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市场调查报告书
商品编码
1418207

记忆体构装基板市场报告：2030 年趋势、预测与竞争分析

Memory Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

记忆体构装基板趋势与预测

预计 2024 年至 2030 年，全球记忆体构装基板市场将以 5.6% 的复合年增长率成长。该市场的主要驱动力是资料消耗的增加和云端运算的采用、人工智慧和高效能运算的扩展以及半导体技术和记忆体封装的进步。全球记忆体构装基板市场未来性广阔，非挥发性记忆体和挥发性记忆体领域都有市场机会。

内存构装基板市场洞察

Lucintel 预测，由于其成本低且易于製造，线焊球栅阵列预计将在预测期内实现最高成长。

在这个市场中，非挥发性记忆体由于其实惠的价格和广泛的应用预计将出现高速成长。

由于中国、台湾和韩国等国家拥有主要电子产品製造地，预计亚太地区在预测期内将出现最高成长。

常问问题

Q1.市场成长预测如何？

A1. 2024年至2030年，全球记忆体构装基板市场预计将以5.6%的复合年增长率成长。

Q2.影响市场成长的主要驱动因素有哪些？

A2. 该市场的主要驱动力是资料消耗的增加和云端运算的采用、人工智慧和高效能运算的扩展以及半导体技术和记忆体封装的进步。

Q3.市场的主要细分市场有哪些？

A3. 记忆体构装基板市场未来性广阔，非挥发性记忆体和挥发性记忆体领域均存在市场机会。

Q4.市场上主要企业有哪些？

A4.生产记忆体构装基板的主要企业如下。

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Q5.未来最大的细分市场是什么？

A5.Lucintel 预测，由于其成本低且易于製造，线焊球栅阵列预计将在预测期内实现最高成长。

Q6. 未来五年预计哪个地区将成为最大的市场？

A6.由于Lectronics在中国、台湾和韩国等国家拥有主要製造地，因此亚太地区预计在预测期内将出现最高成长。

Q7. 可以客製化报告吗？

A7. 是的，Lucintel 提供 10% 的客製化服务，无需额外费用。

目录

第一章执行摘要

第二章全球记忆体构装基板市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球构装基板市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球记忆体构装基板市场
    • 引线键合球栅阵列
    • 覆晶球栅阵列
    • 三维积体电路
    • 晶圆级晶片规模封装
  • 按应用分類的全球记忆体构装基板市场
    • 非挥发性记忆体
    • 挥发性记忆体

第四章 2018-2030年区域市场趋势及预测分析

  • 全球构装基板市场（按地区）
  • 北美记忆体构装基板市场
  • 欧洲构装基板市场
  • 亚太地区构装基板市场
  • 世界其他地区 (ROW) 记忆体构装基板市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球记忆体构装基板市场成长机会
    • 全球构装基板市场成长机会（按应用）
    • 全球构装基板市场成长机会（按地区）
  • 全球记忆体构装基板市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球构装基板市场产能
    • 全球记忆体构装基板市场併购及合资
    • 认证和许可

第七章主要企业概况

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit
简介目录

Memory Package Substrate Trends and Forecast

The future of the global memory package substrate market looks promising with opportunities in the non-volatile memory and volatile memory markets. The global memory package substrate market is expected to grow with a CAGR of 5.6% from 2024 to 2030. The major drivers for this market are rising data consumption and adoption of cloud computing, expansion of artificial intelligence and high-performance computing, and advancements in semiconductor technology and memory packaging.

A more than 150-page report is developed to help in your business decisions.

Memory Package Substrate by Segment

The study includes a forecast for the global memory package substrate by type, application, and region.

Memory Package Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Wire Bond Ball-Grid Arrays
  • Flip Chip Ball Grid Arrays
  • Three-Dimensional Integrated Circuit
  • Wafer Level Chip Scale Package

Memory Package Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Non-Volatile Memory
  • Volatile Memory

Memory Package Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Memory Package Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies memory package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the memory package substrate companies profiled in this report include-

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Memory Package Substrate Market Insights

Lucintel forecasts that wire bond ball-grid arrays is expected to witness the highest growth over the forecast period due to its lower cost and ease of manufacturing.

Within this market, non-volatile memory is expected to witness the higher growth due to its affordability and wider range of applications.

APAC is expected to witness highest growth over the forecast period due to presence of major electronics manufacturing hubs in countries like China, Taiwan, and South Korea.

Features of the Global Memory Package Substrate Market

Market Size Estimates: Memory package substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Memory package substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Memory package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the memory package substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the memory package substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for memory package substrate market?

Answer: The global memory package substrate market is expected to grow with a CAGR of 5.6% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the memory package substrate market?

Answer: The major drivers for this market are rising data consumption and adoption of cloud computing, expansion of artificial intelligence and high-performance computing and advancements in semiconductor technology and memory packaging.

Q3. What are the major segments for memory package substrate market?

Answer: The future of the memory package substrate market looks promising with opportunities in the non-volatile memory and volatile memory markets.

Q4. Who are the key memory package substrate market companies?

Answer: Some of the key memory package substrate companies are as follows.

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Q5. Which memory package substrate market segment will be the largest in future?

Answer: Lucintel forecasts that wire bond ball-grid arrays is expected to witness the highest growth over the forecast period due to its lower cost and ease of manufacturing.

Q6. In memory package substrate market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major electronics manufacturing hubs in countries like China, Taiwan, and South Korea.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the memory package substrate market by type (wire bond ball-grid arrays, flip chip ball grid arrays, three-dimensional integrated circuit, and wafer level chip scale package), application (non-volatile memory and volatile memory), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Memory Package Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Memory Package Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Memory Package Substrate Market by Type
    • 3.3.1: Wire Bond Ball-Grid Arrays
    • 3.3.2: Flip Chip Ball Grid Arrays
    • 3.3.3: Three-Dimensional Integrated Circuit
    • 3.3.4: Wafer Level Chip Scale Package
  • 3.4: Global Memory Package Substrate Market by Application
    • 3.4.1: Non-Volatile Memory
    • 3.4.2: Volatile Memory

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Memory Package Substrate Market by Region
  • 4.2: North American Memory Package Substrate Market
    • 4.2.2: North American Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.3: European Memory Package Substrate Market
    • 4.3.1: European Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.3.2: European Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.4: APAC Memory Package Substrate Market
    • 4.4.1: APAC Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.4.2: APAC Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.5: ROW Memory Package Substrate Market
    • 4.5.1: ROW Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.5.2: ROW Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Memory Package Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Memory Package Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Memory Package Substrate Market by Region
  • 6.2: Emerging Trends in the Global Memory Package Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Memory Package Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Memory Package Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Nanya
  • 7.2: Daeduck
  • 7.3: Ibiden
  • 7.4: Shinko
  • 7.5: Toppan Printing
  • 7.6: Kyocera
  • 7.7: Kinsus
  • 7.8: Doosan Electronic
  • 7.9: Fujitsu Global
  • 7.10: Korea Circuit