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市场调查报告书
商品编码
1456985

全球低温钴烧陶瓷基板市场 - 2024 年至 2029 年预测

Global Low Temperature Co Fired Ceramic Substrate Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 114 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

全球低温钴烧陶瓷基板市场预计复合年增长率为7.87%，市场规模从2022年的86.8亿美元增加至2029年的147.56亿美元。

低温钴烧陶瓷（LTCC）是一种多层微晶玻璃基板，透过在低烧成温度（低于1,000°C）下烧製银或铜等钴低电阻金属导体而製成。小型、轻量且能够高速运作的电子元件和基板正在变得流行。

市场驱动因素：

  • 各种最终用途领域的需求增加。

通讯、医疗、汽车、工业、国防和航太等最终用途产业推动了钴烧陶瓷的需求。共烧陶瓷相对于传统印刷电路基板在提高热稳定性和化学惰性方面的优势是这些行业偏好 LTCC 和 HTCC 的根本因素。对高端计算系统和奈米技术不断增长的需求将开闢新的工业前景。

各种好处

LTCC 的优势，例如低损耗介电材料、易于整合嵌入式被动元件以及可靠的多层功能，正在推动其需求。 LTCC 中使用的陶瓷材料比标准 PCB 材料具有更低的损耗角正切。这些小型设备可以使用 LTCC 低成本製造，增加了对广泛应用于智慧型手机、电脑、行动装置和 AR/VR 应用的高频模组的需求。

市场限制因素

  • 技术问题

影响 LTCC 性能的收缩相关问题以及 LTCC 的低导热率预计将在预测期内阻碍低温钴烧陶瓷基板市场的扩张。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章全球低温钴烧陶瓷基板市场：依类型

  • 介绍
  • 射频系统级封装
  • 光电封装
  • 数组包
  • 其他的

第六章全球低温钴烧陶瓷基板市场：依最终用户产业

  • 介绍
  • 家用电器
  • 车
  • 航太和军事
  • 通讯
  • 其他的

第七章全球低温钴烧陶瓷基板市场：依地区

  • 介绍
  • 北美洲
  • 南美洲
  • 欧洲
  • 中东/非洲
  • 亚太地区

第八章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章 公司简介

  • Kyocera Corporation
  • DowDuPont, Inc.
  • Koa Speer Electronics, Inc.
  • Murata Manufacturing Co., Ltd.
  • Selmic Oy
  • TDK Corporation
  • Yokowo Co., Ltd.
  • NGK SPARK PLUG CO., LTD.
  • Adamant Namiki
  • Apitech
简介目录
Product Code: KSI061611368

The global low temperature co-fired ceramic substrate market is expected to grow at a CAGR of 7.87%, reaching a market size of US$14.756 billion in 2029 from US$8.68 billion in 2022.

Low-temperature co-fired Ceramics (LTCC) are multilayer glass-ceramic substrates that are co-fired with low resistance metal conductors at a low firing temperature (less than 1000°C) such as silver or copper. Electronic components and substrates that are compact, light, and deliver high speed have become popular.

Market Drivers:

  • Rising demand from various end-use sectors-

Telecommunications, medical, automotive, industrial, defense, and aerospace are among the end-use industries driving demand for co-fired ceramics. The robust benefits profile that co-fired ceramics have over conventional printed circuit boards in terms of improved thermal stability and the nature of their chemical inactivity is a fundamental factor for these sectors preference for LTCC and HTCC. Increased demand for high-end computing systems and nanotechnology would open up new industry prospects.

Various advantages-

The advantages of LTCC, such as low-loss dielectric materials, ease of integrating embedded passive components, and reliable multilayer capabilities have increased their demand. Ceramic material utilized in LTCC has a lower loss tangent than standard PCB material. These small devices may be made using LTCC at a low cost, which has boosted demand for radiofrequency modules, which are widely used in smartphones, personal computers, portable devices, and AR/VR applications.

Market Restraint-

  • Technical Issue-

Shrinkage-related problems affecting LTCC Performance and the low thermal conductivity of LTCC are expected to stifle the expansion of the Low-Temperature Co-fired ceramics substrate market in the projected period.

Market Segmentation:

By type, the global Low-Temperature Co-Fired ceramic substrate market is segmented into RF System Level Package, Optoelectronic Packages, Array Packages, and others. By end-user industry, the global Low-Temperature Co-Fired ceramic substrate market is segmented into consumer electronics, automotive, aerospace and military, telecommunication, and others. Due to the incorporation of sensors in many elements of cars, such as engines and power transmissions, the automotive segment holds a significant share. The consumer electronics industry has been also employing LTCC technology due to miniaturization, causing smaller electronic circuit boards to overheat.

Geographical segments:

The Asia-Pacific market is expected to the significant growth in demand for electronic devices, combined with technological developments and improvements in electronics. The country has a large number of market participants at each stage of the supply chain and has been spending heavily on new inventions and research and development. During the projected period, North America is also expected to account for a significant portion of the global market. The expansion of the electronic and automotive industries and R&D investments in North America is a major driver of the low-temperature co-fired ceramic (LTCC) substrate industry.

Market Developments:

  • March 2023- TMY Technology Inc. (TMYTEK) and Celanese collaborated to showcase an innovative Ultra-Low Size, Weight, and Power (SWaP) Electronically Steered Antenna (ESA) solution featuring Antenna-on-Chip (AoC) technology at Satellite 2023. TMYTEK, a leading provider of millimeter-wave solutions, joined forces with Celanese, a global chemical and specialty materials company, to unveil their latest advancement. The dual-polarization AoC technology was crafted using Micromax(R) GreenTape(TM) low-temperature co-fired ceramic (LTCC).

Market Segmentation:

By Type

  • RF System Level Package
  • Optoelectronic Package
  • Array Package
  • Others

By End-User Industry

  • Consumer Electronics
  • Automotive
  • Aerospace and Military
  • Telecommunication
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • UK
  • Germany
  • France
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. RF System Level Package
    • 5.2.1. Market opportunities and trends
    • 5.2.2. Growth prospects
    • 5.2.3. Geographic lucrativeness
  • 5.3. Optoelectronic Package
    • 5.3.1. Market opportunities and trends
    • 5.3.2. Growth prospects
    • 5.3.3. Geographic lucrativeness
  • 5.4. Array Package
    • 5.4.1. Market opportunities and trends
    • 5.4.2. Growth prospects
    • 5.4.3. Geographic lucrativeness
  • 5.5. Others
    • 5.5.1. Market opportunities and trends
    • 5.5.2. Growth prospects
    • 5.5.3. Geographic lucrativeness

6. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY END-USER INDUSTRY

  • 6.1. Introduction
  • 6.2. Consumer Electronics
    • 6.2.1. Market opportunities and trends
    • 6.2.2. Growth prospects
    • 6.2.3. Geographic lucrativeness
  • 6.3. Automotive
    • 6.3.1. Market opportunities and trends
    • 6.3.2. Growth prospects
    • 6.3.3. Geographic lucrativeness
  • 6.4. Aerospace and Military
    • 6.4.1. Market opportunities and trends
    • 6.4.2. Growth prospects
    • 6.4.3. Geographic lucrativeness
  • 6.5. Telecommunication
    • 6.5.1. Market opportunities and trends
    • 6.5.2. Growth prospects
    • 6.5.3. Geographic lucrativeness
  • 6.6. Others
    • 6.6.1. Market opportunities and trends
    • 6.6.2. Growth prospects
    • 6.6.3. Geographic lucrativeness

7. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. By Type
    • 7.2.2. By End-user
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Mexico
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
  • 7.3. South America
    • 7.3.1. By Type
    • 7.3.2. By End-user
    • 7.3.3. By Country
      • 7.3.3.1. Brazil
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. Argentina
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Others
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
  • 7.4. Europe
    • 7.4.1. By Type
    • 7.4.2. By End-user
    • 7.4.3. By Country
      • 7.4.3.1. Germany
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. France
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. United Kingdom
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Others
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
  • 7.5. Middle East and Africa
    • 7.5.1. By Type
    • 7.5.2. By End-user
    • 7.5.3. By Country
      • 7.5.3.1. Saudi Arabia
        • 7.5.3.1.1. Market Trends and Opportunities
        • 7.5.3.1.2. Growth Prospects
      • 7.5.3.2. Israel
        • 7.5.3.2.1. Market Trends and Opportunities
        • 7.5.3.2.2. Growth Prospects
      • 7.5.3.3. Others
        • 7.5.3.3.1. Market Trends and Opportunities
        • 7.5.3.3.2. Growth Prospects
  • 7.6. Asia Pacific
    • 7.6.1. By Type
    • 7.6.2. By End-user
    • 7.6.3. By Country
      • 7.6.3.1. China
        • 7.6.3.1.1. Market Trends and Opportunities
        • 7.6.3.1.2. Growth Prospects
      • 7.6.3.2. Japan
        • 7.6.3.2.1. Market Trends and Opportunities
        • 7.6.3.2.2. Growth Prospects
      • 7.6.3.3. India
        • 7.6.3.3.1. Market Trends and Opportunities
        • 7.6.3.3.2. Growth Prospects
      • 7.6.3.4. South Korea
        • 7.6.3.4.1. Market Trends and Opportunities
        • 7.6.3.4.2. Growth Prospects
      • 7.6.3.5. Indonesia
        • 7.6.3.5.1. Market Trends and Opportunities
        • 7.6.3.5.2. Growth Prospects
      • 7.6.3.6. Taiwan
        • 7.6.3.6.1. Market Trends and Opportunities
        • 7.6.3.6.2. Growth Prospects
      • 7.6.3.7. Others
        • 7.6.3.7.1. Market Trends and Opportunities
        • 7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisition, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Kyocera Corporation
  • 9.2. DowDuPont, Inc.
  • 9.3. Koa Speer Electronics, Inc.
  • 9.4. Murata Manufacturing Co., Ltd.
  • 9.5. Selmic Oy
  • 9.6. TDK Corporation
  • 9.7. Yokowo Co., Ltd.
  • 9.8. NGK SPARK PLUG CO., LTD.
  • 9.9. Adamant Namiki
  • 9.10. Apitech