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市场调查报告书
商品编码
1664983

宽频电力线通讯组市场报告：2031 年趋势、预测与竞争分析

Broadband Power Line Communication Chipset Market Report: Trends, Forecast and Competitive Analysis to 2031
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

全球宽频通讯（PLC）晶片组市场前景光明，在智慧电网、网路、照明、安全和监控、远距和 M2M（机器对机器）市场都存在机会。预计到 2031 年全球宽频通讯通讯晶片组市场规模将达到 98 亿美元，2025 年至 2031 年的复合年增长率为 14.6%。该市场的主要驱动因素是智慧电网技术的日益普及、对高速互联网的需求不断增长、政府推动智慧城市市场发展的倡议活性化以及对能源效率的日益关注。

  • Lucintel 预测，独立式市场在预测期内仍将是最大的技术类别，因为独立 PLC 晶片组易于安装，只需要连接到电网，非常适合维修现有住宅和建筑物。
  • 根据地区，由于网路接取需求强劲，预计亚太地区在预测期内仍将是最大的地区。

宽频通讯通讯晶片组市场的策略成长机会

宽频 PLC 晶片组市场应用领域似乎为广泛的应用领域提供了众多策略成长机会。识别这些机会对于相关人员充分利用市场现有趋势并相应地满足供应至关重要。

  • 智慧家庭应用：对智慧家庭解决方案的需求不断增长，为 PLC 晶片组创造了机会。该技术促进了智慧型设备的无缝互动和控制，增强了家庭自动化。
  • 工业自动化：PLC晶片组在工业自动化的应用日益增加。这些晶片组在工业环境中提供有效的通讯和控制，促进自动化系统和智慧製造的发展。
  • 智慧电网整合：针对智慧电网应用而开发的 PLC 晶片组市场正在不断成长。这些晶片组在能源管理、监控和控制方面提供了新的功能，从而推动了更好、更有效率的能源系统的发展。
  • 农村连通解决方案：PLC 晶片组的使用也越来越多，以改善农村和偏远地区的连结性。这些解决方案有利于通讯和宽频存取基础设施有限的地区实现发展。
  • 能源管理系统：能源管理系统可以是 PLC 晶片组。这些技术使得对能源消耗的观察和控制更加容易，从而能够实现永续性和效率目标。

智慧家庭、工业自动化、智慧电网整合等应用领域的不断扩大，为宽频PLC晶片组市场创造了策略成长机会。农村连通性和能源管理策略也在影响市场成长并推动创新。

宽频电力线通讯组市场驱动因素与挑战

宽频 PLC 晶片组市场受到技术创新、经济状况和监管因素等多种因素的影响。了解这些因素对于有效的市场管理至关重要。

推动宽频电力线通讯组市场的因素如下：

  • 技术进步：PLC晶片组技术的不断改进，提高了其整合度、速度和效能。新技术有助于创造更有效、更可靠的通讯解决方案。
  • 对高速网路的需求不断增加：随着越来越多的人需要更快的宽频连接，对 PLC 晶片组的需求也在增加。进阶应用需要更快的资料传输速度和增强的网路技术。
  • 智慧电网和智慧家庭解决方案的使用日益增多：智慧电网和智慧家庭技术的部署将推动 PLC 晶片组的采用。单纯的经营模式限制了开发后的能源协同效应和整合。
  • 政府推动宽频存取的措施：政府为扩大宽频存取而采取的优惠政策和措施将推动对 PLC 晶片组的需求。对通讯技术和基础设施升级的投资将增加市场机会。
  • 重视能源效率：随着对节能技术的重视，PLC晶片组正朝着更低功耗的方向发展。这一发展符合全球节能目标并为市场带来了利益。

宽频通讯通讯晶片组市场挑战包括：

  • 初始成本高：PLC 晶片组的初始成本高是其广泛采用的障碍之一，尤其是在小规模 PLC 应用中。成本问题限制了先进通讯技术的可负担性和可用性。
  • 复杂的整合要求：在现有框架内采用 PLC 晶片组可能会带来许多挑战。技术困难、相容性问题、实施挑战和采用障碍都可能减慢或阻碍部署。
  • 监管合规问题：虽然存在许多通讯技术，但对法律和标准的追求可能会限制许多公司的成长潜力。合规成本和监管变化影响市场平等和整合。
  • 来自替代技术的竞争：使用其他通讯方法（例如无线和光纤）往往会限制 PLC 晶片组的采用。区分并有效行销这些产品的优势对于在市场上取得成功至关重要。
  • 技术限制和干扰：技术限制和与其他通讯通道干扰的可能性会影响 PLC 晶片组的功能。为了提供有效的通讯系统，必须解决这些问题。

虽然宽频通讯通讯晶片组市场受益于技术的不断发展和用户对电子活动日益增长的需求，高成本和监管政策等限制因素限制了其增长。管理所有这些因素对于发挥成长潜力和克服市场挑战至关重要。

目录

第一章执行摘要

第 2 章全球宽频通讯通讯晶片组市场：市场动态

  • 简介、背景和分类
  • 供应链
  • 产业驱动因素与挑战

第 3 章 市场趋势与预测分析（2019-2031）

  • 宏观经济趋势（2019-2024）与预测（2025-2031）
  • 全球宽频电力线通讯组市场趋势（2019-2024）及预测（2025-2031）
  • 全球宽频通讯通讯晶片组市场（依规格）
    • 家插AV
    • HomePlug AV1
    • HomePlug AV2
    • IEEE 1901
    • IEEE 1905.1
    • G.Hn
    • HomePNA
    • 其他的
  • 全球宽频电力线通讯组市场（按技术）
    • 独立
    • 杂交种
    • Wi-Fi
    • Zigbee
    • Ethernet
    • 其他的
  • 全球宽频电力线通讯组市场（按应用）
    • 智慧电网
    • 联网
    • 照明设备
    • 安全与监控
    • 远距
    • M2M (Machine to Machine)
    • 其他的

第 4 章区域市场趋势与预测分析（2019-2031 年）

  • 全球宽频电力线通讯组市场（按区域）
  • 北美宽频通讯线通讯晶片组市场
  • 欧洲宽频通讯通讯晶片组市场
  • 亚太地区宽频电力线通讯组市场
  • 世界其他地区的宽频通讯通讯晶片组市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球宽频电力线通讯组市场成长机会（依标准）
    • 全球宽频电力线通讯组市场成长机会（按技术）
    • 全球宽频电力线通讯组市场成长机会（按应用）
    • 全球宽频电力线通讯组市场成长机会（按地区）
  • 全球宽频通讯通讯晶片组市场的新趋势
  • 战略分析
    • 新产品开发
    • 全球宽频通讯通讯晶片组市场产能扩张
    • 全球宽频通讯通讯晶片组市场的企业合併
    • 认证和许可

第七章主要企业简介

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies
简介目录

The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets. The global broadband power line communication chipset market is expected to reach an estimated $9.8 billion by 2031 with a CAGR of 14.6% from 2025 to 2031. The major drivers for this market are the rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

  • Lucintel forecasts that, within the technology category, the standalone segment will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.
  • In terms of region, APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

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Emerging Trends in the Broadband Power Line Communication Chipset Market

Emerging trends in the broadband PLC chipset market are transforming this industry by embracing new technologies and applications. These trends are affecting the way PLC solutions are developed and deployed in many parts of the world.

  • Integration with Smart Grid Technologies: PLC chipsets are increasingly coupled with smart grids for enhanced energy management and efficiency. This integration enhances real-time monitoring and control, improving the reliability of the grid and lowering energy costs.
  • Advancements in Data Transmission Speeds: Improving data transmission speed using new PLC chipsets is gaining popularity. Newer and higher speeds help develop high-bandwidth applications and dependable communication networks, which are essential due to the rising need for fast internet access.
  • Expansion into IoT Applications: The PLC chipsets are utilized as elements to enhance the Internet of Things (IoT). This trend helps meet the increasing demand for connected and smart systems that aid in communication and control in an IoT ecosystem.
  • Development of Cost-Effective Solutions: In the market, the trend of developing affordable PLC chipsets is becoming more common. Due to the reduction in production costs, these technologies are spreading rapidly, especially in developing countries with a high demand for broadband.
  • Focus on Energy Efficiency: The new PLC chipsets focus on energy efficiency in design and use, thereby reducing power consumption and increasing performance simultaneously. This aligns with the global appetite for sustainability and will help bring about eco-friendlier communication technologies.

These trends are revolutionizing the broadband PLC chipset market by facilitating new levels of integration with smart technologies, increasing data transmission speeds, and opening new markets. The emphasis on affordability and energy efficiency will foster wider acceptance, propelling the advancement of the communication solutions market.

Recent Developments in the Broadband Power Line Communication Chipset Market

The broadband PLC chipset has undergone numerous key developments that influence its future and the market's trajectory. These improvements have aimed at enhancing technology performance, widening its use, and satisfying market needs.

  • Launch of High-Speed PLC Chipsets: The last decade has witnessed the introduction of next-generation high-speed PLC chipsets, which have made it possible to transfer data at much higher rates, consequently improving network efficiency. Such chipsets are critical in high-bandwidth applications and enhance overall communication efficiency.
  • Integration with Smart Grid Technologies: Smart grid planning solutions have recently been identified as one of the new applications of PLC chipsets. This integration improves energy management and the performance of advanced grid management and control systems.
  • Improvements in Energy Efficiency: New PLC chipsets come with enhanced energy efficiency features, improving overall performance with low power consumption. This advancement dovetails with sustainability efforts and the quest to reduce energy consumption globally.
  • Growth in Industrial Sector Applications: More PLC chipsets are being adopted in the industrial sector. These developments cater to the growing demand for reliable and high-speed communication systems for industrial automation and control applications.
  • Reduction of Costs: Technologies and materials emerging from current manufacturing systems will help reduce the price of PLC chipsets. This price reduction enables broader adoption of these technologies across more applications and markets.

These developments are positively impacting the broadband PLC chipset market by enhancing technology performance, increasing the number of applications, and reducing costs. Integration with smart grids, improved energy efficiency, and cost reductions are enhancing growth and innovation within the market.

Strategic Growth Opportunities for Broadband Power Line Communication Chipset Market

The application of the broadband PLC chipset market appears to provide numerous strategic growth opportunities across a wide range of applications. Identifying these opportunities is crucial for stakeholders to maximize available trends in the market and meet supply accordingly.

  • Smart Home Applications: The increasing demand for smart home solutions creates potential for PLC chipsets. The technology promotes seamless interaction and control of smart devices, thereby enhancing home automation.
  • Industrial Automation: There is a rise in the application of PLC chipsets in industrial automation. These chipsets provide effective communication and control in industrial environments, thereby enhancing the growth of automated systems and smart manufacturing.
  • Smart Grid Integration: There is a market for further development of PLC chipsets for applications in smart grids. These chipsets offer new features in energy management, monitoring, and control, leading to the evolution of better and more efficient energy systems.
  • Rural Connectivity Solutions: There is also an increase in the use of PLC chipsets for improved rural and remote area connectivity. These solutions enable the development of communication and broadband access infrastructure in areas with limited provision.
  • Energy Management Systems: There is potential for PLC chipsets in energy management systems. These technologies enable enhanced observation and control of energy consumption, resulting in the achievement of sustainability and efficiency goals.

The expanding application of smart homes, industrial automation, and smart grid integration represents strategic growth opportunities in the broadband PLC chipset market. Strategies for rural connectivity and energy management are also influencing market growth and fostering innovation.

Broadband Power Line Communication Chipset Market Driver and Challenges

The broadband PLC chipset market is influenced by various factors, including but not limited to technological innovations, economic conditions, and regulatory factors. Understanding these factors is essential for effective market management.

The factors driving the broadband power line communication chipset market include:

  • Technological Advancement: The constant improvement of PLC chipset technology enhances its integration, speed, and performance. New technologies help create more effective and reliable communication solutions.
  • Growing Demand for High-Speed Internet: As more people require faster broadband connectivity, the demand for PLC chipsets increases. Advanced applications require greater data transmission rates and enhanced networking technologies.
  • Increase in Usage of Smart Grid and Smart Home Solutions: The deployment of smart grid and smart home technologies drives the adoption of PLC chipsets. Purely business models would limit energy synergies and integration post-development.
  • Government Efforts to Promote Broadband Access: Favorable government policies and measures aimed at increasing broadband access create demand for PLC chipsets. Investments in communication technologies and infrastructure upgrades enhance opportunities in the market.
  • Focus on Energy Efficiency: The emphasis on energy-saving technologies drives the evolution of PLC chipsets towards lower power consumption. This development aligns with global conservation goals and benefits the market.

Challenges in the broadband power line communication chipset market are:

  • High Initial Costs: The high initial cost of PLC chipsets constitutes one of the barriers to adoption, especially for small-scale PLC applications. Cost issues limit the affordability and availability of advanced communication technologies.
  • Complex Integration Requirements: Numerous challenges may arise when adopting PLC chipsets within existing frameworks. Technical difficulties, compatibility issues, implementation challenges, and adoption hurdles can all slow down or impede deployment.
  • Regulatory Compliance Issues: While many communication technologies exist, pursuing laws and standards can limit the growth potential of many companies. Compliance costs and regulatory changes affect the market's leveling and enhancement.
  • Competition from Alternative Technologies: The use of other communication methods, such as wireless and fiber optics, tends to limit the adoption of PLC chipsets. Effectively marketing these products by differentiating their advantages is essential for success in the market.
  • Technical Limitations and Interference: Technical limitations and potential interference with other communication channels can impact the functionality of PLC chipsets. These issues must be addressed to provide effective communication systems.

The broadband power line communication chipset market benefits from ongoing technological development and an increased need for e-activities among users, while constraints such as high costs and regulatory policies restrict growth. Managing all these factors is crucial to taking advantage of growth potential and overcoming market challenges.

List of Broadband Power Line Communication Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. through these strategies broadband power line communication chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the broadband power line communication chipset companies profiled in this report include-

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Broadband Power Line Communication Chipset by Segment

The study includes a forecast for the global broadband power line communication chipset market by standards, technology, application, and region.

Broadband Power Line Communication Chipset Market by Standards [Analysis by Value from 2019 to 2031]:

  • Homeplug AV
  • HomePlug AV1
  • HomePlug AV2
  • IEEE 1901
  • IEEE 1905.1
  • G.Hn
  • HomePNA
  • Others

Broadband Power Line Communication Chipset Market by Technology [Analysis by Value from 2019 to 2031]:

  • Standalone
  • Hybrid
  • Wi-Fi
  • Zigbee
  • Ethernet
  • Others

Broadband Power Line Communication Chipset Market by Application [Analysis by Value from 2019 to 2031]:

  • Smart Grids
  • Networking
  • Lighting
  • Security & Surveillance
  • Long Haul
  • Machine to Machine
  • Others

Broadband Power Line Communication Chipset Market by Region [Analysis by Value from 2019 to 2031]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Broadband Power Line Communication Chipset Market

Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. The following highlights recent developments by major broadband power line communication chipset producers in key regions: the USA, China, India, Japan, and Germany.

  • United States: Progress has been made in developing high-speed PLC chipsets in the U.S., which are faster and more reliable for data transmission. There is an emphasis on integrating these chipsets with smart grids to improve energy management and connectivity.
  • China: The PLC chipset market in China is set to witness significant growth, with a strong focus on smart home and industrial application expansion. The country is building high-performance PLC chipsets suitable for large infrastructure and smart city projects.
  • Germany: Camp ICC is enhancing its PLC technology by integrating chipsets with IoT solutions for applications in smart buildings and industrial automation. The focus is on improving energy efficiency and network stability to achieve the country's climate goals.
  • India: In India, the embedded PLC chip market is growing, focusing on developing affordable solutions for extending rural broadband. The emphasis is on inexpensive chipsets that will improve broadband penetration in rural areas and support the country's digital development.
  • Japan: Japan is introducing unique innovations with new designs of PLC chipsets that utilize high bandwidth for data transmission while connecting to improved energy control systems. Developments are targeted at enhancing efficiency and reliability to support high-end technological systems in Japan.

Features of the Global Broadband Power Line Communication Chipset Market

Market Size Estimates: Broadband power line communication chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Broadband power line communication chipset market size by various segments, such as by standards, technology, application, and region in terms of value ($B).

Regional Analysis: Broadband power line communication chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different standards, technology, application, and regions for the broadband power line communication chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the broadband power line communication chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the broadband power line communication chipset market by standards (homeplug AV, homeplug AV1, homeplug AV2, IEEE 1901, IEEE 1905.1, G.Hn, homePNA, and others), technology (standalone, hybrid, Wi-Fi, ZigBee, ethernet, and others), application (smart grids, networking, lighting, security & surveillance, long haul, machine to machine, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Broadband Power Line Communication Chipset Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

  • 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
  • 3.2. Global Broadband Power Line Communication Chipset Market Trends (2019-2024) and Forecast (2025-2031)
  • 3.3: Global Broadband Power Line Communication Chipset Market by Standards
    • 3.3.1: Homeplug AV
    • 3.3.2: HomePlug AV1
    • 3.3.3: HomePlug AV2
    • 3.3.4: IEEE 1901
    • 3.3.5: IEEE 1905.1
    • 3.3.6: G.Hn
    • 3.3.7: HomePNA
    • 3.3.8: Others
  • 3.4: Global Broadband Power Line Communication Chipset Market by Technology
    • 3.4.1: Standalone
    • 3.4.2: Hybrid
    • 3.4.3: Wi-Fi
    • 3.4.4: Zigbee
    • 3.4.5: Ethernet
    • 3.4.6: Others
  • 3.4: Global Broadband Power Line Communication Chipset Market by Application
    • 3.4.1: Smart Grids
    • 3.4.2: Networking
    • 3.4.3: Lighting
    • 3.4.4: Security & Surveillance
    • 3.4.5: Long Haul
    • 3.4.6: Machine to Machine
    • 3.4.7: Others

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

  • 4.1: Global Broadband Power Line Communication Chipset Market by Region
  • 4.2: North American Broadband Power Line Communication Chipset Market
    • 4.2.1: North American Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.2.2: North American Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.3: European Broadband Power Line Communication Chipset Market
    • 4.3.1: European Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.3.2: European Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.4: APAC Broadband Power Line Communication Chipset Market
    • 4.4.1: APAC Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.4.2: APAC Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.5: ROW Broadband Power Line Communication Chipset Market
    • 4.5.1: ROW Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.5.2: ROW Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Standards
    • 6.1.2: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Technology
    • 6.1.3: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Application
    • 6.1.4: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Region
  • 6.2: Emerging Trends in the Global Broadband Power Line Communication Chipset Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Broadband Power Line Communication Chipset Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Broadband Power Line Communication Chipset Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: Intel
  • 7.3: Marvell Technology
  • 7.4: Maxim Integrated
  • 7.5: Megachips
  • 7.6: Qualcomm
  • 7.7: Semtech
  • 7.8: ST Microelectronics
  • 7.9: Vango Technologies
  • 7.10: Yitran Technologies