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市场调查报告书
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1823748
互相连接及被动元件的全球市场 (~2035年):产品类型·技术·终端用户·各地区Global Interconnects and Passive Components Market Research Report by Product Type, by Technology, by End User, and by Region Forecast till 2035 |
全球互连和被动元件市场预计将成长至 2,676.7381 亿美元,预测期内维持 5.0% 的稳定复合年增长率。互连是指连接器、插座和电路走线等实体连接,用于实现电子模组之间的通讯。而被动元件则包括电阻器、电容器和电感器等装置,它们用于管理能量,但不会放大或产生能量。这些元件确保了电子系统的稳定性、效率和功能性。
5G 网路的广泛部署是全球互连和被动元件市场最强劲的成长动力之一。这项技术变革要求使用能够实现大容量资料传输、低延迟和广泛网路覆盖的高效能元件。智慧城市、自动驾驶、工业物联网和数位医疗等领域的应用正在推动对先进天线、基地台和连接器的强劲需求。
报告属性详情
北美市场已成熟,但仍在持续成长。 5G、电动车和先进工业系统推动了需求成长。美国联邦通讯委员会 (FCC) 和美国能源部 (DOE) 等政府机构在加速 5G 普及和电动车产业发展方面发挥主导作用。 2024 年,美国和加拿大表现强劲,分别达到 3,070 万美元和 380 万美元。
预计欧洲市场的成长将主要得益于其广泛的可再生能源计划和汽车行业的蓬勃发展。预计在可预见的未来,仅德国汽车产业就将继续对先进汽车所需的高品质零件产生需求。欧洲市场需求稳定,英国和法国的零件消费量超过德国。
亚太地区是最重要的成长来源,这得益于全球领先的消费性电子产品製造业和物联网 (IoT) 的广泛应用。中国大陆、日本、韩国和台湾地区在高科技电子领域占有重要地位,而不断增长的可支配收入是该地区消费的主要驱动力。亚太市场仍然是成长的领头羊,其中中国占了 3,411 万美元的显着占有率,日本和印度的需求不断增长也为其提供了支撑。
本报告研究了全球互连和被动元件市场,提供了市场定义和概述、影响市场成长的各种因素分析、市场规模趋势和预测、按细分市场、地区和主要国家/地区进行的细分、竞争格局以及主要公司的概况。
Global Interconnects and Passive Components Market Research Report by Product Type [Interconnects, Passive Components, Electromechanical Components (Emech)], by Technology [Optical Interconnects, Wireless Interconnects, High-Speed Connectors (USB, HDMI, etc.), 5G and Telecom Infrastructure, Surface Mount Technology (SMT) Components, MEMS-based Components (Micro-Electromechanical Systems), Smart Electromechanical Systems (IoT-enabled), Microactuators Robotics Integration, Others], by End User (Automotive, Consumer Electronics, Telecommunications, Industrial Equipment Manufacturing, Medical Devices Healthcare, Aerospace Defense, IT Data Centers, Power Generation Distribution, Robotics, Energy Utilities, Others), and by Region (North America, Europe, Asia Pacific, South America, Middle East & Africa) Forecast till 2035
Industry Overview
The global interconnects and passive components market is expected to attain a valuation of USD 267,673.81 million, growing steadily at a 5.0% CAGR over the forecast period. Interconnects refer to the physical connections, like connectors, sockets, and circuit traces, that allow communication between electronic modules. Passive components, on the other hand, include devices such as resistors, capacitors, and inductors that manage energy without amplifying or producing it. These elements ensure stability, efficiency, and functionality in electronic systems.
One of the most powerful growth drivers for the global Interconnects and Passive Components Market is the general installation of the 5G network. This change in technology makes the use of components with high performance that are able to handle data transmissions of huge volumes, low latency, and wide network coverage a must. The application of smart cities, autonomous mobility, industrial IoT, and digital healthcare is intensively increasing the needs of advanced antennas, base stations, and connectors.
Major Company Development
The main changes at Samsung Electro-Mechanics made the company's strategy widely known to be based on innovation and partnerships. The firm presented its MLCC for cars in February 2025 and new power inductors in September 2024. By signing a contract with AMD for the development of advanced data center substrates in July 2024, the company has taken the step to consolidate its leadership in technology. Prior to that, in January 2022, Hanwha Solutions obtained part of Samsung's wireless module business, indicating a significant restructuring move.
Major competitors in the global interconnects and passive components market include KYOCERA Corporation, Murata Manufacturing Co., Ltd., Samsung Electro-Mechanics, TDK Corporation, TAIYO YUDEN, Molex Incorporated, Amphenol Corporation, Vishay Intertechnology Inc., TE Connectivity Corporation, and Hirose Electric Co.
Report Attribute Details
Industry Segmentations
The North American market is both mature and growing. The demand is mainly based on 5G, EVs, and advanced industrial systems. The FCC and DOE are among the government agencies that have a lead role in speeding up 5G rollouts and the EV sector. In 2024, North America sees strong performance, driven by the U.S. at USD 30.70 million alongside Canada's USD 3.80 million contribution.
Europe is said to be facing market growth that is heavily dependent on its far-reaching renewable energy programs and the vigor of its automotive industry. Just the car industry in Germany by itself is still creating great demand for high-quality parts used in advanced vehicles for a very long time to come. The European market highlights consistent demand, with the UK and France leading Germany in component consumption
Asia-Pacific is the most significant growth source, due to its consumer electronics manufacturing and IoT adoption, which are both globally dominant. China, Japan, South Korea, and Taiwan have a substantial presence in high-tech electronics, and increasing disposable incomes are the main drivers of local consumption. Asia-Pacific remains the growth leader, led by China's significant USD 34.11 million share, reinforced by Japan and India's rising demand.
Digital transformation across MEA is spurring demand for advanced interconnect and passive components. Saudi Arabia's investments in building ultra-fast networks and South Africa's electronics production capacity demonstrate the region's rising importance in global supply chains. Expansion across telecom and automotive segments supports further growth.
The South American market continues to grow steadily, with Brazil, Argentina, and Mexico leading investments in consumer electronics and telecom infrastructure. Brazil's digital economy initiatives and IoT promotion programs are creating strong demand for interconnect solutions. Rising smartphone penetration and energy-efficient technology adoption also contribute to expansion.