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市场调查报告书
商品编码
1440237

表面黏着技术：市场占有率分析、产业趋势与统计、成长预测（2024-2029）

Surface Mount Technology - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

表面黏着技术市场规模预计到 2024 年为 61.4 亿美元，预计到 2029 年将达到 88.7 亿美元，在预测期内（2024-2029 年）增长 7.65%。复合年增长率为

表面贴装技术 - 市场

电子产业的快速成长、当前电子元件尺寸的缩小、软性印刷电路板的使用不断增加以及对电动车日益增长的兴趣是推动表面黏着技术兴起的一些主要因素。

主要亮点

  • 表面黏着技术预计在未来几年将获得越来越多的认可。该行业正在将重点从通孔技术转向表面黏着技术，因为它具有许多优点，包括减少元件数量、增加元件密度、提高机械性能以及更容易和更快的自动化组装。
  • 转换为表面黏着技术的主要优点是速度、成本效益和可靠性。所有这些优点在组装过程中都派上用场，因为製造过程被简化并且更容易执行。 SMT 是对传统引线元件的重大改进。印刷电路基板的 SMT 元件为传统引线元件提供了更快、更轻、更可靠的替代方案。此外，值得注意的是，製造商和设计人员已经能够透过在 PCB 中使用 SMT 元件来显着降低成本。
  • 电动车使用需求的不断增长正在增加电动车的销售和製造，为该市场提供了充满希望的成长机会。表面黏着技术因其卓越的抗衝击和振动机械效率而被用于製造电动车中使用的大部分电气元件。
  • 电路基板可以使用导电轨道和其他特征来机械支撑和电气连接电子元件。随着表面黏着技术的出现，PCB组装现在透过焊点完成，使得在发生故障时更容易从目标部件上移除备件和材料。以前，PCB 是使用固定组件方法创建的，这使得它们很难拆卸。
  • 大多数电子设备预计将变得更加紧凑，而 SMT 正在增加对实现这一目标的更小型单元的需求。然而，儘管这些设备不像旧设备那么笨重，但它们的组件密度更高，每个组件的连接数量也有所增加。这意味着电子产品可以比以往任何时候都更加先进和高效，同时保持外形尽可能紧凑。
  • 然而，SMT 不适合大型、高功率/高电压元件。此外，随着超细间距技术的进步，焊点尺寸不断缩小，SMD 的小尺寸可能会产生问题。最终，这意味着每个接头可用的焊料更少，这可能导致空隙和完整性问题。
  • 此外，市场也面临一些挑战。例如，SMT 比通孔安装需要更多关注细节。而且，SMT机器的投资成本非常昂贵。
  • COVID-19 的传播正在对全球和各国经济产生重大影响。许多最终用户产业都受到影响，包括电子製造业。大多数製造业工作都涉及工厂车间的工作，人们在车间密切接触地一起工作以提高生产力。市场正面临着用于建构电路基板的元件短缺的问题。随着许多零件製造商关闭营运或以最低产能运作，维持现有零件健康库存的能力已大大降低。运作SMT组装所需的许多 PCB 元件都是透过常规商业航空公司作为货物运输的。国际旅行限制导致航班取消、运输可能性减少和价格上涨。

表面黏着技术（SMT）市场趋势

被动元件持续大幅成长

  • SMT 允许小型被动元件组装，使电气设备便携且轻巧。进一步小型化的趋势主要集中在被动元件（电阻器和电容器），并且将支援尺寸为 400 x 200 毫米和 300 x 150 毫米的元件尺寸 01005 和 0201（公制）。因此，迫切需要进行研究来帮助产业将这些组件纳入产品设计中。
  • 此外，当SMT用于包括被动元件的PCB製造时，可以节省更多空间。此外，该技术允许在 PCB 上放置更多组件。 SMT 使 PCB 製造商能够製造更小、更复杂的基板。这些板用于製造先进的电气设备。
  • 表面黏着技术在 PCB 设计和材料方面提供了更大的弹性。此外，表面黏着技术被动电气元件直接焊接到 PCB 表面。因此，这赋予了 PCB 板很大的多功能性。
  • 然而，被动和互连电子声音元件市场受到了被动和互连声音元件复杂性不断增加、全球商品成本下降以及最近爆发的新型COVID-19感染疾病的不利影响。然而，在预计的时期内，资料中心对网路和储存设备的需求不断增长，对保全摄影机、工业应用中的机器人以及基于感测器的设备的需求将为表面黏着技术设备市场创造巨大的潜力。
  • 为了尽可能降低生产成本，必须使用高度机械的方法大规模生产电路基板。与电镀通孔插入程序相比，表面黏着技术(SMT) 具有提高封装密度、提高可靠性和降低被动元件成本的优点。 SMT 是低成本、高产量家电组装最常用的工艺，推动了市场扩张。
  • SMD 电容器和电阻器构成了大部分被动表面黏着技术元件。技术的进步使得製造和使用更小的部件成为可能，因此现在的标准尺寸更少。读数值明显低于大多数引线电阻器，因此在使用表面黏着技术电阻器时必须小心，以避免超过功率损耗水平。
  • 表面黏着技术电阻器和表面黏着技术电容器是两种最常用的元件。这些 SMD 电阻器和电容器采用微型矩形封装。每个大量生产的电子设备中都使用了数十亿个小型表面黏着技术电容器。表面黏着技术电容器通常采用小长方体的形式，其尺寸根据行业标准製作。 SMCD 电容器采用多种技术，包括多层陶瓷、钽、电解和较不常见的类型。

亚太地区预计将经历最快的成长

  • 亚太地区的表面黏着技术市场正在显着成长，这主要是由于该地区拥有各种 PCB 生产设施。中国有许多PCB生产设施。 AT&S最重要的生产部门位于上海，专注于多层PCB。这是因为该公司专注于中国大量的行动通讯客户。
  • 由于都市化、工业化的加速、对创新和高效技术的更大投资以及人均收入的增加，预计亚太地区在预测期内将出现增长，其中印度、中国和日本在增长中处于领先地位，并做出部分贡献。
  • 此外，由于技术进步和发展使客户能够使用智慧型手机和智慧电视上的指纹感应器等日益复杂的功能，亚太地区的消费性电器产品市场正在显着成长。为了满足对小型设备日益增长的需求，人们开发了占用更少空间的更小型电气元件。只有当设备的实体组件（例如 PCB）紧凑并且即使在组合多种功能时也能顺利工作时，这才有可能实现。创建电子设备非常复杂，特别是对于表面黏着技术而言，因为需要考虑许多因素。
  • 智慧型手机普及的上升使亚太地区成为全球最大的行动市场之一。这是由于人口成长和都市化加快。据 GSM 协会称，到 2025 年，预计超过五分之四的连接是智慧型手机。这一趋势预计将增加该地区消费性电器产品产品中表面黏着技术的采用。
  • 无线通讯标准的不断增加以及3G/4G网路需求的不断增长，正在增加电讯领域对SMT的需求。中国是世界上成长最快的经济体之一，该国的SMT市场预计将成长，这主要得益于大量的SMT製造公司。 SMT市场的成长也受到亚太地区汽车产业电动车发展的推动。
  • 此外，由于半导体行业的周期性成长回归以及在该地区运营的设备製造商的扩张，预计亚太地区的半导体製造设备市场将出现强劲成长。电子和半导体产业的发展，特别是在中国，可以归因于区域市场的扩大。中国、韩国和台湾电子製造地的建立增加了对SMT製程的需求。

表面黏着技术(SMT) 产业概览

表面黏着技术市场由多个全球和区域参与者组成，并在竞争激烈的市场领域中获得吸引力。市场适度分散，为新参与企业设置了较高的进入障碍。

  • 2022 年 7 月 - GJD 承诺投资新型顶级 Hanwha Techwin SM482 Plus表面黏着技术技术 (SMT) 机器。新机器将在电子组装过程中实现高速自动化，进一步提高效率并加速 GJD 碳排放对其收益的影响。
  • 2022 年 10 月 - Keystone Electronics 透过推出公制和英制螺纹版本，扩展了其超平坦表面黏着技术螺纹嵌件的产品系列。表面黏着技术嵌件现提供公制螺纹（M2.5、M3、M4）或英制螺纹（2-56、4-40、6-32）。特殊的包装和设计可以快速、轻鬆地将镀锡钢螺丝嵌件添加到印刷基板。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章 简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业价值链分析
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 消费者议价能力
    • 新进入者的威胁
    • 竞争公司之间的敌意强度
    • 替代品的威胁

第五章市场动态

  • 市场驱动因素
    • 对技术小型化的需求不断增长
    • 与其他技术相比，在 PCB 上钻孔所需的孔更少
  • 市场挑战
    • SMT不适用于大型、高功率、高电压元件或经常受到机械应力的元件
  • 新型冠状病毒感染疾病（COVID-19）对表面黏着技术市场的影响

第六章市场区隔

  • 按成分
    • 被动元件
      • 电阻器
      • 电容器
    • 主动元件
      • 电晶体
      • 积体电路
  • 按最终用户产业
    • 家用电器
    • 车
    • 工业电子
    • 航太和国防
    • 卫生保健
    • 其他最终用户产业
  • 按地区
    • 北美洲
    • 欧洲
    • 亚太地区
    • 世界其他地区（拉丁美洲、中东/非洲）

第七章 竞争形势

  • 公司简介
    • Fuji Corporation
    • Yamaha Motor Co. Ltd
    • Mycronic AB
    • ASM Assembly Systems GmbH &Co. KG
    • Panasonic Corporation
    • Nordson Corporation
    • Juki Corporation
    • Hanwha Group
    • Zhejiang Neoden Technology Co. Ltd
    • Electronic Manufacturing Services Group Inc.
    • Kasdon Electronics Limited

第八章投资分析

第九章市场机会与未来趋势

简介目录
Product Code: 71613

The Surface Mount Technology Market size is estimated at USD 6.14 billion in 2024, and is expected to reach USD 8.87 billion by 2029, growing at a CAGR of 7.65% during the forecast period (2024-2029).

Surface Mount Technology - Market

The exponential growth of the electronics industry, the shrinking of current electronic components, the increased usage of flexible printed circuit boards, and the growing interest in electric cars are some of the key drivers driving the rise of surface mount technology.

Key Highlights

  • In the upcoming years, surface mount technology is anticipated to experience increasing acceptance. Industries are shifting their preference from through-hole technology to surface mount technology as a result of its many benefits, including fewer components, better component density, improved mechanical performance, and easier and faster automated assembly.
  • The major key benefits of converting to surface mount technology, to put it simply, were speed, cost-effectiveness, and reliability. Because of the simpler production processes and easier execution, all these advantages are useful during the assembly process. SMT is a significant improvement over conventional leaded components. The SMT components in printed circuit boards provide a quicker, lighter, and more reliable substitute for the conventional leaded components. Additionally, it's important to note that manufacturers and designers have been able to significantly reduce costs by using SMT components in PCBs.
  • Electric car sales and manufacturing are increasing as a result of the rising demand for their use, offering this market promising growth opportunities. Because it offers superior mechanical efficiency under shock and vibration, surface-mount technology is used to manufacture the majority of the electrical components used in electric vehicles.
  • Using conductive tracks and other features, circuit boards can mechanically support and electrically link electronic components. With the advent of Surface Mount Technology technology, PCB assembly is now done by solder joints, making spare parts and materials easier to remove from the target parts in the event of failure. In the past, PCBs were created using a method that fixed the component and made it extremely challenging to disassemble.
  • Most of the electronics are expected to be more compact, and there is an increase in demand for smaller units, where SMT makes this possible. But even though these units are not as bulky as older devices, there is a much higher component density, as well as more connections per component. This means that electronics can be more advanced and efficient than ever before while the form factor is still as compact as possible.
  • However, SMT is not suited for any large, high-power/high-voltage parts. Also, the small size of SMDs can create issues in that the solder joint dimensions continue to become smaller as advances are made toward ultra-fine pitch technology. Ultimately, this means that less solder can be used for each joint, which can result in voiding and integrity issues.
  • Additionally, the market is faced with a few difficulties. For instance, SMT demands more meticulous attention to detail than through-hole installation would. Additionally, the cost of an SMT machine as an investment is very expensive.
  • The COVID-19 outbreak has had a considerable impact on the global and national economies. Many end-user industries have been affected, including those in electronics manufacturing. A large part of manufacturing includes work on the factory floor, where people are in close contact as they collaborate to boost productivity. The market is facing component shortages for building circuit boards. As many component manufacturers shut down or run at minimum capacity, the ability to keep a healthy stock of components on hand has been dramatically reduced. Many PCB components required for the operation of SMT assembly lines get shipped on regular commercial airlines as cargo. As flights have been canceled owing to international travel restrictions, shipping availability has diminished, and prices have escalated.

Surface Mount Technology (SMT) Market Trends

Passive Components to Hold Significant Growth

  • Smaller passive component assemblies made possible by SMT make electrical devices that are portable and lightweight possible. The trend toward further downsizing is focused mainly on passive components (resistors and capacitors), where component sizes of 01005 and 0201 (metric) with dimensions of 400 x 200 mm and 300 x 150 mm will be addressed. Due to this, there is a significant demand for research to assist the industry in incorporating these components into their product designs.
  • Moreover, when used in PCB manufacturing with passive components, SMT helps to save more space. Additionally, this technique allows for placing more components on a PCB. SMT has enabled PCB producers to create tiny and intricate boards. Advanced electrical gadgets are then produced using these boards.
  • Regarding PCB design and material, the surface mount technique offers more flexibility. Additionally, surface-mount passive electrical parts are soldered directly to the PCB surface. As a result, this gives PCB boards a lot of versatility.
  • However, the market for passive and connecting electronic sound components have been negatively impacted by the growing complexity of passive and interconnecting sound components, the decline in global commodity costs, and the most recent COVID-19 epidemic. But for the anticipated term, the growing need for networking and storage devices in data centers, demand for security cameras, robots in industrial applications, and sensor-based devices would create enormous potential for the Surface Mount Technology Equipment Market.
  • For the lowest possible production cost, it is essential to mass-produce electrical circuit boards in a very mechanical way. Surface mount technology (SMT) offers the advantages of increased package densities, greater reliability, and lower cost for the passive components than the plated through-hole insertion procedure. The most frequently utilized process for low-cost, high-production consumer electronic assemblies is SMT, which is fueling market expansion.
  • SMD capacitors and resistors make up the majority of passive surface mount components. As technology has made it possible to produce and use smaller components, there are now fewer standard sizes. Because the leading figures are substantially lower than most leaded resistors, caution must be taken when utilizing surface mount resistors to prevent power dissipation levels from being exceeded.
  • Surface-mount resistors and surface-mount capacitors are two of the most used components. These SMD resistors and capacitors are housed in tiny, small-format rectangular packages. Billions of small surface-mount capacitors are used in all mass-produced electronic devices. Surface mount capacitors often come in the form of tiny rectangular cuboids with dimensions created according to industry norms. Numerous technologies, including multilayer ceramic, tantalum, electrolytic, and some less popular types, may be utilized in SMCD capacitors.

Asia Pacific is Expected to Witness Fastest Growth

  • The market for surface mount technology is growing significantly in the Asia-Pacific region, mainly due to the presence of various PCB production facilities in the region. China is home to many PCB production facilities. AT&S's most significant production unit is located in Shanghai, focusing on multi-layer PCBs. This is because the company focuses on large volumes of mobile communications customers in China.
  • Due to increasing urbanization, industrialization, more significant investment in innovative & efficient technologies, and rising per capita income, the Asia Pacific area is anticipated to increase throughout the forecast period, with India, China, and Japan contributing the majority of the growth.
  • Additionally, the APAC region's consumer electronics market is growing significantly due to technological advancements and developments that give customers access to increasingly sophisticated features like fingerprint sensors in smartphones and smart televisions, among others. Smaller electrical components that take up less space have been developed in response to the growing need for downsized devices. This is only achievable if the device's physical components, such as the PCB, are compact and have smooth operation even when combining multiple features. Creating an electrical device is complex since numerous elements must be considered, especially with surface mount technology.
  • Increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world. This is due to increasing population growth and urbanization. As per the GSM Association, more than 4 out of 5 connections will be smartphones by 2025. This trend is expected to increase the adoption of surface mount technology among consumer electronics in the region.
  • The increasing wireless communication standards and the rising demand for 3G/4G networks are boosting the demand for SMT in the telecommunications sector. China is one of the world's fastest-growing economies, and its market for SMT is expected to grow primarily because of the vast number of SMT manufacturing companies. The growth of the SMT market is also driven by the development of electric vehicles in the automotive sector in the APAC region.
  • Additionally, due to the semiconductor industry's cyclical return of growth and the expansion of equipment manufacturers operating in the region, the Asia-Pacific semiconductor manufacturing equipment market is anticipated to have strong growth. The development of the electronics and semiconductor industries, particularly in China, can be blamed for the regional market expansion. SMT process demand rose due to the established electronics manufacturing hubs in China, South Korea, and Taiwan.

Surface Mount Technology (SMT) Industry Overview

The Surface Mount Technology market comprises several global and regional players, such as Fuji Machine Manufacturing Co., Ltd., Yamaha Motor Co., Ltd., Panasonic Corporation, Mycronic AB, etc., who are vying for attention in a contested market space. The market is moderately fragmented and poses high barriers to entry for new players.

  • July 2022 - GJD committed to an investment in a new top-of-the-range Hanwha Techwin SM482 Plus Surface Mount Technology (SMT) machine. The new machine will enable high-speed automation during the electronic assembly process and, additionally, drive efficiency and the bottom-line impact of GJD's carbon footprint.
  • October 2022 - Keystone Electronics expanded its product portfolio of ultra-flat surface mount thread inserts with the launch of metric and inch-threaded versions. The surface mount inserts are now available in metric thread (M2.5, M3, M4) or inch thread (2-56, 4-40, 6-32). The special packaging and design makes it quick and easy to add tin-coated steel thread inserts to printed circuit boards.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Bargaining Power of Suppliers
    • 4.3.2 Bargaining Power of Consumers
    • 4.3.3 Threat of New Entrants
    • 4.3.4 Intensity of Competitive Rivalry
    • 4.3.5 Threat of SubstituteProdcuts

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Rising Demand For Miniaturization of Technology
    • 5.1.2 Fewer Holes Required to Drill on PCBs Compared to Other Technologies
  • 5.2 Market Challenegs
    • 5.2.1 SMT is Unsuitable for Any Large, High-Power and High-Voltage Parts and Parts Undergoing Frequent Mechanical Stress
  • 5.3 Impact of COVID-19 on the Surface Mount Technology Market

6 MARKET SEGMENTATION

  • 6.1 By Component
    • 6.1.1 Passive Components
      • 6.1.1.1 Resistors
      • 6.1.1.2 Capacitors
    • 6.1.2 Active Components
      • 6.1.2.1 Transistors
      • 6.1.2.2 Integrated Circuits
  • 6.2 By End-user Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Automotive
    • 6.2.3 Industrial Electronics
    • 6.2.4 Aerospace and Defense
    • 6.2.5 Healthcare
    • 6.2.6 Other End-User Industries
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia-Pacific
    • 6.3.4 Rest of the World (Latin America and Middle East & Africa)

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Fuji Corporation
    • 7.1.2 Yamaha Motor Co. Ltd
    • 7.1.3 Mycronic AB
    • 7.1.4 ASM Assembly Systems GmbH & Co. KG
    • 7.1.5 Panasonic Corporation
    • 7.1.6 Nordson Corporation
    • 7.1.7 Juki Corporation
    • 7.1.8 Hanwha Group
    • 7.1.9 Zhejiang Neoden Technology Co. Ltd
    • 7.1.10 Electronic Manufacturing Services Group Inc.
    • 7.1.11 Kasdon Electronics Limited

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS