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市场调查报告书
商品编码
1457078

半导体导线架市场：2024年至2029年预测

Semiconductor Lead Frame Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 135 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

半导体导线架市场预计将以 4.99% 的复合年增长率成长，从 2022 年的 31.74 亿美元增至 2029 年的 44.62 亿美元。

半导体导线架是一种由金属製成的小型扁平结构，用于支撑和连接积体电路 (IC)、分离元件和半导体装置中的其他组件。导线架描述了 IC 与周围环境之间电讯号的途径。它是半导体装置製造中的重要组成部分，因为它可确保可靠的连接和高效的性能。半导体导线架市场成长的驱动力是对电子设备的需求不断增长，以及随着电子设备变得更小、更复杂，电子元件的小型化趋势日益增强。

市场驱动力

  • 先进封装技术的越来越多的使用正在推动市场的扩张。

引线接合法等先进封装技术的日益使用是推动半导体导线架市场成长的主要因素。随着引线接合法技术精度的提高，整个半导体产业的需求预计将增加。例如，2022 年 9 月，Henniker Plasma 公司宣布推出一种基于等离子体的新工艺，可提高引线接合法技术的效率。此外，汽车照明和其他显示器对 LED 的需求不断增长，刺激了对半导体导线架的需求。半导体导线架通常用于LED构装，因为它们可以精确放置和布线，以确保最佳的电气连接和性能。例如，2022 年 9 月，德国照明解决方案製造商 Osram Licht AG 将基于导线架的 LED 照明组件引入其用于汽车照明的 Oslon Black Flat S 产品系列。因此，随着 LED 需求的增加，对焊线封装技术的需求不断增长，预计将在整个预测期内推动半导体导线架市场的发展。

从技术角度来看，冲压预计将占据显着的市场占有率。

冲压技术涉及将金属板或金属箔压入模具中以形成所需的图案或型态。这是一种快速、经济高效的工艺，可以快速有效地生产大量导线架，使其主要用于生产智慧型手机和平板电脑等家用电子电器的导线架。智慧型手机和平板电脑设备的需求不断增长，预计将增加冲压技术的消耗。此外，半导体导线架市场的冲压技术领域受到对高性能和小型化电子设备的需求以及对小型和轻量化导线架的高需求的推动，以满足各种电子产品的精确要求。

亚太地区在半导体导线架市场占据主要份额

亚太各国半导体产业的扩张预计将推动半导体导线架市场。这是因为，随着半导体需求的增加，对用于製造此类半导体的各种设备（例如导线架）的需求也在增加。例如，根据世界半导体贸易协会公布的资料，台湾半导体产业2022年第三季实现销售额6,255.3亿元新台币。此外，国际贸易局宣布，2020年至2021年日本半导体产业成长19.8%，占全球半导体产量的近9%。此外，根据印度政府新闻资讯局2022年发布的声明，印度半导体市场将从2020年的150亿美元成长到2026年的630亿美元。

市场挑战

  • 替代供应和半导体元件短缺仍然是市场成长的主要挑战。

扇出晶圆级封装 (FOWLP) 和系统级封装(SiP) 解决方案等替代封装技术的使用越来越多，但这些技术比传统基于导线架的封装具有显着优势，例如更高的整合度和更高的导线架度。例如，三星电子宣布将于2023年4月投资7,500万美元在其日本生产设施实施扇出晶圆级封装。因此，多家半导体和电子公司正在从基于导线架的封装解决方案转向这些替代方案，预计这将在预测期内放缓市场发展。

此外，半导体元件的持续短缺正在影响对半导体元件及其製造中使用的元件（包括导线架）的整体需求，从而影响半导体导线架市场。这种短缺导致价格上涨，并使某些製造商更难获得生产产品所需的材料和资源。

产品供应

  • 凸版公司负责凸版公司的半导体导线架印刷业务，生产细间距构装基板导线架、下置式导线架、带散热器的导线架、改良树脂粘合剂封装、填缝导线架，我们生产六种类型的引线框架。​
  • Advanced Assembly Materials International Ltd. 的半导体导线架-Advanced Assembly Materials International Ltd. 是一家总部位于香港的特殊产品供应商，可满足各种半导体封装要求，生产导线架。
  • SDI Group, Inc. 的半导体导线架SDI Group Inc. 是一家生产各种专业科学产品的台湾公司，为 IC、分立/电晶体和其他半导体晶片应用生产三种类型的导线架。本公司生产的分离式导线架广泛应用于汽车电脑控制系统。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章半导体导线架市场：依技术分类

  • 介绍
  • 化学蚀刻
  • 冲压

第六章半导体导线架市场：依应用分类

  • 介绍
  • 积体电路
  • 分立元件
  • 其他的

第七章半导体导线架市场：按地区

  • 介绍
  • 北美洲
  • 南美洲
  • 欧洲
  • 中东/非洲
  • 亚太地区

第八章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章 公司简介

  • Toppan Inc.
  • Advanced Assembly Materials International Ltd.
  • SDI Group, Inc.
  • SHINKO ELECTRIC INDUSTRIES CO., LTD.（Fujitsu）
  • Mitsui High-tec, Inc.
  • Precision Micro Ltd.
  • Amkor Technology
  • QPL Electronics Factory
  • Ningbo Kangqiang Electronics Co., LTD.
简介目录
Product Code: KSI061615239

The semiconductor lead frame market is projected to grow at a CAGR of 4.99% to reach US$4.462 billion in 2029 from US$3.174 billion in 2022.

A semiconductor lead frame is a small, flat structure made of metal that supports and connects the integrated circuit (IC), discrete devices, and other components in semiconductor devices. The lead frame provides a pathway for electrical signals to pass between the IC and the peripheral environment. They are an essential component in the manufacturing of semiconductor devices as they ensure reliable connectivity and efficient performance. The growth of the semiconductor lead frame market is driven by the increasing demand for electronic devices and the growing trend towards miniaturization of electronic components since the reduction in the size and increasing complexity of electronic devices are creating a high demand for smaller and precise lead frames.

Market Drivers

  • Increasing use of advanced packaging technologies is driving the market expansion.

The increasing use of advanced packaging technologies, such as wire bonding, is a significant factor driving the growth of the semiconductor lead frame market. Improving the accuracy of wire bonding technology is expected to increase its demand across the semiconductor industry. For instance, in September 2022, Henniker Plasma Company announced a new treatment based on plasma to improve the efficiency of wire bonding technology. In addition, the rising demand for LEDs driven by automotive lighting and other displays is stimulating the demand for semiconductor lead frames as semiconductor lead frames are often used in LED packaging due to their ability to accommodate the precise placement and routing of the wires to ensure the optimal electrical connectivity and performance. For instance, in September 2022, a German-based light solutions manufacturing company, OSRAM Licht AG, introduced lead-frame-based LED lighting components to its Oslon Black Flat S product range used for automotive lighting. Therefore, the rising demand for wire bonding packaging technologies driven by increasing demand for LEDs is expected to drive the semiconductor lead frame market over the forecast period.

By technology, the stamping is expected to hold a prominent market share.

Stamping technology involves pressing a metal sheet or foil against a die to create the desired pattern or shape. It is a fast and cost-effective process that can produce large volumes of lead frames quickly and efficiently and, therefore, is majorly utilized in producing lead frames for consumer electronics such as smartphones and tablets. The rising demand for smartphones and tablets is anticipated to increase the consumption of stamping technology. Further, the stamping technology sector in the semiconductor lead frame market is driven by the demand for high-performance and miniaturized electronic devices and the high demand for lead frames that are small and lightweight to accommodate the precise requirements of various electronic products.

Asia Pacific region held a substantial share in the semiconductor lead frame market

The expansion of the semiconductor industry in different countries in the Asia Pacific region is expected to drive the semiconductor lead frame market as the increasing demand for semiconductors is followed by a rise in demand for various equipment used to manufacture such semiconductors as lead frames. For instance, the semiconductor industry in Taiwan achieved sales revenues of TWD625.53 billion in the third quarter of 2022, according to data released by the World Semiconductor Trade. In addition, the Japanese semiconductor sector, as reported by the International Trade Administration, witnessed a 19.8% rise between 2020 and 2021, accounting for nearly 9% of the total world semiconductor production. Further, according to a statement released by the Press Information Bureau of the Indian government in 2022, India's semiconductor market will increase from US$15 billion in 2020 to US$63 billion by 2026.

Market Challenge

  • Alternative availability and the scarcity of semiconductor components remains significant challenge to the market growth.

The increasing use of alternative packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, is limiting the semiconductor lead frame market growth since these technologies offer several advantages over traditional lead frame-based packaging, such as higher levels of integration and improved thermal performance. For instance, Samsung Electronics announced an investment of US$75 million to deploy fan-out wafer-level packaging at its production facility in Japan in April 2023. Consequently, several semiconductor and electronics companies are shifting from lead frame-based packaging solutions to these alternatives is expected to slow down the market over the forecast period.

In addition, the ongoing shortage of semiconductor components is impacting the semiconductor lead frame market as it is affecting the overall demand for semiconductor devices and the components used to manufacture them, including lead frames. The shortage is rising the prices and increasing production difficulty for certain manufacturers to secure the necessary materials and resources to produce their products.

Product Offerings:

  • Semiconductor lead frame by Toppan Inc. - Toppan Inc., a Japan-based company involved in the printing business, manufactures six different lead frame products, namely Fine Pitch Leadframe, Downset Leadframe, Leadframe with Heat Spreader, Resin Adhesion Improved Package, Caulking Leadframe, and QFN Substrate under its semiconductor package substrates product division to meet the varying needs of different semiconductor processes.
  • Semiconductor lead frame by Advanced Assembly Materials International Ltd. - Advanced Assembly Materials International Ltd., a Hong-Kong-based company offering specialty products to various semiconductor packaging requirements, manufactures lead frames of high-density and cost-effective nature of varying sizes up to 100x300mm as per the specifications of its customers.
  • Semiconductor lead frame by SDI Group, Inc. - SDI Group Inc., a Taiwanese company generating various specialty scientific products, manufactures three different lead frame types for ICs, discrete/transistors, and other semiconductor chip applications. The discrete lead frames manufactured by the company are extensively adopted in control systems of auto-computers.

Segmentation:

By Technology

  • Chemical Etching
  • Stamping

By Application

  • Integrated Circuit (IC)
  • Discrete Devices
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR LEAD FRAME MARKET BY TECHNOLOGY

  • 5.1. Introduction
  • 5.2. Chemical Etching
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness Insights
  • 5.3. Stamping
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness Insights

6. SEMICONDUCTOR LEAD FRAME MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Integrated Circuits
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness Insights
  • 6.3. Discrete Devices
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness Insights
  • 6.4. Others
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness Insights

7. SEMICONDUCTOR LEAD FRAME MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. By Technology
    • 7.2.2. By Application
    • 7.2.3. By Country
      • 7.2.3.1. USA
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Mexico
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
  • 7.3. South America
    • 7.3.1. By Technology
    • 7.3.2. By Application
    • 7.3.3. By Country
      • 7.3.3.1. Brazil
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. Argentina
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Others
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
  • 7.4. Europe
    • 7.4.1. By Technology
    • 7.4.2. By Application
    • 7.4.3. By Country
      • 7.4.3.1. Germany
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. France
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. United KIngdom
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Spain
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects
  • 7.5. Middle East and Africa
    • 7.5.1. By Technology
    • 7.5.2. By Application
    • 7.5.3. By Country
      • 7.5.3.1. Saudi Arabia
        • 7.5.3.1.1. Market Trends and Opportunities
        • 7.5.3.1.2. Growth Prospects
      • 7.5.3.2. UAE
        • 7.5.3.2.1. Market Trends and Opportunities
        • 7.5.3.2.2. Growth Prospects
      • 7.5.3.3. Israel
        • 7.5.3.3.1. Market Trends and Opportunities
        • 7.5.3.3.2. Growth Prospects
      • 7.5.3.4. Others
        • 7.5.3.4.1. Market Trends and Opportunities
        • 7.5.3.4.2. Growth Prospects
  • 7.6. Asia Pacific
    • 7.6.1. By Technology
    • 7.6.2. By Application
    • 7.6.3. By Country
      • 7.6.3.1. China
        • 7.6.3.1.1. Market Trends and Opportunities
        • 7.6.3.1.2. Growth Prospects
      • 7.6.3.2. Japan
        • 7.6.3.2.1. Market Trends and Opportunities
        • 7.6.3.2.2. Growth Prospects
      • 7.6.3.3. India
        • 7.6.3.3.1. Market Trends and Opportunities
        • 7.6.3.3.2. Growth Prospects
      • 7.6.3.4. South Korea
        • 7.6.3.4.1. Market Trends and Opportunities
        • 7.6.3.4.2. Growth Prospects
      • 7.6.3.5. Taiwan
        • 7.6.3.5.1. Market Trends and Opportunities
        • 7.6.3.5.2. Growth Prospects
      • 7.6.3.6. Others
        • 7.6.3.6.1. Market Trends and Opportunities
        • 7.6.3.6.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Toppan Inc.
  • 9.2. Advanced Assembly Materials International Ltd.
  • 9.3. SDI Group, Inc.
  • 9.4. SHINKO ELECTRIC INDUSTRIES CO., LTD. (Fujitsu)
  • 9.5. Mitsui High-tec, Inc.
  • 9.6. Precision Micro Ltd.
  • 9.7. Amkor Technology
  • 9.8. QPL Electronics Factory
  • 9.9. Ningbo Kangqiang Electronics Co., LTD.