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市场调查报告书
商品编码
1522958

高速互连 (HSI) 市场报告：2030 年趋势、预测与竞争分析

High Speed Interconnect Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

高速互连 (HSI) 趋势与预测

预计到 2030 年，全球高速互连 (HSI) 市场规模将达到 5,300 万美元，2024 年至 2030 年复合年增长率为 7.3%。该市场的关键驱动因素是随着数位社会产生和消耗大量资料（从流服务到云端运算），对资料的需求不断增长，对高频宽互连的需求不断增长，以及对机器人和控制系统的需求通讯成长。全球高速互连 (HSI) 市场的未来前景广阔，资料中心、电讯、消费性电子产品以及网路和运算市场充满机会。

高速互连 (HSI) 按细分市场

该研究包括按类型、应用和地区对全球高速互连 (HSI) 的预测。

高速互连 (HSI) 市场洞察

Lucintel 预测 DAC 在预测期内仍将是一个很大的细分市场。

由于电子设备互连需求的不断增长以及智慧家居趋势的不断发展，消费性电子产品将继续成为该市场的最大细分市场。

由于新技术的使用不断增加以及对更高频宽的需求不断增加，北美在预测期内将继续成为最大的地区。

常问问题

Q1.市场规模为：

A1. 到 2030 年，全球高速互连 (HSI) 市场预计将达到 5,300 万美元。

Q2.市场成长预测是多少：

A2. 2024年至2030年，全球高速互连（HSI）市场预计将以7.3%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素是：

A3. 随着数位社会产生和消耗从串流媒体服务到云端运算的大量资料，该市场的主要驱动力是资料需求的增加，对高频宽互连、机器人和自动化的需求不断增长。高速通讯。

Q4.市场的主要细分市场是：

A4. 全球高速互连 (HSI) 市场前景广阔，资料中心、通讯、消费性电子和网路/运算市场充满机会。

Q5.市场的主要企业是：

A5. 主要的高速互连 (HSI) 公司是：

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom

Q6.未来最大的细分市场是什么？

A6.Lucintel 预计 DAC 在预测期内仍将是一个更大的细分市场。

Q7. 未来五年预计哪些地区的市场成长最大？

A7. 由于新技术的使用不断增加以及对更高频宽的需求不断增加，预计北美在预测期内仍将是最大的地区。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球高速互连（HSI）市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球高速互连（HSI）市场趋势（2018-2023）与预测（2024-2030）
  • 全球高速互连 (HSI) 市场（按类型）
    • DAC
    • AOC
  • 全球高速互连 (HSI) 市场（按应用）
    • 资料中心
    • 通讯
    • 消费性电子产品
    • 网路运算
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球高速互连（HSI）市场按地区划分
  • 北美高速互连（HSI）市场
  • 欧洲高速互连（HSI）市场
  • 亚太地区高速互连（HSI）市场
  • 其他地区的高速互连（HSI）市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
  • 全球高速互连（HSI）市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 全球高速互连（HSI）市场产能扩张
    • 全球高速互连 (HSI) 市场的併购和合资企业
    • 认证和许可

第七章主要企业概况

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom
简介目录

High Speed Interconnect Trends and Forecast

The future of the global high speed interconnect market looks promising with opportunities in the data center, telecom, consumer electronics, and networking and computing markets. The global high speed interconnect market is expected to reach an estimated $53.0 million by 2030 with a CAGR of 7.3% from 2024 to 2030. The major drivers for this market are increasing demand for data as digital world generates and consumes massive amounts of data from streaming services to cloud computing, rising demand for high-bandwidth interconnects, and increasing automation in various industries, requiring high-speed communication for robotics and control systems.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

High Speed Interconnect by Segment

The study includes a forecast for the global high speed interconnect by type, application, and region.

High Speed Interconnect Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Direct Attach Cable
  • Active Optical Cable

High Speed Interconnect Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Data Centers
  • Telecom
  • Consumer Electronics
  • Networking And Computing
  • Others

High Speed Interconnect Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of High Speed Interconnect Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies high speed interconnect companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the high speed interconnect companies profiled in this report include-

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom

High Speed Interconnect Market Insights

Lucintel forecasts that direct attach cable will remain larger segment over the forecast period.

Within this market, consumer electronics will remain the largest segment due to growing need to interconnect electronic devices, as well as, growing trend of smart homes.

North America will remain the largest region over the forecast period due to increased use of new technologies and demand for higher bandwidth in the region.

Features of the Global High Speed Interconnect Market

Market Size Estimates: High speed interconnect market size estimation in terms of value ($M).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: High speed interconnect market size by type, application, and region in terms of value ($M).

Regional Analysis: High speed interconnect market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the high speed interconnect market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the high speed interconnect market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the high speed interconnect market size?

Answer: The global high speed interconnect market is expected to reach an estimated $53.0 million by 2030.

Q2. What is the growth forecast for high speed interconnect market?

Answer: The global high speed interconnect market is expected to grow with a CAGR of 7.3% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the high speed interconnect market?

Answer: The major drivers for this market are increasing demand for data as digital world generates and consumes massive amounts of data from streaming services to cloud computing, rising demand for high-bandwidth interconnects, and increasing automation in various industries, requiring high-speed communication for robotics and control systems.

Q4. What are the major segments for high speed interconnect market?

Answer: The future of the global high speed interconnect market looks promising with opportunities in the data center, telecom, consumer electronics, and networking and computing markets.

Q5. Who are the key high speed interconnect market companies?

Answer: Some of the key high speed interconnect companies are as follows:

  • Molex
  • Nexans
  • Leoni
  • Samtec
  • CBO
  • Cisco Systems
  • Huawei Technologies
  • Intel
  • The Siemon Company
  • Broadcom

Q6. Which high speed interconnect market segment will be the largest in future?

Answer: Lucintel forecasts that direct attach cable will remain larger segment over the forecast period.

Q7. In high speed interconnect market, which region is expected to be the largest in next 5 years?

Answer: North America will remain the largest region over the forecast period due to increased use of new technologies and demand for higher bandwidth in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the high speed interconnect market by type (direct attach cable and active optical cable), application (data centers, telecom, consumer electronics, networking and computing, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global High Speed Interconnect Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global High Speed Interconnect Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global High Speed Interconnect Market by Type
    • 3.3.1: Direct Attach Cable
    • 3.3.2: Active Optical Cable
  • 3.4: Global High Speed Interconnect Market by Application
    • 3.4.1: Data Centers
    • 3.4.2: Telecom
    • 3.4.3: Consumer Electronics
    • 3.4.4: Networking and Computing
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global High Speed Interconnect Market by Region
  • 4.2: North American High Speed Interconnect Market
    • 4.2.1: North American High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.2.2: North American High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others
  • 4.3: European High Speed Interconnect Market
    • 4.3.1: European High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.3.2: European High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others
  • 4.4: APAC High Speed Interconnect Market
    • 4.4.1: APAC High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.4.2: APAC High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others
  • 4.5: ROW High Speed Interconnect Market
    • 4.5.1: ROW High Speed Interconnect Market by Type: Direct Attach Cable and Active Optical Cable
    • 4.5.2: ROW High Speed Interconnect Market by Application: Data Centers, Telecom, Consumer Electronics, Networking and Computing, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global High Speed Interconnect Market by Type
    • 6.1.2: Growth Opportunities for the Global High Speed Interconnect Market by Application
    • 6.1.3: Growth Opportunities for the Global High Speed Interconnect Market by Region
  • 6.2: Emerging Trends in the Global High Speed Interconnect Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global High Speed Interconnect Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global High Speed Interconnect Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Molex
  • 7.2: Nexans
  • 7.3: Leoni
  • 7.4: Samtec
  • 7.5: CBO
  • 7.6: Cisco Systems
  • 7.7: Huawei Technologies
  • 7.8: Intel
  • 7.9: The Siemon Company
  • 7.10: Broadcom