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市场调查报告书
商品编码
1190711

导电胶市场 - 增长、趋势、COVID-19 影响和预测 (2023-2028)

Electrically Conductive Adhesives Market - Growth, Trends, and Forecasts (2023 - 2028)
出版日期: | 出版商: Mordor Intelligence | 英文 150 Pages | 商品交期: 2-3个工作天内

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简介目录

预计在 2022 年至 2027 年的预测期内，全球导电胶市场的复合年增长率将低于 6%。

COVID-19 大流行对市场产生了负面影响。 但是，现在估计市场已达到大流行前的水平。

*推动市场的主要因素是电力电子领域应用的扩展。

*在预测期内，电力电子产品中越来越多地使用单组分和两组分环氧粘合剂预计将推动市场增长。

*亚太地区预计将主导全球市场，其中最大的消费来自中国、日本和印度。

导电胶市场趋势

环氧树脂部分主导市场

*导电胶是含有纯银、铜、铝、铁等填料成分的粘合剂，具有优异的导电性、优异的附着力和优异的物理强度。

*用于需要热固化和热焊接的电路组装应用和工艺。

*Epoxy 系列导电胶广泛应用于触控面板、涂层、RFID 芯片接合和 LED 安装等各种应用领域。

*这些粘合剂可实现与传统焊接类似的电气连续性，无需热应力，并且可以粘附到许多焊料无法粘附的导电聚合物上。

*环氧树脂具有保质期长、常温保存、固化温度低等优点，比其他类型更通用。

*预计2022年消费电子市场收入将达到15066.93亿美元。 2022-2026 年的复合年增长率预计为 1.82%。

*因此，基于上述因素，环氧树脂部分有望在预测期内主导市场。

亚太地区引领市场

*预计在预测期内，全球导电胶市场将由亚太地区主导。 由于中国、印度和日本等国家的高需求，导电粘合剂市场正在增长。

*最大的导电胶生产商位于亚太地区。 生产导电粘合剂的领先公司包括 Henkel AG & Co. KGaA、3M、Dow、Aremco 和 HB Fuller Company。

*中国的“中国製造2025”政策设定了具体目标，即到2020年将集成电路生产的自给率提高到40%，到2025年提高到70%。 因此，预计未来导电胶在电路芯片上的应用范围将会扩大。

*此外，在东盟国家，电子元件製造商正在积极投资生产设施。

*这些因素以及政府的支持预计将主导亚太地区的全球市场。

导电胶市场竞争分析

全球导电胶市场是分散的，大多数参与者只占有很小的市场份额。 主要公司包括 Henkel AG & Co. KGaA、3M、Dow、Permabond.com 和 HB Fuller Company。

其他好处

  • Excel 格式的市场预测 (ME) 表
  • 三个月的分析师支持

内容

第一章介绍

  • 调查先决条件
  • 调查范围

第二章研究方法论

第 3 章执行摘要

第四章市场动态

  • 司机
    • 扩大在电力电子领域的应用
    • 其他司机
  • 约束因素
    • 其他抑製剂
  • 工业价值链分析
  • 波特的五力分析
    • 新进入者的威胁
    • 买家的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争程度

第 5 章市场细分

  • 化学类型
    • 环氧树脂
    • 硅胶
    • 聚氨酯
    • 亚克力
    • 其他化学类型
  • 类型
    • 各向同性
    • 各向异性
  • 申请
    • 太阳能电池
    • 车载电子产品
    • LED 照明
    • 印刷线路板
    • 液晶显示器
    • 其他用途
  • 按地区
    • 亚太地区
      • 中国
      • 印度
      • 日本
      • 韩国
      • 其他亚太地区
    • 北美
      • 美国
      • 加拿大
      • 墨西哥
    • 欧洲
      • 德国
      • 英国
      • 法国
      • 意大利
      • 其他欧洲
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美洲
    • 中东和非洲
      • 沙特阿拉伯
      • 南非
      • 其他中东和非洲地区

第六章竞争格局

  • 併购、合资企业、合作、合同
  • 市场份额 (%)**/排名分析
  • 主要参与者采用的策略
  • 公司简介
    • 3M
    • Aremco
    • Creative Materials Inc.
    • Dow
    • HB Fuller Company
    • Henkel AG & Co. KGaA
    • HITEK Electronic Materials Ltd
    • Master Bond Inc.
    • MG Chemicals
    • Panacol-Elosol GmbH
    • Parker Hannifin Corp.
    • Permabond

第7章 市场机会未来动向

简介目录
Product Code: 69622

The electrically conductive adhesives market is expected to record a CAGR of less than 6% globally during the forecast period 2022-2027.

The COVID-19 pandemic had a negative impact on the market. However, the market is now estimated to have reached pre-pandemic levels.

* The major factor driving the market studied is increasing application in power electronics.

* Increasing applications of single-part and two-part epoxy adhesives in power electronics are expected to drive market growth during the forecast period.

* Asia-Pacific is expected to dominate the global market with the most significant consumption from China, Japan, and India.

Electrically Conductive Adhesives Market Trends

Epoxy Segment to Dominate the Market

* Electrically conductive adhesives are adhesives that have filler components like pure silver, copper, aluminum, or iron, which provide excellent electrical conductivity, superior adhesion, and good physical strength.

* These adhesives are used in circuit assembly applications and processes where heat curing or hot soldering can be altered.

* The epoxy segment of electrically conductive adhesives is widely used in various applications like touch panels, coating, and bonding RFID chips, mounting LEDs, and others.

* These adhesives provide electrical continuity similar to traditional soldering without the heat stress, and they adhere to many conductive polymers where adhesion with solder is not possible.

* Epoxy offers the advantages of extended shelf life, room temperature storage, and much lower cure temperatures, which is increasing its application compared to other types.

* Revenue from the consumer electronics market is likely to reach USD 1,056,693 million in 2022. The market is expected to observe a CAGR of 1.82% from 2022-2026.

* Hence, based on the aforementioned factors, the epoxy segment is expected to dominate the market over the forecast period.

Asia-Pacific Region to Dominate the Market

* Asia-Pacific is expected to dominate the global market for electrically conductive adhesives during the forecast period. Due to the high demand from countries like China, India, and Japan, the market for electrically conductive adhesives has been growing.

* The largest producers of electrically conductive adhesives are located in Asia-Pacific. Some of the leading companies for the production of electrically conductive adhesives are Henkel AG & Co. KGaA, 3M, Dow, Aremco, and HB Fuller Company.

* The "Made in China 2025" policy, incorporated by China, set specific targets to increase self-sufficiency in integrated circuits production to 40% in 2020 and 70% by 2025. This is expected to increase the scope of application for electrically conductive adhesives in circuit chips over the coming years.

* ASEAN countries have also been observing the influx of electronics producing companies investing in the region for production facilities.

* The aforementioned factors, coupled with government support, are expected to result in the Asia-Pacific region dominating the global market.

Electrically Conductive Adhesives Market Competitive Analysis

The global electrically conductive adhesives market is fragmented, with most players accounting for a marginal share in the market. Some of the major companies include Henkel AG & Co. KGaA, 3M, Dow, Permabond.com, and HB Fuller Company, among others.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Drivers
    • 4.1.1 Increasing Application in Power Electronics
    • 4.1.2 Other Drivers
  • 4.2 Restraints
    • 4.2.1 Other Restraints
  • 4.3 Industry Value Chain Analysis
  • 4.4 Porter's Five Forces Analysis
    • 4.4.1 Threat of New Entrants
    • 4.4.2 Bargaining Power of Buyers
    • 4.4.3 Bargaining Power of Suppliers
    • 4.4.4 Threat of Substitute Products
    • 4.4.5 Degree of Competition

5 MARKET SEGMENTATION

  • 5.1 Chemistry Type
    • 5.1.1 Epoxy
    • 5.1.2 Silicone
    • 5.1.3 Polyurethane
    • 5.1.4 Acrylic
    • 5.1.5 Other Chemistry Types
  • 5.2 Type
    • 5.2.1 Isotropic
    • 5.2.2 Anisotropic
  • 5.3 Application
    • 5.3.1 Solar Cells
    • 5.3.2 Automotive Electronics
    • 5.3.3 LED Lighting
    • 5.3.4 Printed Circuit Boards
    • 5.3.5 LCD Displays
    • 5.3.6 Other Applications
  • 5.4 Geography
    • 5.4.1 Asia-Pacific
      • 5.4.1.1 China
      • 5.4.1.2 India
      • 5.4.1.3 Japan
      • 5.4.1.4 South Korea
      • 5.4.1.5 Rest of Asia-Pacific
    • 5.4.2 North America
      • 5.4.2.1 US
      • 5.4.2.2 Canada
      • 5.4.2.3 Mexico
    • 5.4.3 Europe
      • 5.4.3.1 Germany
      • 5.4.3.2 United Kingdom
      • 5.4.3.3 France
      • 5.4.3.4 Italy
      • 5.4.3.5 Rest of Europe
    • 5.4.4 South America
      • 5.4.4.1 Brazil
      • 5.4.4.2 Argentina
      • 5.4.4.3 Rest of South America
    • 5.4.5 Middle-East and Africa
      • 5.4.5.1 Saudi Arabia
      • 5.4.5.2 South Africa
      • 5.4.5.3 Rest of Middle-East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
  • 6.2 Market Share (%)**/Ranking Analysis
  • 6.3 Strategies Adopted by Leading Players
  • 6.4 Company Profiles
    • 6.4.1 3M
    • 6.4.2 Aremco
    • 6.4.3 Creative Materials Inc.
    • 6.4.4 Dow
    • 6.4.5 HB Fuller Company
    • 6.4.6 Henkel AG & Co. KGaA
    • 6.4.7 HITEK Electronic Materials Ltd
    • 6.4.8 Master Bond Inc.
    • 6.4.9 MG Chemicals
    • 6.4.10 Panacol-Elosol GmbH
    • 6.4.11 Parker Hannifin Corp.
    • 6.4.12 Permabond

7 MARKET OPPORTUNITIES AND FUTURE TRENDS