自动晶圆贴片机市场－2025-2030年预测

预计到 2025 年，自动晶圆贴片机市场规模将达到 14.73 亿美元，到 2030 年将达到 23.89 亿美元，复合年增长率为 10.15%。

自动晶圆贴片机市场分析

自动贴片机是一种专用贴片设备，旨在自动固定晶圆，同时确保在用于3D积体电路和晶圆层次电子构装技术的薄晶片晶圆製造过程中安全运作。这些先进的系统满足了先进半导体製造工作流程中对精度和安全性的关键要求。消费性电子产品产量的不断增长以及先进电子控制设备和半导体装置在工业和消费领域的快速普及，推动了自动贴片机市场的成长。

工业4.0的成长轨迹显着提高了采用自动化晶圆製造技术生产的尖端半导体元件的普及率，同时也推动了自动化晶圆贴装设备市场在预测期内的扩张。製造自动化、数位转型和先进半导体需求的融合，为支援下一代元件的生产，持续催生了精密晶圆贴装解决方案的需求。

主要市场特征

随着製造商努力提高产能和产量比率，半导体产业对速度更快、精度更高的晶圆贴片设备的需求日益增长。物联网 (IoT) 的兴起推动了电子製造领域对先进晶圆贴片技术的需求，因为物联网设备需要使用精密设备来製造复杂的半导体元件。亚太地区凭藉其生产成本优势和半导体製造设施的集中度，正崛起为关键市场。各公司正在创新自动化贴片设备，以支援小型化趋势和 3D 积体电路技术，从而实现更复杂、更高效能的半导体装置。

主要市场驱动因素

半导体产业的成长

对速度更快、功能更强大、价格更实惠的电子设备的需求日益增长，迫使元件製造商不断升级产品，从而增加了对自动化晶圆贴片设备的需求。晶圆贴片是半导体製造过程中晶粒准备阶段的关键步骤。随着半导体小型化趋势的持续发展，对贴片和处理能力的要求也越来越高，相应的需求也不断增长。

根据世界半导体贸易统计（WSTS）的数据，2021年5月全球半导体产业销售额预计达到436亿美元，高于2021年4月的419亿美元。该统计机构预测，2022年至2023年全球半导体市场将以5.1%的年复合成长率成长，达到6,800亿美元，显示该产业正稳定扩张。随着半导体销售额和市场规模的扩大，对晶圆贴片机的需求也将相应增长，从而在整个预测期内推动自动化晶圆贴片机市场的成长。

半导体产业的持续成长反映了数位转型、人工智慧应用、汽车电气化以及5G网路建置等根本需求驱动因素。所有这些应用都需要大量的半导体元件，从而持续推动对製造设备的需求，其中包括对先进封装和3D整合技术至关重要的自动化晶圆贴片系统。

物联网（IoT）的兴起

半导体装置製造商正优先发展自动化晶圆组装设备，以满足新兴应用（包括物联网 (IoT) 的部署）对晶片日益增长的需求。物联网的发展需要感测器、微控制器和其他元件来获取即时数据并执行边缘运算功能，因此对硅晶圆和积体电路的需求不断增长。

预计对智慧城市计划的投资增加将提振物联网需求，并显着促进自动化晶圆贴片机市场的成长。印度政府承诺投资10亿美元建设100座智慧城市，这有望成为全部区域物联网普及的关键因素。 2021年7月，沙乌地阿拉伯启动了四座大型智慧城市的开发案：NEOM、吉迪亚、红海计划和阿玛拉。每个计划都获得了价值数十亿美元的建设合约支援。其中，NEOM是规模最大的开发计划，是一个耗资5000亿美元的特大城市项目，旨在打造一个零碳排放、高度互联的大都市。

政府对关键领域物联网应用的支持，加上网路普及率的不断提高，正在促进物联网的普及，并推动自动化晶圆贴片机市场的成长。这些政府措施正在创造有利的政策环境，支持技术基础设施投资和半导体製造能力的扩张。

区域市场动态

预计亚太地区将在预测期内引领自动化晶圆贴片机市场。推动亚太地区市场成长的主要因素是低成本生产和电子产业生产设施的增加。根据中华人民共和国国务院报告显示，2022年1-2月，主要电子设备製造商的增加价值额年增12.7%，而同期整个工业部门的增幅仅为7.5%。

亚太地区继续主导该市场，这主要得益于该地区半导体製造业的快速成长。根据印度新闻资讯局 (PIB) 2022 年 2 月发布的报告，2020 年印度半导体市场规模为 150 亿美元，预计到 2026 年将达到约 630 亿美元。这一显着的成长势头表明该地区半导体製造能力正在扩张，并伴随着对相关设备需求的成长。

预计半导体和电子产业的这些发展将推动全部区域自动化晶圆贴片机市场在预测期内成长，巩固该地区作为全球半导体製造和设备消费中心的地位。

本报告的主要优势：

• 深入分析：提供对主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、行业垂直领域和其他细分市场。
• 竞争格局：了解全球主要参与者的策略倡议，并了解透过正确的策略进入市场的机会。
• 市场驱动因素与未来趋势：探索推动市场的动态因素和关键趋势，以及它们将如何塑造未来的市场发展。
• 可操作的建议：利用这些见解，在动态环境中製定策略决策，发展新的商业机会和收入来源。
• 受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

公司如何使用我们的报告范例

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

报告范围：

• 2022年至2024年的历史数据和2025年至2030年的预测数据
• 成长机会、挑战、供应链前景、法规结构与趋势分析
• 竞争定位、策略和市场占有率分析
• 按业务板块和地区分類的收入成长和预测评估，包括国家/地区
• 公司概况（策略、产品、财务资讯、关键发展等）

目录

第一章执行摘要

第二章 市场概览

• 市场概览
• 市场定义
• 调查范围
• 市场区隔

第三章 商业情境

• 市场驱动因素
• 市场限制
• 市场机会
• 波特五力分析
• 产业价值链分析
• 政策与法规
• 策略建议

第四章 技术展望

第五章 依晶圆尺寸分類的自动晶圆贴片机设备市场

• 介绍
• 150mm
• 200mm
• 300mm
• 其他的

第六章：按应用分類的自动晶圆贴片机设备市场

• 介绍
• 切丁
• 保护
• 晶片附着膜

第七章：依地区分類的自动晶圆贴片机设备市场

• 介绍
• 北美洲
  • 美国
  • 加拿大
  • 墨西哥
• 南美洲
  • 巴西
  • 阿根廷
  • 其他的
• 欧洲
  • 德国
  • 法国
  • 英国
  • 西班牙
  • 其他的
• 中东和非洲
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 其他的
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 印尼
  • 泰国
  • 其他的

第八章 竞争格局与分析

• 主要企业和策略分析
• 市占率分析
• 合併、收购、协议和合作
• 竞争对手仪錶板

第九章：公司简介

• DISCO Corp
• Syagrus Systems
• Longhill Industries
• Lintec Corporation
• Nitto Denko
• Hibex Singapore Pte Ltd
• Takatori
• Semiconductor Equipment Corp
• QES Group Berhad
• UVFAB Systems, Inc

第十章附录

• 货币
• 先决条件
• 基准年和预测年时间表
• 相关人员的主要收益
• 调查方法
• 简称

The automatic mounter wafer equipment market, growing at a 10.15% CAGR, is expected to grow to USD 2.389 billion in 2030 from USD 1.473 billion in 2025.

Automatic Mounter Wafer Equipment Market Analysis

Automatic mounter wafer equipment represents specialized mounting devices designed to automatically secure wafers while guaranteeing safe operation during thin die wafer fabrication processes utilized in 3D integrated circuit and wafer-level packaging technologies. These sophisticated systems address critical requirements for precision and safety in advanced semiconductor manufacturing workflows. Market growth for automatic mounter wafer equipment is being driven by expanding consumer electronics production and the rapid proliferation of sophisticated electronic controls and semiconductor devices across industrial and consumer applications.

The adoption of cutting-edge semiconductor devices created through automatic mounter wafer fabrication has increased significantly due to Industry 4.0 growth trajectories, simultaneously boosting automatic mounter wafer equipment market expansion during the forecasted period. This convergence of manufacturing automation, digital transformation, and advanced semiconductor requirements creates sustained demand for precision wafer mounting solutions supporting next-generation device production.

Key Market Highlights

The semiconductor industry is driving demand for faster and more precise wafer mounting equipment as manufacturers pursue enhanced throughput and yield performance. Internet of Things adoption is increasing demand for advanced wafer mounting capabilities in electronics manufacturing, as IoT devices require sophisticated semiconductor components manufactured with precision equipment. The Asia-Pacific region is expanding as a key market due to production cost advantages and concentration of semiconductor manufacturing facilities. Companies are innovating automatic mounter equipment supporting miniaturization trends and 3D integrated circuit technologies, enabling more complex and capable semiconductor devices.

Primary Market Drivers

Rising Semiconductor Industry

Demand for faster, better, and more affordable electronic devices compels component manufacturers to upgrade their products constantly, increasing demand for automatic mounter wafer equipment. The wafer mounting procedure is executed as part of semiconductor fabrication during die preparation phases, representing a critical process step. An increasing tendency toward miniaturization in semiconductors creates corresponding demand growth, as smaller device geometries require more precise mounting and handling capabilities.

According to World Semiconductor Trade Statistics, global semiconductor sector sales were estimated to have reached $43.6 billion in May 2021, increasing from $41.9 billion in April 2021. The same source projected the global semiconductor market would grow by 5.1% from 2022 to reach $680 billion in 2023, demonstrating robust industry expansion. As semiconductor sales and market size grow, demand for fabrication utilizing mounter wafer equipment increases correspondingly, boosting automatic mounter wafer equipment market growth throughout the forecast period.

The semiconductor industry's sustained growth reflects fundamental demand drivers including digital transformation, artificial intelligence deployment, automotive electrification, and 5G network buildout. Each of these application areas requires substantial semiconductor content, creating sustained fabrication equipment demand including automatic mounter wafer systems essential for advanced packaging and 3D integration technologies.

Internet of Things Adoption

Semiconductor device manufacturers prefer automatic wafer mounting equipment to address increasing chip demand in emerging applications including Internet of Things deployments. IoT development has generated rising demand for silicon wafers and integrated circuits due to requirements for sensors, microcontrollers, and other components enabling IoT applications to retrieve real-time data and execute edge computing functions.

Rising investment in smart city projects is increasing IoT demand, which will boost automatic mounter wafer equipment market growth significantly. The Indian government committed $1 billion to construct 100 smart cities, anticipated to be crucial factors in IoT proliferation throughout the region. In July 2021, Saudi Arabia initiated development of four major smart cities: NEOM, Qiddiya, the Red Sea Project, and Amaala, each supported by multibillion-dollar construction contracts. The largest development, NEOM, represents a planned $500 billion megacity incorporating a zero-carbon hyper-connected metropolis.

Government support for IoT proliferation in key sectors, combined with mass internet adoption, is driving IoT deployment, thereby increasing automatic mounter wafer equipment market growth. This governmental commitment creates favorable policy environments supporting technology infrastructure investment and semiconductor manufacturing capacity expansion.

Regional Market Dynamics

During the forecast period, the Asia-Pacific region is expected to dominate the automatic mounter wafer equipment market. Two primary factors propelling market growth in Asia-Pacific are low production costs and rising numbers of production facilities in the electronics industry. The State Council of the People's Republic of China reported that in January-February 2022, the added value of the country's main electronics manufacturers increased by 12.7% year over year, contrasting with 7.5% growth experienced by the entire industrial sector.

The Asia-Pacific region will continue dominating this market primarily due to its flourishing semiconductor manufacturing sector. According to PIB reports from February 2022, the Indian semiconductors market was valued at $15 billion in 2020, with projections reaching approximately $63 billion by 2026. This substantial growth trajectory demonstrates the region's expanding semiconductor manufacturing capabilities and corresponding equipment requirements.

These developments in semiconductors and electronics industries will boost automatic mounter wafer equipment market growth throughout the Asia Pacific region during the forecasted period, solidifying its position as the global epicenter for semiconductor manufacturing and equipment consumption.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Automatic Mounter Wafer Equipment Market Segmentation:

• AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY WAFER SIZE
• 150mm
• 200mm
• 300mm
• Others
• AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY APPLICATION
• Dicing
• Protection
• Die Attach Films
• AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY GEOGRAPHY
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Indonesia
• Thailand
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY WAFER SIZE

• 5.1. Introduction
• 5.2. 150mm
• 5.3. 200mm
• 5.4. 300mm
• 5.5. Others

6. AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Dicing
• 6.3. Protection
• 6.4. Die Attach Films

7. AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East and Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. India
  • 7.6.3. Japan
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Thailand
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. DISCO Corp
• 9.2. Syagrus Systems
• 9.3. Longhill Industries
• 9.4. Lintec Corporation
• 9.5. Nitto Denko
• 9.6. Hibex Singapore Pte Ltd
• 9.7. Takatori
• 9.8. Semiconductor Equipment Corp
• 9.9. QES Group Berhad
• 9.10. UVFAB Systems, Inc

10. APPENDIX

• 10.1. Currency
• 10.2. Assumptions
• 10.3. Base and Forecast Years Timeline
• 10.4. Key Benefits for the Stakeholders
• 10.5. Research Methodology
• 10.6. Abbreviations