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市场调查报告书
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1698454

高可靠性半导体市场：未来预测（2025-2030）

High-Reliability Semiconductor Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 149 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计 2025-2030 年预测期内高可靠性半导体市场将以 4.66% 的复合年增长率成长。

航太和国防工业的组件采用高度可靠的半导体，能够长时间承受高温。其中包括射频微波、放大器、资料转换器和其他高可靠性半导体。影响高可靠性半导体采用的主要因素之一是利用商品组件和高频率的紧凑、高效和耐用设备的需求。电子战系统必须对不断变化的威胁做出快速反应，因此需要快速部署标准化解决方案。高可靠性半导体在这些设备中的应用越来越频繁，从而增加了市场占有率。

市场趋势：

  • 高可靠性半导体的需求不断增加：高可靠性半导体的日益普及是市场成长的主要驱动力。这些半导体广泛应用于航空航太和国防等产业的关键应用，这些产业在恶劣条件下的耐用性和性能至关重要。这些半导体提高了高温环境下使用的零件（例如引擎零件）的韧性和使用寿命。此外，材料的强度更高、重量更轻、可承受更高的工作温度，使得製造更轻的零件成为可能，也使其更具吸引力。
  • 市场参与企业的策略发展：製造商的重大倡议有望推动市场向前发展。例如，2023 年 1 月，Behrman Capital 的投资组合公司、工业、军事和太空应用高可靠性微电子解决方案的主要企业Micross Components, Inc. 签署了一项具有约束力的协议，收购英飞凌科技股份公司的高可靠性 DC-DC 转换器业务。此次收购预计将于 2023 年第一季完成，并将加强 Micross 的市场地位。
  • 按地区分類的市场：高可靠性半导体市场分为美洲、欧洲、中东和非洲以及亚太地区。其中，由于对高可靠性半导体相关研发的积极投资，预计亚太地区将在预测期内占据市场主导地位。
  • 亚太市场成长：由于航太和国防领域对高可靠性半导体的需求不断增加，该地区的市场正在扩大。亚太国家越来越多地使用这些半导体来确保军事装备（包括航空电子设备、卫星和作战车辆）的可靠运作。此外，先进基础设施技术的采用增加了汽车和航太应用对可靠和安全组件的需求，进一步推动了该地区高可靠性半导体市场的成长。

报告中介绍的主要企业包括 Digitron Semiconductors、Infineon Technologies AG、Microsemi Corporation、Semtech Corporation、KCB Solutions, LLC、Teledyne Technologies Incorporated、Texas Instruments Inc.、Skyworks Solutions Inc.、Vishay Intertechnology, Inc. 和 Fujitsu Limited。

本报告的主要优点

  • 深刻分析：获得涵盖主要地区和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他子区隔。
  • 竞争格局：了解全球主要企业所采用的策略策略，并了解正确策略带来的潜在市场渗透。
  • 市场驱动因素和未来趋势：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
  • 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
  • 适用范围广：对于新兴企业、研究机构、顾问公司、中小企业和大型企业来说，它都是实用且具有成本效益的。

它有什么用途？

产业与市场洞察、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

分析范围

  • 历史资料（2022-2024）和预测资料（2025-2030）
  • 成长机会、挑战、供应链前景、法规结构、顾客行为、趋势分析
  • 竞争对手定位、策略和市场占有率分析
  • 按部门和地区（国家）分類的收益成长和预测分析
  • 公司概况（策略、产品、财务资讯、主要趋势等）

高可靠性半导体市场分析涵盖以下几个部分：

按类型

  • 离散的
  • 模拟
  • 混合

依技术

  • 表面黏着技术
  • 通孔技术

按包装材质

  • 塑胶
  • 陶瓷製品

按最终用户

  • 车
  • 航太与国防
  • 其他的

按地区

  • 美洲
  • 美国
  • 欧洲、中东和非洲
  • 德国
  • 荷兰
  • 其他的
  • 亚太地区
  • 中国
  • 日本
  • 台湾
  • 韩国
  • 其他的

目录

第一章 引言

  • 市场概览
  • 市场定义
  • 分析范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章分析方法

  • 分析设计
  • 分析过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章 市场动态

  • 市场驱动因素
  • 市场限制
  • 波特五力分析
  • 产业价值链分析

第五章高可靠度半导体市场（依类型）

  • 介绍
  • 离散的
  • 模拟
  • 混合

第六章高可靠度半导体市场（依技术）

  • 介绍
  • 表面黏着技术
  • 通孔技术

第七章高可靠度半导体市场（依封装材料）

  • 介绍
  • 塑胶
  • 陶瓷製品

第八章高可靠性半导体市场（依最终用户）

  • 介绍
  • 车
  • 航太与国防
  • 其他的

第九章高可靠度半导体市场（按地区）

  • 世界概况
  • 美洲
    • 美国
  • 欧洲、中东和非洲
    • 德国
    • 荷兰
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 台湾
    • 韩国
    • 其他的

第十章竞争格局及分析

  • 主要企业和策略分析
  • 市场占有率分析
  • 企业合併、协议、商业合作
  • 竞争仪錶板

第十一章 公司简介

  • Digitron Semiconductors
  • Infineon Technologies AG
  • Microsemi Corporation
  • Semtech Corporation
  • KCB Solutions, LLC
  • Teledyne Technologies Incorporated
  • Texas Instruments Inc.
  • Skyworks Solutions Inc.
  • Vishay Intertechnology, Inc.
  • Fujitsu Limited
简介目录
Product Code: KSI061615487

The high-reliability semiconductor market is expected to grow at a CAGR of 4.66% during the forecast period between 2025 and 2030.

Components for the space and defense industries use high-reliability semiconductors designed to endure high temperatures for a longer time. These include RF microwaves, amplifiers, data converters, and other highly reliable semiconductors. One of the key factors influencing the adoption of high-reliability semiconductors is the demand for compact, extremely efficient, and durable devices that utilize common components and high frequencies. Electronic warfare systems must react quickly to continuously changing threats, which requires rapidly deploying standardized solutions. More frequently, high-reliability semiconductors are employed in these devices, leading to a rise in their market share.

Market Trends:

  • Growing demand for high-reliability semiconductors: The increasing adoption of high-reliability semiconductors is a key driver of market growth. These semiconductors are widely used in critical applications across industries such as aviation and defense, where durability and performance under extreme conditions are essential. They enhance the toughness and longevity of components used in high-temperature environments, such as engine parts. Additionally, advancements in materials that are stronger, lighter, and capable of withstanding higher operating temperatures are enabling weight reduction in components, further boosting their appeal.
  • Strategic developments by market players: Key initiatives by manufacturers are expected to propel the market forward. For example, in January 2023, Micross Components, Inc., a portfolio company of Behrman Capital and a leading provider of high-reliability microelectronic solutions for industrial, military, and space applications, entered into a binding agreement to acquire the High-Reliability DC-DC converter business of Infineon Technologies AG. The acquisition is anticipated to be finalized in the first quarter of 2023, strengthening Micross's market position.
  • Regional market segmentation: The high-reliability semiconductor market is segmented into the Americas, Europe, the Middle East and Africa, and Asia Pacific. Among these, Asia Pacific is expected to dominate the market during the forecast period, driven by significant investments in research and development related to high-reliability semiconductors.
  • Asia Pacific's market growth: The region's market is expanding due to rising demand for high-reliability semiconductors from the aerospace and defense sectors. Countries in Asia Pacific are increasingly using these semiconductors to ensure the reliable operation of military equipment, including avionics, satellites, and combat vehicles. Furthermore, the adoption of advanced infrastructure technologies has increased the need for dependable and secure components in automotive and aerospace applications, further fueling the growth of the high-reliability semiconductor market in the region.

Some of the major players covered in this report Digitron Semiconductors, Infineon Technologies AG, Microsemi Corporation, Semtech Corporation, KCB Solutions, LLC, Teledyne Technologies Incorporated, Texas Instruments Inc., Skyworks Solutions Inc., Vishay Intertechnology, Inc., Fujitsu Limited, among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The High-Reliability Semiconductor Market is analyzed into the following segments:

By Type

  • Discrete
  • Analog
  • Mixed

By Technology

  • Surface Mount Technology
  • Through Hole Technology

By Packaging Material

  • Plastic
  • Ceramic

By End-User

  • Automotive
  • Aerospace & Defence
  • Others

By Geography

  • Americas
  • § US
  • Europe, the Middle East, and Africa
  • § Germany
  • § Netherlands
  • § Others
  • Asia Pacific
  • § China
  • § Japan
  • § Taiwan
  • § South Korea
  • § Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study

1.4. Market Segmentation

  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Discrete
  • 5.3. Analog
  • 5.4. Mixed

6. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY TECHNOLOGY

  • 6.1. Introduction
  • 6.2. Surface Mount Technology
  • 6.3. Through Hole Technology

7. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY PACKAGING MATERIAL

  • 7.1. Introduction
  • 7.2. Plastic
  • 7.3. Ceramic

8. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY END-USER

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Aerospace & Defence
  • 8.4. Others

9. HIGH-RELIABILITY SEMICONDUCTOR MARKET BY GEOGRAPHY

  • 9.1. Global Overview
  • 9.2. Americas
    • 9.2.1. US
  • 9.3. Europe, Middle East, and Africa
    • 9.3.1. Germany
    • 9.3.2. Netherlands
    • 9.3.3. Others
  • 9.4. Asia-Pacific
    • 9.4.1. China
    • 9.4.2. Japan
    • 9.4.3. Taiwan
    • 9.4.4. South Korea
    • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. Digitron Semiconductors
  • 11.2. Infineon Technologies AG
  • 11.3. Microsemi Corporation
  • 11.4. Semtech Corporation
  • 11.5. KCB Solutions, LLC
  • 11.6. Teledyne Technologies Incorporated
  • 11.7. Texas Instruments Inc.
  • 11.8. Skyworks Solutions Inc.
  • 11.9. Vishay Intertechnology, Inc.
  • 11.10. Fujitsu Limited