切割设备市场增长、趋势、COVID-19 的影响、预测2023-2028

在预测期内，切割设备市场预计将以 7.4% 的复合年增长率增长。

推动切割设备市场增长的主要因素是对智能卡、RFID 技术和汽车电源 IC 不断增长的需求。 由于消费电子市场的扩大以及小型化和技术转型的趋势，市场供应商增加了用于小型化和性能改进的研发支出，而随着 MEMS(微机电系统)和 3D 的出现，这种联繫正在推动需求用于切丁机。

主要亮点

• 在电子产品製造中，IC(集成电路)封装是半导体设备製造的最后阶段，其中一小块半导体材料封装在支撑壳中以防止物理损坏和腐蚀。 电子设备的封装正变得更加节约资源，并被用于多种用途。
• 封装尺寸的减小与功耗成反比。 因此，市场参与者正在努力开发能够在小型化的同时保持功率的半导体。 例如，NXP Semiconductors 的 MaxQFP 封装以更小的封装提供相同的 I/O。 比较 16*16mm 172MaxQFP 和 24*24mm 176LQFP，据说实现了约 55% 的占位面积减少。
• 此外，由于消费者对始终在线连接的需求，汽车和车辆中的电子元件数量正在增加，尤其是在混合动力和电动汽车中。 例如，根据国际能源署 (IEA) 的数据，电动汽车的销量几乎翻了一番，达到 660 万辆。 汽车行业在未来十年内推出自动驾驶汽车和电动汽车的动力也在推动所研究市场的增长。
• 大多数 RFID 都嵌入到一些消费电子产品和 ID 解决方案中，例如 ID 标籤和智能卡，最终用户需要超光滑的表面和更薄的晶圆以无缝集成到这些设备中。要求越来越高。 这种背景，加上对企业ID管理解决方案和汽车远程信息处理等RFID应用的强劲需求，将进一步推动对薄晶圆的需求，预计将在预测期内带动切割设备的正增长。
• 刀片切割是 MEMS 和半导体技术中用于将硅晶圆分离成单个芯片和器件的最广泛使用的工艺。 此外，刀片切割已作为一种低成本切割技术在许多应用中被采用，预计这将在预测期内提振需求。
• 但随着微型化的进展，图案的复杂度增加，製造过程中出现功能性缺陷的可能性增加。
• COVID-19 及其引发的经济动盪导致多个国家/地区的整体经济下滑，商业和贸易大幅下滑。 半导体和晶圆市场也不例外，收入、生产和扩张都受到疫情的严重影响，切割设备市场也受到类似的影响。 然而，随着半导体製造商专注于增加产能以满足市场需求，预计所研究的市场将遵循类似的轨迹。

切粒机市场趋势

刀片切割占有较大份额

• 晶圆切割是一种将晶圆上的单个硅芯片(芯片)分开的设备。 切割过程以机械方式切掉芯片之间的多余空间(称为切割道或划线)。 目前主流是切割直径为200mm或300mm的硅片，0.05mm见方的切割也在考虑中。 该标准使用金刚石刀片将工业钻石隐藏在树脂中。 切割硅片时，刀片厚度从 20m 到 35m 不等，具体取决于目标材料。
• 精度和可控性在晶圆切割过程中非常重要。 晶圆基板被送入切割刀片的速度决定了整个过程的产量和生产率。 因此，大多数行业都需要高速、高切割的划片机，以提高生产率并降低成本。
• 有多家供应商提供切割刀片。 例如，SIMAC 提供用于晶圆切割、CSP、BGA、GaAs、GaP、LED 封装分割、化合物半导体、陶瓷、玻璃、晶体和其他材料的切割刀片。
• 金刚石刀片通常用于需要持续供应冷却液的切割机。 因此，需要持续供应冷却液并获得均匀的切割质量。 由于喷嘴堵塞、喷嘴调整变化和刀片质量等不可控原因，可能会出现偏差。 因此，需要一种统计方法来连续监测叶片扭矩。 在线监测划片机性能对于确保工艺稳定性至关重要。
• 半导体芯片需求的增加预计会对刀片切割设备的需求产生积极影响。 例如，据SEMI(国际半导体设备与材料)统计，全球硅晶圆出货总面积已达141.65亿平方英寸。

亚太地区占据很大的市场份额

• 在过去几十年中，半导体行业经历了巨大的发展，中国大陆和台湾等国家/地区逐渐成为主要的半导体製造商。 台积电、三星、SK海力士等都是该地区半导体芯片的顶级製造商。
• 中国被认为是世界上增长最快的半导体市场之一。 由于对智能手机和其他消费电子产品的高需求，许多厂商已在中国设立生产基地。 中国政府的中国製造倡议等举措势头强劲，国际企业在当地建立生产基地的关注度也越来越高。
• 根据半导体行业协会 (SIA) 的预测，到 2024 年，中国半导体行业的年收入将达到 1160 亿美元，约占全球市场份额的 17.4%。
• 此外，中国宣布在代工厂、氮化镓 (GaN) 和碳化硅 (SiC) 市场开展新的大规模晶圆厂开发活动，以发展国内半导体产业。 据 SEMI 称，全球芯片製造商将在 2021 年开始建设 19 座新晶圆厂，併计划在 2022 年再建 10 座。
• 日益严重的芯片短缺和不断增长的需求也鼓励其他国家率先推动本国半导体产业的发展。 例如，印度政府采取了多项举措来发展电子製造集群。 去年 12 月，电子和信息技术部 (MeitY) 批准了一项全面的 PLI 计划，在未来六年内为半导体和显示器製造商提供价值 92 亿美元的激励措施。

切割设备市场竞争分析

切割设备市场竞争激烈，由几家大公司组成。 其中，市场份额增长尤为明显的是那些专注于扩大海外客户群的公司。 他们利用创新来提高知名度、市场份额和盈利能力。 进入市场的主要参与者包括 Suzhou Delphi Laser、ASM Laser Separation International (ALSI) BV 和 Neon Tech。

2022 年 6 月，晶圆切割锯製造商 SR Inc. 宣布计划重点扩大其晶圆切割锯业务。 作为其中的一部分，该公司正专注于为三星电子提供大量用于相机模块的切割机。 我们还将专注于进军新领域。

2021年10月，Northrop Grumman，一家切割、后端晶圆后处理能力、士兵凸块、钝化、先进检测和测试解决方案的供应商，进一步建立国防应用的晶圆后处理和测试来源，扩大我们的立足点在国防微电子系统领域。

其他福利

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第1章介绍

• 研究假设和市场定义
• 调查范围

第2章研究方法论

第 3 章执行摘要

第 4 章市场洞察

• 市场概览
• 产业吸引力 - 波特五力分析
  • 供应商的议价能力
  • 消费者的议价能力
  • 新进入者的威胁
  • 竞争公司之间的敌对关係
  • 替代品的威胁
• 工业价值链分析
• 评估 COVID-19 对切割设备市场的影响

第 5 章市场动态

• 市场驱动因素
  • 技术进步，下一代设备的发展
• 市场挑战
  • 大规模生产的挑战

第 6 章市场细分

• 通过切割技术
  • 刀片切割
  • 激光消融
  • 等离子切割
• 通过申请
  • 逻辑记忆
  • MEMS 设备
  • 功率器件
  • CMOS 图像传感器
  • 无线射频识别
• 区域信息
  • 中国
  • 台湾
  • 韩国
  • 北美
  • 欧洲
  • 世界其他地方

第7章划片机潜在主要客户名单

第八章竞争格局

• 公司简介
  • Suzhou Delphi Laser Co. Ltd
  • SPTS Technologies Limited (KLA Tencor Corporation)
  • ASM Laser Separation International(ALSI)BV
  • Tokyo Seimitsu Co. Ltd
  • Neon Tech Co. Ltd
  • Nippon Pulse Motor Taiwan(NPM)Group
  • Panasonic Corporation
  • Plasma-Therm LLC

第9章 投资分析

第10章 投资分析市场的将来展望

The Dicing Equipment Market is expected to grow by registering a CAGR of 7.4% over the forecast period. The primary factors driving the growth of the dicing equipment market are the increasing demand for smart cards, RFID technology, and automotive power ICs. The increasing consumer electronics market and the inclination toward miniaturization and technology migration has forced market vendors to increase R&D expenditure to reduce the size and improve performance, leading to the emergence of micro-electro-mechanical systems (MEMS) and 3D packaging, which in turn is driving the demand for dicing equipment.

Key Highlights

• In electronics manufacturing, IC (integrated circuit) packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The increasing efforts to make electronic packaging highly resourceful have amplified usage in myriad applications.
• The reduction in package size is inversely proportional to the power dissipation. Therefore, players in the market strive to develop semiconductors that can retain power with reduced size. For instance, NXP Semiconductors' MaxQFP package delivers the same I/O in a smaller footprint. While comparing 16x16 mm 172 MaxQFP to 24x24 mm 176 LQFP, the company claims a reduction of about 55% in footprint.
• Furthermore, the increasing number of electronic components in vehicles or automobiles is a key driver, particularly in hybrid and electric cars, due to the consumer demand for constant connectivity. For instance, according to the International Energy Agency (IEA), the sales of electric vehicles nearly doubled, reaching 6.6 million. The automotive industry's push to deliver autonomous and electric vehicles in the next decade is also driving the growth of the market studied.
• With most RFIDs being integrated into several consumer electronics and identity solutions, such as identification tags and smart cards, end users increasingly demand ultra-smooth surfaces and thinner wafers to incorporate them seamlessly into these devices. Such scenarios, coupled with the strong demand for RFID applications, such as enterprise identity management solutions and automobile telematics, are expected to create more demand for thin wafers, thus providing positive growth for dicing equipment during the forecast period.
• Blade dicing has been the most widely used process in separating silicon wafers into individual chips/devices, both in MEMS and semiconductor technologies. It is also the low-cost dicing technology in many applications, which is expected to drive its demand during the forecast period.
• However, with the miniaturization trend becoming prevalent, the complexity of patterns has increased significantly, increasing the chances of functional defects in manufacturing processes which is among the major factors challenging the growth of the studied market.
• COVID-19 and the economic disruption caused by it resulted in the overall decline in the economies of several nations and a drastic fall in business and trade. The semiconductor or wafer market was no exception and suffered major falls in revenue, manufacturing, and expansion due to the pandemic, which had a similar impact on the dicing equipment market. However, with the semiconductor manufacturers focusing on expanding their production capabilities to match the market demand, the studied market is also expected to follow a similar trajectory.

Dicing Equipment Market Trends

Blade Dicing to Hold Significant Market Share

• Wafer dicing separates individual silicon chips (die) from one another on a wafer. The wafer is mechanically sawed in the excess spaces between the dies during the dicing process (often referred to as either dicing streets or scribe lines). Mainstream cutting of silicon wafers with a diameter of 200mm or 300mm is currently conceivable, as is a 0.05mm square cut. The standard uses a diamond blade to hide the industrial diamond in the resin. When cutting the silicon wafer, the blade thickness varies depending on the subject material and ranges from 20 m to 35 m.
• The precision and control capabilities of the wafer dicing process are critical. The yield and productivity of the entire process are determined by the rate at which the wafer substrate is fed into the cutting blade. Most industries, therefore, require high-speed, high-cutting dicing machines, which can increase the throughput rate and lower the cost.
• There are several vendors offering dicing blades. For instance, SIMAC offers dicing blades for Wafer Dicing, CSP, BGA, GaAs, GaP, LED Package singulation, compound semiconductors, ceramics, glass, crystals, and other materials.
• Diamond blades are commonly used in dicing machines, which require a constant supply of coolant. Only in this manner can a uniform cut quality be achieved. Deviations can be caused by uncontrollable causes such as nozzle clogging, nozzle adjustment changes, and blade quality. As a result, a statistical technique is required to monitor blade torque continuously. To ensure process stability, online monitoring of dicing machine performance is critical.
• The increasing demand for semiconductor chips is expected to positively impact the demand for blade dicing equipment. For instance, according to Semiconductor Equipment and Materials International (SEMI), the total area of silicon wafers shipped globally reached 14,165 million square inches.

Asia-Pacific to Hold a Major Market Share

• In the last few decades, the semiconductor industry witnessed tremendous growth, with countries like China and Taiwan emerging among the leading semiconductor manufacturers. TSMC, Samsung, SK Hynix, etc., are among the region's top manufacturers of semiconductor chips.
• China is considered one of the world's fastest-growing semiconductor markets. Significant demand for smartphones and other consumer electronics devices encourages many vendors to set up production establishments in the country. Increasing initiatives, such as 'Made in China' by the Chinese government, are increasingly drawing attention from international players to set up local production establishments.​
• According to the Semiconductor Industry Association (SIA) forecasts, the Chinese semiconductor industry could generate USD 116 billion in annual revenue by 2024, capturing about 17.4% of the global market share.
• Furthermore, China also announced a new and enormous fab development campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets, among other steps, to advance its domestic semiconductor industry. According to SEMI, chipmakers worldwide were scheduled to begin construction on 19 new fabs in 2021, with another ten planned for 2022.
• The ongoing chip shortage and the growing demand have also encouraged other countries to take the initiative to promote local semiconductor industry. For instance, the government of India took several initiatives to develop its electronics manufacturing cluster. In December last year, the Ministry of Electronics and Information Technology (MeitY) approved a comprehensive PLI scheme involving incentives worth USD 9.2 billion for semiconductor and display manufacturers to be distributed over the next six years.

Dicing Equipment Market Competitive Analysis

The dicing equipment market is competitive and consists of several major players. These players, with a prominent share of the market, are focused on expanding their customer base across foreign countries. They leverage innovations to increase their recognition, market share, and profitability. Some major players operating in the market include Suzhou Delphi Laser Co. Ltd, ASM Laser Separation International (ALSI) BV, and Neon Tech Co. Ltd, among others.

In June 2022, SR, a wafer dicing saw machine maker, announced its plans wherein the company would focus on expanding the wafer dicing saw machine business. As part of its expansion plans, the company focused on supplying many saws to Samsung Electronics to dice camera modules. The company would also focus on expanding its presence to new sectors.

In October 2021, Northrop Grumman, the provider of dicing, backend wafer post-processing capabilities, soldier bumping, passivation, advanced inspection, and test solution, established wafer post-processing and test source tailored for defense applications further to expand its footprint into the defense microelectronics systems sector.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers​
  • 4.2.2 Bargaining Power of Consumers​
  • 4.2.3 Threat of New Entrants​
  • 4.2.4 Intensity of Competitive Rivalry​
  • 4.2.5 Threat of Substitutes​
• 4.3 Industry Value Chain Analysis
• 4.4 Assessment of the Impact of COVID-19 on the Dicing Equipment Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Technological Advancements, and Evolution of Next Generation Devices
• 5.2 Market Challenges
  • 5.2.1 Mass Manufacturing Challenges

6 MARKET SEGMENTATION

• 6.1 By Dicing Technology
  • 6.1.1 Blade Dicing
  • 6.1.2 Laser Ablation
  • 6.1.3 Plasma Dicing
• 6.2 By Application
  • 6.2.1 Logic & Memory
  • 6.2.2 MEMS Devices
  • 6.2.3 Power Devices
  • 6.2.4 CMOS Image Sensor
  • 6.2.5 RFID
• 6.3 By Geography
  • 6.3.1 China
  • 6.3.2 Taiwan
  • 6.3.3 South Korea
  • 6.3.4 North America
  • 6.3.5 Europe
  • 6.3.6 Rest of the World

7 POTENTIAL LIST OF KEY CUSTOMERS FOR DICING EQUIPMENT

8 COMPETITIVE LANDSCAPE

• 8.1 Company Profiles
  • 8.1.1 Suzhou Delphi Laser Co. Ltd
  • 8.1.2 SPTS Technologies Limited (KLA Tencor Corporation)
  • 8.1.3 ASM Laser Separation International (ALSI) BV
  • 8.1.4 Tokyo Seimitsu Co. Ltd
  • 8.1.5 Neon Tech Co. Ltd
  • 8.1.6 Nippon Pulse Motor Taiwan (NPM) Group
  • 8.1.7 Panasonic Corporation
  • 8.1.8 Plasma-Therm LLC

9 INVESTMENT ANALYSIS

10 FUTURE OUTLOOK OF THE MARKET