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薄晶圆市场：趋势、机遇、竞争分析 [2023-2028]
市场调查报告书
商品编码
1285027

薄晶圆市场：趋势、机遇、竞争分析 [2023-2028]

Thin Wafer Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

薄晶圆市场趋势和预测

到 2028 年，全球薄晶圆市场预计将达到 205 亿美元，2023 年至 2028 年復合年增长率为 10.2%。 该市场的主要驱动力是智能手机和手持健康监测设备的普及、电子设备小型化趋势的增强以及物联网和人工智能在汽车中的日益融合。 MEMS、CIS、存储器、射频器件、LED、中介层和逻辑市场的薄晶圆市场前景看好。

进入薄晶圆市场的公司名单

市场上的公司根据其提供的产品质量进行竞争。 该市场的主要参与者专注于扩大製造设施、投资研发、升级基础设施以及利用整个价值链的整合机会。 这些战略使晶圆公司能够满足不断增长的需求、保持竞争力、开发创新产品和技术、降低製造成本并扩大客户群。

薄晶圆市场洞察

  • Lucintel 预计，由于对先进半导体产品的需求增加以及太阳能行业需求的增加，300mm 仍将是预测期内最大的细分市场。
  • 由于 CIS 在手机和其他消费电子设备中的应用不断增长，预计其仍将是最大的细分市场。
  • 由于消费电子设备的需求增加以及半导体製造商的存在，预计亚太地区仍将是最大的地区。

本报告回答了 11 个关键问题：

  • Q.1.您的细分市场中最有前途和高增长的机会是什么？
  • Q.2.哪些细分市场增长速度更快？原因是什么？
  • Q.3.您认为哪些地区的增长速度会更快？为什么？
  • Q.4.影响市场动态的关键因素有哪些？ 这个市场的主要挑战和商业风险是什么？
  • Q.5.这个市场的业务风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.这个市场中的客户需求有哪些变化？
  • Q.8.市场有哪些新发展？ 哪些公司正在引领这些发展？
  • Q.9.这个市场的主要参与者是谁？ 主要参与者采取哪些战略举措来发展业务？
  • Q.10.该市场上的竞争产品有哪些？因材料或产品替代而导致市场份额损失的威胁是什么？
  • Q.11.过去五年发生了哪些类型的併购，对行业产生了哪些影响？

内容

第 1 章执行摘要

第二章全球薄晶圆市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 行业驱动因素和挑战

第三章2017-2028年市场趋势及预测分析

  • 宏观经济趋势（2017-2022 年）和预测（2023-2028 年）
  • 全球薄晶圆市场趋势（2017-2022）及预测（2023-2028）
  • 按晶圆尺寸划分的全球薄晶圆市场
    • 125mm
    • 200mm
    • 300mm
  • 按工艺划分的全球薄晶圆市场
    • 暂时粘合/剥离
    • 无载体/TAIKO 工艺
  • 按应用划分的全球薄晶圆市场
    • MEMS
    • CIS
    • 内存
    • 射频设备
    • LED
    • 插入器
    • 逻辑
    • 其他

第四章2017-2028年分地区市场趋势及预测分析

  • 按地区划分的全球薄晶圆市场
  • 北美薄晶圆市场
  • 欧洲薄晶圆市场
  • 亚太薄晶圆市场
  • 其他区域薄晶圆市场

第五章竞争分析

  • 产品组合分析
  • 运营整合
  • 波特五力分析

第 6 章增长机会和战略分析

  • 增长机会分析
    • 按晶圆尺寸划分的全球薄晶圆市场增长机会
    • 按工艺划分的全球薄晶圆市场增长机会
    • 按应用划分的全球薄晶圆市场增长机会
    • 按地区划分的全球薄晶圆市场增长机会
  • 全球薄晶圆市场新趋势
  • 战略分析
    • 新产品开发
    • 全球薄晶圆市场产能扩张
    • 全球薄晶圆市场的合併、收购和合资企业
    • 身份验证和许可

第 7 章主要公司简介

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials
简介目录

Thin Wafer Market Trends and Forecast

The future of the thin wafer market looks promising with in the MEMS, CIS, memory, RF device, LED, interposer, and logic markets. The global thin wafer market is expected to reach an estimated $20.5 billion by 2028 with a CAGR of 10.2% from 2023 to 2028. The major drivers for this market are growing adoption of smartphones and portable health monitoring devices, rising trend of miniaturization of electronic devices, and increasing integration of IoT and AI in vehicles.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Thin Wafer Market by Segment

The study includes a forecast for the global thin wafer market by wafer size, process, application, and region, as follows.

Thin Wafer Market by Wafer Size [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 125 mm
  • 200 mm
  • 300 mm

Thin Wafer Market by Process [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Temporary Bonding & Debonding
  • Carrier-less/Taiko Process

Thin Wafer Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • MEMS
  • CIS
  • Memory
  • RF Devices
  • LED
  • Interposer
  • Logic
  • Others

Thin Wafer Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Thin Wafer Market Companie

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies thin wafer companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the thin wafer companies profiled in this report include.

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials

Thin Wafer Market Insights

  • Lucintel forecasts that 300 mm will remain the largest segment over the forecast period due to increasing demand for advanced semiconductor products and growing demand from the solar energy sector.
  • CIS is expected to remain the largest segment due to its increasing application in mobile phones and other consumer electronic devices.
  • APAC will remain the largest region due to increasing demand for consumer electronics and presence of semiconductor manufacturers in the region.

Features of the Thin Wafer Market

  • Market Size Estimates: Thin wafer market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Thin wafer market size by various segments, such as by wafer size, process, application, and region
  • Regional Analysis: Thin wafer market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by wafer size, process, application, and regions for the thin wafer market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the thin wafer market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the thin wafer market size?

Answer: The global thin wafer market is expected to reach an estimated $20.5 billion by 2028.

Q2. What is the growth forecast for thin wafer market?

Answer: The global thin wafer market is expected to grow with a CAGR of 10.2% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the thin wafer market?

Answer: The major drivers for this market are growing adoption of smartphones and portable health monitoring devices, rising trend of miniaturization of electronic devices, and increasing integration of IoT and AI in vehicles.

Q4. What are the major segments for thin wafer market?

Answer: The future of the thin wafer market looks promising with opportunities in the MEMS, CIS, memory, RF device, LED, interposer, and logic markets.

Q5. Who are the key thin wafer companies?

Answer: Some of the key thin wafer companies are as follows:

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials

Q6. Which thin wafer segment will be the largest in future?

Answer: Lucintel forecasts that 300 mm will remain the largest segment over the forecast period due to increasing demand for advanced semiconductor products and growing demand from the solar energy sector.

Q7. In thin wafer market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to increasing demand for consumer electronics and presence of semiconductor manufacturers in the region.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10.2% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the thin wafer market by wafer size (125 mm, 200 mm, and 300 mm), process (temporary bonding & debonding and carrier-less/taiko process), application (MEMS, CIS, memory, RF devices, LED, interposer, logic, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Thin Wafer Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Thin Wafer Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Thin Wafer Market by Wafer Size
    • 3.3.1: 125 mm
    • 3.3.2: 200 mm
    • 3.3.3: 300 mm
  • 3.4: Global Thin Wafer Market by Process
    • 3.4.1: Temporary Bonding & Debonding
    • 3.4.2: Carrier-less/Taiko Process
  • 3.5: Global Thin Wafer Market by Application
    • 3.5.1: MEMS
    • 3.5.2: CIS
    • 3.5.3: Memory
    • 3.5.4: RF Devices
    • 3.5.5: LED
    • 3.5.6: Interposer
    • 3.5.7: Logic
    • 3.5.8: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global Thin Wafer Market by Region
  • 4.2: North American Thin Wafer Market
    • 4.2.1: North American Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm: 125 mm, 200 mm, and 300 mm
    • 4.2.2: North American Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.3: European Thin Wafer Market
    • 4.3.1: European Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.3.2: European Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.4: APAC Thin Wafer Market
    • 4.4.1: APAC Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.4.2: APAC Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.5: ROW Thin Wafer Market
    • 4.5.1: ROW Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.5.2: ROW Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Thin Wafer Market by Wafer Size
    • 6.1.2: Growth Opportunities for the Global Thin Wafer Market by Process
    • 6.1.3: Growth Opportunities for the Global Thin Wafer Market by Application
    • 6.1.4: Growth Opportunities for the Global Thin Wafer Market by Region
  • 6.2: Emerging Trends in the Global Thin Wafer Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Thin Wafer Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Thin Wafer Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Shin-Etsu Chemical
  • 7.2: SUMCO Corporation
  • 7.3: GlobalWafers Co.
  • 7.4: Siltronic
  • 7.5: SK Siltron
  • 7.6: SUSS MicroTec
  • 7.7: Soitec
  • 7.8: DISCO Corporation
  • 7.9: 3M
  • 7.10: Applied Materials