At the same time, FormFactor Inc. is a prominent player in probe cards and probe stations.

Market Segmentation:

By Type

  • Fully Automatic
  • Semi-Automatic
  • Manual

By Geography

  • Americas
  • USA
  • Others
  • Europe, Middle East and Africa
  • Germany
  • France
  • United Kingdom
  • Others
  • Asia Pacific
  • China
  • South Korea
  • Japan
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Research Highlights

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Force Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
    • 4.3.6. Industry Value Chain Analysis

5. WAFER PROBER MARKET, BY TYPE

  • 5.1. Introduction
  • 5.2. Fully Automatic
  • 5.3. Semi-Automatic
  • 5.4. Manual

6. WAFER PROBER MARKET, BY GEOGRAPHY

  • 6.1. Introduction
  • 6.2. Americas
    • 6.2.1. By Type
    • 6.2.2. By Country
    • 6.2.2.1. United States
    • 6.2.2.2. Others
  • 6.3. Europe, Middle East and Africa
    • 6.3.1. By Type
    • 6.3.2. By Country
    • 6.3.2.1. Germany
    • 6.3.2.2. France
    • 6.3.2.3. United Kingdom
    • 6.3.2.4. Others
  • 6.4. Asia Pacific
    • 6.4.1. By Type
    • 6.4.2. By Country
    • 6.4.2.1. China
    • 6.4.2.2. South Korea
    • 6.4.2.3. Japan
    • 6.4.2.4. Taiwan
    • 6.4.2.5. Others

7. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 7.1. Major Players and Strategy Analysis
  • 7.2. Emerging Players and Market Lucrativeness
  • 7.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 7.4. Vendor Competitiveness Matrix

8. COMPANY PROFILES

  • 8.1. FormFactor
  • 8.2. Micronics Japan Co., Ltd.
  • 8.3. SV Probe
  • 8.4. Hprobe
  • 8.5. MPI Corporation
  • 8.6. Advantest Corporation
  • 8.7. Tokyo Electron
  • 8.8. SemiProbe
  • 8.9. Technoprobe
  • 8.10. Semidice