IO-Link 市场:趋势、机会、竞争分析 [2023-2028]
市场调查报告书
商品编码
1342026

IO-Link 市场:趋势、机会、竞争分析 [2023-2028]

IO-Link Market: Trends, Opportunities and Competitive Analysis [2023-2028]

出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

IO-Link市场趋势与预测

预计到 2028 年,全球 IO-Link 市场将达到 324 亿美元,2023 年至 2028 年年复合成长率为 20.40%。该市场的主要促进因素是对工业 4.0 的需求不断增长、政府对采用工业自动化的配合措施不断增加,以及消费者对製造业中可靠、紧凑的解决方案的意愿不断增加。全球 IO-Link 市场的未来可能包括工具机、搬运和组装自动化、内部物流和包装市场的商机。

IO-Link 市场洞察

  • Lucintel 预测 IO-link 主站将成为一个不断成长的细分市场。
  • 工具机可能会继续属于这一领域,因为 IO 链路提供与多种类型的感测器和致动器的兼容性和弹性。
  • 由于对高度先进的互联和自动驾驶汽车的需求不断增长,以及该地区汽车、航太和工业製造业的存在,预计欧洲在预测期内仍将是最大的地区。

本报告回答了 11 个关键问题:

  • Q.1. 细分市场中最有前途和高成长的机会是什么?
  • Q.2.哪个细分市场将以更快的速度成长?为什么?
  • Q.3.您认为哪些地区未来会出现更快的成长?为什么?
  • Q.4. 影响市场动态的主要要素有哪些?市场的主要挑战和商业风险是什么?
  • Q.5. 这个市场的商业风险和竞争威胁是什么?
  • Q.6.这个市场有哪些新趋势?为什么?
  • Q.7.市场客户需求有何改变?
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位?
  • Q.9.这个市场的主要企业有哪些?此外,主要企业正在采取什么样的策略配合措施?
  • Q10.该市场的竞争产品有哪些?因材料或产品替代而导致市场占有率下降的威胁有多大?
  • Q11.过去年度发生了哪些併购事件,对产业产生了哪些影响?

目录

第1章执行摘要

第2章全球 IO-Link 市场:市场动态

  • 简介、背景、分类
  • 供应链
  • 产业促进因素与挑战

第3章2017-2028年市场趋势及预测分析

  • 宏观经济趋势(2017-2022)与预测(2023-2028)
  • 全球IO-Link市场趋势(2017-2022)与预测(2023-2028)
  • 按类型分類的全球 IO-Link 市场
    • IO 连结有线
    • IO连接无线
  • 全球 IO-Link 市场(按应用)
    • 工具机
    • 自动化搬运和组装
    • 物流
    • 包装
  • 按组件分類的全球 IO-Link 市场
    • IO 连结主站
    • IO连结设备
    • 感测器节点
    • 模组
    • 执行器
    • RFID读取头
    • 其他的

第4章2017-2028年分地区市场趋势及预测分析

  • 全球 IO-Link 市场(按地区)
  • 北美IO-Link市场
  • 欧洲 IO-Link 市场
  • 亚太 IO-Link 市场
  • 其他地区 IO-Link 市场

第5章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第6章成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球 IO-Link 市场成长机会
    • 全球 IO-Link 市场成长机会(按应用)
    • 按组件分類的全球 IO-Link 市场成长机会
    • 按地区分類的全球 IO-Link 市场成长机会
  • 全球IO-Link市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球 IO-Link 市场的能力
    • 全球 IO-Link 市场的合併、收购与合资企业
    • 认证和许可

第7章主要企业概况

  • Balluff
  • ifm electronic
  • Banner
  • SICK
  • Siemens
  • Emerson
  • Rockwell Automation
  • Pepperl+Fuchs
  • Hans Turck
  • Omron Corporation
简介目录

IO-Link Market Trends and Forecast

The future of the global IO-link market looks promising with opportunities in the machine tool, handling & assembly automation, intralogistic, and packaging markets. The global IO-link market is expected to reach an estimated $32.4 billion by 2028 with a CAGR of 20.40% from 2023 to 2028. The major drivers for this market are growing demand for growing demand for industry 4.0, rising government initiatives towards the adoption of industrial automation and increasing consumer inclination towards reliable and compact solutions in the manufacturing industry.

A more than 150-page report is developed to help in your business decisions.

IO-Link Market by Segment

The study includes trends and forecast for the global IO-link market by type, application, component and region, as follows:

IO-Link Market by Type [Shipment Analysis by Value from 2017 to 2028]:

  • IO-link Wired
  • IO-link Wireless

IO-Link Market by Application [Shipment Analysis by Value from 2017 to 2028]:

  • Machine Tool
  • Handling & Assembly Automation
  • Intralogistics
  • Packaging

IO-Link Market by Component [Shipment Analysis by Value from 2017 to 2028]:

  • IO-link Master
  • IO-link Devices
  • Sensor Nodes
  • Modules
  • Actuators
  • RFID Read Heads
  • Others

IO-Link Market by Region [Shipment Analysis by Value from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of IO-Link Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IO-link companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the IO-link companies profiled in this report include:

  • Balluff
  • ifm electronic
  • Banner
  • SICK
  • Siemens
  • Emerson
  • Rockwell Automation
  • Pepperl+Fuchs
  • Hans Turck
  • Omron Corporation

IO-Link Market Insights

  • Lucintel forecasts that IO-link masters will witness the highest growing segment over the forecast period due to its increasing usage as gateway in field applications for connecting eight IO link devices, which include input modules, valves, sensors, and binary output.
  • Machine tools will remain the segment because IO-link delivers compatibility as well as flexibility with many types of sensors and actuators, which is mostly used in the industrial automotive systems.
  • Europe will remain the largest region over the forecast period due to the increasing demand for highly advanced connected cars and autonomous vehicles and existence of automotive, aerospace, and industrial manufacturing verticals in the region.

Features of the IO-Link Market

  • Market Size Estimates: IO-link market size estimation in terms of value ($B)
  • Trend and Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: IO-link market size by various segments, such as by type, application, component, and region
  • Regional Analysis: IO-link market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different types, applications, components, and regions for the IO-link market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the IO-link market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

  • Q1. What is the IO-link market size?
  • Answer: The global IO-link market is expected to reach an estimated $32.4 billion by 2028.
  • Q2. What is the growth forecast for IO-link market?
  • Answer: The global IO-link market is expected to grow with a CAGR of 20.40% from 2023 to 2028.
  • Q3. What are the major drivers influencing the growth of the IO-link market?
  • Answer: The major drivers for this market are growing demand for growing demand for industry 4.0, rising government initiatives towards the adoption of industrial automation, and increasing consumer inclination towards reliable and compact solutions in the manufacturing industry.
  • Q4. What are the major segments for IO-link market?
  • Answer: The future of the global IO-link market looks promising with opportunities in the machine tool, handling & assembly automation, intralogistic, and packaging markets.
  • Q5. Who are the key IO-link companies?
  • Answer: Some of the key IO-link companies are as follows:
    • Balluff
    • ifm electronic
    • Banner
    • SICK
    • Siemens
    • Emerson
    • Rockwell Automation
    • Pepperl+Fuchs
    • Hans Turck
    • Omron Corporation
  • Q6. Which IO-link segment will be the largest in future?
  • Answer:Lucintel forecast that IO-link masters will witness the highest growing segment over the forecast period due to its increasing usage as gateway in field applications for connecting eight IO link devices, which includes input modules, valves, sensors, and binary output.
  • Q7. In IO-link market, which region is expected to be the largest in next 5 years?
  • Answer: Europe will remain the largest region over the forecast period due to the increasing demand for highly advanced connected cars and autonomous vehicles and existence of automotive, aerospace, and industrial manufacturing verticals in the region.
  • Q8. Do we receive customization in this report?
  • Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the global IO-link market by type (IO-link wired, and IO-link wireless), application (machine tool, handling & assembly automation, intralogistic, and packaging), component (IO-link master, IO-link devices, sensor nodes, modules, actuators, RFID read heads, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global IO-Link Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global IO-Link Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global IO-Link Market by Type
    • 3.3.1: IO-link Wired
    • 3.3.2: IO-link Wireless
  • 3.4: Global IO-Link Market by Application
    • 3.4.1: Machine Tool
    • 3.4.2: Handling & Assembly Automation
    • 3.4.3: Intralogistics
    • 3.4.4: Packaging
  • 3.5: Global IO-Link Market by Component
    • 3.5.1: IO-link Master
    • 3.5.2: IO-link Devices
    • 3.5.3: Sensor Nodes
    • 3.5.4: Modules
    • 3.5.5: Actuators
    • 3.5.6: RFID Read Heads
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global IO-Link Market by Region
  • 4.2: North American IO-Link Market
    • 4.2.1: North American IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.2.2: North American IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
  • 4.3: European IO-Link Market
    • 4.3.1: European IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.3.2: European IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
  • 4.4: APAC IO-Link Market
    • 4.4.1: APAC IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.4.2: APAC IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
  • 4.5: ROW IO-Link Market
    • 4.5.1: ROW IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.5.2: ROW IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global IO-Link Market by Type
    • 6.1.2: Growth Opportunities for the Global IO-Link Market by Application
    • 6.1.3: Growth Opportunities for the Global IO-Link Market by Component
    • 6.1.4: Growth Opportunities for the Global IO-Link Market by Region
  • 6.2: Emerging Trends in the Global IO-Link Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global IO-Link Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global IO-Link Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Balluff
  • 7.2: ifm electronic
  • 7.3: Banner
  • 7.4: SICK
  • 7.5: Siemens
  • 7.6: Emerson
  • 7.7: Rockwell Automation
  • 7.8: Pepperl+Fuchs
  • 7.9: Hans Turck
  • 7.10: Omron Corporation