汽车半导体市场 - 增长、趋势、COVID-19 的影响、预测 (2023-2028)

在预测期内，汽车半导体市场预计将以 16.2% 的复合年增长率增长。

这个市场是通过分析汽车行业中使用的各种组件的市场规模来评估的，例如处理器、传感器、存储设备、集成电路和分立功率设备。 报告的研究范围包括对全球轻型商用车、重型商用车和乘用车等多种车型的分析。

主要亮点

• 半导体是导电性介于导体和绝缘体之间的物质，例如锗和硅。 半导体在汽车中的应用多种多样：底盘、电力电子、安全、车身电子、舒适或娱乐单元。
• 汽车已成为人们生活中不可或缺的一部分，因为它们是当今的主要交通工具。 目前，全球道路上行驶的汽车超过13亿辆，预计到2035年这一数字将增至18亿辆。 其中，乘用车约占74%，轻型商用车、重型卡车、客车、客车和小巴占其余26%。
• 汽车安全和保障系统技术近年来发生了重大变化，从座椅头枕到自适应巡航控制系统。 盲点检测、睡意监测系统、车道偏离预警系统、平视显示器、夜视系统、泊车辅助、e-call telematics、胎压监测系统技术等一波先进技术不断涌现，驱动因素以及在发生车祸时共乘。安全和保障系统在保护人们免受严重伤害方面具有巨大的潜力。
• 越来越多的经济型车辆配备先进的信息娱乐功能、安全性、性能和燃油效率。 这些特征导致包含各种组件，从而增加了车辆的整体价格。 当今汽车的核心是数以千计的半导体芯片，它们充当汽车的眼睛、耳朵和大脑，监测其环境、做出选择并控制其行动。 据半导体行业协会称，一辆现代汽车可能有8000多颗半导体芯片和100多个电子控制单元，目前占汽车总成本的35%以上，预计从2025年到2030年将增长。预计年均超过50%。
• COVID-19 立即导致现有製造业停顿，并影响了全球的供应链。 最先受到疫情打击的中国，由于全州范围内的封锁和供应链的破坏，已经损失了超过三分之二的汽车製造。 汽车供应链往往在地理上分散，随着每个国家在大流行后推出自己的协议，供应链管理受到重创，使其成为 COVID-19 期间汽车行业面临的最重大挑战之一。成为其中之一

汽车半导体市场趋势

重型商用车市场增长强劲

• 在预测期内，重型商用车市场预计将保持显着的复合年增长率。 事故预防系统、ADAS、驾驶效率和发动机系统等最新技术的引入，以及对环境可持续性和减少排放的关注，将增加对这些重型商用车的需求。
• 重型商用车顶级製造商的技术进步预计将在全球范围内激增。 表征市场成功的突出趋势集中在事故预防系统、自动紧急制动系统、辅助人员协助和盲点监控器上。 公路安全保险协会 (IIHS) 领导的一项研究发现，为重型车辆配备自动紧急制动系统和前方碰撞警告系统可以防止超过 40% 的重型卡车追尾事故。仅此而已。
• 研究表明，配备自动紧急制动 (AEB) 等前向防撞系统的重型车辆的碰撞事故减少了 12%，配备前向碰撞警告 (FCW) 的重型车辆的碰撞事故减少了 22%。 因此，对用于创建高效自动制动和自动驾驶系统的集成 IC 的需求不断增长，正在显着推动全球汽车半导体市场。
• 根据新的报废政策，印度、韩国和中国等亚太国家/地区的政府鼓励重型卡车车主购买新的重型卡车和其他商用车辆，不鼓励使用旧车或污染车辆.目的压制。 该计划不仅会降低污染水平，还会促进重型卡车领域采用集成 IC、传感器、高级微控制器、ADAS 和电机驱动器 IC 的进步，这将对市场增长产生重大影响。
• 欧洲重型卡车製造商已投资于新技术的整合，以实现其 2025 年后的零排放目标，以避免因不遵守欧盟法规而支付高额罚款。 欧盟 (EU) 为重型车辆制定了碳中和目标和标准。 这包括从 2025 年减少 15%，到 2030 年增加到 30%，到 2050 年实现零排放。
• 根据 OICA 的数据，与 2020 年的商用车产量相比，2021 年的重型商用车产量将下降 1.51%。 大部分在亚洲的芯片製造商在 Delta 版本造成严重的供应问题之前将产量提高到 2021 年下半年。 总体而言，大流行后市场正在復苏。

亚太地区将成为增长最快的地区

• 亚太地区的汽车半导体市场受到汽车製造业增长以及汽车原始设备製造商与半导体製造商之间持续合作的推动。 成本和燃油效率不再是购买汽车时最重要的因素，而是汽车提供的舒适性和豪华性变得越来越重要。
• 这是因为全球汽车製造商目睹了对豪华车和半豪华车的强劲需求，并被迫安装更多电子元件。我认为这是因为我在推动。 由于这些原因，亚太地区的汽车半导体行业提供了一个潜在的市场领域。
• 亚太地区汽车半导体行业的快速扩张预计将受到电动汽车需求不断增长的推动。 汽车製造商必须继续创新、创造和开发自动驾驶汽车，他们已经在主要汽车製造国家拥有大量客户。
• 全自动驾驶汽车的增长轨迹受到多种因素的推动，包括技术进步、消费者接受全自动驾驶汽车的意愿、定价以及供应商和原始设备製造商解决关键车辆安全问题的能力。预计将受到以下方面的重大影响因素。
• 据汽车行业称，印度各地对摩托车、三轮车和拖拉机的需求量很大。 印度还拥有强大的半导体研发基础设施，这可能会在未来为印度汽车半导体市场开闢新的可能性。 此外，政府已采取各种举措促进国内半导体芯片供应。 例如，2022年9月，印度政府宣布将对建立半导体製造工厂的项目成本提供50%的固定财政支持，以提振该国的半导体製造业。

汽车半导体市场竞争分析

汽车半导体市场被 NXP Semiconductor NV、Infineon Technologies AG、Renesas Electronics Corporation、STMicroelectronics NV 和 Toshiba Electronic Devices & Storage Corporation (Toshiba Corporation) 等大公司分割开来。 市场参与者正在采用合作伙伴关係、合併、联盟、创新和收购等战略来增强其产品供应并获得持续的竞争优势。

2022 年 8 月，Onsemi 在新罕布什尔州哈德逊开设了碳化硅 (SiC) 工厂。 预计到 2022 年底，该工厂将使公司的年生产能力增加五倍，并将其在哈德逊的员工人数增加近四倍。

2022 年 7 月，NXP Semiconductors NV 与富士康合作开发新一代智能网联汽车。 此次扩大合作的重点是富士康对电动汽车 (EV) 平台的承诺，利用恩智浦的系统专业知识和全面的电气化产品组合，从恩智浦 S32 处理器到模拟前端、加速器、网络和电源产品。 此次合作将利用恩智浦的汽车技术组合和多年的安全和安保专业知识，为电气化、连接性和安全自动驾驶提供架构创新和平台。

2022 年 6 月，瑞萨电子株式会社将与 Cyber□□on Corporation 合作，为使用瑞萨电子全系列 RA MCU 的客户提供语音用户界面 (VUI) 解决方案。 客户现在可以免费访问 Cyber□□on 基于命令的 VUI 工具链，以将语音识别添加到各种端点应用程序，包括消费电子、楼宇自动化、工业自动化和可穿戴设备。

额外津贴

• Excel 格式的市场预测 (ME) 表
• 3 个月的分析师支持

内容

第1章介绍

• 研究假设和市场定义
• 调查范围

第2章研究方法论

第 3 章执行摘要

第 4 章市场洞察

• 市场概览
• 产业吸引力 - 波特五力分析
  • 供应商的议价能力
  • 消费者的议价能力
  • 新进入者的威胁
  • 竞争公司之间的敌对关係
  • 替代品的威胁
• 工业价值链分析
• 评估 COVID-19 对市场的影响

第 5 章市场动态

• 市场驱动力
  • 汽车产量增加
  • 对高级安全性和舒适性的需求不断增加
• 市场製约因素
  • 高性能车辆成本上升

第 6 章市场细分

• 按车型
  • 乘用车
  • 轻型商用车
  • 大型商用车
• 按组件
  • 处理器
  • 传感器
  • 记忆装置
  • 集成电路
  • 分立式功率器件
• 通过使用
  • 底盘
  • 电力电子
  • 安全
  • 车身电子
  • 舒适/娱乐单元
  • 其他用途
• 区域信息
  • 北美
  • 欧洲
  • 亚太地区
  • 拉丁美洲
  • 中东和非洲

第7章竞争格局

• 公司简介
  • NXP Semiconductor NV
  • Infineon Technologies AG
  • Renesas Electronics Corporaton
  • STMicroelectronics NV
  • Toshiba Electronic Devices & Storage Corporation（Toshiba Corporation）
  • Texas Instrument Inc.
  • Robert Bosch GmbH
  • Micron Technology
  • Onsemi（Semiconductor Components Industries LLC）
  • Analog Devices Inc.
  • ROHM Co. Ltd

第8章 投资分析

第9章 今后动向

The automotive semiconductor market is expected to register at a CAGR of 16.2% over the forecast period. The market was evaluated by analyzing the market sizes of different components used in the automotive industry, including processors, sensors, memory devices, integrated circuits, and discrete power devices. The scope of the report comprises analyzing various vehicle types, like light commercial vehicles, heavy commercial vehicles, and passenger vehicles, around the world.

Key Highlights

• A semiconductor is a substance, such as germanium or silicon, with electrical conductivity intermediate between a conductor and an insulator. The application of semiconductors in vehicles ranges from chassis, power electronics, safety, body electronics, and comfort or entertainment units, among others.
• Automobiles are an essential element of people's life because they are the primary form of transportation today. There are currently over 1.3 billion motor cars on the road worldwide, which is predicted to climb to 1.8 billion by 2035. Passenger automobiles account for around 74% of these figures, with light commercial vehicles and large trucks, buses, coaches, and mini-buses accounting for the remaining 26%.
• The technologies in automotive safety and security system have undergone a significant change in recent years, from seat headrests to adaptive cruise control systems. The rising wave of advanced technologies, such as blind-spot detection, drowsiness monitoring system, lane departure warning system, head-up display, night vision systems, park assist, e-call telematics, and tire-pressure-monitoring system technologies, are creating a significant potential for safety and security systems to protect the driver and passengers from serious injuries during a vehicle crash.
• A growing number of affordable vehicles feature advanced infotainment, safety, performance, and fuel efficiency. Such features lead to the inclusion of various components leading to an increase in the price raise of the overall vehicle. Thousands of semiconductor chips are at the core of automobiles today, acting as the vehicle's eyes, ears, and brain, monitoring the environment, making choices, and regulating actions. According to the Semiconductor Industry Association, modern automobiles may have 8,000 or more semiconductor chips and over 100 electronic control units, which currently account for more than 35% of total vehicle cost and are predicted to exceed 50% by 2025 to 2030.
• The COVID-19 caused an immediate halt in existing manufacturing, impacting supply chains around the world. China, which was initially afflicted by the pandemic, lost over two-thirds of its vehicle manufacturing owing to the statewide lockdown, which significantly damaged the supply chain. Auto supply chains are frequently geographically dispersed; with each country imposing its own protocol following the pandemic, supply chain management took a significant hit, emerging as one of the most critical challenges confronting the automotive industry during COVID-19.

Automotive Semiconductor Market Trends

Heavy Commercial Vehicle Segment to Register Significant Growth

• The heavy commercial vehicle market is expected to register a significant CAGR during the projected period. With the introduction of modern technology, such as accident prevention systems, ADAS, efficient driving, and engine systems, and a focus on environmental sustainability and emission reduction, the demand for these large commercial vehicles is likely to increase in the future.
• Top manufacturers' technological advancements in heavy commercial vehicles are set to surge worldwide. A prominent trend characterizing the market's success has concentrated on accident prevention systems, automatic emergency braking systems, driver assistance, and blind-spot monitoring. Installing automated emergency braking systems and forward-collision warnings on heavy-duty vehicles may save more than 40% of rear-end incidents involving large trucks, according to research led by the Insurance Institute for Highway Safety (IIHS).
• According to the research, heavy-duty vehicles with front-crash prevention systems, such as automated emergency braking (AEB), had 12% fewer collisions, and forward-collision warning (FCW) had 22% fewer collisions. Consequently, the increasing demand for integrated ICs to make efficient automatic braking and driving systems is significantly driving the automotive semiconductor market worldwide.
• Under the new scrappage policy, governments in Asia-Pacific countries, like India, South Korea, and China, seek to push heavy-duty truck owners to acquire new heavy-duty trucks and other commercial vehicles, discouraging the use of old, polluting ones. The program would not only reduce pollution levels but also promote the advancements of the heavy-trucks segment in adopting integrated ICs, sensors , advanced microcontrollers, ADAS, and motor driver ICs, significantly influencing the growth of the market.
• To avoid paying high penalties for non-compliance with EU norms, several heavy-duty truck manufacturers in Europe have been investing in integrating novel technology to meet the zero-emission objective from 2025 onwards. The European Union has established carbon-neutrality goals and criteria for heavy-duty vehicles. These include a 15% decrease beginning in 2025 and increasing to 30% by 2030, with zero emissions by 2050.
• According to OICA, heavy commercial vehicle production in 2021 decreased by 1.51% compared with 2020 commercial vehicle production. Before the delta version caused a severe supply issue, chip producers, mostly in Asia, had ramped up manufacturing through the second half of 2021. Overall, the market is recovering after the pandemic.

Asia-Pacific to be the Fastest Growing Region

• The Asia-Pacific automotive semiconductor market is fueled by increased automotive manufacturing and continued partnerships between automotive OEMs and semiconductor manufacturers. Cost and fuel efficiency are no longer the most important factors to consider when buying an automobile; instead, the comfort and luxury offered by the vehicle are more important.
• This may be attributed to the fact that global automobile manufacturers are seeing strong demand for luxury and semi-luxury vehicles, which is pressuring them to install more electronic components, pushing the Asia-Pacific automotive semiconductors market. As a result of this reason, the Asia-Pacific automotive semiconductor industry offers a potential market area.
• The rapid expansion of the Asia-Pacific automotive semiconductor industry is expected to be fueled by the rising demand for electric vehicles. Automobile manufacturers must continue to innovate, create, and develop self-driving cars, which have already attracted a significant number of customers in key automotive manufacturing countries.
• The growth trajectory of fully-autonomous automobiles is expected to be heavily influenced by several factors, including technology advancements, consumer willingness to accept fully-automated vehicles, pricing, and suppliers' and OEMs' capacity to address major concerns about vehicle safety.
• According to the automobile industry, two-wheelers, three-wheelers, and tractors are in great demand across the country. In addition, India has a strong semiconductor R&D infrastructure, which may open up new potentials for the automotive semiconductor market in India in the future. Further, the government is taking various initiatives to boost the supply of semiconductor chips in the country. For instance, in September 2022, the Indian government announced to provide uniform fiscal support of 50% of the project cost for setting up semiconductor fabrication plants to boost semiconductor manufacturing in the country.

Automotive Semiconductor Market Competitive Analysis

The automotive semiconductor market is fragmented due to the presence of major players like NXP Semiconductor NV, Infineon Technologies AG, Renesas Electronics Corporation, STMicroelectronics NV, and Toshiba Electronic Devices& Storage Corporation (Toshiba Corporation) among others. Players in the market are adopting strategies such as partnerships, mergers, collaborations, innovations, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

In August 2022, Onsemi opened a silicon carbide (SiC) facility in Hudson, New Hampshire. The facility is expected to increase the company's production capacity by five times yearly and almost quadruple the number of employees in Hudson by the end of 2022.

In July 2022, NXP Semiconductors NV collaborated with Foxconn for a new generation of intelligent connected vehicles. The primary focus of the expanded collaboration is aimed at Foxconn's efforts in electric vehicle (EV) platforms, leveraging NXP's system expertise and comprehensive electrification portfolio, from NXP S32 processors to analog-front-end, drivers, networking, and power products. The collaboration would leverage NXP's portfolio of automotive technologies and its longstanding expertise in safety and security to enable architectural innovation and platforms for electrification, connectivity, and safe automated driving.

In June 2022, Renesas Electronics Corporation partnered with Cyberon Corporation to provide voice user interface (VUI) solutions for customers using Renesas' entire RA MCU line. The customers would get complimentary access to Cyberon's command-based VUI toolchain, enabling them to add voice recognition to various endpoint applications in home appliances, building automation, industrial automation, wearables, and many more.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Consumers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Intensity of Competitive Rivalry
  • 4.2.5 Threat of Substitute Products
• 4.3 Industry Value Chain Analysis
• 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Increasing Vehicle Production
  • 5.1.2 Rising Demand for Advanced Safety and Comfort Systems
• 5.2 Market Restraints
  • 5.2.1 Higher Cost of Advanced Featured Vehicles

6 MARKET SEGMENTATION

• 6.1 By Vehicle Type
  • 6.1.1 Passenger Vehicle
  • 6.1.2 Light Commercial Vehicle
  • 6.1.3 Heavy Commercial Vehicle
• 6.2 By Component
  • 6.2.1 Processors
  • 6.2.2 Sensors
  • 6.2.3 Memory Devices
  • 6.2.4 Integrated Circuits
  • 6.2.5 Discrete Power Devices
• 6.3 By Application
  • 6.3.1 Chassis
  • 6.3.2 Power Electronics
  • 6.3.3 Safety
  • 6.3.4 Body Electronics
  • 6.3.5 Comforts/Entertainment Unit
  • 6.3.6 Other Applications
• 6.4 By Geography
  • 6.4.1 North America
  • 6.4.2 Europe
  • 6.4.3 Asia-Pacific
  • 6.4.4 Latin America
  • 6.4.5 Middle East and Africa

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 NXP Semiconductor NV
  • 7.1.2 Infineon Technologies AG
  • 7.1.3 Renesas Electronics Corporaton
  • 7.1.4 STMicroelectronics NV
  • 7.1.5 Toshiba Electronic Devices & Storage Corporation (Toshiba Corporation)
  • 7.1.6 Texas Instrument Inc.
  • 7.1.7 Robert Bosch GmbH
  • 7.1.8 Micron Technology
  • 7.1.9 Onsemi (Semiconductor Components Industries LLC)
  • 7.1.10 Analog Devices Inc.
  • 7.1.11 ROHM Co. Ltd

8 INVESTMENT ANALYSIS

9 FUTURE TRENDS