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市场调查报告书
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PCBA(印刷电路板集合)的到市场规模，占有率，趋势，成长机会，预测:各集合类型，各元件类型，各用途，各终端用户产业 - 2035年前的世界预测

Printed Circuit Board Assembly Market Size, Share, Trends, Growth Opportunities & Forecast by Assembly Type (Surface Mount Technology, Through-Hole Technology, Mixed Technology), Component Type, Application, and End-User Industry-Global Forecast to 2035
出版日期: | 出版商: Meticulous Research | 英文 436 Pages | 订单完成后即时交付

价格

预计2035年，PCBA（印刷电路板组装）市场规模将达到1,475亿美元，预测期间（2025-2035年）的复合年增长率为4.7%。本报告对全球五大主要地区的PCBA（印刷电路板组装）市场进行了深入分析，重点关注当前的市场趋势、市场规模、近期发展以及2035年的预测。

本报告进行了全面的二手资料和一手资料研究，对市场情景进行了详细的分析，并对关键行业驱动因素、限制因素、市场机会和课题进行了影响分析。预计市场成长将受到消费性电子和智慧型装置需求成长、汽车电子和电动汽车快速扩张、物联网和连网设备日益普及、5G 网路加速部署、医疗电子和医疗保健设备需求成长以及持续小型化趋势对先进组装技术需求的推动。此外，电动汽车电子产品的扩张、可穿戴和柔性电子产品的发展、先进的封装技术以及人工智慧硬体的采用预计将支持市场成长。

目录

第1章 简介

第2章 调查手法

第3章 摘要整理

  • 概要
  • 各市场区隔分析
    • 各集合类型市场分析
    • 各元件类型市场分析
    • 各用途市场分析
    • 各终端用户市场分析
  • 各地区分析
  • 竞争分析

第4章 产业洞察

  • 概要
  • PCB集合技术标准
    • SMT对THT对混合技术的比较
    • 品质与可靠性标准（IPC、ISO）
  • 价值链分析
    • 概要
    • 原料和零件供应商
    • 与PCB製造集合
      • 主要的PCBA服务供应商(各规模)
        • 小规模集合住宅
        • 中规模地区供应商
        • 大规模受託製造商
        • 全球的EMS大厂
    • 与品管试验
    • 物流和流通
    • 终端用户的整合
    • 售后与服务支援
  • 波特的五力分析

第5章 市场洞察

  • 概要
  • 市场成长的影响因素
    • 促进因素
      • 消费性电子产品需求成长
      • 汽车电子的快速扩张电子产业
      • 5G 和物联网的加速普及
      • 医疗电子应用日益增多
      • 小型化和复杂化趋势持续
      • 工业自动化需求不断成长
      • 电动车日益普及
      • 航空航太与国防电子应用不断扩展
    • 限制因素
      • 原料与零件成本波动
      • 复杂的法规合规要求
      • 製造基地劳动成本上升
      • 先进组装的技术课题
      • 供应链中断与依赖性
    • 机遇
      • 电动车电子应用不断扩展
      • 工业自动化与工业 4.0
      • 穿戴式和柔性电子产品的成长
      • 先进的封装组装技术
      • 对人工智慧和机器学习的需求硬体
    • 趋势
      • 自动化与智慧製造的应用
      • 永续与绿色製造实践
      • 近岸外包与供应链多元化
  • 标准和法规
    • 全球 PCB 组装品质标准
    • 区域合规要求
      • 北美（IPC、UL、FCC）
      • 欧洲（CE、ROHM S、REACH）
      • 亚太地区（JIS、GB、区域标准）
      • 拉丁美洲（区域合规）
      • 中东和非洲（区域标准）
  • 对盒装和布线日益增长的趋势的洞察
  • 技术进步
    • 模板与焊锡印刷
    • 氮气烤箱
    • 拾放吞吐量
    • 其他新兴 PCBA 技术

第6章 PCBA(印刷电路板集合)的全球市场评估:各集合类型

  • 概要
  • 表面装置技术(SMT)
  • 通孔技术(THT)
  • 混合技术集合
  • 高密度互相连接(HDI)集合
  • 弹性及软硬复合集合
  • 球栅阵列(BGA)与先进包装

第7章 PCBA(印刷电路板集合)的全球市场评估:各元件类型

  • 概要
  • 主动元件
    • 积体电路和微处理器
    • 离散半导体
    • 光电零件
  • 被动元件
    • 电阻器和电容器(冷凝器)
    • 感应器和变压器
    • 过滤器及振盪器
  • 电磁零件
    • 连接器和插座
    • 交换器及继电器
    • 感测器和转换器

第8章 PCBA(印刷电路板集合)的全球市场评估:各用途

  • 概要
  • 家用电子电器
    • 智慧型手机和平板电脑
    • 电脑和週边设备
    • 家电及娱乐
    • 穿戴式设备
  • 汽车电子产品
    • 动力传动系统与引擎控制
    • 资讯娱乐和导航
    • 先进安全系统
    • 电动车系统
  • 通讯设备
    • 网路基础设施设备
    • 基地台和小型基地台
    • 资料中心和云端·基础设施
  • 医疗设备
    • 诊断设备
    • 治疗设备
    • 监测和穿戴式·健康·Tec
  • 工业自动化
    • 控制系统和PLCS
    • 机器人技术和运动控制
    • 流程自动化设备
  • 航太·防卫
    • 航空电子学·系统
    • 军事通讯设备
    • 雷达和导航系统

第9章 PCBA(印刷电路板集合)的全球市场评估:各终端用户

  • 概要
  • 目标商标产品厂商(OEMS)
    • 科技企业
    • 汽车厂商
    • 产业设备厂商
  • 电子设备製造服务(EMS)
    • 受託製造商
    • 专门组装供应商
    • 承包·解决方案·供应商
  • 原始·设计·厂商(ODMS)
    • 设计製造合作伙伴
    • 自有品牌厂商
    • 系统厂商

第10章 PCBA(印刷电路板集合)市场评估:各地区

  • 概要
  • 北美
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 西班牙
    • 瑞典
    • 丹麦
    • 其他欧洲
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 台湾
    • 印度
    • 新加坡
    • 马来西亚
    • 其他亚太地区
  • 南美
    • 巴西
    • 墨西哥
    • 阿根廷
    • 其他南美国家
  • 中东·非洲
    • UAE
    • 沙乌地阿拉伯
    • 南非
    • 其他中东和非洲

第11章 竞争情形

  • 概要
  • 主要成长策略
  • 竞争基准
  • 竞争仪表板
    • 产业领导者
    • 市场差异化要素
    • 领先企业
    • 新兴企业
  • 市场占有率/市场情况分析

第12章 企业简介

  • Hon Hai Precision Industry Co., Ltd.(Foxconn)
  • Flex Ltd
  • Jabil, Inc
  • Sanmina Corporation
  • Celestica Inc.
  • Benchmark Electronics, Inc.
  • Plexus Corp.
  • Kimball Electronics, Inc.
  • Creation Technologies LP
  • Nortech Systems, Inc
  • Key Tronic Corporation
  • Universal Scientific Industrial Co., Ltd.
  • Shenzhen Kaifa Technology Co., Ltd.
  • Eurocircuits NV
  • Seeed Technology Co., Ltd
  • Vexos Corporation
  • Tempo Automation, Inc
  • PCBWay
  • WellPCB Technology Co., Ltd

第13章 附录

Product Code: MRSE - 1041514

According to the research report titled, Printed Circuit Board Assembly Market Size, Share, Trends, Growth Opportunities & Forecast by Assembly Type (Surface Mount Technology, Through-Hole Technology, Mixed Technology), Component Type, Application, and End-User Industry-Global Forecast to 2035,' the printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035. The report provides an in-depth analysis of the global printed circuit board assembly market across five major regions, emphasizing the current market trends, market sizes, recent developments, and forecasts till 2035.

Following comprehensive secondary and primary research and an in-depth analysis of the market scenario, the report conducts the impact analysis of the key industry drivers, restraints, opportunities, and challenges. The growth of this market is driven by the increasing demand for consumer electronics and smart devices, rapid expansion of automotive electronics and electric vehicles, growing adoption of IoT and connected devices, accelerating 5G network deployment, rising demand for medical electronics and healthcare devices, and continuous miniaturization trends requiring advanced assembly technologies. Moreover, electric vehicle electronics expansion, development of wearable and flexible electronics, advanced packaging technologies, and AI hardware adoption are expected to support the market's growth.

The key players operating in the printed circuit board assembly market are Hon Hai Precision Industry Co., Ltd. (Taiwan), Flex Ltd. (Singapore), Jabil Inc. (USA), Sanmina Corporation (USA), Celestica Inc. (Canada), Benchmark Electronics, Inc. (USA), Plexus Corp. (USA), Kimball Electronics, Inc. (USA), Creation Technologies LP (Canada), Nortech Systems, Inc. (USA), Key Tronic Corporation (USA), Universal Scientific Industrial Co., Ltd. (Taiwan), Shenzhen Kaifa Technology Co., Ltd. (China), and others.

The printed circuit board assembly market is segmented by assembly type (surface mount technology, through-hole technology, mixed technology assemblies), component type (active components, passive components, electromagnetic components), application (consumer electronics, automotive, telecommunications, medical devices, industrial automation, aerospace & defense), end-user industry (original equipment manufacturers, electronics manufacturing services providers, original design manufacturers), and geography. The study also evaluates industry competitors and analyzes the market at the country level.

Based on assembly type, the mixed technology segment is projected to grow at the highest CAGR during the forecast period of 2025-2035. The rapid growth of this segment is mainly due to the increasing complexity of electronic designs requiring both surface mount and through-hole components in a single assembly. This growth is driven by expanding automotive electronics applications, rising demand for ruggedized assemblies in industrial environments, and the need for hybrid solutions that combine high-density mounting with mechanical strength. As electronic systems become more sophisticated and demand both high performance and durability, the adoption of mixed technology assemblies is accelerating rapidly, particularly in sectors that prioritize long-term reliability and harsh environment operation.

Based on component type, the active components segment is expected to account for the largest share of the printed circuit board assembly market. Active components, including microprocessors, semiconductors, and integrated circuits, are fundamental to modern electronic devices and drive the functionality of virtually all electronic systems. As electronic devices become more intelligent and feature-rich, the demand for sophisticated active components continues to grow. Furthermore, the proliferation of AI-enabled devices, 5G infrastructure, and automotive electronics significantly increases the complexity and quantity of active components required per assembly.

Based on application, the automotive segment is projected to register the highest CAGR from 2025 to 2035. This growth is driven by the rapid transformation of the automotive industry toward electrification, autonomous driving, and connected vehicle technologies. The increasing electronic content per vehicle, driven by advanced driver assistance systems, infotainment systems, and electric powertrain controls, is significantly boosting demand for sophisticated PCB assemblies. Additionally, the global push toward electric vehicles is creating new requirements for high-power electronics, battery management systems, and thermal management solutions.

Based on end-user industry, the electronics manufacturing services (EMS) segment is expected to account for the largest share of the printed circuit board assembly market in 2025. This dominance is primarily driven by the widespread outsourcing trend among original equipment manufacturers seeking to reduce costs, access specialized expertise, and focus on core competencies. EMS providers offer comprehensive assembly services, advanced manufacturing capabilities, and economies of scale that individual OEMs find difficult to replicate in-house.

An in-depth geographic analysis of the industry provides detailed qualitative and quantitative insights into the five major regions (North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa) and the coverage of major countries in each region. Asia-Pacific is projected to register the highest growth rate during the forecast period across the overall printed circuit board assembly market. This growth is fueled by the region's established electronics manufacturing ecosystem, continued capacity expansion by leading EMS providers, and increasing domestic demand for electronic devices. The concentration of major contract manufacturers, well-developed supply chains, and favorable labor costs contribute to the region's manufacturing advantages.

Key Questions Answered in the Report-

  • What is the current revenue generated by the printed circuit board assembly market globally?
  • At what rate is the global printed circuit board assembly demand projected to grow for the next 7-10 years?
  • What are the historical market sizes and growth rates of the global printed circuit board assembly market?
  • What are the major factors impacting the growth of this market at the regional and country levels? What are the major opportunities for existing players and new entrants in the market?
  • Which segments in terms of assembly type, component type, application, and end-user industry are expected to create major traction for the manufacturers in this market?
  • What are the key geographical trends in this market? Which regions/countries are expected to offer significant growth opportunities for the manufacturers operating in the global printed circuit board assembly market?
  • Who are the major players in the global printed circuit board assembly market? What are their specific product offerings in this market?
  • What are the recent strategic developments in the global printed circuit board assembly market? What are the impacts of these strategic developments on the market?

Scope of the Report:

Printed Circuit Board Assembly Market Assessment -- by Assembly Type

  • Surface Mount Technology (SMT)
  • Through-Hole Technology (THT)
  • Mixed Technology Assemblies

Printed Circuit Board Assembly Market Assessment -- by Component Type

  • Active Components
  • Passive Components
  • Electromagnetic Components

Printed Circuit Board Assembly Market Assessment -- by Application

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Medical Devices
  • Industrial Automation
  • Aerospace & Defense
  • Others

Printed Circuit Board Assembly Market Assessment -- by End-User Industry

  • Original Equipment Manufacturers (OEMs)
  • Electronics Manufacturing Services (EMS) Providers
  • Original Design Manufacturers (ODMs)

Printed Circuit Board Assembly Market Assessment --- by Geography

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • U.K.
    • Germany
    • France
    • Spain
    • Italy
    • Netherlands
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Taiwan
    • Singapore
    • Malaysia
    • Rest of Asia-Pacific
  • Latin America
    • Brazil
    • Argentina
    • Rest of Latin America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • South Africa
    • Rest of Middle East & Africa

TABLE OF CONTENTS

1 Introduction

  • 1.1. Market Definition & Scope
  • 1.2. Market Ecosystem
  • 1.3. Currency & Limitations
  • 1.4. Key Stakeholders

2 Research Methodology

  • 2.1. Research Approach
  • 2.2. Data Collection & Validation
    • 2.2.1. Secondary Research
    • 2.2.2. Primary Research
  • 2.3. Market Assessment
    • 2.3.1. Market Size Estimation
    • 2.3.2. Bottom-Up Approach
    • 2.3.3. Top-Down Approach
    • 2.3.4. Growth forecast
  • 2.4. Assumptions for The Study

3 Executive Summary

  • 3.1. Overview
  • 3.2. Segmental Analysis
    • 3.2.1. Market Analysis by Assembly Type
    • 3.2.2. Market Analysis by Component Type
    • 3.2.3. Market Analysis by Application
    • 3.2.4. Market Analysis by End User
  • 3.3. Regional Analysis
  • 3.4. Competitive Analysis

4 Industry Insights

  • 4.1. Overview
  • 4.2. PCB Assembly Technology Standards
    • 4.2.1. SMT Vs. THT Vs. Mixed Technology Comparison
    • 4.2.2. Quality and Reliability Standards (IPC, ISO)
  • 4.3. Value Chain Analysis
    • 4.3.1. Overview
    • 4.3.2. Raw Material and Component Suppliers
    • 4.3.3. PCB Manufacturing and Assembly
      • 4.3.3.1. Key PCBA Service Providers, by Size
        • 4.3.3.1.1. Small-Scale Assembly Houses
        • 4.3.3.1.2. Medium-Scale Regional Providers
        • 4.3.3.1.3. Large-Scale Contract Manufacturers
        • 4.3.3.1.4. Global EMS Giants
    • 4.3.4. Quality Control and Testing
    • 4.3.5. Logistics and Distribution
    • 4.3.6. End-User Integration
    • 4.3.7. After-Sales Service and Support
  • 4.4. Porter's Five forces Analysis
    • 4.4.1. Bargaining Power of Component Suppliers
    • 4.4.2. Bargaining Power of Electronics OEMS
    • 4.4.3. Threat of In-House Manufacturing
    • 4.4.4. Threat of New Assembly Service Entrants
    • 4.4.5. Degree of Competition Among EMS Providers

5 Market Insights

  • 5.1. Overview
  • 5.2. Factors Affecting Market Growth
    • 5.2.1. Drivers
      • 5.2.1.1. Growing Demand for Consumer Electronics
      • 5.2.1.2. Rapid Expansion of Automotive Electronics
      • 5.2.1.3. Accelerating 5G and IOT Deployment
      • 5.2.1.4. Increasing Medical Electronics Applications
      • 5.2.1.5. Continuous Miniaturization and Complexity Trends
      • 5.2.1.6. Rising Industrial Automation Demand
      • 5.2.1.7. Growing Electric Vehicle Adoption
      • 5.2.1.8. Expansion of Aerospace and Defense Electronics
    • 5.2.2. Restraints
      • 5.2.2.1. Volatile Raw Material and Component Costs
      • 5.2.2.2. Complex Regulatory Compliance Requirements
      • 5.2.2.3. Increasing Labor Costs in Manufacturing Hubs
      • 5.2.2.4. Technical Challenges in Advanced Assembly
      • 5.2.2.5. Supply Chain Disruptions and Dependencies
    • 5.2.3. Opportunities
      • 5.2.3.1. Electric Vehicle Electronics Expansion
      • 5.2.3.2. Industrial Automation and Industry 4.0
      • 5.2.3.3. Wearable and Flexible Electronics Growth
      • 5.2.3.4. Advanced Package Assembly Technologies
      • 5.2.3.5. Ai and Machine Learning Hardware Demand
    • 5.2.4. Trends
      • 5.2.4.1. Automation and Smart Manufacturing Adoption
      • 5.2.4.2. Sustainable and Green Manufacturing Practices
      • 5.2.4.3. Nearshoring and Supply Chain Diversification
  • 5.3. Standards and Regulations
    • 5.3.1. Global PCB Assembly Quality Standards
    • 5.3.2. Regional Compliance Requirements
      • 5.3.2.1. North America (IPC, Ul, FCC)
      • 5.3.2.2. Europe (CE, ROHS, REACH)
      • 5.3.2.3. Asia-Pacific (JIS, GB, Regional Standards)
      • 5.3.2.4. Latin America (Regional Compliance)
      • 5.3.2.5. Middle East & Africa (Local Standards)
  • 5.4. Insights on Growing Trend Towards Box Builds and Cabling
  • 5.5. Technological Advances
    • 5.5.1. Stencilling Vs. Solder Printing
    • 5.5.2. Nitrogen Ovens
    • 5.5.3. Pick-and-Place Throughput
    • 5.5.4. Other Emerging PCBA Technologies

6 Global PCBA Market Assessment - by Assembly Type

  • 6.1. Overview
  • 6.2. Surface Mount Technology (SMT)
  • 6.3. Through-Hole Technology (THT)
  • 6.4. Mixed Technology Assembly
  • 6.5. High-Density Interconnect (HDI) Assembly
  • 6.6. Flexible and Rigid-Flex Assembly
  • 6.7. Ball Grid Array (BGA) and Advanced Packaging

7 Global PCBA Market Assessment - by Component Type

  • 7.1. Overview
  • 7.2. Active Components
    • 7.2.1. Integrated Circuits and Microprocessors
    • 7.2.2. Discrete Semiconductors
    • 7.2.3. Optoelectronic Components
  • 7.3. Passive Components
    • 7.3.1. Resistors and Capacitors
    • 7.3.2. Inductors and Transformers
    • 7.3.3. Filters and Oscillators
  • 7.4. Electromagnetic Components
    • 7.4.1. Connectors and Sockets
    • 7.4.2. Switches and Relays
    • 7.4.3. Sensors and Transducers

8 Global PCBA Market Assessment - by Application

  • 8.1. Overview
  • 8.2. Consumer Electronics
    • 8.2.1. Smartphones and Tablets
    • 8.2.2. Computers and Peripherals
    • 8.2.3. Home Appliances and Entertainment
    • 8.2.4. Wearable Devices
  • 8.3. Automotive Electronics
    • 8.3.1. Powertrain and Engine Control
    • 8.3.2. Infotainment and Navigation
    • 8.3.3. Adas and Safety Systems
    • 8.3.4. Electric Vehicle Systems
  • 8.4. Telecommunications
    • 8.4.1. Network Infrastructure Equipment
    • 8.4.2. Base Stations and Small Cells
    • 8.4.3. Data Centers and Cloud Infrastructure
  • 8.5. Medical Devices
    • 8.5.1. Diagnostic Equipment
    • 8.5.2. Therapeutic Devices
    • 8.5.3. Monitoring and Wearable Health Tech
  • 8.6. Industrial Automation
    • 8.6.1. Control Systems and PLCS
    • 8.6.2. Robotics and Motion Control
    • 8.6.3. Process Automation Equipment
  • 8.7. Aerospace & Defense
    • 8.7.1. Avionics Systems
    • 8.7.2. Military Communication Equipment
    • 8.7.3. Radar and Navigation Systems

9 Global PCBA Market Assessment - by End User

  • 9.1. Overview
  • 9.2. Original Equipment Manufacturers (OEMS)
    • 9.2.1. Technology Companies
    • 9.2.2. Automotive Manufacturers
    • 9.2.3. Industrial Equipment Manufacturers
  • 9.3. Electronics Manufacturing Services (EMS)
    • 9.3.1. Contract Manufacturers
    • 9.3.2. Specialized Assembly Providers
    • 9.3.3. Turnkey Solution Providers
  • 9.4. Original Design Manufacturers (ODMS)
    • 9.4.1. Design and Manufacturing Partners
    • 9.4.2. Private Label Manufacturers
    • 9.4.3. System Integrators

10 PCBA Market Assessment, by Geography

  • 10.1. Overview
  • 10.2. North America
    • 10.2.1. U.S.
    • 10.2.2. Canada
  • 10.3. Europe
    • 10.3.1. Germany
    • 10.3.2. France
    • 10.3.3. U.K.
    • 10.3.4. Italy
    • 10.3.5. Netherlands
    • 10.3.6. Spain
    • 10.3.7. Sweden
    • 10.3.8. Denmark
    • 10.3.9. Rest of Europe
  • 10.4. Asia-Pacific
    • 10.4.1. China
    • 10.4.2. Japan
    • 10.4.3. South Korea
    • 10.4.4. Taiwan
    • 10.4.5. India
    • 10.4.6. Singapore
    • 10.4.7. Malaysia
    • 10.4.8. Rest of Asia Pacific
  • 10.5. Latin America
    • 10.5.1. Brazil
    • 10.5.2. Mexico
    • 10.5.3. Argentia
    • 10.5.4. Rest of Latin America
  • 10.6. Middle East & Africa
    • 10.6.1. UAE
    • 10.6.2. Saudi Arabia
    • 10.6.3. South Africa
    • 10.6.4. Rest of Middle East & Africa

11 Competitive Landscape

  • 11.1. Overview
  • 11.2. Key Growth Strategies
  • 11.3. Competitive Benchmarking
  • 11.4. Competitive Dashboard
    • 11.4.1. Industry Leaders
    • 11.4.2. Market Differentiators
    • 11.4.3. Vanguards
    • 11.4.4. Emerging Companies
  • 11.5. Market Share/Position Analysis

12 Company Profiles

  • 12.1. Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • 12.2. Flex Ltd
  • 12.3. Jabil, Inc
  • 12.4. Sanmina Corporation
  • 12.5. Celestica Inc.
  • 12.6. Benchmark Electronics, Inc.
  • 12.7. Plexus Corp.
  • 12.8. Kimball Electronics, Inc.
  • 12.9. Creation Technologies LP
  • 12.10. Nortech Systems, Inc
  • 12.11. Key Tronic Corporation
  • 12.12. Universal Scientific Industrial Co., Ltd.
  • 12.13. Shenzhen Kaifa Technology Co., Ltd.
  • 12.14. Eurocircuits NV
  • 12.15. Seeed Technology Co., Ltd
  • 12.16. Vexos Corporation
  • 12.17. Tempo Automation, Inc
  • 12.18. PCBWay
  • 12.19. WellPCB Technology Co., Ltd

13 Appendix

  • 13.1. Available Customization
  • 13.2. Related Reports

LIST OF TABLES

  • Figure 1 Research Process
  • Figure 2 Key Secondary Sources
  • Figure 3 Primary Research Techniques
  • Figure 4 Key Executives Interviewed
  • Figure 5 Breakdown of Primary Interviews (Supply-Side & Demand-Side)
  • Figure 6 Market Sizing and Growth forecast Approach
  • Figure 7 in 2025, the Surface Mount Technology Segment is Expected to Dominate the PCBA Market
  • Figure 8 in 2025, the Active Components Segment is Expected to Dominate the PCBA Market
  • Figure 9 in 2025, the Consumer Electronics Segment is Expected to Dominate the PCBA Market
  • Figure 10 in 2025, the Electronics Manufacturing Services (EMS) Segment Is Expected to Dominate the PCBA Market
  • Figure 11 PCBA Market, by Region, 2025 Vs. 2032 (USD Million)
  • Figure 12 Factors Affecting Market Growth
  • Figure 13 Global PCBA Market, by Assembly Type, 2025 Vs. 2035 (USD Million)
  • Figure 14 Global PCBA Market, by Component Type, 2025 Vs. 2035 (USD Million)
  • Figure 15 Global PCBA Market, by Application, 2025 Vs. 2035 (USD Million)
  • Figure 16 Global PCBA Market, by End User, 2025 Vs. 2035 (USD Million)
  • Figure 17 Global PCBA Market, by Region, 2025 Vs. 2035 (USD Million)
  • Figure 18 North America: PCBA Market Snapshot
  • Figure 19 Europe: PCBA Market Snapshot
  • Figure 20 Asia-Pacific: PCBA Market Snapshot
  • Figure 21 Latin America: PCBA Market Snapshot
  • Figure 22 Middle East & Africa: PCBA Market Snapshot
  • Figure 23 Key Growth Strategies Adopted by Leading Players, 2022-2025
  • Figure 24 Printed Circuit Board Assembly (PCBA) Market: Competitive Benchmarking, by Region
  • Figure 25 Competitive Dashboard: Printed Circuit Board Assembly (PCBA) Market
  • Figure 26 Printed Circuit Board Assembly (PCBA) Market Position Analysis, 2024
  • Figure 27 SWOT Analysis - Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • Figure 28 SWOT Analysis - Flex Ltd
  • Figure 29 SWOT Analysis - Jabil, Inc
  • Figure 30 SWOT Analysis - Sanmina Corporation
  • Figure 31 SWOT Analysis - Celestica Inc.
  • Figure 32 SWOT Analysis - Benchmark Electronics, Inc.
  • Figure 33 SWOT Analysis - Plexus Corp.
  • Figure 34 SWOT Analysis - Kimball Electronics, Inc.
  • Figure 35 SWOT Analysis - Creation Technologies LP
  • Figure 36 SWOT Analysis - Nortech Systems, Inc
  • Figure 37 SWOT Analysis - Key Tronic Corporation
  • Figure 38 SWOT Analysis - Universal Scientific Industrial Co., Ltd.
  • Figure 39 SWOT Analysis - Shenzhen Kaifa Technology Co., Ltd.
  • Figure 40 SWOT Analysis - Eurocircuits NV
  • Figure 41 SWOT Analysis - Seeed Technology Co., Ltd
  • Figure 42 SWOT Analysis - Vexos Corporation
  • Figure 43 SWOT Analysis - Tempo Automation, Inc
  • Figure 44 SWOT Analysis - PCBWay
  • Figure 45 SWOT Analysis - WellPCB Technology Co., Ltd

LIST OF FIGURES

  • Figure 1 Research Process
  • Figure 2 Key Secondary Sources
  • Figure 3 Primary Research Techniques
  • Figure 4 Key Executives Interviewed
  • Figure 5 Breakdown of Primary Interviews (Supply-Side & Demand-Side)
  • Figure 6 Market Sizing and Growth forecast Approach
  • Figure 7 in 2025, the Surface Mount Technology Segment is Expected to Dominate the PCBA Market
  • Figure 8 in 2025, the Active Components Segment is Expected to Dominate the PCBA Market
  • Figure 9 in 2025, the Consumer Electronics Segment is Expected to Dominate the PCBA Market
  • Figure 10 in 2025, the Electronics Manufacturing Services (EMS) Segment Is Expected to Dominate the PCBA Market
  • Figure 11 PCBA Market, by Region, 2025 Vs. 2032 (USD Million)
  • Figure 12 Factors Affecting Market Growth
  • Figure 13 Global PCBA Market, by Assembly Type, 2025 Vs. 2035 (USD Million)
  • Figure 14 Global PCBA Market, by Component Type, 2025 Vs. 2035 (USD Million)
  • Figure 15 Global PCBA Market, by Application, 2025 Vs. 2035 (USD Million)
  • Figure 16 Global PCBA Market, by End User, 2025 Vs. 2035 (USD Million)
  • Figure 17 Global PCBA Market, by Region, 2025 Vs. 2035 (USD Million)
  • Figure 18 North America: PCBA Market Snapshot
  • Figure 19 Europe: PCBA Market Snapshot
  • Figure 20 Asia-Pacific: PCBA Market Snapshot
  • Figure 21 Latin America: PCBA Market Snapshot
  • Figure 22 Middle East & Africa: PCBA Market Snapshot
  • Figure 23 Key Growth Strategies Adopted by Leading Players, 2022-2025
  • Figure 24 Printed Circuit Board Assembly (PCBA) Market: Competitive Benchmarking, by Region
  • Figure 25 Competitive Dashboard: Printed Circuit Board Assembly (PCBA) Market
  • Figure 26 Printed Circuit Board Assembly (PCBA) Market Position Analysis, 2024
  • Figure 27 SWOT Analysis - Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • Figure 28 SWOT Analysis - Flex Ltd
  • Figure 29 SWOT Analysis - Jabil, Inc
  • Figure 30 SWOT Analysis - Sanmina Corporation
  • Figure 31 SWOT Analysis - Celestica Inc.
  • Figure 32 SWOT Analysis - Benchmark Electronics, Inc.
  • Figure 33 SWOT Analysis - Plexus Corp.
  • Figure 34 SWOT Analysis - Kimball Electronics, Inc.
  • Figure 35 SWOT Analysis - Creation Technologies LP
  • Figure 36 SWOT Analysis - Nortech Systems, Inc
  • Figure 37 SWOT Analysis - Key Tronic Corporation
  • Figure 38 SWOT Analysis - Universal Scientific Industrial Co., Ltd.
  • Figure 39 SWOT Analysis - Shenzhen Kaifa Technology Co., Ltd.
  • Figure 40 SWOT Analysis - Eurocircuits NV
  • Figure 41 SWOT Analysis - Seeed Technology Co., Ltd
  • Figure 42 SWOT Analysis - Vexos Corporation
  • Figure 43 SWOT Analysis - Tempo Automation, Inc
  • Figure 44 SWOT Analysis - PCBWay
  • Figure 45 SWOT Analysis - WellPCB Technology Co., Ltd