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市场调查报告书
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1496045

探针卡市场：2024-2029 年预测

Probe Card Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计2022年探针卡市场规模为26.51亿美元，复合年增长率为9.21%，2029年市场规模将达49.12亿美元。

预计探针卡市场在预测期内将呈现稳定成长。探针卡是电子晶片製造过程中用于晶片评估的高科技电子设备。晶片由一种称为硅的薄半导体材料製成。探针卡充当电子机械网关，用于表征晶圆上或单独封装之前的晶片操作。

探针卡是根据晶片的机械和电气要求建造的。探针卡分为针式、立式和电子机械系统（MEMS）三种。先进技术的不断增加、半导体行业需求的增加以及半导体领域投资的增加正在推动探针卡市场的成长。

探针卡市场驱动因素

  • 先进技术的增加推动探针卡市场的成长

5G、人工智慧、自动驾驶和物联网 (IoT) 等新技术的兴起正在推动半导体的使用，从而推动探针卡市场的成长。逼真图形、人工智慧、自动驾驶汽车和资料中心等进阶应用需要高效的性能。上述技术涉及笨重的高速性能晶片，需要先进的探针卡才能进行快速测试。

传统的探针卡在性能方面一直举步维艰，而这些新型探针卡与下一代高品质、成熟的半导体的发展保持同步。技术升级需要更快、更强大、更低能耗的晶片，迫使采用复杂的探针卡进行有效的测试。

  • 半导体产业普及推动探针卡市场成长

行动电话和笔记型电脑等家用电子电器的使用不断增加，推动了对半导体的额外需求。随着这些电子设备的复杂性增加，需要有效率的测试程序。探针卡在通讯协定中发挥关键作用，以确保积体电路在封装和分发之前的优越性和功能性。

製造商正在优先考虑创新，开发具有增强功能的探针卡，以处理复杂的细节、增加的引脚数和晶圆上的精緻结构。这确保了先进 IC 的精确测试，这对于现代电子设备的无缝运作至关重要。

例如，根据 2023 年半导体产业协会发表的报导，由于日常技术的使用不断增加，半导体的重要性将在 2023 年飙升。 2022年，全球半导体销量将达到10亿颗。

  • 半导体领域投资的增加将带动探针卡市场的成长。

对积体电路的需求不断增长正在推动半导体製造商广泛扩大其生产设施。探针卡在这些扩充功能中发挥重要作用，这需要在测试设备的安装方面进行大量投资。

随着半导体製造商增加积体电路产量，晶片品质成为重中之重。探针卡是在检测设备和晶圆之间建立电气连接的重要组件，是晶片封装前的预处理步骤。对检测製程的投资和半导体製造中心的建立并进，以提高积体电路的品质。

例如，根据新闻资讯局2023年12月发表的报导，美国政府已核准美光科技设立半导体部门，资本投资2,251.6亿卢比（27.5亿美元）。

探针卡市场－地域展望

  • 亚太地区预计将出现显着成长。

亚太地区拥有数量最多的韩国、台湾和日本半导体製造商，推动了探针卡市场的成长。该地区还拥有数量最多的消费性电子产品，例如行动装置和穿戴式设备，并提供了大量在製造过程中用于这些设备的经过测试的晶片。

各国政府正采取倡议促进本地晶片製造，以实现国内晶片生产，并加强探针卡等测试设备。

例如，根据世界经济论坛2023年11月发表的报导，日本政府正在透过提供130亿美元资金加强国内半导体生产来提振半导体产业。

限制探针卡市场的因素

  • 巨大的投资限制了探针卡市场的成长。

作为製造实施的一部分，製造和创建具有先进功能的复杂的新型探针卡可能会增加高额投资。这是困难且高成本的，因为它涉及晶片设计的不断发展。

  • 不断出现的技术问题可能会阻碍探针卡市场的成长。

随着晶片变得越来越小、越来越复杂，探针卡面临着与晶片垫片的精确对准和接触的挑战。这可能会导致损坏或不正确的对准，从而影响测试期间的准确性。

探针卡市场主​​要产业开拓

  • 2023 年 11 月，Teradyne 和 Technophobia 宣布建立合作伙伴关係，旨在推动半导体测试介面的创新和快速成长。此次合作将为两家公司在晶片测试市场提供支援。

探针卡市场参与者和产品

  • MT系列：日本电子材料公司提供的产品是一款MEMS探针卡，专门用于测试包含小型铜柱凸块和垫片的覆晶。结合 MEMS（微机电系统）和多层薄膜的先进技术可实现高精度检测。
  • V93000：Advantest公司的产品，专门用于半导体评估。本产品有不同型号、不同特点，为不同尺寸提供灵活的解决方案。
  • HFTAP 系列：FormFactor 的这款产品是最先进的探针解决方案，专为动态随机存取记忆体 (DRAM) 装置的高速测试而设计。采用先进的 PCB 技术，速度可达 3.2GHz，实现高效能的晶片测试系列。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关利益者的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章探针卡市场：按探针类型

  • 介绍
  • 高度探针卡
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 标准探针卡
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力

第六章探针卡市场：依技术类型

  • 介绍
  • 垂直的
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • MEMS
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 悬臂
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 专业
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
    • 地域获利能力

第七章 探针卡市场：依应用分类

  • 介绍
  • DRAM
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 参数
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 铸造厂
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 其他的
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力

第八章探针卡市场：按地区

  • 介绍
  • 北美洲
    • 按探头类型
    • 依技术类型
    • 按用途
    • 按国家/地区
  • 南美洲
    • 按探头类型
    • 依技术类型
    • 按用途
    • 按国家/地区
  • 欧洲
    • 按探头类型
    • 依技术类型
    • 按用途
    • 按国家/地区
  • 中东/非洲
    • 按探头类型
    • 依技术类型
    • 按用途
    • 按国家/地区
  • 亚太地区
    • 按探头类型
    • 依技术类型
    • 按用途
    • 按国家/地区

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第十章 公司简介

  • Japan Electronic Materials Corporation
  • Advantest Corporation
  • Korea Instruments Co. Ltd
  • FormFactor
  • Feinmetall
  • Nidec SV Probe
  • TSE Co., Ltd.
  • Willtechnology
  • Micronics Japan Co., Ltd.
  • Suzhou Silicon Test System Co., Ltd.
简介目录
Product Code: KSI061616867

The probe card market was estimated at US$2.651 billion in 2022, growing at a CAGR of 9.21%, reaching a market size of US$4.912 billion by 2029.

The Probe card market is anticipated to show steady growth during the forecast period. The probe card is a Hitech electronic device used for evaluating the chips during the process of manufacturing the electronic chips. Chips are made up of thin semiconductor material called silicon. A probe card serves as an electromechanical gateway that enables the evaluation of a chip's operation while it is still on the wafer or before it is packed separately.

The probe cards are constructed under the mechanical and electrical requirements of the chip. The probe cards are classified into three different categories: needle, vertical, and micro-electro-mechanical system (MEMS). Increased advanced technologies, growing demand for the semiconductor industry, and increased investment in the semiconductor sector are driving the probe cards market growth.

Probe Cards Market Drivers

  • Increased advanced technologies drive probe card market growth

The rise of new technologies like 5G, AI, autonomous driving, and the Internet of Things (IoT) has boosted the use of semiconductors, consequently driving growth in the probe cards market. There is a need for efficient performance in advanced applications, such as realistic graphics, AI, self-driving cars, and data centers. The above technologies involve the tedious and fast-performing chip where advanced probe cards are required for rapid testing purposes.

The previously built cards struggle in the performance level, where these emerging probe cards pace the development of quality and well-developed next-generation semiconductors. The technological upgradations require faster, more powerful, and low energy consumption chips, thus compelling the practice of refined probe cards for effective testing.

  • Growing prevalence of the semiconductor industry enhances probe card market growth

The growing frequency for consumer electronic devices like mobile phones, laptops, and other devices is propelling the additional perquisites for semiconductors. As the intricacy of these electronic devices increases, there is a high requirement for productive testing procedures. Probe cards play a vital role in the protocols as they assure the superiority and functionality of integrated circuits before their wrapping and distribution.

Manufacturers are prioritizing innovation to develop probe cards with enhanced capabilities to handle complex details, increased pin counts, and delicate structures on the wafer. This guarantees accurate testing of advanced ICs, which is crucial for the seamless operation of contemporary electronics.

For instance, according to an article published in the Semiconductor Industry Association in 2023, it states that in 2023, the significance of semiconductors has been on an upsurge due to the growing usage of everyday technologies. In 2022 there were 1 billion semiconductors sold worldwide.

  • Increased investment in the semiconductor sector enhances the probe cards market growth.

The increased demand for Integrated Circuits enhances the manufacturers of semiconductors to expand their production facility in the wide range. As these expansions require a vast amount of investment in installing a testing facility, probe cards play a crucial role.

As semiconductor fabrications increase their production of integrated circuits, its crucial to prioritize the quality of the chips. Probe cards are an essential component in establishing the electrical connection between testing equipment and wafers, which is a prior process before the packaging of chips. The investment in the testing process and establishing the semiconductor fabrication center are aligned with each other for the quality output of the integrated circuit.

For instance, according to an article published by the Press Information Bureau in December 2023, it states that the Government of India has approved to establish a semiconductor unit by Micron with a capital investment of 22,516 crores (2.75 billion dollars)

Probe Card Market - Geographical Outlook

  • Asia Pacific is expected to grow significantly.

Asia Pacific is anticipated to account for a significant share of the probe cards market. due to various factors, such as the regions having the maximum number of semiconductor manufacturers from South Korea, Taiwan, and Japan, which enhances the probe cards market growth. The region also has the highest consumer electronics goods like mobile devices and wearables, which creates a large base for the tested chips that are being used for these devices in the manufacturing process.

The governments from the regions are taking initiatives to boost the local chip manufacturing industries to enable domestic chip production and enhance testing equipment like probe cards as the above-mentioned factors propelling the probe cards market in the region.

For instance, in November 2023 World Economic forum published article, it states that the Government of Japan is fueling the semiconductor industry by providing a funding of $13 billion to enhance the domestic production of semiconductor.

Probe Cards Market Restraints

  • Immense investments curb the probe cards market growth.

The manufacturing and creation of complex new probe cards with advanced features can enhance the investment, which would be high as an introductory part of manufacturing. This creates a greater barrier for new entrants into the market. as it involves constant evolution in chip designing, makes it difficult and ends up with high cost

  • Growing technical issues may hinder the probe cards market growth.

Reduction in size and increased complexity of the chip features, probe cards encounter challenges in ensuring accurate alignment and contact with the chip pads. This can lead to damage and wrong alignment which impacts the accuracy while testing.

Probe Card Market Key Industry Developments

  • November 2023: Teradyne and Technophobe announced the agreement aimed at propelling innovation in semiconductor test interfaces and fostering rapid growth. This partnership helps both companies in the field of chip testing market.

Probe Card Market Players and Products

  • MT Series: The product offered by Japan Electronics Materials is a MEMS probe card specifically designed for testing flip chips containing small copper pillar bumps and pads. This advanced technology incorporates MEMS (Micro Electromechanical Systems) and thin-film multilayer to enable accurate testing.
  • V93000: The product introduced by ADVANTEST is specifically designed for the evaluation of semiconductors. The product has various models with different specific features to provide a flexible solution for a variety of sizes. The product has enlisted a range of classes from A class to L class.
  • HFTAP Series: The product offered by Formfactor is a cutting-edge probe solution specifically designed to test dynamic random-access memory (DRAM) devices at high speed. Leveraging advanced PCB technology, it can reach up to 3.2 GHz speed, which facilitates effective chip testing series.

The Probe Cards market is segmented and analyzed as follows:

By Probe Type

  • Advanced Probe Card
  • Standard Probe Card

By Technology Type

  • Vertical
  • MEMS
  • Cantilever
  • Specialty

By Application

  • DRAM
  • Parametric
  • Foundry
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others
  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key Benefits to the Stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. PROBE CARD MARKET BY PROBE TYPE

  • 5.1. Introduction
  • 5.2. Advanced Probe Card
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. Standard Probe Card
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness

6. PROBE CARD MARKET BY TECHNOLOGY TYPE

  • 6.1. Introduction
  • 6.2. Vertical
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. MEMS
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Cantilever
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Specialty
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness
    • 6.5.4. Geographic Lucrativeness

7. PROBE CARD MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. DRAM
    • 7.2.1. Market Trends and Opportunities
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. Parametric
    • 7.3.1. Market Trends and Opportunities
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. Foundry
    • 7.4.1. Market Trends and Opportunities
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Others
    • 7.5.1. Market Trends and Opportunities
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness

8. PROBE CARD MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Probe Type
    • 8.2.2. By Technology Type
    • 8.2.3. By Application
    • 8.2.4. By Country
      • 8.2.4.1. United States
        • 8.2.4.1.1. Market Trends and Opportunities
        • 8.2.4.1.2. Growth Prospects
      • 8.2.4.2. Canada
        • 8.2.4.2.1. Market Trends and Opportunities
        • 8.2.4.2.2. Growth Prospects
      • 8.2.4.3. Mexico
        • 8.2.4.3.1. Market Trends and Opportunities
        • 8.2.4.3.2. Growth Prospects
  • 8.3. South America
    • 8.3.1. By Probe Type
    • 8.3.2. By Technology Type
    • 8.3.3. By Application
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
        • 8.3.4.1.1.1. Market Trends and Opportunities
        • 8.3.4.1.1.2. Growth Prospects
      • 8.3.4.2. Argentina
        • 8.3.4.2.1.1. Market Trends and Opportunities
        • 8.3.4.2.1.2. Growth Prospects
      • 8.3.4.3. Others
        • 8.3.4.3.1.1. Market Trends and Opportunities
        • 8.3.4.3.1.2. Growth Prospects
  • 8.4. Europe
    • 8.4.1. By Probe Type
    • 8.4.2. By Technology Type
    • 8.4.3. By Application
    • 8.4.4. By Country
      • 8.4.4.1. United Kingdom
        • 8.4.4.1.1. Market Trends and Opportunities
        • 8.4.4.1.2. Growth Prospects
      • 8.4.4.2. Germany
        • 8.4.4.2.1. Market Trends and Opportunities
        • 8.4.4.2.2. Growth Prospects
      • 8.4.4.3. France
        • 8.4.4.3.1. Market Trends and Opportunities
        • 8.4.4.3.2. Growth Prospects
      • 8.4.4.4. Italy
        • 8.4.4.4.1. Market Trends and Opportunities
        • 8.4.4.4.2. Growth Prospects
      • 8.4.4.5. Spain
        • 8.4.4.5.1. Market Trends and Opportunities
        • 8.4.4.5.2. Growth Prospects
      • 8.4.4.6. Others
        • 8.4.4.6.1. Market Trends and Opportunities
        • 8.4.4.6.2. Growth Prospects
  • 8.5. Middle East and Africa
    • 8.5.1. By Probe Type
    • 8.5.2. By Technology Type
    • 8.5.3. By Application
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
        • 8.5.4.1.1. Market Trends and Opportunities
        • 8.5.4.1.2. Growth Prospects
      • 8.5.4.2. UAE
        • 8.5.4.2.1. Market Trends and Opportunities
        • 8.5.4.2.2. Growth Prospects
      • 8.5.4.3. Others
        • 8.5.4.3.1. Market Trends and Opportunities
        • 8.5.4.3.2. Growth Prospects
  • 8.6. Asia Pacific
    • 8.6.1. By Probe Type
    • 8.6.2. By Technology Type
    • 8.6.3. By Application
    • 8.6.4. By Country
      • 8.6.4.1. Japan
        • 8.6.4.1.1. Market Trends and Opportunities
        • 8.6.4.1.2. Growth Prospects
      • 8.6.4.2. China
        • 8.6.4.2.1. Market Trends and Opportunities
        • 8.6.4.2.2. Growth Prospects
      • 8.6.4.3. India
        • 8.6.4.3.1. Market Trends and Opportunities
        • 8.6.4.3.2. Growth Prospects
      • 8.6.4.4. South Korea
        • 8.6.4.4.1. Market Trends and Opportunities
        • 8.6.4.4.2. Growth Prospects
      • 8.6.4.5. Taiwan
        • 8.6.4.5.1. Market Trends and Opportunities
        • 8.6.4.5.2. Growth Prospects
      • 8.6.4.6. Thailand
        • 8.6.4.6.1. Market Trends and Opportunities
        • 8.6.4.6.2. Growth Prospects
      • 8.6.4.7. Indonesia
        • 8.6.4.7.1. Market Trends and Opportunities
        • 8.6.4.7.2. Growth Prospects
      • 8.6.4.8. Others
        • 8.6.4.8.1. Market Trends and Opportunities
        • 8.6.4.8.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Japan Electronic Materials Corporation
  • 10.2. Advantest Corporation
  • 10.3. Korea Instruments Co. Ltd
  • 10.4. FormFactor
  • 10.5. Feinmetall
  • 10.6. Nidec SV Probe
  • 10.7. TSE Co., Ltd.
  • 10.8. Willtechnology
  • 10.9. Micronics Japan Co., Ltd.
  • 10.10. Suzhou Silicon Test System Co., Ltd.