半导体干式剥离设备市场 - 2026-2031 年预测

预计半导体干带设备市场将从 2025 年的 2.8337 亿美元成长到 2031 年的 3.64336 亿美元，复合年增长率为 4.28%。

半导体干式剥离系统利用等离子体製程去除关键的光阻剂和蚀刻后残留物，从而保护那些不再适用湿式化学製程的精密前端（FEOL）和后段製程（BEOL）结构。随着装置尺寸的不断缩小、新型通道材料的涌现以及3D结构的日益普及，这些工具变得至关重要。其需求主要来自逻辑晶片代工厂、记忆体製造商及功率元件製造商，他们需要处理7nm及以下节点的晶圆，以及宽能带隙化合物半导体的快速规模化生产。

主要成长要素

1. 全球半导体晶圆厂产能快速成长：逻辑晶片、DRAM、3D NAND快闪记忆体和代工服务的持续大规模生产扩张直接转化为晶圆产量的增加，以及每片晶圆干法剥离製程步骤的增加。同时，5G基础设施、边缘人工智慧、汽车电子和高效能运算的并行发展，也持续推动前端製程向剥离室集中化。

2. 装置的复杂性和尺寸不断缩小。环栅奈米片（GAA）、CFET架构、背面供电和先进封装技术显着增加了剥离循环次数，同时也对原子级选择性提出了更高的要求。干式剥离设备必须能够无损去除聚合物，并保持表面无残留，同时不得劣化高介电常数材料、低介电常数材料和新型通道半导体材料造成性能劣化。

目录

第一章执行摘要

第二章市场概述

• 市场概览
• 市场定义
• 分析范围
• 市场区隔

第三章 商业情境

• 市场驱动因素
• 市场限制
• 市场机会
• 波特五力分析
• 产业价值链分析
• 政策和法规
• 策略建议

第四章 技术展望

5. 以半导体类型分類的半导体干式剥线设备市场

• 介绍
• 元素半导体
• 化合物半导体

6. 按技术分類的半导体干剥离设备市场

• 介绍
• 等离子条
• 气相反应

7. 半导体干式剥线设备市场（依应用领域划分）

• 介绍
• 功率半导体
• MEMS
• CMOS影像感测器
• 其他的

8. 半导体干式剥线设备市场（依地区划分）

• 介绍
• 美洲
  • 我们
• 欧洲、中东和非洲
  • 德国
  • 法国
  • 英国
  • 其他的
• 亚太地区
  • 中国
  • 日本
  • 韩国
  • 台湾
  • 其他的

第九章 竞争格局与分析

• 主要企业和策略分析
• 市占率分析
• 企业合併、协议、商业合作
• 竞争对手仪錶板

第十章：公司简介

• Applied Materials Inc.
• Axcelis Technologies Inc.
• PSK Holdings Inc.
• Lam Research Corporation
• Mattson Technology Inc.
• Tokyo Electron Limited
• Grand Process Technology Co., Ltd.
• Samco Inc.
• ULVAC Inc.

第十一章附录

• 货币
• 先决条件
• 基准年和预测年时间表
• 相关人员的主要收益
• 分析方法
• 简称

Semiconductor Dry Strip Equipment Market is expected to grow at a 4.28% CAGR, achieving USD 364.336 million in 2031 from USD 283.370 million in 2025.

emiconductor dry strip systems perform critical photoresist and post-etch residue removal through plasma-based processes, preserving delicate front-end-of-line (FEOL) and back-end-of-line (BEOL) structures where wet chemistry is no longer viable. These tools have become indispensable as device geometries shrink, new channel materials emerge, and 3D architectures proliferate. Primary demand originates from logic foundries, memory manufacturers, and power-device fabricators processing wafers at <=7 nm nodes and below, alongside the rapid scale-up of wide-bandgap compound semiconductors.

Core Growth Drivers

1. Surging global semiconductor fab capacity Sustained volume expansion across logic, DRAM, 3D NAND, and foundry services directly correlates with higher wafer starts and increased dry-strip processing steps per wafer. The parallel ramp of 5G infrastructure, edge AI, automotive electronics, and high-performance computing continues to drive front-end loading of strip chambers.

2. Relentless device complexity and miniaturization Gate-all-around (GAA) nanosheets, CFET architectures, backside power delivery, and advanced packaging schemes dramatically increase the number of strip cycles while imposing atomic-level selectivity requirements. Dry strip tools must deliver damage-free polymer removal and residue-free surfaces without degrading high-k dielectrics, low-k materials, or novel channel semiconductors.

Fastest-Growing Segments

The compound semiconductor segment is the most dynamic portion of the dry strip equipment market:

• Gallium Nitride (GaN): Accelerated adoption in RF front-end modules, fast chargers, and electric-vehicle traction inverters requires dedicated strip recipes that prevent surface pitting and gallium re-deposition. Specialized downstream plasma systems optimized for GaN-on-Si, GaN-on-SiC, and GaN-on-sapphire are seeing the strongest unit growth.
• Silicon Carbide (SiC): The shift to 150 mm and 200 mm SiC platforms for 800 V+ EV powertrains and renewable-energy inverters demands robust high-temperature implant strip and post-etch cleaning processes that maintain basal plane integrity and minimize micro-pipe propagation.

Regional Dynamics

Asia-Pacific maintains overwhelming dominance, accounting for the majority of installed base and new tool shipments. Taiwan, South Korea, and Japan benefit from massive logic, memory, and power-device investments, reinforced by aggressive national semiconductor initiatives:

• South Korea's Semiconductor Industry Promotion Plan
• Japan's Rebirth of Japan's Electronics Industry strategy
• Taiwan's continuing foundry and memory megafab expansions

These programs channel subsidies, tax incentives, and R&D funding directly into advanced-node and compound-semiconductor capacity, ensuring sustained pull-through demand for next-generation dry strip platforms.

North America retains a strategic position through design leadership and early adoption of advanced packaging and GAA technologies at Intel, AMD, and Qualcomm, but lags in raw manufacturing footprint.

Key Equipment Platforms

• Lam Research GAMMA(R) family: Remains the volume leader for logic and memory with differentiated downstream microwave plasma technology offering high throughput, residue-free performance, and minimal device impact at advanced nodes.
• Kao CLEANTHROUGH A-06 & A-19: Specialty chemical dry-film strippers targeting back-end photoresist removal with emphasis on speed (A-06) and amine-free environmental compliance (A-19).

Market Constraints

High system cost, extreme selectivity challenges with new materials (e.g., ruthenium, molybdenum, EUV resists), and the intrinsic cyclicality of semiconductor capex continue to moderate growth velocity despite strong underlying wafer-fab-equipment (WFE) intensity trends.

The confluence of logic/memory node scaling and the structural rise of GaN and SiC devices nevertheless positions semiconductor dry strip equipment for sustained mid-to-high single-digit annual growth, with compound-semiconductor-specific systems exhibiting the highest incremental demand through the remainder of the decade.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2021 to 2025 & forecast data from 2026 to 2031
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information), and Key Developments among others.

Semiconductor Dry Strip Equipment Market Segmentation:

• By Semiconductor Type
• Element Semiconductor
• Compound Semiconductor
• By Technology
• Plasma Strip
• Gas-Phased Reaction
• By Application
• Power Semiconductors
• MEMS
• CMOS Image Sensors
• Others
• By Geography
• Americas
• USA
• Europe Middle East and Africa
• Germany
• France
• United Kingdom
• Others
• Asia Pacific
• China
• Japan
• South Korea
• Taiwan
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study
• 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY SEMICONDUCTOR TYPE

• 5.1. Introduction
• 5.2. Element Semiconductor
• 5.3. Compound Semiconductor

6. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY TECHNOLOGY

• 6.1. Introduction
• 6.2. Plasma Strip
• 6.3. Gas-Phased Reaction

7. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY APPLICATION

• 7.1. Introduction
• 7.2. Power Semiconductors
• 7.3. MEMS
• 7.4. CMOS Image Sensors
• 7.5. Others

8. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY GEOGRAPHY

• 8.1. Introduction
• 8.2. Americas
  • 8.2.1. USA
• 8.3. Europe Middle East and Africa
  • 8.3.1. Germany
  • 8.3.2. France
  • 8.3.3. United Kingdom
  • 8.3.4. Others
• 8.4. Asia Pacific
  • 8.4.1. China
  • 8.4.2. Japan
  • 8.4.3. South Korea
  • 8.4.4. Taiwan
  • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 9.1. Major Players and Strategy Analysis
• 9.2. Market Share Analysis
• 9.3. Mergers, Acquisitions, Agreements, and Collaborations
• 9.4. Competitive Dashboard

10. COMPANY PROFILES

• 10.1. Applied Materials Inc.
• 10.2. Axcelis Technologies Inc.
• 10.3. PSK Holdings Inc.
• 10.4. Lam Research Corporation
• 10.5. Mattson Technology Inc.
• 10.6. Tokyo Electron Limited
• 10.7. Grand Process Technology Co., Ltd.
• 10.8. Samco Inc.
• 10.9. ULVAC Inc.

11. APPENDIX

• 11.1. Currency
• 11.2. Assumptions
• 11.3. Base and Forecast Years Timeline
• 11.4. Key Benefits for the Stakeholders
• 11.5. Research Methodology
• 11.6. Abbreviations

LIST OF TABLE