查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1496924

软性印刷电路板(FPC) 市场：趋势、机会与竞争分析 [2024-2030]

Flexible Printed Circuit Board Market: Trends, Opportunities and Competitive Analysis [2024-2030]
出版日期: | 出版商: Lucintel | 英文 197 Pages | 商品交期: 3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

软性印刷电路板市场趋势及预测

全球软性印刷电路板（FPC）市场预计到 2030 年将达到 227 亿美元，2024 年至 2030 年复合年增长率为 3.2%。该市场的主要驱动力是通讯业对 FPC 的需求不断增长、连网型设备的成长以及汽车电子产品的进步。全球软性印刷电路板(FPC) 市场的未来前景广阔，在电脑/周边设备、通讯、消费性电子、医疗、汽车、航太和国防工业领域存在机会。

软性印刷电路板市场新趋势

对产业动态有直接影响的新兴趋势包括电子产品的小型化以及对低损耗/高速印刷电路基板不断增长的需求。

软性印刷电路板市场洞察

  • Lucintel 预测，由于汽车和通讯业的需求不断增长，多层技术仍将是最大的技术类型。由于智慧型手机和显示器应用的需求不断增长，预计软硬复合基板领域将在预测期内实现最高成长。
  • 在智慧型手机、资料储存、5G 技术和网路解决方案领域不断增长的需求的支持下，通讯将继续成为最大的最终用途产业。由于对可携式、无线和更复杂的电子组件的需求不断增加，预计医疗最终用途市场将在预测期内实现最高成长。
  • 由于汽车中 ADAS 和车辆安全功能的增加，以及家用电子电器和通讯产品的成长，亚太地区仍然是最大的市场，预计在预测期内将经历最高的成长。此外，由于环境问题和法规的日益严格，电动车的使用不断增加，预计也将推动该地区对 FPC 的需求。

常问问题

Q1.市场规模为：

A1. 到2030年，全球软性印刷电路板市场预计将达到227亿美元。

Q2.市场成长预测是多少：

A2. 2024年至2030年，软性印刷电路板市场预计将以3.2%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素是：

A3. 该市场的主要驱动力是通讯业对 FPC 的需求增加、连网型设备的成长以及汽车电子产品的进步。

Q4.软性印刷电路板的主要用途与最终产业有哪些？

A4.软性印刷电路板市场的主要最终用途产业是通讯和电脑周边设备。

Q5.软性印刷电路板市场有哪些新趋势？

A5. 对产业动态有直接影响的新兴趋势包括电子设备的小型化和对低损耗/高速印刷基板不断增长的需求。

Q6.软性印刷电路板的主要企业有哪些？

A6.软性印刷电路板的主要企业如下：

  • Zhen Ding Technology Holding Limited（ZDT）
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc.

Q7.软性印刷电路板的哪个技术领域将成为未来最大的技术领域？

A7.Lucintel 预测，由于汽车和通讯业的需求不断增长，多层技术仍将是最大的技术类型。由于智慧型手机和显示器应用的需求不断增长，预计刚性-柔性基板领域将在预测期内实现最高成长。

Q8.：在软性印刷电路板市场中，预计未来五年哪个地区的成长最快？

A8.亚太地区仍是最大的地区，预计未来五年将成长最快。

Q9. 可以客製化报告吗？

A9. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章 市场背景及分类

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球FPC市场趋势（2018-2023）与预测（2024-2030）
  • 按最终用途产业分類的全球 FPC 市场
    • 计算机/周边设备
    • 车
    • 通讯
      • 行动电话
      • 其他的
    • 家用电器
    • 医疗保健
    • 军事/航太
    • 其他的
  • 按技术分類的全球 FPC 市场
    • 单面软板
    • 双面FPC
    • 多层软板
    • 软硬复合板
  • FPC市场按材料类型
    • 聚酰亚胺
    • 聚酯其他
  • FPC市场依原料应用
    • 聚酰亚胺薄膜
    • 聚酯及其他薄膜

第四章 2018-2030年区域市场趋势及预测分析

  • 全球FPC市场按地区划分
  • 北美FPC市场
  • 欧洲FPC市场
  • 亚太FPC市场
  • 其他地区FPC市场

第五章 竞争分析

  • 产品系列分析
  • 市场占有率分析
  • 业务整合
  • 地理范围
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按最终用途产业分類的全球 FPC 市场成长机会
    • 全球 FPC 市场成长机会（按技术）
    • 按地区分類的全球 FPC 市场成长机会
  • 全球FPC市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球FPC市场产能
    • 全球FPC产业併购

第七章主要企业概况

  • Zhen Ding Technology Holding Limited（ZDT）
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc .
简介目录

Flexible Printed Circuit Board Market Trends and Forecast

The future of the global flexible printed circuit board (FPC) market looks promising with opportunities in the computer/peripheral, telecommunication, consumer electronics, medical, automotive, and aerospace and defense industries.The global flexible printed circuit board (FPC) market is expected to reach an estimated $22.7 billion by 2030 with a CAGR of 3.2% from 2024 to 2030. The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.

Emerging Trends in the Flexible Printed Circuit Board Market

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.

A total of 122 figures / charts and 134 tables are provided in this 197-page report to help in your business decisions. Sample figures with insights are shown below.

Flexible Printed Circuit Board Market by Segment

The study includes trends and forecast for the global flexible printed circuit board (FPC) market by technology, end use industry, laminate material type, raw material usage, and region as follows:

By End Use Industry [$M and M Sqm shipment analysis for 2018 - 2030]:

  • Computers/Peripherals
  • Telecommunications
  • Consumer Electronics
  • Medical
  • Automotive
  • Aerospace and Defense
  • Others

By Technology [$M and M Sqm shipment analysis for 2018 - 2030]:

  • Single Layer
  • Double Layer
  • Multi- Layer
  • Rigid-Flex

By Laminate Material Type [$M and M Sqm shipment analysis for 2018 - 2030]:

  • Polyimide
  • Polyester and Others

By Raw Material Usage [$M and kilotons shipment analysis for 2018 - 2030]:

  • Polyimide Films
  • Polyester and Other Films

By Region [$M and M Sqm shipment analysis for 2018 - 2030]:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • India
    • Taiwan
  • Rest of the World

List of Flexible Printed Circuit Board Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies flexible PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the flexible PCB companies profiled in this report includes.

  • Zhen Ding Technology Holding Limited (ZDT)
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc

Flexible Printed Circuit Board Market Insight

  • Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.
  • Telecommunication will remain the largest end use industry, supported by increasing demand for smartphones, data storage, 5G technology, and network solution sectors. The medical end use market is expected to witness the highest growth during the forecast period because it will witness increasing demand for portable, wireless, and more complex electronic assemblies.
  • Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to increasing ADAS and vehicle safety features in automotive and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region.

Features of Flexible Printed Circuit Board Market

  • Market Size Estimates: Flexible printed circuit board market size estimation in terms of value ($M) and volume (million square meter)
  • Trend and Forecast Analysis: Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
  • Segmentation Analysis: Flexible printed circuit board market size by various segments, such as end use industry, technology, laminate material type, and raw material usage, in terms of value and volume.
  • Regional Analysis: Flexible printed circuit board market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, laminate material types, and raw material usages, and regions, for the flexible printed circuit board market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the flexible printed circuit board market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the flexible printed circuit board market size?

Answer: The global flexible printed circuit board market is expected to reach an estimated $22.7 billion by 2030.

Q2. What is the growth forecast for flexible printed circuit board market?

Answer: The flexible printed circuit board market is expected to grow at a CAGR of 3.2% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the flexible printed circuit board market?

Answer: The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.

Q4. What are the major applications or end use industries for flexible printed circuit board?

Answer: Telecommunication and computer ad peripherals are the major end use industries for flexible printed circuit board market.

Q5. What are the emerging trends in flexible printed circuit board market?

Answer: Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.

Q6. Who are the key flexible printed circuit board companies?

Answer: Some of the key flexible printed circuit board companies are as follows:

  • Zhen Ding Technology Holding Limited (ZDT)
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc.

Q7.Which flexible printed circuit board technology segment will be the largest in future?

Answer: Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.

Q8: In flexible printed circuit board market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high-growth opportunities for the global FPC market by end use industry (computers/peripherals, telecommunication, consumer electronics, medical, automotive, aerospace and defense, and others), technology (single layer, double layer, multi-layer and rigid flex), laminate material type (polyimide and polyester & others), laminate raw material usage (polyimide films and polyester & other films), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q. 2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
  • Q.5 What are the business risks and threats to the market?
  • Q.6 What are the emerging trends in this market and the reasons behind them?
  • Q.7 What are some changing demands of customers in the market?
  • Q.8 What are the new developments in the market? Which companies are leading these developments?
  • Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
  • Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.11 What M & A activities did take place in the last five years in this market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2: Global FPC Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global FPC Market by End Use Industry
    • 3.3.1: Computers/Peripherals
    • 3.3.2: Automotive
    • 3.3.3: Telecommunications
      • 3.3.3.1: Mobile Phones
      • 3.3.3.2: Others
    • 3.3.4: Consumer Electronics
    • 3.3.5: Medical
    • 3.3.6: Military/Aerospace
    • 3.3.7: Others
  • 3.4: Global FPC Market by Technology
    • 3.4.1: Single-Sided FPC
    • 3.4.2: Double-Sided FPC
    • 3.4.3: Multi-Layer FPC
    • 3.4.4: Rigid-Flex FPC
  • 3.5: FPC Market by Material Type
    • 3.5.1: Polyimide
    • 3.5.2: Polyester and Others
  • 3.6: FPC Market by Raw Material Usage
    • 3.6.1: Polyimide Films
    • 3.6.2: Polyester and Other Films

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global FPC Market by Region
  • 4.2: North American FPC Market
    • 4.2.1: Market by End Use Industry
    • 4.2.2: Market by Technology
    • 4.2.3: The US FPC Market
    • 4.2.4: The Canadian FPC Market
    • 4.2.5: The Mexican FPC Market
  • 4.3: European FPC Market
    • 4.3.1: Market by End Use Industry
    • 4.3.2: Market by Technology
    • 4.3.3: German FPC Market
    • 4.3.4: United Kingdom FPC Market
    • 4.3.5: French FPC Market
  • 4.4: APAC FPC Market
    • 4.4.1: Market by End Use Industry
    • 4.4.2: Market by Technology
    • 4.4.3: Chinese FPC Market
    • 4.4.4: Japanese FPC Market
    • 4.4.5: Taiwanese FPC Market
    • 4.4.6: South Korean FPC Market
  • 4.5: ROW FPC Market
    • 4.5.1: Market by End Use Industry
    • 4.5.2: Market by Technology

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Market Share Analysis
  • 5.3: Operational Integration
  • 5.4: Geographical Reach
  • 5.5: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global FPC Market by End Use Industry
    • 6.1.2: Growth Opportunities for the Global FPC Market by Technology
    • 6.1.3: Growth Opportunities for the Global FPC Market by Region
  • 6.2: Emerging Trends in the Global FPC Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global FPC Market
    • 6.3.3: Mergers and Acquisitions in the Global FPC Industry

7. Company Profiles of Leading Players

  • 7.1: Zhen Ding Technology Holding Limited (ZDT)
  • 7.2: NOK Corporation
  • 7.3: Sumitomo Electric
  • 7.4: Flexium Interconnect Inc.
  • 7.5: Fujikura Ltd.
  • 7.6: Nitto Denko Corporation
  • 7.7: Interflex
  • 7.8: Samsung Electro-Mechanics
  • 7.9: Daeduck GDS
  • 7.10: Compeq Samtec Inc .