纸和纸板技术市场 - COVID-19 的增长、趋势、影响、预测(2022-2027 年)
市场调查报告书
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1136157

纸和纸板技术市场 - COVID-19 的增长、趋势、影响、预测(2022-2027 年)

Paper and Board Technologies Market - Growth, Trends, and Forecasts (2022 - 2027)

出版日期: | 出版商: Mordor Intelligence | 英文 101 Pages | 商品交期: 2-3个工作天内

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简介目录

在 2022-2027 年的预测期内,纸张和纸板技术市场的复合年增长率预计为 7.8%。

过去十年,行业变革步伐加快,技术颠覆性日益超过发展。在 COVID-19 大流行期间,纸和纸板产品为我们的客户发挥了重要作用。例如,随着消费者转向在家工作,纸板被广泛用作电子商务的包装。

主要亮点

  • 在过去十年中,造纸和纸板行业的参与者将重点放在了纸浆和造纸行业的强制重组上,包括资产关闭和工厂转换。对一些纸张(如图形纸)的需求下降,迫使纸张和纸板行业的参与者将资产转移到包装和纸巾产能。为应对这一重组阶段,许多全球纸浆和造纸公司出售相邻业务领域或退出某些区域以专注于其核心业务。
  • 由于行业的技术创新浪潮(例如数字和分析技术)以及对可持续性的兴趣日益浓厚,预计纸张和纸板行业将进入变革时期。与其他包装行业产品不同,对纸和纸板包装产品的需求在结构上不断增加,因此预计下一阶段的颠覆将涉及提高生产力和产量,以及可持续发展驱动的转型。
  • 数字化和分析可以提供行业的下一次转型。借助这些先进技术,企业可以将生产力和产量提高 10% 到 15% 或更多,显着克服许多市场参与者之间的传统成本曲线差异以及个别工厂和机器的成本曲线差异。这些技术可以进一步扩展,以优化从纺织品(森林和回收)到最终产品的端到端价值链,并利用供应链中数据的全部价值。
  • COVID-19 大流行加速了行业的数字化,这表明需要在纸和纸板包装价值链中提高弹性和透明度。预计这一发展将扩大人工智能 (AI) 的使用,以监控成本效率和生产力并实时跟踪流程。
  • 在 COVID-19 大流行爆发之前,一些品牌和加工商已经在试验用于智能包装应用的射频识别 (RFID) 和近场通信 (NFC)。由于减少运输错误、提高安全性以及原材料和成品验证等优势,工业 RFID 标籤正变得越来越流行。

主要市场趋势

纸和纸板製品替代塑料和一次性纸製品的趋势

  • 消除一次性塑料和减少纸製品消耗的压力正在推动造纸和涂料技术的发展。纸和纸板包装材料涂有功能性涂层材料和阻隔涂层材料,防止油、水、水蒸气、氧气、香料等进出,提高被包装产品的阻隔性能。
  • 塑料法规的对象正逐渐从塑料购物袋扩大到一次性塑料包装製品。限制使用塑料产品已导致许多最终用户和许多国家寻求具有成本效益和环保的替代品。作为塑料产品的替代品,除了纸和纸板等材料外,还考虑了金属、玻璃和可生物降解的塑料产品。
  • 随着禁塑令的实施,自 COVID-19 流行以来,对一次性纸盒、纸袋和食品包装纸罐等相关纸和纸板产品的需求有所增加。
  • 在这些纸和纸板包装产品的製造中,正在使用创新技术来减轻包装重量和体积,降低能源消耗,消除和减少有害添加剂,并建立可持续的商业模式,领先并引领市场。
  • 例如,2022 年 6 月,罗格斯公共卫生学院和环境与职业健康科学研究所的科学家们发现了一种基于植物的可生物降解涂层,可以喷涂到食品上以保护其免受致病、腐败和运输损坏。该研究旨在为塑料食品包装和容器创造一种环保替代品。这种技术已使纸和纸板包装产品用于包括食品在内的广泛的最终用户行业。

亚太地区有望录得最快增速

  • 由于包装机械的渗透率不断提高,预计亚太地区将在预测期内实现最高增长率。该地区主要供应商建立战略伙伴关係和合作将为市场带来增长。例如,2021 年 10 月,印度最大的纸浆和纸张製造商之一的 JK Paper Limited 将为 JK Paper 最新的包装纸板扩建项目提供 POM 方法(纸机方法技术)流程和备料系统。我们选择 AFT Global
  • 由于 COVID-19 大流行,自动化变得越来越流行。鑑于零售市场部门的投资增加和规模扩大,预计中国将成为纸和纸板包装自动化的主要市场之一。商品消费率的上升推动了对更多包装的需求,影响了对包装机器人的需求。
  • 日本包装市场也在健康增长。日本对纸板箱的需求受到食品和饮料以及加工食品不断增长的需求和发展的推动。日本加工食品行业的增长也有望成为纸张和纸板技术市场的主要驱动力之一。
  • 此外,在包装设备中引入工业物联网 (IIoT) 在该地区也越来越受欢迎,通过为机器、机器基础设施和操作员的改进开闢新的机会来提高包装线的效率。改进并为未来十年包装设备数字化的未来铺平道路。

竞争格局

纸和纸板技术市场适度分散,有大量参与者在其中运营。由于新技术和先进机械需要更多的资金和研发投入,更先进的技术通常由多个大型参与者提供,因此某些细分市场会向这些大型市场参与者汇聚。

  • 2022 年 6 月——国际科技集团ANDRITZ已签署协议,收购总部位于意大利米兰的 Bonetti 集团。此次收购扩大和加强了ANDRITZ的售后市场业务,并补充了其造纸机服务组合。
  • 2022 年 4 月 - Valmet宣布将向位于中国日照的Asia Symbol(山东)浆纸有限公司提供一条备料和多种自动化的高级纸生产线。这条新的高产能高级纸生产线将设计用于生产高质量的精细无涂层 (WFU) 等级。新生产线 PM14 计划于 2023 年投产。该项目预计价值约80-1亿欧元。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 调查范围

第二章研究方法论

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力——波特五力分析
    • 供应商的议价能力
    • 消费者议价能力
    • 新进入者的威胁
    • 竞争对手之间的竞争
    • 替代品的威胁
  • 评估 COVID-19 的市场影响

第五章市场动态

  • 市场驱动力
    • 减轻包装板的重量
    • 行业自动化和数字化的进步
  • 市场挑战
    • 预算限制和解决方案的高成本

第六章市场细分

  • 按产品类型
    • 纸板
    • 纸板原纸
    • 包装纸
    • 组织
    • 其他纸及纸板
  • 按用途
    • 生产线和机器部分
    • 自动化
    • 印刷
    • 服务
    • 其他应用
  • 区域信息
    • 北美
    • 欧洲
    • 亚太地区
    • 世界其他地区

第 7 章 竞争格局

  • 公司简介
    • Valmet Oyj
    • Siemens AG
    • Andritz AG
    • Flint Group
    • Covestro AG
    • Honeywell International Inc.
    • ABB Ltd
    • Stora Enso Oyj
    • International Paper
    • BW Papersystems
    • Syntegon Technology GmbH

第八章投资分析

第九章 市场潜力

简介目录
Product Code: 92112

The Paper and Board Technologies Market is expected to register a CAGR of 7.8% during the forecast period 2022 to 2027. In the last decade, the pace of change in the industry has accelerated, with more and more frequent technological disruptions outpacing development. Paper and Board products have played a crucial role for customers during the COVID-19 pandemic. For example, as consumers transitioned to work from home, corrugated board packaging was extensively used for e-commerce packaging.

Key Highlights

  • During the last decade, paper and board industry players focused heavily on a forced restructuring of the pulp and paper industry, with asset closures and mill conversions. A decline in demand is some types of paper, such as graphic paper, prompted paper and board market players to shift their assets into packaging and tissue capacity. To manage this phase of forced restructuring, many global diversified pulp and paper corporations were also engaged in divesting adjacent business sectors and exiting some geographies to focus back on their core businesses.
  • The paper and board industry is expected to witness a transformational change characterized by the wave of industry technology disruption, such as digital and analytics, coupled with an increasing focus on sustainability. Unlike other packaging industry products, demand for paper and board packaging products is structurally increasing; therefore, the next level of disruption is anticipated to involve an increase in productivity and output along with the sustainability-led transformation.
  • Digital and analytics are able to offer the next transformation in the industry. Using these advanced technologies, companies can improve productivity and throughput by more than 10% to 15%, representing considerable gains on traditional cost-curve differences between many market players or individual mills and machines. These technologies can be further extended to optimize the end-to-end value chain, from fiber (forest or recycled) to the final product, in order to harness the complete value of the data along the supply chain.
  • Digitalization in the industry has been accelerated by the COVID-19 pandemic, which exposed a requirement for more resilience and transparency across the paper and board packaging value chain. This development is anticipated to lead to greater use of artificial intelligence (AI) to monitor cost efficiency and productivity and track processes in real-time.
  • Several brands and converters were already experimenting with radio-frequency identification (RFID) and near-field communications (NFC) for intelligent packaging applications before the COVID-19 pandemic struck. Industrial RFID tags have become more popular owing to the advantages it provides, such as reducing shipping errors, improving security, and validating raw materials and finished goods., among others.

Key Market Trends

Increasing Trend of Replacing Plastic and Single-use Paper Products with Paper and Board Products

  • Pressures to eliminate single-use plastic and reduce single-use paper product consumption are spurring developments in papermaking and coating technologies. Functional and barrier coating materials are applied to paper and board packaging to provide a barrier against the egress or ingress of oil and grease, water and water vapor, oxygen, and aroma, for the products packed.
  • The scope of plastic restrictions has gradually expanded from plastic bags to disposable plastic packaging products. The limited use of plastic products has prompted a number of end-users and many countries to look for cost-effective and environmentally friendly alternatives. Materials such as paper and board, along with other materials like metals, glass, and biodegradable plastics products, have been considered as alternatives to plastic products.
  • With the implementation of plastic bans, the demand for disposable paper boxes, paper bags, paper cans, and other related paper and board products for food packaging increased post COVID-19 pandemic period.
  • In manufacturing these paper and board packaging products, innovative technologies are helping to reduce weight and volume of packaging, reduce energy consumption, eliminate and minimize toxic additives, as well as create sustainable business models, therefore driving the market.
  • For instance, in June 2022, a scientist from Rutgers School of Public Health and Environmental and Occupational Health Sciences Institute developed a plant-based biodegradable coating which can be sprayed on foods, guarding them against pathogenic and spoilage microorganisms as well as transportation damage. This research was aimed to produce environmentally friendly alternatives to plastic food wrap and containers. Owing to technologies like these, paper and board packaging products can be used in a wide range of end-user industries including food.

Asia Pacific is Expected to Register the Fastest Growth Rate

  • Due to the increasing penetration of packaging machinery in the region, Asia Pacific is expected to witness the highest growth rate during the forecast period. The formation of strategic partnerships and collaborations by key regional vendors add growth to the market. For instance, in October 2021, JK Paper Limited, one of India's largest pulp and paper producers, selected AFT Global to supply a POM approach (paper machine approach technology) flow and stock preparation system for JK Paper's latest packaging board expansion project.
  • Automation became more prevalent with the spread of the COVID-19 pandemic. China is expected to be one of the critical markets for paper and board packaging automation, considering the increasing investments and the growing size of the retail market sector. The rising consumption rate of goods accelerates the need for more packaging; therefore, influencing the demand for packaging robots.
  • The packaging market in Japan is also experiencing healthy growth. The demand for corrugated packaging in the country has been fueled by the growing demand and development of beverages and packaged food. Japan's growing processed food industry is also expected to act as one of the crucial drivers for the paper and board technologies market.
  • In addition, the introduction of the Industrial Internet of Things (IIoT) into packaging equipment is also gaining popularity in the region, which is expected to improve the efficiency of packaging lines and pave the way for the digital future of packaging equipment over the next decade, by opening new opportunities for improved machinery, machine infrastructure, and operators.

Competitive Landscape

The Paper and Board Technologies Market is moderately fragmented with a significant number of players operating in the market. As new technologies and advanced machineries require more capital and R&D investment, more advanced technologies are usually provided by several large companies, therefore, certain segments of the market are consolidated within these large market players.

  • June 2022 - ANDRITZ, an international technology group signed an agreement to acquire the Bonetti Group, headquartered in Milan, Italy. This acquisition expanded and strengthened ANDRITZ's aftermarket business and supplemented the company's Paper Machine Service portfolio.
  • April 2022 - Valmet announced to supply a fine paper-making line with stock preparation and extensive scope of automation to Asia Symbol (Shandong) Pulp and Paper in Rizhao, China. This new high-capacity fine paper-making line is planned to be designed to produce high-quality wood-free uncoated paper (WFU) grades. The launch of the new production line PM14 is scheduled for 2023. The project is expected to be of value around EUR 80 to 100 million.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Assessment of Impact of COVID-19 on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Lightweighting of Packaging Board
    • 5.1.2 Increasing Automation and Digitalization of the Industry
  • 5.2 Market Challenges
    • 5.2.1 Budget Constraints and High Cost of Solutions

6 MARKET SEGMENTATION

  • 6.1 By Product Type
    • 6.1.1 Containerboard
    • 6.1.2 Cartonboard
    • 6.1.3 Wrapping Paper
    • 6.1.4 Tissue
    • 6.1.5 Other Paper and Board
  • 6.2 By Application
    • 6.2.1 Production Lines and Machine Sections
    • 6.2.2 Automation
    • 6.2.3 Printing
    • 6.2.4 Services
    • 6.2.5 Other Application
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia Pacific
    • 6.3.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Valmet Oyj
    • 7.1.2 Siemens AG
    • 7.1.3 Andritz AG
    • 7.1.4 Flint Group
    • 7.1.5 Covestro AG
    • 7.1.6 Honeywell International Inc.
    • 7.1.7 ABB Ltd
    • 7.1.8 Stora Enso Oyj
    • 7.1.9 International Paper
    • 7.1.10 BW Papersystems
    • 7.1.11 Syntegon Technology GmbH

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET