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封面
市场调查报告书
商品编码
1825381

清凉膏市场：2025-2030 年预测

Cooling Paste Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计冷却膏市场将从 2025 年的 1,035,467,000 美元成长到 2030 年的 1,290,333,000 美元，复合年增长率为 4.50%。

受电子、汽车和通讯业加速成长的推动，冷却膏市场预计将大幅扩张，这些行业的各种应用都需要先进的温度控管解决方案，对确保最佳性能和组件寿命的冷却膏产品的需求巨大。

电子元件和设备在运作过程中会产生大量热量，因此需要有效的温度控管干预措施来维持产品的可靠性和性能标准。消费性电子产品日益复杂，迫使製造商采取措施保护敏感元件，防止热相关损坏，同时确保足够的使用者安全。这项技术需求是冷却膏市场成长的根本驱动力。

市场驱动因素

家电需求不断成长

家电市场的成长是散热膏需求加速成长的主要驱动力。为了应对日益激烈的竞争和快速的技术发展，家电製造商正越来越多地采用创新且具有战略意义的经营模式。随着企业不断寻求更优的产品温度控管解决方案，这些市场动态直接推动了散热膏市场的成长。

在消费性电子产业，虚拟实境、物联网 (IoT) 和机器人应用等新兴技术正在推动温度控管产品的需求成长。这些新技术带来的先进硬体要求需要有效的冷却解决方案来防止性能下降和组件故障，从而推动了散热膏市场的扩张。

数位转型在各行各业的广泛应用，数位化渗透率高，对家电的供需动态产生了重大影响。这种数位转型推动了对散热膏的需求，因为製造商需要有效的温度控管解决方案，以防止日益复杂的电子产品热损伤。

发展新兴市场

近年来，亚太市场，尤其是印度，电子产业发展迅速。该地区的扩张对经济发展发挥关键作用，促进了GDP成长并创造了大量就业机会。随着製造商扩大生产规模并采用更先进的温度控管要求，这些市场电子产业的成长轨迹与散热膏需求的成长直接相关。

印度政府倡议透过各种数位支付推广计划，将国家转型为无现金经济，这正在加速电子产品的普及。政府推出的政策，例如数付款管道的推荐奖励计划和线上交易激励措施，正在刺激消费电子产品的需求，并相应地催生了对温度控管解决方案的需求。

技术创新趋势

随着製造商不断开发更有效率的热界面材料，散热膏市场正受益于持续的技术进步。创新工作专注于提高导热係数、易用性以及在各种工作条件下的长期稳定性。这些技术改进不仅能实现更佳的散热性能，还能满足现代电子产品的严苛要求。

先进的冷却膏配方增强了散热性能，以应对电子製造业日益增长的功率密度和小型化趋势。这些发展与业界对更紧凑、更有效率的散热解决方案的需求相契合，以支援高效能电子系统。

政府措施和政策支持

政府正在实施各种倡议，以扩大电子产品的国内生产，为散热膏市场的成长创造了有利条件。促进电子产品在地化生产和自主生产的政策正在刺激电子和IT产业的投资，从而增加对温度控管解决方案的需求。

政府推出的支持性政策框架，鼓励国内製造业发展，促进了电子和IT产业的大规模投资。这些政策倡议为散热膏市场的扩张创造了有利环境，因为电子製造商需要可靠的温度控管解决方案来支援其生产营运。

竞争格局

不断增长的退烧膏需求吸引了众多新进者，加剧了产业竞争动态。市场参与企业正在实施各种策略方针，包括伙伴关係和开发创新解决方案，以扩大客户群并提升市场份额。 3M、博伊德公司和莱尔德等行业领导者继续透过技术创新和策略定位引领市场发展，在快速发展的市场中保持竞争优势。

本报告的主要优点

  • 深刻分析：获得深入的市场洞察，重点关注客户细分、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场，涵盖主要地区和新兴地区。
  • 竞争格局：了解世界主要企业所采用的策略策略，并了解采用正确的策略的市场渗透潜力。
  • 市场趋势和驱动因素：探索动态因素和关键市场趋势以及它们将如何影响未来的市场发展。
  • 可行的建议：利用洞察力进行策略决策，并在动态环境中开闢新的业务流和收益。
  • 适合广泛的使用者：对于新兴企业、研究机构、顾问、中小企业和大型企业来说都是有益且具有成本效益的。

它有什么用途？

产业和市场考量、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法律规范与影响、新产品开发、竞争影响

调查范围

  • 2022 年至 2024 年的历史数据和 2025 年至 2030 年的预测数据
  • 成长机会、挑战、供应链前景、法律规范与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 收益成长和预测细分市场和区域分析（包括国家）
  • 公司概况（尤其是财务状况和关键发展）。

目录

第一章执行摘要

第二章市场概述

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔

第三章 经营状况

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策法规
  • 策略建议

第四章 技术展望

5. 清凉膏市场（按类型）

  • 介绍
  • 胶带和薄膜
  • 填缝剂
  • 相变材料
  • 油脂和黏合剂
  • 金属基导热材料
  • 其他的

6. 清凉膏市场（依应用）

  • 介绍
  • 工业机械
  • 医疗设备
  • 汽车电子
  • 通讯设备
  • 个人电脑
  • 其他的

7. 清凉膏市场（按地区）

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 印尼
    • 泰国
    • 其他的

第八章竞争格局及分析

  • 主要企业和策略分析
  • 市占率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章：公司简介

  • Parker Hannifin Corp
  • Henkel AG & Co. KGaA
  • Momentive
  • Laird
  • 3M
  • Boyd Corporation
  • Novagard Solutions
  • Dow Corning Corporation
  • To-Plan
  • Kobayashi Pharmaceutical Co.

第十章 附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061610648

The Cooling Paste Market is expected to grow from USD 1,035.467 million in 2025 to USD 1,290.333 million in 2030, at a CAGR of 4.50%.

The cooling paste market is positioned for significant expansion driven by the accelerating growth across electronics, automotive, and telecommunication industries. These sectors increasingly require sophisticated thermal management solutions for various applications, creating substantial demand for cooling paste products that ensure optimal performance and component longevity.

Electronic components and devices inherently generate considerable heat during operation, necessitating effective thermal management interventions to maintain product reliability and performance standards. The increasing complexity of consumer electronics has compelled manufacturers to implement protective measures for sensitive components, preventing heat damage while ensuring adequate user safety. This technological imperative has become a fundamental driver for cooling paste market growth.

Primary Market Drivers

Consumer Electronics Demand Expansion

The growing consumer electronics market represents the primary catalyst for cooling paste demand acceleration. Manufacturers within this sector are increasingly adopting innovative and strategic business models in response to intensifying competition levels and rapid technological developments. These market dynamics have directly augmented cooling paste market growth as companies seek superior thermal management solutions for their products.

Advanced technologies including virtual reality, Internet of Things (IoT), and robotics applications within the consumer electronics industry have created elevated demand for thermal management products. The sophisticated hardware requirements associated with these emerging technologies necessitate effective cooling solutions to prevent performance degradation and component failure, thereby driving cooling paste market expansion.

The widespread adoption of digital transformation across industries, characterized by high digitalization penetration, has significantly influenced demand and supply dynamics for consumer electronics. This digital shift has correspondingly increased cooling paste demand as manufacturers require effective thermal management solutions to prevent heat damage in increasingly complex electronic products.

Regional Market Development

Asia-Pacific markets, particularly India, have demonstrated rapid growth in electronics industry development over recent years. This regional expansion plays a vital role in economic development by contributing to GDP growth and creating substantial employment opportunities. The electronics sector's growth trajectory in these markets directly translates to increased cooling paste demand as manufacturers scale production and adopt more sophisticated thermal management requirements.

The Indian government's initiative to transform the country into a cashless economy through various digital payment promotion schemes has accelerated electronics adoption. Government policies including referral bonus schemes for digital payment platforms and incentives for online transactions have stimulated consumer electronics demand, creating corresponding requirements for thermal management solutions.

Technology and Innovation Trends

The cooling paste market benefits from continuous technological advancement as manufacturers develop more efficient thermal interface materials. Innovation efforts focus on improving thermal conductivity, application ease, and long-term stability under varying operating conditions. These technological improvements enable better heat dissipation performance while meeting the demanding requirements of modern electronic devices.

Advanced cooling paste formulations incorporate enhanced thermal properties that accommodate the increasing power densities and miniaturization trends in electronics manufacturing. These developments align with industry requirements for more compact yet thermally efficient solutions that support high-performance electronic systems.

Government Initiatives and Policy Support

Various government initiatives have been implemented to scale domestic production of electronic products, creating favorable conditions for cooling paste market growth. Policies promoting local manufacturing and self-reliance in electronics production have stimulated investment in the electronics and information technology sectors, generating increased demand for thermal management solutions.

Significant investments in electronics and IT sectors have been facilitated through supportive government frameworks that encourage domestic manufacturing capabilities. These policy initiatives have created a conducive environment for cooling paste market expansion as electronics manufacturers require reliable thermal management solutions for their production operations.

Competitive Landscape

The increasing demand for cooling paste has attracted numerous new market entrants, intensifying competitive dynamics within the industry. Market participants are implementing various strategic approaches including partnerships and novel solution development to expand their clientele and increase market share. Major industry players including 3M, BOYD Corporation, and Laird continue to lead market development through innovation and strategic positioning, maintaining competitive advantages in this rapidly evolving marketplace.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Cooling Paste Market Segments:

By Type

  • Tapes & Films
  • Gap Fillers
  • Phase Change Materials
  • Greases & Adhesives
  • Metal-Based Thermal Interface Materials
  • Others

By Application

  • Industrial Machinery
  • Medical Devices
  • Automotive Electronics
  • Telecom Devices
  • Personal Computers
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. COOLING PASTE MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Tapes & Films
  • 5.3. Gap Fillers
  • 5.4. Phase Change Materials
  • 5.5. Greases & Adhesives
  • 5.6. Metal-Based Thermal Interface Materials
  • 5.7. Others

6. COOLING PASTE MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Industrial Machinery
  • 6.3. Medical Devices
  • 6.4. Automotive Electronics
  • 6.5. Telecom Devices
  • 6.6. Personal Computers
  • 6.7. Others

7. COOLING PASTE MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. USA
    • 7.2.2. Canada
    • 7.2.3. Mexico
  • 7.3. South America
    • 7.3.1. Brazil
    • 7.3.2. Argentina
    • 7.3.3. Others
  • 7.4. Europe
    • 7.4.1. Germany
    • 7.4.2. France
    • 7.4.3. United Kingdom
    • 7.4.4. Spain
    • 7.4.5. Others
  • 7.5. Middle East and Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. Others
  • 7.6. Asia Pacific
    • 7.6.1. China
    • 7.6.2. India
    • 7.6.3. Japan
    • 7.6.4. South Korea
    • 7.6.5. Indonesia
    • 7.6.6. Thailand
    • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Parker Hannifin Corp
  • 9.2. Henkel AG & Co. KGaA
  • 9.3. Momentive
  • 9.4. Laird
  • 9.5. 3M
  • 9.6. Boyd Corporation
  • 9.7. Novagard Solutions
  • 9.8. Dow Corning Corporation
  • 9.9. To-Plan
  • 9.10. Kobayashi Pharmaceutical Co.

10. APPENDIX

  • 10.1. Currency
  • 10.2. Assumptions
  • 10.3. Base and Forecast Years Timeline
  • 10.4. Key benefits for the stakeholders
  • 10.5. Research Methodology
  • 10.6. Abbreviations