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市场调查报告书
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1560058

CPU热感膏市场报告：2030 年趋势、预测与竞争分析

Thermal Paste for CPUs Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

CPU热感膏的趋势和预测

全球CPU热感膏市场未来性广阔，笔电CPU、桌上型电脑CPU和行动装置CPU市场都有机会。 2024 年至 2030 年，全球 CPU热感膏市场预计将以 7.2% 的复合年增长率成长。该市场的主要驱动因素是对高效能 CPU 的需求不断增长、CPU 的小型化以及游戏机和高阶 PC 的日益普及。

根据Lucintel的预测，硅基材料由于其高导热性和长期稳定性，预计将在预测期内实现最高成长。

在这个市场中，笔记型电脑的CPU预计将经历最高的成长。

由于对电子产品的高需求以及领先电子产品製造商的存在，预计亚太地区将在预测期内实现最高成长。

CPU热感膏市场新趋势

由于不断的技术开拓和不断变化的消费者需求，CPU热感膏市场代表了许多新兴市场趋势。这些新趋势正在重塑市场的性能-永续性-应用解决方案空间。

  • 高导热配方：技术创新促进了导热率更高的热感膏的开发，从而可以更有效地将热量从CPU传递到散热器。这提高了冷却性能并提高了CPU性能和稳定性。
  • 奈米材料的整合：将奈米材料整合到热感膏中的势头正在增强。奈米材料增强浆料具有更好的热性能和更低的热阻，满足高性能和小型化计算设备的需求。
  • 环保配方：目前人们对采用环保材料和製程开发绿色热感膏越来越感兴趣。这些材料配方响应了环境责任和合规性的全球趋势，并吸引了具有环保意识的消费者和製造商。
  • 改进的涂布方法：随着该领域的发展，热感膏涂布方法的易用性和一致性不断提高。新技术和封装旨在实现均匀分布和更好的黏附力，从而提高热感膏在许多 CPU 冷却场景中的有效性。
  • 更长的使用寿命和可靠性：最近的努力集中在提高热感膏的耐用性和寿命上，创造出不会随着时间的推移而劣化、不需要频繁涂布并且可以保持热稳定性的配方。

高导热率配方、奈米材料整合、环保选择、改进的涂布方法和更长的使用寿命是目前引领 CPU热感膏市场发展的一些非常流行的趋势。这些透过进一步提高性能、永续性和用户便利性来塑造计算领域温度控管的未来。

CPU热感膏市场近期趋势

CPU热感膏市场的最新趋势带来了效能改进和具有成本效益的解决方案，并具有特定于应用的结果，以满足对高效能运算和游戏不断增长的需求。

  • 采用高导电性膏，推出新型高导电性热感，促进高功率CPU的高效散热。该膏可防止您的处理器过热，并保持游戏和高效能运算需求的最佳效能。
  • 奈米增强导热膏配方的开发：含有奈米材料的热感膏正在获得发展动力。这些奈米增强浆料提供更好的温度控管和更低的热阻，满足电子设备的小型化和高性能要求。
  • 绿色解决方案成为最前线：市场正在准备采用永续材料和製程设计的环保热感膏。此类配方的开发是在保持高热性能的同时最大限度地减少环境影响的方式完成的。
  • 大众市场经济高效的选择：製造流程的改进使得热感膏的成本效益越来越高。这些具有成本效益的产品扩大了在大量生产的家用电子电器中的应用，同时提供了可接受的热性能。
  • 改进的涂布技术：新的涂布技术和封装提高了涂布热感膏时的简单性和准确性。这些新技术可确保适当的涂布和附着力，最大限度地提高热性能，同时减少涂布错误。

高导电性膏、奈米增强配方、环保解决方案、经济高效的选择和卓越的涂布技术等最新趋势正在推动 CPU热感膏市场的创新。它们满足了高效能运算的新需求，因此继续推动该市场的前沿。

CPU热感膏市场的策略性成长机会

CPU热感膏市场的特点是在广泛的应用中存在多个策略性成长机会。其中包括因各种应用的高效冷却领域的技术进步而产生的技术。

  • 游戏/高效能运算：游戏和高效能运算领域预计将成长。高性能热感膏对于确保需要可靠性的应用中的最佳性能至关重要。
  • 消费性电子：在家用电子电器领域，高效能和小型化的电子设备正在增加对适用于小型设备的有效温度控管解决方案的需求，因此低成本和高效的热感膏存在机会。
  • 资料中心：资料中心是一个主要的成长领域，对密集伺服器环境及其适当冷却的需求不断增加。需要高性能和长寿命的热感膏来确保资料中心高效可靠的运作。
  • 汽车电子以及电子产品在汽车产业中日益增长的应用，使得热感膏在车辆系统中的应用范围不断扩大。动力传动系统和资讯娱乐系统等汽车电子产品需要具有高性能的热感膏来控制该温度。
  • 可再生能源技术：对可再生能源技术的需求不断增长正在推动能源系统的发展。温度控管对可再生能源应用中的组件效率和性能产生影响。

游戏和高效能运算、消费性电子、资料中心、汽车电子和可再生能源技术等策略性成长的新机会将进一步增强 CPU 市场对热感膏的需求。这些新的成长机会支撑了各种应用和领域对先进温度控管解决方案日益增长的兴趣和需求。

CPU热感膏市场推动因素及挑战

CPU热感膏市场预计将面临许多驱动因素和挑战，从技术进步到经济因素和监管要求。了解这些因素将使您能够利用这个市场的成长机会。

推动CPU热感膏市场的因素如下：

1.技术进步；配方创新推动市场成长。新材料导热性的提高有助于满足高性能、紧凑型计算设备的要求，从而提高性能。

2. 计算能力的提升：运算能力的提升加上电子设备的小型化，增加了对适当温度控管方法的需求。如今，高效能 CPU 的热能也需要昂贵的热感膏。

3. 游戏和专业市场的增加：随着游戏和专业计算的增加，对高品质热感膏的需求越来越大。这些市场需要针对先进、高功率中央处理单位的高价值温度控管解决方案。

4. 规模经济：热感膏的可负担性得益于降低製造成本的努力。具有成本效益的解决方案的激增将导致在各种应用中广泛采用。

5.环境法规：由于需要遵守环境法规，因此正在讨论开发环保热感膏。这种永续配方符合全球绿色技术和监管标准的趋势。

CPU热感膏市场面临的挑战如下。

1.製造成本高：先进材料和製造流程的成本可能是一个障碍。在製造商面临的主要挑战中，确保高性能同时降低製造成本至关重要。

2.材料相容性：确保热感膏与各种CPU材料和基板的兼容性，可以达到极为复杂的尺寸。相容性问题直接影响效能，需要仔细制定和测试。

3. 法规遵循：满足产业法规和标准是一项挑战。成功的市场进入需要遵守环境或安全要求。

CPU热感膏市场受到技术进步、运算能力提高、游戏和专业市场成长、成本降低努力以及环境法规的推动。破坏市场稳定的因素有很多，包括高製造成本、材料相容性和监管合规性。正确理解这些因素可以将它们转化为在热感膏市场中取得成功的机会。

CPU热感膏市场企业名单

同一市场中的公司根据其提供的产品品质进行竞争。该市场的主要企业专注于扩大製造设施、投资研发、开拓以及利用整个价值链的整合机会。透过这些策略，CPU市场竞争可以应对不断增长的需求，确保竞争，开发创新产品和技术，降低生产成本，扩大基本客群。本报告介绍了部分CPU用导热膏企业。

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

CPU热感膏细分市场预测

我们按类型、应用和地区提供 CPU热感膏的预测。

CPU热感膏市场国家展望

由于技术的快速变化和对高效冷却的需求不断增加，CPU热感膏市场最近出现了一些新的发展。新兴市场的开拓与全球主要市场中高效能运算和游戏应用的导热性、易用性和持久品质有关。

  • 美国：美国正在为游戏和专业运算领域开发现代高效能热感膏。为了满足现代 CPU 和 GPU 日益增长的功率需求，我们推出了具有改进的导热性和耐用性的新配方。
  • 中国：由于电子和游戏产业的快速繁荣，中国的热感膏市场正在经历快速成长。高容量消费性电子产品和高效能运算应用中包含了经济高效、高效能热感膏的开发。
  • 德国：德国热感膏市场的创新针对与汽车和工业领域相关的高精度应用。这包括开发可改善先进电子系统温度控管并提高高温条件下可靠性的浆料。
  • 印度：热感膏在印度的使用呈上升趋势，主要是由于成本和性能。因此，预计将为不断增长的电子和电脑行业做出贡献。最近的趋势包括具有成本效益的热感膏，为消费和工业应用提供有竞争力的导热性。
  • 日本：热感膏市场由日本主导，应用集中在家用电子电器和资料中心等高科技领域。产品开发包括高热性能和长寿命，以支援要求严格的日本电子製造业提供品质和一致性。

常问问题

Q1.全球CPU市场热感膏的成长预测如何？

答：2024 年至 2030 年，全球 CPU热感膏市场预计将以 7.2% 的复合年增长率成长。

Q2.影响全球CPU热感膏市场成长的关键驱动因素有哪些？

答：该市场的主要驱动力是对高效能 CPU 的需求不断增长、CPU 小型化以及游戏和高阶 PC 中的采用不断增加。

Q3.市场的主要细分市场有哪些？

答：全球CPU热感膏市场未来性广阔，笔电CPU、桌上型电脑CPU、行动装置CPU市场都有机会。

Q4.市场上的主要企业有哪些？

答：生产CPU热感膏的主要企业如下。

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

Q5.未来最大的细分市场是什么？

答：Lucintel 预测，硅基材料由于其高导热性和长期稳定性，将在预测期内达到最高成长。

Q6.未来五年预计哪个地区的市场规模最大？

答：由于该地区对电子产品的高需求以及领先电子产品製造商的存在，预计亚太地区在预测期内将出现最高的成长。

Q7. 可以客製化报告吗？

答：是的，Lucintel 列出了 10% 的客製化服务，无需额外费用。

目录

第一章执行摘要

第二章全球CPU热感膏市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球CPU热感膏市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球 CPU热感膏市场
    • 硅胶底座
    • 银基
    • 铜底座
    • 铝底座
    • 碳基
    • 其他的
  • 按应用分類的全球 CPU热感膏市场
    • 笔记型电脑CPU
    • 桌上型电脑CPU
    • 行动装置CPU
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • CPU热感膏市场区域分布
  • 北美CPU热感膏市场
  • 欧洲CPU热感膏市场
  • 亚太CPU热感膏市场
  • 其他地区CPU热感膏市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球 CPU热感膏市场成长机会
    • 全球 CPU热感膏市场成长机会（按应用）
    • 全球CPU热感膏市场成长机会（按地区）
  • 全球CPU市场热感膏新趋势
  • 战略分析
    • 新产品开发
    • 全球CPU热感膏市场产能扩大
    • 全球CPU热感膏市场的合併、收购与合资
    • 认证和许可

第七章主要企业概况

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver
简介目录

Thermal Paste for CPUs Trends and Forecast

The future of thermal paste for the global CPUs market looks promising with opportunities in the laptop CPU, desktop CPU, and mobile device CPU markets. Thermal paste for the global CPUs market is expected to grow with a CAGR of 7.2% from 2024 to 2030. The major drivers for this market are increasing demand for high-performance CPUs, miniaturization of CPUs, and growing adoption of gaming and high-end personal computers.

Lucintel forecasts that silicon based is expected to witness highest growth over the forecast period due to its high thermal conductivity and long term stability.

Within this market, laptop CPU is expected to witness highest growth.

APAC is expected to witness highest growth over the forecast period due to high demand of electronic devices and presence of leading electronics manufacturers in this region.

Emerging Trends in the Thermal Paste for CPUs Market

The CPU thermal paste market represents a number of emergent trends that are driven by continuous technological development, along with a change in consumer demand. These emergent trends have reconfigured the performance-sustainability-application-specific solution space of the market.

  • High Thermal Conductivity Formulations: Innovations are leading to the development of thermal pastes with much higher thermal conductivity, enabling higher efficiency in heat conduction from the CPU to the heatsink. This helps in providing better cooling, hence improved CPU performance and stability.
  • Nano-Material Integration: The integration of nano-materials into thermal pastes is gaining momentum. Nano-enhanced pastes boast an advantage of better thermal performance and low thermal resistance; these meet the demand for high-performance and miniaturized computing devices.
  • Eco-Friendly Formulations: There is now an increasing interest in the development of green thermal pastes from environmentally friendly materials and processes. The formulation of such materials responds to global trends toward environmental responsibility and regulatory compliance, thus appealing to environmentally conscious consumers and manufacturers.
  • Improved Methods of Application: Ease of use and consistency in the method of application of thermal paste further improve with advancements in the field. New techniques and packaging aim at even distribution and better adhesion to improve the effectiveness of the thermal paste in many CPU cooling scenarios.
  • Longer Lifetime and Reliability: Recent efforts have concentrated on enhancing the durability and lifetime of thermal pastes, including formulations that do not degrade over time and, therefore, remain consistent thermally, without frequently needing reapplication.

High thermal conductivity formulations, nano-material integrations, eco-friendly options, improved application methods, and longevity are some of the currently very popular trends leading the way in the evolution of the thermal paste market for CPUs. These further performance, sustainability, and user convenience to shape the future of thermal management in computing.

Recent Developments in the Thermal Paste for CPUs Market

Recent developments in the CPU thermal paste market have yielded a performance-enhancing, cost-efficient solution with application-specific outcomes that target the growing demands of high-performance computing and gaming.

  • Introduction of High-Conductivity Pastes; New high-conductivity thermal pastes are being introduced to promote efficient heat dissipation in high-power CPUs. The paste will prevent overheating of the processor and maintain an optimum performance to meet the requirements for gaming and high-performance computing.
  • Nano-Enhanced Paste Formulation Development: Thermal pastes including nano-materials are gaining momentum. These nano-enhanced pastes realize better thermal management with low thermal resistance, thus fulfilling the compactness and high-performance requirements of electronic devices.
  • Eco-Friendly Solutions to Come to the Forefront: The market is gearing up toward eco-friendly thermal pastes that will be engineered with sustainable materials and processes. Development of such formulations is done in a way to minimize environmental impact while maintaining high thermal performance.
  • Cost-Efficient Options for Mass Markets: Improvements in the manufacturing process are making thermal pastes increasingly cost-effective. These cost-effective products have begun to extend the range of applications for mass-produced consumer electronics, yet with acceptable thermal performance.
  • Improved Application Techniques: New application techniques and packaging improve ease and accuracy when applying the thermal paste. These new methods will ensure proper coverage and adhesion for maximum thermal performance with fewer application errors.

Recent development in high-conductivity pastes, nano-enhanced formulations, eco-friendly solutions, cost-effective options, and superior techniques for application are driving innovation in the market of thermal paste for CPUs. These are satisfying new demands for high-performance computing and, therefore, continuing to push the edges in this marketplace.

Strategic Growth Opportunities for Thermal Paste for CPUs Market

The market for CPU thermal paste is characterized by several strategic growth opportunities in a wide variety of applications. These include those that arise from technological advances made in the field of efficient cooling across different applications.

  • Gaming/High-Performance Computing: Gaming and high-performance computing segments can present good prospects for growth. High-performance thermal pastes become very much imperative to ensure optimum performances in highly demanding applications with their reliability
  • Consumer Electronics: The consumer electronics segment provides opportunities for low-cost and efficient thermal pastes because high-performance, miniaturized electronics have increased demand for effective thermal management solutions that can be applied to small-sized devices.
  • Data Centers: Data centers represent a prime growth area, with ever-increasing demands for high-density server environments and their adequate cooling. There is a demand for high-performance and long-lifespan thermal pastes to ensure efficient and reliable performance of data center operations.
  • Automotive Electronics; In addition, the increase in the application of electronics in the automotive industries allows an expansion of the application scope for thermal pastes in vehicle systems. Thermal pastes of high-performance characteristics are needed to keep this temperature under control in car electronics, such as powertrain and infotainment systems.
  • Renewable Energy Technologies: Rising demand for renewable energy technologies propels growth in energy systems. Heat management can make a difference in terms of component efficiency and performance in renewable energy applications.

These emerging opportunities for strategic growth in gaming and high-performance computing, consumer electronics, data centers, automotive electronics, and renewable energy technologies will further strengthen demand in the thermal paste market for CPUs. This set of emerging growth opportunities underlines the growing interest in and demand for advanced thermal management solutions from various applications and sectors.

Thermal Paste for CPUs Market Driver and Challenges

A raft of drivers and challenges are expected to confront the thermal paste market for CPUs, from technological advancements through to economic factors and regulatory requirements. Understanding such factors is what will enable the navigation of this market for leveraging any growth opportunities.

The factors responsible for driving the thermal paste for CPUs market include:

1. Technological Advancements; Innovations in formulation drive the growth of the market. Better thermal conductivity with the help of new materials helps improve performance by meeting the requirements of high-performance and compact computing devices.

2. Rising Computing Power: However, increasing computing power combined with miniaturization of electronic devices creates the demand for adequate methods of thermal management. High-value thermal pastes are also in demand nowadays due to thermal energy from high-performance CPUs.

3. Increasing Gaming and Professional Markets: With the rise in gaming and professional computing, quality thermal pastes become increasingly sought after. These markets demand highly valued thermal management solutions for advanced and high-power central processing units.

4. Economies of Scale: The increased affordability of thermal pastes is due to efforts at reducing their production cost. Cost-effective solutions go a long way in increasing the reach, thereby facilitating broader adoption in multiple applications.

5. Environmental Regulations: Due to the need for compliance with environmental regulations, the development of eco-friendly thermal pastes has been discussed. Such sustainable formulation is thus in tune with global trends toward greener technologies and regulatory standards.

Challenges in the thermal paste for CPUs market are:

1. High Production Costs: Advanced material and manufacturing process costs can be a barrier. Among the major challenges faced by manufacturers, the assurance of high performance, while controlling production costs, features very strongly.

2. Material Compatibility: Thermal paste compatibility with various CPU materials or substrates can reach very complicated dimensions to ensure. Compatibility issues have a direct impact on performance and demand careful formulation and testing.

3. Regulatory Compliance: Meeting regulations and standards in industry is a challenge. In order to successfully enter the market, one must comply with either environmental requirements or safety requirements.

The thermal paste market for CPUs is driven by technological advances, increases in computing power, and growth in gaming and professional markets, along with cost-reduction initiatives and environmental regulations. There are several factors that make treading a path in the market precarious: high production cost, compatibility of materials, and regulatory compliances. The above-discussed factors can be turned into an opportunity to succeed in the thermal paste market by rightly understanding those factors.

List of Thermal Paste Companies for CPUs Market

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies thermal paste companies for CPUs market cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of thermal paste companies for CPUs market are profiled in this report include-

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

Thermal Paste for CPUs by Segment

The study includes a forecast for thermal paste for CPUs by type, application, and region.

Thermal Paste for the CPUs Market by Type [Analysis by Value from 2018 to 2030]:

  • Silicon Based
  • Silver Based
  • Copper Based
  • Aluminum Based
  • Carbon Based
  • Others

Thermal Paste for the CPUs Market by Application [Analysis by Value from 2018 to 2030]:

  • Laptop CPU
  • Desktop CPU
  • Mobile Device CPU
  • Others

Thermal Paste for CPUs Market by Region [Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Thermal Paste for CPUs Market

Due to fast-changing technology and increasing demand for efficient cooling, the CPU thermal paste market has witnessed some new developments lately. Development pertains to thermal conductivity, ease of application, and long-lasting qualities to meet high-performance computing and gaming applications in key markets around the globe.

  • United States: Recently, high-performance thermal pastes have been increasingly developed for gaming and professional computing sectors in the U.S. New formulations with improved thermal conductivity and durability are launched to help meet increasing power demands of modern CPUs and GPUs.
  • China: The thermal paste market in China is observing rapid growth due to the sudden boom in the electronics and gaming industries. The development of cost-effective, high-performance thermal pastes is included for mass-produced consumer electronics and high-performance computing applications.
  • Germany: The innovation in the thermal paste market in Germany is targeted at high-precision applications related to the automotive and industrial sectors. This includes the development of pastes for improved thermal management of advanced electronic systems and with enhanced reliability in high-temperature conditions.
  • India: The use of thermal paste in India is on the rise due mainly to reasons of cost and performance. As such, it is targeted toward serving the growing electronics and computing industries. Among the recent developments are cost-effective thermal pastes that make some competitive thermal conductivity applications for both consumer and industrial uses.
  • Japan: The thermal paste market is dominated by Japan, with applications focused on hi-tech areas, like consumer electronics and data centers. Product development encompasses high thermal performance and life spans to support the very demanding Japanese electronics manufacturing industry in offering quality and consistency.

Features of Thermal Paste for the Global CPUs Market

Market Size Estimates: Thermal paste for CPUs market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Thermal paste for CPUs market size by type, application, and region in terms of value ($B).

Regional Analysis: Thermal paste for CPUs market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for thermal paste for CPUs market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of thermal paste for CPUs market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

If you are looking to expand your business in this market or adjacent markets, then contact us. We have done hundreds of strategic consulting projects in market entry, opportunity screening, due diligence, supply chain analysis, M & A, and more.

FAQ

Q1. What is the growth forecast of thermal paste for the global CPUs market?

Answer: Thermal paste for the global CPUs market is expected to grow with a CAGR of 7.2% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of thermal paste for the global CPUs market?

Answer: The major drivers for this market are increasing demand for high-performance CPUs, miniaturization of CPUs, and growing adoption of gaming and high-end personal computers.

Q3. What are the major segments for thermal paste for the global CPUs market?

Answer: The future of thermal paste for the global CPUs market looks promising with opportunities in the laptop CPU, desktop CPU, and mobile device CPU markets.

Q4. Who are the key thermal paste for CPUs market companies?

Answer: Some of the key thermal paste for CPUs companies are as follows:

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

Q5. Which thermal paste for the global CPUs market segment will be the largest in future?

Answer: Lucintel forecasts that silicon based is expected to witness highest growth over the forecast period due to its high thermal conductivity and long term stability.

Q6. In thermal paste for the global CPUs market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to high demand of electronic devices and presence of leading electronics manufacturers in this region.

Q.7 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for thermal paste for CPUs market by type (silicon based, silver based, copper based, aluminum based, carbon based, and others), application (laptop CPU, desktop CPU, mobile device CPU, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
  • Market Report

Table of Contents

1. Executive Summary

2. Thermal Paste for the Global CPUs Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Thermal Paste for the Global CPUs Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Thermal Paste for the Global CPUs Market by Type
    • 3.3.1: Silicon Based
    • 3.3.2: Silver Based
    • 3.3.3: Copper Based
    • 3.3.4: Aluminum Based
    • 3.3.5: Carbon Based
    • 3.3.6: Others
  • 3.4: Thermal Paste for the Global CPUs Market by Application
    • 3.4.1: Laptop CPU
    • 3.4.2: Desktop CPU
    • 3.4.3: Mobile Device CPU
    • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Thermal Paste for the Global CPUs Market by Region
  • 4.2: Thermal Paste for the North American CPUs Market
    • 4.2.1: Thermal Paste for the North American CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminum Based, Carbon Based, and Others
    • 4.2.2: Thermal Paste for the North American CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others
  • 4.3: Thermal Paste for the European CPUs Market
    • 4.3.1: Thermal Paste for the European CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminum Based, Carbon Based, and Others
    • 4.3.2: Thermal Paste for the European CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others
  • 4.4: Thermal Paste for the APAC CPUs Market
    • 4.4.1: Thermal Paste for the APAC CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminum Based, Carbon Based, and Others
    • 4.4.2: Thermal Paste for the APAC CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others
  • 4.5: Thermal Paste for the ROW CPUs Market
    • 4.5.1: Thermal Paste for the ROW CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminum Based, Carbon Based, and Others
    • 4.5.2: Thermal Paste for the ROW CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for Thermal Paste for the Global CPUs Market by Type
    • 6.1.2: Growth Opportunities for Thermal Paste for the Global CPUs Market by Application
    • 6.1.3: Growth Opportunities for Thermal Paste for the Global CPUs Market by Region
  • 6.2: Emerging Trends in Thermal Paste for the Global CPUs Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of Thermal Paste for the Global CPUs Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in Thermal Paste for the Global CPUs Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: 3M
  • 7.2: Henkel
  • 7.3: ShinEtsu
  • 7.4: Dow Corning
  • 7.5: Laird Technology
  • 7.6: Wacker Chemie
  • 7.7: Parker Chomerics
  • 7.8: Sekisui Chemical
  • 7.9: Noctua
  • 7.10: Arctic Silver