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液体封装市场：2023年至2028年预测
市场调查报告书
商品编码
1410229

液体封装市场：2023年至2028年预测

Liquid Encapsulation Market - Forecasts from 2023 to 2028
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 132 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

液体封装市场预计将从 2021 年的 17.03 亿美元增至 2028 年的 23.32 亿美元，预测期内复合年增长率为 4.59%。

液体封装是将聚合物、金属和陶瓷等物质涂布固体或液体设备以保护其免受衝击和潮湿的方法。此保护层用于维持设备功能并防止电气组件之间断开连接。这种封装製程通常使用环氧树脂和环氧改质材料。

液体封装市场的动态成长归因于几个关键因素。首先，电子设备日益复杂、可操作性不断提高，加上电气元件小型化的趋势，正在推动市场扩张。此外，通讯和电子产业的快速成长以及对感测器设备、无线技术和光电子学的需求不断增长，导致封装技术的使用不断增加。例如，2023年6月，滑铁卢大学宣布了该大学研究部门开发的一项新封装技术—液体封装系统。这项创新将能耗显着降低了至少 5000 倍，并且在封装过程中不使用微塑胶。

半导体在各行业的不断扩大应用正在推动市场成长。

半导体元件小型化的不断增长趋势正在推动对液体封装技术的需求。此方法用于底部填充、空腔填充、先进封装和球顶封装等任务，在半导体装置的生产中至关重要。它可以提高更小、更复杂的电子设备的效率，而不会影响品质。由于电子设备和半导体由需要精确放置的精密元件组成，这些因素预计将推动市场成长。液体封装对于设备运作也至关重要，可防止电子设备组件发生故障，从而加速成长。

根据半导体产业协会（SIA）按地区分類的全球半导体产业销售额，2022年中国将引领全球半导体产业销售额，销售额达156.7亿美元，紧追在后的是美洲，销售额创历史新高118.4亿。其次是亚太/世界其他地区，其销售额也很可观，总合129.1 亿美元，反映了全球市场的动态和竞争。半导体销售成长在加强液体封装市场方面发挥关键作用。

台湾液态封装市场预计将稳定成长。

液体封装是MEMS元件的一种开发技术。与环氧树脂封装相比，液体封装更加弹性，因此被用于半导体、板载晶片、IC和电晶体等应用。台湾是主要的半导体製造国家之一，由于电气电子设备和汽车等终端用户对IC的需求迅速增长，IC的产量大幅增加。例如，根据台湾半导体工业协会的数据，2022年台湾IC销售额为新台币4.837万亿，比2021年的新台币4.82万亿增长18.5%。

此外，台湾国家科学技术委员会积极努力加强台湾在全球范围内的积体电路製造领域的影响力，进一步促进了市场的成长。此外，日东电工公司和台湾 PU 公司等主要液体封装供应商的强大影响力也是市场的驱动因素。此外，汽车MEMS的应用不断扩大，如惯性感测器、气体感测器、光学感测器、压力感测器等，以及这些最终用户的加速成长，也有助于保护MEMS免受外部环境因素影响的液体胶囊。预计这将同时增加对根据国际汽车工业组织预测，2022年台湾汽车产量为265,320辆，较2020年的245,615辆增加6%。

市场主要发展

2022 年 1 月，TDK 推出了 SmartMotion(TM) 超高效能係列，该系列采用尖端的 BalancedGyro(TM) 技术和适用于消费性应用的最低功耗。 TDK 公司推出 InvenSense ICM-45xxx SmartMotion(TM) 超高性能 (UHP) 6 轴 MEMS 运动感测器系列，为产业性能和效率树立了新标准。 2021 年 6 月 汉高的 Technomelt 低压成型技术满足电子和医疗零件封装的最新要求，并正在获得各行业的认可。该技术在医疗、电子、电力、工业自动化、暖通空调和照明领域的应用越来越广泛。与反应性树脂系统灌封和高压射出成型等替代方案相比，该技术具有多种经济、製程控制、设计和环境优势，因此脱颖而出。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表

第二章调查方法

  • 调查资料
  • 先决条件

第三章执行摘要

  • 研究亮点

第四章市场动态

  • 市场驱动因素
  • 市场抑制因素
  • 波特五力分析
  • 产业价值链分析

第五章液体封装市场：依材料分类

  • 介绍
  • 环氧树脂
  • 环氧改质树脂
  • 其他的

第六章液体封装市场：副产品

  • 介绍
  • 积体电路
  • 光电子学
  • 感应器
  • 其他的

第七章液体封装市场：依应用分类

  • 介绍
  • 车
  • 通讯和技术
  • 家用电器
  • 製造业

第八章液体封装市场：依地区

  • 介绍
  • 美洲
    • 美国
    • 其他的
  • 欧洲、中东/非洲
    • 德国
    • 英国
    • 法国
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 台湾
    • 韩国
    • 其他的

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作

第十章 公司简介

  • BASF
  • Epic Resins
  • Panasonic Corporation
  • Sumitomo Bakelite
  • KYOCERA Chemical Corporation
  • Shin-Etsu Chemical
  • Nagase & Co.
  • Nitto Denko Corporation
  • Resin Technical systems
  • CAPLINQ Corporation BAE Systems
简介目录
Product Code: KSI061610206

The liquid encapsulation market is projected to grow at a CAGR of 4.59% during the forecast period to reach US$2.332 billion by 2028, from US$1.703 billion in 2021.

Liquid encapsulation is a method that entails the application of substances such as polymers, metals, and ceramics to solid or liquid devices to shield them from shocks and moisture. This protective layer is employed to maintain device functionality and prevent disconnections among electrical components. Epoxy resin and epoxy-modified substances are commonly employed for this encapsulation process.

The dynamic growth of the liquid encapsulation market can be attributed to several key factors. Firstly, the increasing complexity and operability of electronic devices, coupled with the trend toward miniaturized electrical components, are driving market expansion. Additionally, the rapid growth of the telecommunications and electronics industries, alongside the rising demand for sensor devices, wireless technologies, and optoelectronics, has led to greater utilization of encapsulation methods. For example, in June 2023, the University of Waterloo introduced a novel encapsulation technology developed by its research department known as the liquid-liquid encapsulation system. This innovation boasts significantly lower energy consumption, being at least 5000 times less intensive, and it eliminates the use of microplastics during encapsulation.

The growing application of semiconductors across various industries is propelling the market growth.

The surging trend towards miniaturized semiconductor devices is fueling the demand for liquid encapsulation technology. This method is vital in the production of semiconductor devices, used for tasks like under-filling, cavity filling, advanced packaging, and glob-top encapsulation. It enhances the efficiency of smaller, more intricate electronic devices without compromising quality. As electronics and semiconductors consist of delicate components requiring precise placement, this factor is expected to boost market growth. Liquid encapsulation is also crucial for device operation, preventing component malfunctions in electronic devices, thus accelerating its growth.

According to The Semiconductor Industry Association (SIA) global semiconductor industry sales by region, data shows that in 2022, the global semiconductor industry sales were led by China, with sales figures reaching $15.67 billion, closely followed by the Americas, which recorded sales of $11.84 billion. Subsequently, the Asia-Pacific/all other regions also showed substantial sales, totalling $12.91 billion, reflecting a dynamic and competitive global market. Increased sales of semiconductor plays a pivotal role in bolstering the liquid encapsulation market as they create demand for miniaturized semiconductor devices resulting in a surge in its market growth.

It is projected that the Taiwan liquid encapsulation market will grow steadily.

Liquid encapsulation refers to the technology of developing MEMS devices and in comparison, to epoxy molded compounds liquid encapsulant's high flexibility enables them to be used in semiconductor, chip-on-board, ICs, and transistors applications. Taiwan is one of the leading semiconductor manufacturing countries and with booming end-user demand for ICs in electrical & electronics and automotive, the country is witnessing a significant increase in its ICs production which is expected to provide a positive scope for the usage of liquid encapsulation technology for boosting the mechanical strength of wire-bonded devices. For instance, according to the Taiwan Semiconductor Industry Association, in 2022, Taiwan's IC revenue stood at NT$4,837 billion which represented an 18.5% increase over 2021's revenue figure of NT$4,082 billion.

Moreover, the favorable initiatives undertaken by the National Science and Technology Council, Taiwan to bolster the country's presence in IC manufacturing on a global scale has further augmented the market growth. Furthermore, the well-established presence of major liquid encapsulant providers such as Nitto Denko Corporation and Taiwan PU Corporation is acting as an additional driving factor. Also, the growing applicability of MEMS in automotive for inertia, gas, optical, and pressure sensors coupled with the bolstering growth in such end-users is anticipated to simultaneously increase the demand for liquid encapsulation for safeguarding MEMS from external environment factors. According to the International Organization of Motor Vehicle Manufacturers, in 2022, Taiwan's automotive production stood at 2,65,320 units which signified a 6% increase over 2020's production volume of 2,45,615.

Market Key Developments

  • In January 2022, TDK introduced its SmartMotion™ ultra-high-performance family, featuring cutting-edge BalancedGyro™ technology and the lowest power consumption available for consumer applications. TDK Corporation unveiled the InvenSense ICM-45xxx SmartMotion™ ultra-high-performance (UHP) family of 6-axis MEMS motion sensors, setting new standards for performance and efficiency in the industry.
  • In June 2021, Henkel's Technomelt Low-Pressure Molding technology, which aligns with the latest requirements for encapsulating electronics and medical components, is gaining traction in various industries. This technology is finding increased application in medical, electronic components, power, industrial automation, HVAC, and lighting sectors. It stands out by providing several economic, process control, design, and environmental benefits when compared to alternative methods, including potting with reactive resin systems and high-pressure injection molding.

Segmentation:

By Materials

  • Epoxy Resins
  • Epoxy-Modified Resins
  • Others

By Product

  • Integrated circuit
  • Optoelectronics
  • Sensors
  • Others

By Application

  • Automotive
  • Communication and Technology
  • Consumer Electronics
  • Manufacturing

By Geography

  • Americas
  • USA
  • Others
  • Europe, Middle East and Africa
  • Germany
  • UK
  • France
  • Others
  • Asia Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Assumptions

3. EXECUTIVE SUMMARY

  • 3.1. Research Highlights

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Force Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. LIQUID ENCAPSULATION MARKET BY MATERIALS

  • 5.1. Introduction
  • 5.2. Epoxy Resins
  • 5.3. Epoxy-Modified Resins
  • 5.4. Others

6. LIQUID ENCAPSULATION MARKET BY PRODUCT

  • 6.1. Introduction
  • 6.2. Integrated circuit
  • 6.3. Optoelectronics
  • 6.4. Sensors
  • 6.5. Others

7. LIQUID ENCAPSULATION MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Automotive
  • 7.3. Communication and Technology
  • 7.4. Consumer Electronics
  • 7.5. Manufacturing

8. LIQUID ENCAPSULATION MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. Americas
    • 8.2.1. USA
    • 8.2.2. Others
  • 8.3. Europe, Middle East and Africa
    • 8.3.1. Germany
    • 8.3.2. UK
    • 8.3.3. France
    • 8.3.4. Others
  • 8.4. Asia Pacific
    • 8.4.1. China
    • 8.4.2. Japan
    • 8.4.3. Taiwan
    • 8.4.4. South Korea
    • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations

10. COMPANY PROFILES

  • 10.1. BASF
  • 10.2. Epic Resins
  • 10.3. Panasonic Corporation
  • 10.4. Sumitomo Bakelite
  • 10.5. KYOCERA Chemical Corporation
  • 10.6. Shin-Etsu Chemical
  • 10.7. Nagase & Co.
  • 10.8. Nitto Denko Corporation
  • 10.9. Resin Technical systems
  • 10.10. CAPLINQ Corporation BAE Systems