查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1436039

基板：全球市场占有率分析、产业趋势与统计、成长预测（2024-2029）

Global Substrate - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

预计2024年全球基板市场规模为41.3亿美元，预计2029年将达52.4亿美元，预测期间（2024-2029年）复合年增长率为4.88%。

全球主机板市场

COVID-19 的爆发扰乱了电子产业的供应链，阻碍了市场成长。由于可支配收入减少和消费者信心疲软，消费者选择购买食品和清洁用品等必需品，并避免大额购买穿戴式装置等非必需品。

主要亮点

  • COVID-19 大流行以及由此导致的半导体元件短缺震惊了全球经济和半导体产业。全世界和几乎所有经济部门首次受到影响，供应链中断将继续对今年及以后的产能产生负面影响。此外，COVID-19 的影响显着增加了对医疗监测设备的需求，各种合作伙伴关係促进了市场成长。
  • 柔性混合电子（FHE）是一种新的电子电路製造方法，结合了印刷电子和传统电子的优点。这种弹性和处理能力的结合是非常理想的，因为它可以减轻重量，实现新的外形尺寸，并保持资料记录和蓝牙连接等理想的功能。
  • 印刷基板（PCB）产业在过去几年中经历了显着成长，这主要是由于消费性电子产品的持续发展以及所有电子和电气设备对PCB的需求不断增加。
  • 消费性电子产品需要新的、不同的 PCB 功能。开发涉及 PCB 或与其相连的附件的形状。 PCB 板相机已显着发展，照片和视讯成像以及耐用性是主要改进领域。这些小型相机可以轻鬆捕捉高解析度影像和影片。车载相机准备在未来几年进一步发展，以创建强大的工业和消费性电子解决方案。
  • 按地区划分，台湾、日本、中国等亚太国家占据了PCB形势的较大份额。然而，台湾地区的PCB产量近年来一直在下降。根据台北印刷电路协会（TPCA）统计，台湾印刷基板市场曾经称霸全球，市场占有率非常大。假设政府创建了一个全球先进的 PCB 製造中心，并寻求 PCB 材料供应的自主权。那样的话，海湾很可能能够在未来三到五年内保持其技术优势。

基板市场趋势

工业用途在胎心率市场中占有很大份额

  • 相容FHE的软性机器人也在工业4.0时代被应用。机器人外骨骼旨在帮助失去运动技能的人恢復运动技能，并帮助移动和举起物体（例如板条箱、纸箱和盒子）以减少职场伤害，这是早期软性机器人。
  • FHE 最重要的应用之一是通讯，因为无线技术对于资料传输和系统控制 (IoT) 至关重要。 「物联网」(IoT) 一词指的是对日常生活抱持未来主义观点的新想法。它连接大量智慧型设备（嵌入感测器和资讯发送器）以实现机器对机器的通讯。这需要在无需人工干预的情况下频繁地向云端交换资料和更新，从而实现智慧家庭、智慧医疗、智慧城市、工业和交通系统等领域的成功创新。
  • FHE 的另一个应用领域是环境形势下的精密农业。研究人员使用基于几丁聚醣的墨水将柔性应变感测器直接列印到水果上。这些感测器对水果具有良好的附着力并识别机械损伤。石墨烯带可调谐感测器可以测量流经植物的水流量。此感测器的开发方法是将石墨烯薄膜滴在预先图案化的聚二甲基硅氧烷（PDMS）表面上，并将图案化的石墨烯表面转移到目标胶带上。
  • 另一个研究领域是开发具有多种感测功能的灵活可拉伸设备来监测植物健康状况。此外，所报告的植物穿戴式装置是透过整合温度、湿度和应变感测器来设计的。透过在 PDMS基板上沉积金金属薄膜开发了应变感测器。温度和湿度感测器是在同一灵活的 PI/PDMS 平台上製造的。
  • 多功能农业监测感测器已被开发用于测量应变、电阻、温度和光强度。该感测器采用 CMOS、可印刷电子装置和转印技术的组合製造，能够感知叶子的水合作用、温度、应变和光强度。与其他报告的感测器不同，这些可拉伸感测器可以与叶子一起生长，使其适合长期监测。

智慧消费电子和穿戴式装置需求的激增预计将推动 SLP 市场

  • 消费性电子主要包括智慧型手机、智慧手环、健身设备、穿戴式装置等。消费性电子产品需求的不断增长预计将为 SLP 市场参与者提供前景。消费性电子应用中功耗的增加需要电池变得更大，电路板变得更小。
  • 如果没有小而薄的 IC构装基板，智慧型手机就不会存在。小型、薄型 IC构装基板可实现多种电子设备以及连接所有设备的多层薄型 PCB 的功能。智慧型手机功能和电池容量的进步要求主机板更密、更小、更轻。据IBIDEN称，他们已经实现了使用MSAP（改进的半自适应工艺）的精细布线技术和使用填充通层迭结构的技术，该技术已经提供了传统的全通孔堆迭结构（FVSS）。
  • Yoon 表示，扇出晶圆级封装适用于高级产品中的高阶应用处理器，这些产品是手机商的旗舰智慧型手机型号。 SLP 专为手机主机板而设计，可减少此类组件所需的空间。手机中的细间距插槽通常使用球栅阵列或覆晶封装。
  • 软性电子产品通常由安装在聚酯或聚醚醚酮 (PEEK) 等软塑胶基板上的电路组成。为了确保电触点即使在多次弯曲循环后也保持完好，导电迹线必须由具有高疲劳强度的柔性金属或导电聚酯製成。这项任务的理想材料通常是聚合物。
  • 软性电子产品将透过健身追踪器、智慧型手錶和小型即时医疗监测设备等产品积极参与这个不断扩大的行业。由于每个人体的形状略有不同，软性电子产品特别适合这种环境。不再需要紧紧佩戴设备以确保接触，灵活的电子设备使感测器能够贴合皮肤的自然曲线。软性电子产品的最新研究重点是医疗应用。除了计步器和卡路里计数器之外，还开发了血压监测器、氧气监测器、血糖值监测器，甚至血液酒精监测器。
  • 随着科技的突飞猛进，高效、灵活的太阳能板可能成为现实。柔性太阳能电池板可以安装在屋顶支架以外的表面上，例如电线杆、井壳、栅栏柱和其他类似结构。
  • 此外，据报道，苹果供应商之一振鼎科技讨论了其对智慧型手机、穿戴式装置和其他需要超薄和轻量化外形的行动装置的 SLP 需求的愿景。 SLP 允许紧凑的设计而不牺牲运算效能。振鼎计划在其中国工厂内再建一条SLP生产线。

基板产业概况

全球基板市场高度分散。世界各地的製造商都依靠高密度互连 (HDI) PCB 等设计将更多硬体放入有限的空间。 HDI PCB采用高性能无芯结构。与传统 PCB 相比，它具有更高密度的走线、更小的雷射通孔、定位垫片以及其他功能。该行业的老牌企业利用其製造和研发能力来推动创新并保持市场竞争力。

  • 2022 年 10 月，PCB 接点功率元件製造商 Wurth Elektronik ICS 推出了新一代经过验证的无铅大电流接点。第二代PowerPlus，LF PowerPlus 2.0，具有相同的扭力和电流。 -与第一代相同的承载能力，但现在更容易加工且组装效率更高。凭藉 LF PowerPlus 产品系列，Wurth Elektronik ICS 为压接技术应用中的 PCB 接点提供可靠、有效的大电流接点。非常适合将元件固定或将电缆和组件连接到 PCB，特别是在需要高扭力或安装空间有限的情况下。
  • 2022 年 9 月，基于微波和射频的技术专家 TTM Technologies Inc. 的射频和特殊元件业务部门与射频 (RF) 和微波元件的主要纯分销商 RFMW 签署了分销协议。还有半导体。 TTM 将透过 RFMW 提供其全系列 RF&S 产品，包括着名的 Xinger 品牌产品线。识别和开发机会，提供技术销售支持，并将分销纳入分销服务。 RFMW网路商店也提供 TTM 组件。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章 全球PCB市场

  • 当前市场概览 - 趋势/动态/市场需求估计和预测
  • 推动市场成长的因素
  • PCB製造流程及技术需求
  • PCB 的技术进步（製造流程和材料的进步）
  • PCB所用材料及其规格/应用

第五章市场区隔

  • 按用途
    • 计算
    • 消费者
    • 工业/医疗
    • 通讯
    • 车
    • 军事/航太
  • 十大PCB厂商分析
  • 市场展望

第六章 全球 FHE 市场

  • 当前市场概览 - 趋势/动态/市场需求估计和预测
  • 推动市场成长的因素
  • FHE製造流程及技术要求
  • FHE 技术进步（製造流程和材料的进步）
  • FHE所使用的材质及其规格
  • FHE技术蓝图
  • 应用程式和用例
    • 汽车/航空
    • 穿戴式装置和医疗监控
    • 消费品
    • 工业/环境
    • 智慧包装和RFID
  • FHE 供应商分析
  • 市场展望

第七章 全球SLP市场

  • 当前市场概览 - 趋势/动态/市场需求估计和预测
  • 推动市场成长的因素
  • SLP製造工艺及技术要求
  • SLP 的技术进步（製造流程和材料的进步）
  • SLP所用材料及其规格
  • SLP技术蓝图
  • 市场区隔
    • 按用途
      • 消费性电子产品
      • 车
      • 通讯
      • 其他的
  • SLP供应商分析
  • 市场展望

第八章 全球SIP市场

  • 当前市场概览 - 趋势/动态/市场需求估计和预测
  • 推动市场成长的因素
  • SIP製造流程及技术要求
  • SIP 的技术进步（製造流程和材料的进步）
  • SIP所用材料及其规格
  • SIP技术蓝图
  • 市场区隔
    • 按用途
      • 通讯/基础设施（伺服器/基地台）
      • 汽车/交通
      • 行动消费者
      • 医疗/工业
      • 航太/国防
    • SIP供应商分析
    • 市场展望
简介目录
Product Code: 72251

The Global Substrate Market size is estimated at USD 4.13 billion in 2024, and is expected to reach USD 5.24 billion by 2029, growing at a CAGR of 4.88% during the forecast period (2024-2029).

Global Substrate - Market

Due to the COVID-19 outbreak, there was a disruption in the electronics industry's supply chain, which challenged market growth. With reduced disposable incomes and depressed consumer sentiment, consumers chose to buy necessities, like food and cleaning products, and avoid non-essential, big-ticket purchases, like wearable devices.

Key Highlights

  • The COVID-19 pandemic and the ensuing shortage of semiconductor components proved to be a shock to the global economy and the semiconductor industry; for the first time, the entire world and nearly all economic sectors were affected, and supply chain disruptions will continue to impact production capacities negatively even in and beyond the current year. Furthermore, due to COVID-19, the demand for healthcare monitoring devices increased significantly, and various partnerships have led to market growth.
  • Flexible hybrid electronics (FHE) is a novel electronic circuit manufacturing approach that combines the best of printed and conventional electronics. This combination of flexibility and processing capability is much desired since it reduces weight, enables new form factors, and maintains desirable functionality, such as data logging and Bluetooth connectivity.
  • The printed circuit board (PCB) industry has experienced significant growth in the last few years, primarily owing to the continuous development of consumer electronics devices and the increasing demand for PCBs in all electronics and electrical equipment.
  • Consumer electronics have been demanding new and different PCB functions. The development is related to the shape of the PCB or the accessory attached to it. PCB board cameras have developed significantly, with photo and video imaging and durability being the primary areas of improvement. These small cameras could take high-resolution images and videos with ease. Board cameras are poised to develop even further in the next few years, creating robust industry and consumer electronics solutions.
  • Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. However, PCB production in Taiwan has been on a declining trend for a few years. According to the Taipei Printed Circuit Association (TPCA), Taiwan's printed circuit board market briefly dominated the world with a large marginal market share. Suppose the government creates a hub for sophisticated PCB manufacture on a global scale and pursues autonomy in the supply of PCB materials. In that case, Taiwan can preserve its technological edge for the coming three to five years.

Substrate Market Trends

In FHR Market, Industrial to Account for a Significant Share in the Market

  • Also, FHE-enabled soft robots have found applications in the Industry 4.0 era. Robotic exoskeletons designed to give mobility back to those who have lost it and assist with moving and lifting objects (e.g., crates, cartons, and boxes) to reduce workplace injury are early soft robotic applications.
  • One of the most critical uses for FHE is in communication, as wireless technology is essential for data transmission and system control (IoT). The term "Internet of Things" (IoT) refers to an emerging idea that encompasses a futuristic perspective on everyday life. It connects a vast array of intelligent devices (embedded with sensors and information transmitters) to enable machine-to-machine communication, which necessitates frequent data exchange and updates to the cloud without human intervention, allowing successful innovation in areas like smart homes, smart healthcare, smart cities, industry, and transportation systems.
  • Another application area for FHE is precision agriculture in the environmental landscape. Researchers printed a flexible strain sensor directly on the fruits using chitosan-based ink. These sensors provided good adhesion to the fruit and identified mechanical injuries. A graphene-on-tape adjustable sensor can measure water flow through plants. The sensor is developed by dropping a graphene film on a pre-patterned polydimethylsiloxane (PDMS) surface and then transferring the patterned graphene surface onto a target tape.
  • Another research area is developing a flexible and stretchable device with multiple sensing capabilities for plant health monitoring. Further, the reported plant wearable is designed by integrating temperature, humidity, and strain sensors. The strain sensors were developed by depositing a thin gold metal film on the PDMS substrate. The temperature and humidity sensors were fabricated on the same flexible PI/PDMS platform.
  • A multifunctional agricultural monitoring sensor is being developed to measure strain, impedance, temperature, and light intensity. The sensor is fabricated by combining CMOS, printable electronics, and transfer printing techniques, leading to hydration, temperature, strain, and light illuminance sensing capabilities on leaves. Unlike other reported sensors, these stretchable sensors can grow with the leaves, making them compatible with long-term monitoring.

Surge in Demand for Smart Consumer Electronics and Wearable Devices is Expected to Drive the SLP Market

  • Consumer electronics mostly include smartphones, smart bands, fitness devices, and wearables. Increasing demand for consumer electronics is expected to provide prospects for players in the SLP market. Due to the increasing power consumption in consumer electronics applications, batteries need to get bigger, while boards need to get smaller.
  • Smartphones would not exist without the compact, thin IC packaging substrates Compact, thin IC packaging substrates enable multiple electronic devices to function, as does the multilayer, thin PCB that connects all the devices. The advancement of smartphone functions and battery capacity requires higher densities and smaller, lighter motherboards. According to IBIDEN, it has achieved a micro-wiring technology employing the Modified Semi-Adaptive Process (MSAP) and a technique using the filled-via stack-up structure they have been offering in conventional full-via stacked structures (FVSS).
  • According to Yoon, fan-out wafer-level packaging is for high-end application processors going into premium products, the flagship smartphone models for handset vendors. SLP is meant for the motherboard of phones, reducing the space needed for such assemblies. Ball grid arrays or flip-chip packages are typically used for fine-pitch slots in a phone.
  • Flexible electronics typically consist of electrical circuits installed on a flexible plastic substrate, such as polyester or polyether ether ketone (PEEK). For the electrical contact to remain intact even after numerous flexing cycles, the conductive traces must either be made of a flexible metal with high fatigue strength or conductive polyester. The ideal material for the job is often a polymer.
  • Flexible electronics will actively participate in this expanding industry with fitness trackers, smartwatches, and tiny, real-time medical monitoring devices. Since every human body is slightly distinct in shape, flexible electronics are especially well adapted to this environment. Instead of being compelled to wear equipment too tightly to ensure contact, sensors may now conform to the skin's natural curves thanks to flexible electronics. Medical applications have been the focus of recent research in flexible electronics. Blood pressure monitors, oxygen monitors, glucose meters, and even blood-alcohol meters are being created in addition to step counters and calorie counters.
  • Efficient, flexible solar panels might become a reality as technology progresses exponentially. Flexible solar panels can be installed on surfaces other than roof-mounted racks, such as telephone poles, well casings, fence posts, and other similar structures.
  • Furthermore, Zhen Ding Technology, reportedly among the suppliers of Apple, has discussed its vision of SLP demand for smartphones, wearables, and other mobile devices requiring an ultra-thin and lightweight profile. The use of SLP enables compact design without sacrificing computing performance. Zhen Ding plans to build additional SLP production lines at its factory site in China.

Substrate Industry Overview

The global substrate market is highly fragmented. Manufacturers globally have depended on designs, such as high-density interconnect (HDI) PCBs, to place more hardware in limited space. HDI PCBs use high-performance and coreless construction. Compared to traditional PCBs, they sport more densely packed wiring, miniaturized laser vias, capture pads, and other features. The industry's established players are leveraging their manufacturing capabilities and research and development capabilities to drive innovation and sustain their competitive position in the market.

  • In October 2022, the manufacturer of Powerelements for PCB contacting, Wurth Elektronik ICS, launched a new generation of its tried-and-true lead-free high-current contacts: the second PowerPlus generation, LF PowerPlus 2.0, has the same torque and current-carrying capacity as the first generation but is now even easier to process and more effective to assemble. Wurth Elektronik ICS provides reliable and effective high-current contacts for PCB contact in press-fit technology applications with the LF PowerPlus product family. They are perfect for fastening elements or attaching cables and components to the PCB, especially when high torques are needed or there is limited installation space.
  • In September 2022, TTM Technologies Inc.'s Radio Frequency & Specialty Components Business Unit, a microwave and RF-based technology specialist, signed a distribution agreement with RFMW, a pure play premier distributor for radio frequency ("RF") and microwave components and semiconductors. TTM will make available through RFMW the entirety of its line of RF&S goods, including its well-known Xinger brand product lineup. Opportunities will be identified and developed, technical sales support will be provided, and distribution will be included in the distribution services. The RFMW online store will also provide the TTM components.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 GLOBAL PCB MARKET

  • 4.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
  • 4.2 Factors Driving Market Growth
  • 4.3 PCB Manufacturing Process and Technical Requirements
  • 4.4 Technological Advancements in PCBs (Manufacturing Process and Materials Advancements)
  • 4.5 Materials Used for PCBs along with their Specifications and Applications

5 MARKET SEGMENTATION

  • 5.1 By Application
    • 5.1.1 Computing
    • 5.1.2 Consumer
    • 5.1.3 Industrial/Medical
    • 5.1.4 Communication
    • 5.1.5 Automotive
    • 5.1.6 Military/Aerospace
  • 5.2 Analysis of Top 10 PCB Vendors
  • 5.3 Market Outlook

6 GLOBAL FLEXIBLE HYBRID ELECTRONICS (FHE) MARKET

  • 6.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates & Projections
  • 6.2 Factors Driving the Market Growth
  • 6.3 FHE Manufacturing Process and Technical Requirements
  • 6.4 Technological Advancement in FHE (Manufacturing Process and Materials Advancements)
  • 6.5 Materials Used for FHEs along with their Specifications
  • 6.6 Technological Roadmap of FHE
  • 6.7 Applications and Use Cases
    • 6.7.1 Automotive and Aeronautical
    • 6.7.2 Wearable and Healthcare Monitoring
    • 6.7.3 Consumer Goods
    • 6.7.4 Industrial/Environmental
    • 6.7.5 Smart Packaging and RFID
  • 6.8 Analysis of FHE Vendors
  • 6.9 Market Outlook

7 GLOBAL SUBSTRATE LIKE PCB (SLP) MARKET

  • 7.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
  • 7.2 Factors Driving the Market Growth
  • 7.3 SLP Manufacturing Process and Technical Requirements
  • 7.4 Technological Advancement in SLP (Manufacturing Process and Materials Advancements)
  • 7.5 Materials Used for SLP with their Specifications
  • 7.6 Technological Roadmap of SLP
  • 7.7 MARKET SEGMENTATION
    • 7.7.1 By Application
      • 7.7.1.1 Consumer Electronics
      • 7.7.1.2 Automotive
      • 7.7.1.3 Communication
      • 7.7.1.4 Other Applications
  • 7.8 Analysis of SLP Vendors
  • 7.9 Market Outlook

8 GLOBAL SYSTEM-IN-PACKAGE (SIP) MARKET

  • 8.1 Current Market Overview - Trends/Dynamics/Market Demand Estimates and Projections
  • 8.2 Factors Driving the Market Growth
  • 8.3 SIP Manufacturing Process and Technical Requirements
  • 8.4 Technological Advancement in SIP (Manufacturing Process and Materials Advancements)
  • 8.5 Materials Used for SIP along with their Specifications
  • 8.6 Technological Roadmap of SIP
  • 8.7 MARKET SEGMENTATION
    • 8.7.1 By Application
      • 8.7.1.1 Telecom and Infrastructure (Servers and Base Stations)
      • 8.7.1.2 Automotive and Transportation
      • 8.7.1.3 Mobile and Consumer
      • 8.7.1.4 Medical and Industrial
      • 8.7.1.5 Aerospace and Defense
    • 8.7.2 Analysis of SIP Vendors
    • 8.7.3 Market Outlook