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用于国防和航太应用的HDI（高密度互连）PCB：市场和技术预测（~2032年）
市场调查报告书
商品编码
1573258

用于国防和航太应用的HDI（高密度互连）PCB：市场和技术预测（~2032年）

High-density Interconnect PCB for Defence and Space Applications - Market and Technology Forecast to 2032
出版日期: | 出版商: Market Forecast | 英文 145 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

高密度互连（HDI）PCB 现在是下一代国防和太空有效载荷和设备的关键技术。从商业应用到军事和航太应用的转变体现了其多功能性和先进功能，满足关键任务环境中对小型化、提高性能和耐用性日益成长的需求。

HDI PCB 的主要贡献之一是它们能够支援现代国防和航太电子产品所需的更高速度和性能。随着高速处理晶片的普及以及对高速资料传输的需求不断增加，HDI PCB 具有独特的优势来促进这些进步。其多层设计和先进材料的使用可提供卓越的讯号完整性，即使在雷达、导航和电子战系统等高频应用中也能减少干扰和讯号损失。这使得 HDI PCB 成为先进军事平台的理想选择，例如无人机、战斗机和其他速度和精度非常重要的下一代防御系统。

在国防和航太领域，HDI PCB 越来越受到重视，因为其紧凑的外形适合复杂的设计，可显着减小组件尺寸和重量，同时保持高水准的功能。 HDI PCB 具有独特的优势，因为国防系统和太空任务需要电子设备不仅体积小、重量轻，而且能够承受恶劣的条件。 HDI PCB 可以增加电路密度，在不增加整体设备尺寸的情况下整合多层功能。

从战略角度来看，国防和航太应用的HDI PCB 市场预计到2032年将大幅成长。随着全球国防现代化计画的形势增强以及太空领域的快速商业化和探索活动，对先进和高性能电子元件的需求预计将激增。

本报告调查了用于国防和航太应用的HDI（高密度互连）PCB 的市场和技术，提供技术概述、最新趋势，市场成长的各种影响因素分析，市场规模推移和预测，各种区分、地区/主要国家的细分，竞争格局、主要公司简介等。

目录

第1章 执行摘要

第2章 简介

第3章 科技与发展

  • 技术概述
    • HDI PCB 的演变
  • HDI PCB 所采用的关键技术
    • 雷射钻孔技术
    • 雷射直接成像
    • 雷射可钻孔层压板和预浸料
  • 微孔和高密度连接器
    • 微孔
    • 高密度 PCB 连接器
  • 连续层压与层压技术
  • 显着的技术发展
    • 超 HDI PCB

第4章 市场概述

  • HDI PCB 市场分布：依地区
  • 主要公司概览
    • HDI PCB材料公司
    • HDI PCB机械公司
    • HDI PCB 製造与组装
  • 近期合约摘要
  • 主要客户：概览
  • 近期产品介绍摘要
  • 供应链概览
  • 重要原料

第5章 市场动态与预测因子

  • 市场区隔
    • 主要区域细分市场
    • 依用途细分
  • 促进因素
  • 趋势
  • 机会
  • 课题

第6章 国家分析

  • 摘要
  • 美国
  • 加拿大
  • 墨西哥
  • 欧盟
  • ESA
  • 中国
  • 台湾

第7章 全球与区域市场预测

  • HDI PCB 市场概览：依地区
  • HDI PCB 市场：依地区和技术划分
    • 北美
    • 欧洲：欧盟27国
    • 欧洲：非欧盟27国
    • 亚太地区
    • 中东、非洲
    • 拉丁美洲
  • 机会分析
    • 依地区

第8章 市场预测：依应用

  • HDI PCB 市场概览：依应用分类
  • HDI PCB 市场：依地区和应用划分
    • 航空
    • 陆上
    • 海洋/船舶
    • 宇宙
  • 机会分析
    • 依用途

第9章 影响分析

  • 预测因子与市场影响
    • "晶片到系统" 方法的重要性与日俱增
    • 原物料供应状况与采购障碍
    • 情境分析

第10章 主要公司

  • ACB Group
  • AGC Multi Materials
  • Amphenol Invotec
  • Austria Technologie & Systemtechnik AG (AT&S)
  • Introduction
  • DuPont (Electrical & Industrial)
  • Firan Technology Group (FTG)
  • Isola Group
  • NCAB Group
  • Sierra Circuits Inc.
  • 雷射直接成像（LDI）领域的主要公司
    • Orbotech (a KLA Company)
    • LPKF Laser & Electronics
    • Mitsubishi Electric
    • SCREEN Holdings Co., Ltd.
    • Manz AG
    • First EIE SA
    • Limata GmbH
    • Miva Technologies GmbH

第11章 结果/概述

第12章 关于市场预测

附录A：上市公司

附录B：缩写

简介目录
Product Code: MF242240

Market forecasts by Regions and Applications. Market and Technologies Overview, Critical Raw Materials, Country Analysis, Opportunity and Impact Analysis, , and Leading Companies.

High-Density Interconnect (HDI) PCBs have now become a crucial technology in next-generation defence and space payloads and devices. Their transition from commercial to military and aerospace applications highlights their versatility and advanced capabilities, meeting the growing demands for miniaturization, enhanced performance, and durability in mission-critical environments.

One of the key contributions of HDI PCBs is their ability to support the increasing speed and performance demands of modern defence and space electronics. With the proliferation of high-speed processing chips and the growing need for rapid data transfer, HDI PCBs are uniquely positioned to facilitate these advancements. Their multi-layer designs and use of advanced materials enable superior signal integrity, reducing interference and signal loss even in high-frequency applications such as radar, navigation, and electronic warfare systems. This makes HDI PCBs ideal for advanced military platforms, including UAVs, fighter jets, and other next-generation defence systems, where both speed and precision are paramount.

Our study "High-Density Interconnect PCB Technology - Market and Technology Forecast to 2032" covers the market demand potential for HDI PCBs in the defence and space sectors.

In the defence and space sectors, HDI PCBs are increasingly valued for their ability to handle complex designs within a compact form factor, significantly reducing the size and weight of components while maintaining high levels of functionality. As defence systems and space missions require electronics that are not only smaller and lighter but also capable of withstanding extreme conditions, HDI PCBs offer a unique advantage. They allow for increased circuit density, enabling the integration of multiple layers of functionality without increasing the overall size of the device.

From a strategic perspective, the market for HDI PCBs in defence and space applications is poised for significant growth through 2032. As global defence modernization programs gain momentum and the space sector witnesses rapid commercialization and exploration activities, the demand for advanced, high-performance electronic components is expected to soar. This study highlights key market trends, including the increasing collaboration between defence contractors, aerospace companies, and HDI PCB manufacturers, as well as the emergence of new manufacturing techniques that further drive innovation in this sector.

Additionally, regional insights are provided to outline the adoption trends across key markets worldwide. The study examines how different regions are responding to the technological shift towards HDI PCBs, with a focus on defence investments, space exploration initiatives, and the evolving regulatory landscape. Moreover, the competitive analysis section profiles leading HDI PCB manufacturers, offering insights into their technological advancements, market positioning, and product portfolios.

The study particularly addresses the recent developments and emphasis on reshoring PCB production by North American and European governments. The shifting landscape of global electronics production is driving developed countries to reevaluate their reliance on Asian manufacturers, especially in the context of critical raw materials and the growing emphasis on local production of Printed Circuit Boards (PCBs). This transformation is significantly impacting the dynamics of the HDI PCB value chain, as governments and industries in the West increasingly prioritize supply chain security and technological sovereignty.

Critical raw materials, such as rare earth elements and high-performance substrates essential for HDI PCBs, have become central to this strategic shift. Supply chain disruptions and geopolitical tensions have highlighted the vulnerability of relying on a concentrated pool of suppliers, particularly from Asia. In response, developed nations are ramping up efforts to secure these materials through domestic production, recycling initiatives, and strategic partnerships, aiming to reduce their dependence on imports from key Asian markets.

This move towards restoring local manufacturing capabilities is driven by the need for greater control over the production of advanced electronics, particularly in defence, aerospace, and other high-tech industries where HDI PCBs are critical. As the demand for HDI PCBs in these sectors grows, ensuring a steady, reliable supply of components is essential for national security and technological competitiveness. Countries like the United States and those within the European Union are investing heavily in PCB fabrication infrastructure, incentivizing local manufacturers, and encouraging innovation in PCB technology to meet these evolving demands.

This study has many such insights that will unveil the market demand and potential challenges the technology might face through 2032.

Covered in this study:

  • Overview: Snapshot of the HDI PCB technology in the defence and space market during 2024-2032, including highlights of the demand drivers, trends, and challenges. It also provides a snapshot of the spending with respect to regions as well as segments and sheds light on the emergence of new technologies.
  • Market Dynamics: Insights into the technological developments in the HDI PCB market and a detailed analysis of the changing preferences of governments around the world. It also analyses changing industry structure trends and the challenges faced by the industry participants.
  • Segment Analysis:Insights into the various HDI PCB markets from a segmental perspective and a detailed analysis of factors influencing the market for each segment.
  • Regional Review: Insights into modernization patterns and budgetary allocation for top countries within a region.
  • Regional Analysis: Insights into the HDI PCB market from a regional perspective and a detailed analysis of factors influencing the market for each region.
  • Impact Analysis: Analysis of how certain events will impact the HDI PCBs market. This will give you an indication of which factors are important for the forecast.
  • Key Program Analysis: Details of the top programmes in each segment expected to be executed during the forecast period.
  • Competitive landscape Analysis: Analysis of the competitive landscape of this industry. It provides an overview of key companies, together with insights such as key alliances, strategic initiatives, and a SWOT analysis.

Segmentation

The market has is segmented by Region and Application:

Region

  • EU-27
  • Non-EU 27
  • North America
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Applications

  • Ground
  • Air
  • Marine
  • Space

Reasons to buy:

  • To address the procurement and market analysis needs for HDI PCBs in defence and space applications over the next eight years.
  • Conduct a comprehensive analysis of prospective procurement areas based on market trends and government programs. Identify specific areas of demand growth for HDI PCBs in defence and space applications, such as communication systems, command and control systems, radars,weapon systems, next-generation avionics and countermeasures.
  • Develop a procurement plan that aligns with technological advancements and industry dynamics.
  • Gain insights into the factors driving demand for HDI PCBs in leading countries and emerging markets. Identify opportunities presented by each market segment based on defence spending, technological advancements, and geopolitical factors. Analyze market potential in terms of applications like space-based internet, inter-satellite communication, and deep space missions.
  • Strengthen understanding of market demand drivers, industry trends, regulatory landscapes, and technological developments influencing the adoption of HDI PCBs in defence and space applications. Monitor advancements in HDI PCB technology.
  • Identify key channels driving the global HDI PCBs market for defence and space applications. Evaluate opportunities in government procurement programs, defence contracts, research collaborations, and commercial partnerships. Explore avenues for revenue expansion through market penetration and diversification.
  • Conduct a comprehensive analysis of the competitive landscape in the HDI PCBs market. Profile leading providers of HDI PCbs for defence and space applications worldwide, including their product offerings, market presence, research capabilities, and strategic initiatives. Assess competitive positioning to make informed business decisions and identify potential partnership opportunities.

Companies Listed:

  • Advanced Circuits
  • AGC Multi Material America, Inc. (AMMA)
  • Austria Technologie & Systemtechnik AG
  • Cicor Group
  • DuPont
  • Electro Scientific Industries, Inc.
  • Elvia PCB Group
  • Eurocircuits
  • Hitachi High-Tech Corporation
  • ICAPE Group
  • Isola Group
  • LPKF Laser & Electronics AG
  • Manz AG
  • Mitsubishi Electric Corporation
  • NCAB Group
  • Oerlikon Balzers
  • Ohmega Technologies
  • Panasonic
  • Rogers Corporation
  • Sanmina Corporation
  • Schmid Group
  • Schweizer Electronic AG
  • Sierra Circuits
  • Suss MicroTec:
  • Ticer Technologies
  • TTM Technologies
  • Ventec International Group

Table of Contents

1. Executive Summary

  • 1.1. Trends and Insights
  • 1.2. Main Findings
  • 1.3. Key Conclusions

2. Introduction

  • 2.1. Scope
  • 2.2. Definitions
  • 2.3. Methodology
  • 2.4. Who will benefit from this study?

3. Technologies and Developments

  • 3.1. Technology Overview
    • 3.1.1. Evolution of HDI PCBs
  • 3.2. Critical Technologies used in HDI PCBs
    • 3.2.1. Laser Drilling Technology
    • 3.2.2. Laser Direct Imaging
    • 3.2.3. Laser Drillable Laminates and Prepregs
  • 3.3. Microvias and High-density Connectors
    • 3.3.1. Microvias
    • 3.3.2. High-density PCB Connectors
  • 3.4. Sequential Lamination and Layering Technologies
  • 3.5. Notable Technology Developments
    • 3.5.1. Ultra HDI PCBs

4. Market Overview

  • 4.1. Introduction
  • 4.2. HDI PCB market volume distribution over the forecast period by Region
  • 4.3. Main market players overview
    • 4.3.1. HDI PCB Material Companies
    • 4.3.2. HDI PCB Machinery Companies
    • 4.3.3. HDI PCB Fabrication and Assembly
  • 4.4. Recent contracts overview
    • 4.4.1. Calumet Electronics and Green Source Awarded Major Contracts to Boost Advanced PCB Production
    • 4.4.2. Micross Components Awarded Major Contract to Develop Advanced Packaging Capabilities for Department of Defence
  • 4.5. Main customers overview
  • 4.6. Recent product introductions Overview
    • 4.6.1. ESA Approves VT-901 as the First Qualified HDI Material
    • 4.6.2. Atotech Demonstrated Printoganth T1 and InPro
  • 4.7. Supply Chain Overview
  • 4.8. Critical Raw Materials
    • 4.8.1. Laser Drillable (LD) Prepregs
    • 4.8.2. Substrate Material

5. Market Dynamics and Forecast Factors

  • 5.1. Market Segmentation
    • 5.1.1. Segments by Key Regions
    • 5.1.2. Segmentation by Application
  • 5.2. Drivers
  • 5.3. Trends
  • 5.4. Opportunities
  • 5.5. Challenges

6. Country Analysis

  • 6.1. Overview
  • 6.2. USA
    • 6.2.1. Section 841 of the FY 2021 NDAA
    • 6.2.2. NDS and NDIS
    • 6.2.3. The CHIPS and Science Act of 2022
    • 6.2.4. The Defence Production Act (DPA) Title III program
    • 6.2.5. Defence Production Act Investment (DPAI) Program
    • 6.2.6. Supporting PCB Act 2022 and PCBS Act 2023
    • 6.2.7. Relevant contracts
  • 6.3. Canada
  • 6.4. Mexico
  • 6.5. European Union
    • 6.5.1. Europe Chips Act
    • 6.5.2. Horizon Focusing
    • 6.5.3. JTF-2021/23-15 - High Challenges for PCBs and SMT (Surface Mount Technologies)
  • 6.6. ESA
    • 6.6.1. General Support Technology Programme (GSTP)
    • 6.6.2. G61A-017QT
    • 6.6.3. ESA HDI PCB Technology Roadmap
    • 6.6.4. ESA Qualified HDI PCB Suppliers
  • 6.7. China
  • 6.8. Taiwan

7. Global and Regional Market Forecast to 2032

  • 7.1. Introduction
  • 7.2. HDI PCB market by Region overview
  • 7.3. HDI PCB Market Regions by Technology
    • 7.3.1. North America HDI PCB Market by Technology
    • 7.3.2. EU-27 HDI PCB Market by Technology
    • 7.3.3. Non EU-27 HDI PCB Market by Technology
    • 7.3.4. APAC HDI PCB Market by Technology
    • 7.3.5. MEA HDI PCB Market by Technology
    • 7.3.6. LATAM HDI PCB Market by Technology
  • 7.4. Opportunity Analysis
    • 7.4.1. By Region

8. Market Forecast to 2032 by Application

  • 8.1. Introduction
  • 8.2. HDI PCB market by Application overview
  • 8.3. HDI PCB Applications Market by Region
    • 8.3.1. Airborne HDI PCB Market by Region
    • 8.3.2. Ground-based HDI PCB market by Region
    • 8.3.3. Naval-based HDI PCB market by Region
    • 8.3.4. Space-based HDI PCB market by Region
  • 8.4. Opportunity Analysis
    • 8.4.1. By Application

9. Impact Analysis

  • 9.1. Introduction
  • 9.2. Forecast Factors and Market Impact
    • 9.2.1. Growing Emphasis on"Silicon to System" approach
    • 9.2.2. Challenges in Raw Material Availability and Procurement Hurdles
    • 9.2.3. Scenario Analysis

10. Leading Companies

  • 10.1. ACB Group
    • 10.1.1. Introduction
    • 10.1.2. Related Products and Services
    • 10.1.3. Recent Developments and Contracts
    • 10.1.4. SWOT Analysis
  • 10.2. AGC Multi Materials
    • 10.2.1. Introduction
    • 10.2.2. Related Products and Services
    • 10.2.3. Recent Developments and Contracts
    • 10.2.4. SWOT Analysis
  • 10.3. Amphenol Invotec
    • 10.3.1. Introduction
    • 10.3.2. Related Products and Services
    • 10.3.3. Recent Developments and Contracts
    • 10.3.4. SWOT Analysis
  • 10.4. Austria Technologie & Systemtechnik AG (AT&S)
    • 10.4.1. Introduction
    • 10.4.2. Related Products and Services
    • 10.4.3. SWOT Analysis
  • 10.5. Calumet Electronics Corporation
    • 10.5.1. Introduction
    • 10.5.2. Related Products and Services
    • 10.5.3. Recent Developments and Contracts
    • 10.5.4. SWOT Analysis
  • 10.6. DuPont (Electrical & Industrial)
    • 10.6.1. Introduction
    • 10.6.2. Related Products and Services
    • 10.6.3. SWOT Analysis
  • 10.7. Firan Technology Group (FTG)
    • 10.7.1. Introduction
    • 10.7.2. Related Products and Services
    • 10.7.3. Recent Developments and Contracts
    • 10.7.4. SWOT Analysis
  • 10.8. Isola Group
    • 10.8.1. Introduction
    • 10.8.2. Related Products and Services
    • 10.8.3. Recent Developments and Contracts
    • 10.8.4. SWOT Analysis
  • 10.9. NCAB Group
    • 10.9.1. Introduction
    • 10.9.2. Related Products and Services
    • 10.9.3. Recent Developments and Contracts
    • 10.9.4. SWOT Analysis
  • 10.10. Sierra Circuits Inc.
    • 10.10.1. Introduction
    • 10.10.2. Related Products and Services
    • 10.10.3. Recent Developments and Contracts
    • 10.10.4. SWOT Analysis
  • 10.11. Leading Companies in Laser Direct Imaging (LDI)
    • 10.11.1. Orbotech (a KLA Company)
    • 10.11.2. LPKF Laser & Electronics
    • 10.11.3. Mitsubishi Electric
    • 10.11.4. SCREEN Holdings Co., Ltd.
    • 10.11.5. Manz AG
    • 10.11.6. First EIE SA
    • 10.11.7. Limata GmbH
    • 10.11.8. Miva Technologies GmbH

11. Results and Conclusions

12. About Market Forecast

  • 12.1. General
  • 12.2. Contact us
  • 12.3. Disclaimer
  • 12.4. License

Appendix A: Companies Mentioned

Appendix B: Abbreviations

List of figures

  • Figure 1: HDI PCB Market Summary by Region
  • Figure 2: Market volumes over the forecast period per region
  • Figure 3: Market Segmentation and Sub-Segmentation HDI PCB Market
  • Figure 4: Global and Regional HDI PCB Defence and Space Market 2024 - 2032 [US$ million]
  • Figure 5: Global HDI PCB Market Forecast to 2032 by Region [%]
  • Figure 6: North America HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 7: EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 8: Non EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 9: APAC HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 10: MEA HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 11: LATAM HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 12: HDI PCB market size, 2024-2032 (US$ million) by region
  • Figure 13: HDI PCB market CAGR, 2024-2032 by region
  • Figure 14: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
  • Figure 14: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Figure 15: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Figure 16: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Figure 17: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
  • Figure 18: HDI PCB market size, 2024-2034 (US$ million) by Application
  • Figure 19: HDI PCB market CAGR, 2024-2034 by Application
  • Figure 20: HDI PCB Market Forecast to 2031 Scenario I Vs. Scenario II

List of tables

  • Table 1: HDI PCB Market Summary by Region [US$ million]
  • Table 2: HDI PCB Technology Characteristics
  • Table 3: Microvias and High-density Connectors
  • Table 4: HDI PCB Material Companies
  • Table 5: HDI PCB Machinery Companies
  • Table 6: HDI PCB Machinery Companies
  • Table 7: HDI PCB Supply Chain
  • Table 8: HDI PCB Market Defence and Space Forecast to 2032 by Region [US$ million]
  • Table 9: North America HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 10: EU-27 HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 11: Non EU-27 HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 12: APAC HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 13: MEA HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 14: LATAM HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 15: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
  • Table 15: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Table 17: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Table 18: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Table 19: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
  • Table 20: HDI PCB Market Forecast to 2032 Scenario I Vs. Scenario II [US$ million]
  • Table 21: ACB Group Company SWOT Analysis
  • Table 22: AGC Group Company SWOT Analysis
  • Table 23: Amphenol Invotec Company SWOT Analysis
  • Table 24: AT&S Company SWOT Analysis
  • Table 25: Calumet Company SWOT Analysis
  • Table 26: DuPont Company SWOT Analysis
  • Table 27: Firan Technology Company SWOT Analysis
  • Table 28: Isola Group Company SWOT Analysis
  • Table 29: NCAB Group Company SWOT Analysis
  • Table 30: Sierra Circuits Company SWOT Analysis