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封面
市场调查报告书
商品编码
1386421

味之素积层薄膜基板市场报告：2030 年趋势、预测与竞争分析

Ajinomoto Build-Up Film Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

味之素积层薄膜基板趋势与预测

预计到 2030 年，全球味之素组合薄膜基板市场将达到 37 亿美元，2024 年至 2030 年年复合成长率为 18.9%。该市场的主要驱动因素是消费者可支配所得的增加、技术进步以及对笔记型电脑、智慧型手机、平板电脑、个人电脑和笔记型电脑等家用电器的需求不断增长。全球性味之素增层薄膜基板市场前景广阔，PC、AI晶片、伺服器和交换器市场蕴藏商机。

味之素堆积薄膜基板市场洞察

根据Lucintel的预测，由于行动装置、个人电脑、伺服器系统、智慧型手机、平板电脑、资料中心基础设施等领域的全球普及，4-8层ABF基板预计在预测期内将出现更高的细分市场。

由于美国电子和半导体产业的成长，预计北美将成为预测期内最大的市场。

本报告回答了 11 个关键问题：

  • Q.1. 细分市场中最有前途和高成长的机会是什么？
  • Q.2.哪个细分市场将以更快的速度成长？为什么？
  • Q.3.您认为哪些地区未来会出现更快的成长？为什么？
  • Q.4. 影响市场动态的主要因素有哪些？市场的主要挑战和商业风险是什么？
  • Q.5. 这个市场的商业风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何改变？
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位？
  • Q.9.这个市场的主要企业有哪些？主要企业采取哪些策略配合措施来发展业务？
  • Q.10. 该市场上的竞争产品有哪些？由于材料或产品替代而导致市场占有率下降的威胁有多大？
  • Q.11.过去年度发生了哪些併购事件，对产业产生了哪些影响？

目录

第1章执行摘要

第2章全球风味增层薄膜基板市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第3章2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 味之素积层薄膜基板全球市场趋势（2018-2023）与预测（2024-2030）
  • 味之素增层薄膜基板全球市场（按类型）
    • 4-8层ABF基板
    • 8-16层ABF基板
  • 味之素增层薄膜基板全球市场（依应用）
    • 电脑
    • 人工智慧晶片
    • 伺服器和交换机
    • 其他的

第4章2018-2030年分地区市场趋势及预测分析

  • 全球风味增层薄膜基板市场（按地区）
  • 味之素北美增层薄膜基板市场
  • 欧洲味之素增层薄膜基板市场
  • 亚太味之素增层薄膜基板市场
  • 味之素其他地区增建薄膜基板市场

第5章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第6章成长机会与策略分析

  • 成长机会分析
    • 全球味之素堆积薄膜基板市场成长机会（按类型）
    • 全球味之素增层薄膜基板市场成长机会（按应用）
    • 全球性味之素增层薄膜基板市场成长机会（按地区）
  • 全球味之素增层薄膜基板市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大味之素积层薄膜基板的全球市场容量
    • 全球味之素增层薄膜基板市场的合併、收购及合资企业
    • 认证和许可

第7章主要企业概况

  • Ajinomoto
  • Unimicron Technology
  • Nan Ya Printed Circuit Board
  • AT & S
  • Samsung Electro-Mechanics
  • Kyocera
  • TOPPAN
  • ASE
  • LG Inno Tek
  • Shennan Circuit
简介目录

Ajinomoto Build-Up Film Substrate Trends and Forecast

The future of the global ajinomoto build-up film substrate market looks promising with opportunities in the PCs, AI chip, server and switch markets. The global ajinomoto build-up film substrate market is expected to reach an estimated $3.7 billion by 2030 with a CAGR of 18.9% from 2024 to 2030. The major drivers for this market are rising disposable income of consumers, technological advancements, and growing demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks.

A more than 150-page report is developed to help in your business decisions.

Ajinomoto Build-Up Film Substrate by Segment

The study includes a forecast for the global ajinomoto build-up film substrate by type, application, and region.

Ajinomoto Build-Up Film Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • 4-8 Layers ABF Substrate
  • 8-16 ABF Substrate

Ajinomoto Build-Up Film Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • PCs
  • AI Chip
  • Server and Switch
  • Others

Ajinomoto Build-Up Film Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Ajinomoto Build-Up Film Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies ajinomoto build-up film substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the ajinomoto build-up film substrate companies profiled in this report include-

  • Ajinomoto
  • Unimicron Technology
  • Nan Ya Printed Circuit Board
  • AT & S
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • ASE
  • LG Inno Tek
  • Shennan Circuit

Ajinomoto Build-Up Film Substrate Market Insights

Lucintel forecasts that 4-8 layers ABF substrate is expected to witness higher segment over the forecast period due to expanding usage across mobile devices, personal computers, and server systems, as well as, global proliferation of smartphones, tablet computers, and data center infrastructure.

North America is expected to witness largest segment over the forecast period due to increasing electronic and semiconductor industry in US.

Features of the Global Ajinomoto Build-Up Film Substrate Market

Market Size Estimates: Ajinomoto build-up film substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Ajinomoto build-up film substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Ajinomoto build-up film substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the ajinomoto build-up film substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the ajinomoto build-up film substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the ajinomoto build-up film substrate market size?

Answer: The global ajinomoto build-up film substrate market is expected to reach an estimated $3.7 billion by 2030.

Q.2 What is the growth forecast for ajinomoto build-up film substrate market?

Answer: The global ajinomoto build-up film substrate market is expected to grow with a CAGR of 18.9% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the ajinomoto build-up film substrate market?

Answer: The major drivers for this market are rising disposable income of consumers, technological advancements, and growing demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks.

Q4. What are the major segments for ajinomoto build-up film substrate market?

Answer: The future of the global ajinomoto build-up film substrate market looks promising with opportunities in the PCs, AI chip, server and switch markets.

Q5. Who are the key ajinomoto build-up film substrate market companies?

Answer: Some of the key ajinomoto build-up film substrate companies are as follows:

  • Ajinomoto
  • Unimicron Technology
  • Nan Ya Printed Circuit Board
  • AT & S
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • ASE
  • LG Inno Tek
  • Shennan Circuit

Q6. Which ajinomoto build-up film substrate market segment will be the largest in future?

Answer: Lucintel forecasts that 4-8 layers ABF substrate is expected to witness higher segment over the forecast period due to expanding usage across mobile devices, personal computers, and server systems, as well as, global proliferation of smartphones, tablet computers, and data center infrastructure.

Q7. In ajinomoto build-up film substrate market, which region is expected to be the largest in next 5 years?

Answer: North America is expected to witness largest segment over the forecast period due to increasing electronic and semiconductor industry in US.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the ajinomoto build-up film substrate market by type (4-8 layers ABF substrate and 8-16 ABF substrate), application (PCs, AI chip, server and switch, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Ajinomoto Build-Up Film Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Ajinomoto Build-Up Film Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Ajinomoto Build-Up Film Substrate Market by Type
    • 3.3.1: 4-8 Layers ABF Substrate
    • 3.3.2: 8-16 ABF Substrate
  • 3.4: Global Ajinomoto Build-Up Film Substrate Market by Application
    • 3.4.1: PCs
    • 3.4.2: AI Chip
    • 3.4.3: Server And Switch
    • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Ajinomoto Build-Up Film Substrate Market by Region
  • 4.2: North American Ajinomoto Build-Up Film Substrate Market
    • 4.2.2: North American Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
  • 4.3: European Ajinomoto Build-Up Film Substrate Market
    • 4.3.1: European Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
    • 4.3.2: European Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
  • 4.4: APAC Ajinomoto Build-Up Film Substrate Market
    • 4.4.1: APAC Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
    • 4.4.2: APAC Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
  • 4.5: ROW Ajinomoto Build-Up Film Substrate Market
    • 4.5.1: ROW Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
    • 4.5.2: ROW Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Region
  • 6.2: Emerging Trends in the Global Ajinomoto Build-Up Film Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Ajinomoto Build-Up Film Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Ajinomoto Build-Up Film Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ajinomoto
  • 7.2: Unimicron Technology
  • 7.3: Nan Ya Printed Circuit Board
  • 7.4: AT & S
  • 7.5: Samsung Electro-Mechanics
  • 7.6: Kyocera
  • 7.7: TOPPAN
  • 7.8: ASE
  • 7.9: LG Inno Tek
  • 7.10: Shennan Circuit