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系统级封装 (SiP) 技术市场：趋势、机遇和竞争分析 [2023-2028]
市场调查报告书
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1300747

系统级封装 (SiP) 技术市场：趋势、机遇和竞争分析 [2023-2028]

System in Package (SiP) Technology Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

系统级封装 (SiP) 技术市场趋势和预测

到 2028 年，全球系统级封装 (SiP) 技术市场预计将达到 402 亿美元，2023 年至 2028 年復合年增长率为 10.2%。 该市场的主要驱动因素是小型电子设备需求的增长、物联网设备数量的增加以及5G网络连接设备的增长趋势。 全球系统级封装 (SiP) 技术市场前景广阔，消费电子、汽车、通信、工业系统以及航空航天和国防市场充满机遇。

系统级封装 (SiP) 技术公司列表

同一市场中的公司通过其提供的产品质量进行竞争。 该市场的主要参与者专注于扩大製造设施、投资研发、开发基础设施以及利用整个价值链的整合机会。 这些策略使系统级封装 (SiP) 技术公司能够满足不断增长的需求、保持竞争力、开发创新产品和技术、降低生产成本并扩大客户群。 本报告中介绍的系统级封装 (SiP) 技术公司包括：

系统级封装 (SiP) 技术市场洞察

  • Lucintel 预测，3D IC 封装在预测期内将继续成为一个重要细分市场，因为与其他技术相比，3D IC 封装具有更高的性能。
  • 由于智能手机和可穿戴设备的技术进步以及对小型电子设备的需求不断增长，消费电子产品预计仍将是最大的细分市场。
  • 由于互联设备的普及以及对机器人实现各种工作流程自动化以提高该地区效率的需求不断增长，北美将继续成为最大的地区。我会的。

本报告回答了 11 个关键问题：

  • Q.1. 该细分市场中最有前途和高增长的机会是什么？
  • 问题 2：哪个细分市场将以更快的速度增长？为什么？
  • 问题 3. 您认为哪些地区未来会出现更快的增长？为什么？
  • Q.4.影响市场动态的主要因素有哪些？ 市场的主要挑战和商业风险是什么？
  • Q.5. 该市场存在哪些业务风险和竞争威胁？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何变化？
  • 问题8.您可以通过哪些方式开发新兴市场？ 哪些公司正在引领这些发展？
  • Q.9.市场上的主要公司有哪些？ 主要公司采取哪些战略举措来发展业务？
  • Q.10. 该市场中的竞争产品有哪些？由于材料或产品替代而导致市场份额下降的威胁有多大？
  • Q.11.过去五年发生了哪些类型的併购，对行业产生了哪些影响？

目录

第 1 章执行摘要

第 2 章全球系统级封装 (SiP) 技术市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 行业驱动因素和挑战

第三章2017-2028年市场趋势及预测分析

  • 宏观经济趋势（2017-2022 年）和预测（2023-2028 年）
  • 全球系统级封装 (SiP) 技术市场趋势（2017-2022 年）和预测（2023-2028 年）
  • 系统级封装 (SiP) 技术的全球市场：按技术分类
    • 2D IC 封装
    • 2.5D IC封装
    • 3D IC 封装
  • 系统级封装 (SiP) 技术的全球市场：按方法分类
    • 引线键合
    • 倒装芯片
  • 全球系统级封装 (SiP) 技术市场：按最终用途分类
    • 消费电子产品
    • 汽车
    • 通讯
    • 工业系统
    • 航空航天/国防
    • 其他

第四章2017-2028年区域市场趋势及预测分析

  • 系统级封装 (SiP) 技术的全球区域市场
  • 北美系统级封装 (SiP) 技术市场
  • 欧洲系统级封装 (SiP) 技术市场
  • 亚太系统级封装 (SiP) 技术市场
  • 其他区域系统级封装 (SiP) 技术市场

第五章竞争分析

  • 产品组合分析
  • 运营整合
  • 波特五力分析

第 6 章增长机会和战略分析

  • 增长机会分析
    • 系统级封装 (SiP) 技术的全球市场增长机会：按技术分类
    • 系统级封装 (SiP) 技术的全球市场增长机会：按方法分类
    • 系统级封装 (SiP) 技术的全球市场增长机会：按应用分类
    • 系统级封装 (SiP) 技术的全球市场增长机会：按地区划分
  • 全球系统级封装 (SiP) 技术市场的趋势
  • 战略分析
    • 新产品开发
    • 扩大系统级封装 (SiP) 技术全球市场的产能
    • 全球系统级封装 (SiP) 技术市场的合併、收购和合资企业
    • 身份验证和许可

第7章主要公司简介

  • Jiangsu Changjiang Electronics Technology
  • Chipmos Technologies
  • Powertech Technologies
  • ASE Group
  • Amkor Technology
  • Fujitsu
简介目录

System in Package (SiP) Technology Market Trends and Forecast

The future of the global system in package (SiP) technology market looks promising with opportunities in the consumer electronic, automotive, telecommunication, industrial system, and aerospace and defense markets. The global system in package (SiP) technology market is expected to reach an estimated $40.2 billion by 2028 with a CAGR of 10.2% from 2023 to 2028. The major drivers for this market are growing demand for compact electronic device, increasing number of IoT devices, and rising trend of 5G network connected devices.

A more than 150-page report is developed to help in your business decisions.

System in Package (SiP) Technology Market by Segment

The study includes a forecast for the global system in package (SiP) technology market by technology, method, end use, and region, as follows:

System in Package (SiP) Technology Market by Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 2D IC Packaging
  • 2.5D IC Packaging
  • 3D IC Packaging

System in Package (SiP) Technology Market by Method [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Wire Bond
  • Flip Chip

System in Package (SiP) Technology Market by End Use [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace and Defense
  • Others

System in Package (SiP) Technology Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of System in Package (SiP) Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies system in package (SiP) technology companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the system in package (SiP) technology companies profiled in this report includes.

  • Jiangsu Changjiang Electronics Technology
  • Chipmos Technologies
  • Powertech Technologies
  • ASE Group
  • Amkor Technology
  • Fujitsu

System in Package (SiP) Technology Market Insights

  • Lucintel forecasts that 3D IC packaging will remain the larger segment over the forecast period because it delivers improved performance compared to other technologies.
  • Consumer electronics is expected to remain the largest segment due to the growing demand compact electronic devices along with on going technological advancements in smartphones and wearable devices.
  • North America will remain the largest region due to the growing adoption of connected devices and increasing demand for robots so as to automate the various workflows for better efficiency in the region.

Features of the System in Package (SiP) Technology Market

  • Market Size Estimates: System in package (SiP) technology market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: System in package (SiP) technology market size by various segments, such as by technology, method, end use, and region
  • Regional Analysis: System in package (SiP) technology market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by technology, method, end use, and regions for the system in package (SiP) technology market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the system in package (SiP) technology market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the system in package (SiP) technology market size?

Answer: The global system in package (SiP) technology market is expected to reach an estimated $40.2 billion by 2028.

Q2. What is the growth forecast for system in package (SiP) technology market?

Answer: The global system in package (SiP) technology market is expected to grow with a CAGR of 10.2% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the system in package (SiP) technology market?

Answer: The major drivers for this market are growing demand for compact electronic device, increasing number of IoT devices, and rising trend of 5G network connected devices.

Q4. What are the major segments for system in package (SiP) technology market?

Answer: The future of the system in package (SiP) technology market looks promising with opportunities in the consumer electronic, automotive, telecommunication, industrial system, and aerospace and defense markets.

Q5. Who are the key system in package (SiP) technology companies?

Answer: Some of the key system in package (SiP) technology companies are as follows:

  • Jiangsu Changjiang Electronics Technology
  • Chipmos Technologies
  • Powertech Technologies
  • ASE Group
  • Amkor Technology

Q6. Which system in package (SiP) technology segment will be the largest in future?

Answer:Lucintel forecasts that 3D IC packaging will remain the larger segment over the forecast period because it delivers improved performance compared to other technologies.

Q7. In system in package (SiP) technology market, which region is expected to be the largest in next 5 years?

Answer: North America will remain the largest region due to the growing adoption of connected devices and increasing demand for robots so as to automate the various workflows for better efficiency in the region.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10.2% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the system in package (SiP) technology market by technology (2D IC packaging, 2.5D IC packaging, and 3D IC packaging), method (wire bond and flip chip), end use (consumer electronics, automotive, telecommunication, industrial system, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global System in Package (SiP) Technology Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global System in Package (SiP) Technology Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global System in Package (SiP) Technology Market by Technology
    • 3.3.1: 2D IC Packaging
    • 3.3.2: 2.5D IC Packaging
    • 3.3.3: 3D IC Packaging
  • 3.4: Global System in Package (SiP) Technology Market by Method
    • 3.4.1: Wire Bond
    • 3.4.2: Flip Chip
  • 3.5: Global System in Package (SiP) Technology Market by End Use
    • 3.5.1: Consumer Electronics
    • 3.5.2: Automotive
    • 3.5.3: Telecommunication
    • 3.5.4: Industrial System
    • 3.5.5: Aerospace and Defense
    • 3.5.6: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global System in Package (SiP) Technology Market by Region
  • 4.2: North American System in Package (SiP) Technology Market
    • 4.2.1: North American System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.2.2: North American System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Others
  • 4.3: European System in Package (SiP) Technology Market
    • 4.3.1: European System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.3.2: European System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Others
  • 4.4: APAC System in Package (SiP) Technology Market
    • 4.4.1: APAC System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.4.2: APAC System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Other
  • 4.5: ROW System in Package (SiP) Technology Market
    • 4.5.1: ROW System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.5.2: ROW System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global System in Package (SiP) Technology Market by Technology
    • 6.1.2: Growth Opportunities for the Global System in Package (SiP) Technology Market by Method
    • 6.1.3: Growth Opportunities for the Global System in Package (SiP) Technology Market by End Use
    • 6.1.4: Growth Opportunities for the Global System in Package (SiP) Technology Market by Region
  • 6.2: Emerging Trends in the Global System in Package (SiP) Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global System in Package (SiP) Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global System in Package (SiP) Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Jiangsu Changjiang Electronics Technology
  • 7.2: Chipmos Technologies
  • 7.3: Powertech Technologies
  • 7.4: ASE Group
  • 7.5: Amkor Technology
  • 7.6: Fujitsu