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市场调查报告书
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汽车MCU：全球市场占有率分析、产业趋势与统计、成长预测（2024-2029）

Global Automotive MCU - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 140 Pages | 商品交期: 2-3个工作天内

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简介目录

预计2024年全球汽车MCU市场规模为104.8亿美元，预估至2029年将达160.5亿美元，在预测期间（2024-2029年）成长至89.2亿美元，复合年增长率为%。

全球汽车MCU市场

人们对专为极端工作条件设计的设备的需求不断增加，即使在极端温度下也能提供即时响应和高可靠性，并融入功能安全特性以应对汽车设计挑战，导致市场正在被调查，预计将提供有利的机会为了成长。

主要亮点

  • 自动化程度的提高对负责车辆功能自动化操作的微控制器产生了巨大的需求。 MCU 在汽车中用于执行自动化功能，例如保持排气系统清洁、为各种车辆部件供电以及降低燃料消费量。此外，汽车电动催生了对电动车 (EV) 需求进行最佳化的新型专用 MCU 的需求。为了满足对电动车不断增长的需求，市场上的公司正在创新先进产品并投资大规模研发计划。
  • 例如，为了维持分区架构相关解决方案的发展势头，ST于2022年2月宣布推出了围绕32位元、300 MHz Arm Cortex-M7核心构建的软体定义EV优化解决方案。发布新产品Stellar E MCU。此 MCU 每个核心具有高达 2MB 的片上快闪记忆体和 16KB 的快取。作为 Stellar 系列的扩展，新的 MCU 旨在成为强大的集中式网域和区域控制器，简化区域架构车辆的设计和扩充性。新的 MCU 还旨在更轻鬆地控制碳化硅等宽能带隙电力电子装置，而碳化硅是电动车高效电力转换的主流。
  • 此外，2021年7月，电动车马达控制单元製造商Sterling G-Take eMobility宣布获得一家领先电动两轮车製造商价值6亿印度卢比的订单。该公司还表示，与 20 多家电动车 (EV) 製造商的讨论已进入后期阶段，为各种车辆类型（包括两轮和三轮小客车以及商用车）提供马达控制单元 (MCU)。 。
  • 与此同时，全球汽车产业正从 COVID-19 疾病造成的销售下滑中復苏，但新的危机正在阻碍其復苏。全球半导体短缺可能会扰乱全球汽车生产并推迟新车销售。微控制器是现代资讯娱乐系统、防锁死煞车系统（ABS）、高级驾驶辅助系统（ADAS）和其他电子稳定係统中使用的电控系统的关键组件，目前供应短缺，製造商被迫减少产量。因此，汽车製造商有选择地关闭工厂，直到短缺得到缓解。然而，预计市场在不久的将来将迅速发展。
  • 此外，汽车 MCU 加上其设计复杂性，可能在极端气候条件下发生故障，这可能会阻碍所研究市场的成长。

汽车微控制器市场趋势

ADAS 需求的激增可能会推动市场成长

  • 根据世界卫生组织 (WHO) 的数据，道路交通事故每年造成约 130 万人死亡，造成大多数国家国内生产总值(GDP) 约 3% 的损失。此外，根据 Safe International Road Travel 的数据，美国每年有超过 46,000 人死于道路交通事故。美国的交通死亡率为每 10 万居民 12.4 人死亡。另有 440 万人受重伤需要治疗。交通事故是美国1 至 54 岁人口死亡的主要原因。美国也是高所得国家中交通死亡人数最高的国家，比西欧、加拿大、澳洲和日本的同类国家高出约50%。
  • 配备 ADAS（高级驾驶员辅助系统）(ADAS) 的车辆能够侦测和分类道路上的物体，并根据路况对诱发因素发出警报。此外，这些系统还可以根据情况自动减慢车辆速度。重要的以安全为中心的 ADAS 应用包括行人侦测/避让、车道偏离警告/校正、交通标誌识别、自动紧急煞车、盲点侦测等。这些救生系统对于确保 ADAS 应用的成功至关重要。它支援最新的介面标准并执行多种基于视觉的演算法，以支援即时多媒体、视觉协同处理和感测器融合子系统。
  • 据美国国家安全委员会称，ADAS 技术每年有可能避免 20,841 人死亡，约占所有交通死亡人数的 62%。高阶驾驶辅助系统 (ADAS) 的出现正在改变设计人员使用、指定和製造微控制器 (MCU) 的方式。 ADAS 的不断发展和复杂性预计将为所研究的市场中的创新、协作和技术突破提供多种机会。
  • 例如，2022年4月，中国智慧汽车晶片设计公司芯驰科技发表了E3系列微控制器。汽车微控制器采用TSMC 22nm汽车级工艺，可用于许多汽车应用领域，特别是底盘线控、煞车控制、BMS、ADAS、液晶面板、HUD、串流系统、CMS。旨在达到高稳定性和安全水平。车辆规格为 AEC-Q100 Grade 1，功能安全标准为 ISO 26262 ASIL D。
  • 此外，2022 年 3 月，先进半导体解决方案供应商瑞萨电子宣布扩大与本田在先进驾驶辅助系统 (ADAS) 领域的合作伙伴关係。本田在本田 SENSING Elite 系统中采用了瑞萨电子的汽车系统晶片(SoC)“R-Car”和汽车微控制器“RH850”。 HondaSENSING Elite（安装于2021年3月发布的Legend）配备了支援自动驾驶3级（有限区域内有条件自动驾驶）的先进技术。此外，本田还选择R-Car和RH850用于全方位安全驾驶支援系统Honda SENSING 360。它建立在透过先前的技术研究和开发工作所获得的知识和专业知识的基础上。

预计亚太地区市场将高速成长

  • 日益严重的环境问题和不断增加的政府补贴计划，再加上燃油效率的提高、性能的提高和可负担性等因素，正在推动亚太地区混合动力电动车的普及。
  • 例如，根据 EV-Volumes.com 的数据，2021 年亚太全部区域销售了约 672,900 辆插电混合(PHEV)。与 2020 年相比，这一数字显着增加，2020 年售出约 264,260 辆插电式混合动力汽车。车辆已售出。对这些车辆的需求增加可能会推动该地区汽车 MCU 製造商的成长。
  • 此外，亚太地区已成为半导体和半导体设备製造的重要中心。例如，根据世界半导体贸易统计（WSTS）估算，2019年亚太地区（不含日本）半导体产业收益为2,578.8亿美元，2021年为2,908.5亿美元。该地区也是着名电子和汽车工业的所在地。因此，製造公司为所研究的市场的演变提供了空间。
  • 汽车系统设计的未来在于以车辆为中心、面向区域的 E/E架构，这增加了对汽车晶片的需求，以解决这些创新架构对未来几代汽车带来的挑战。该地区的公司正在推出先进的解决方案来满足消费者的需求。
  • 例如，2021 年 11 月，瑞萨电子公司（日本东京）推出了一款功能强大的全新微控制器 (MCU) 组 RH850/U2B MCU。用于不断发展的电气和电子 (E/E)架构的电控系统(ECU)。跨域 RH850/U2B MCU 集弹性、高性能、抗干扰性和安全性于一体，从高端角度来看，非常适合混合动力 ICE 和 xEV 牵引逆变器、连网型关以及车辆移动所需的苛刻工作负载.它是建造的。

汽车微控制器产业概况

全球汽车 MCU 市场适度分散，包括英飞凌科技股份公司、Microchip 科技公司、恩智浦半导体和德州仪器公司等知名厂商。我们预计，由于竞争、消费者偏好的频繁变化以及技术的快速进步，未来的竞争将会更加激烈。预测期内市场成长面临的威胁。

  • 2022 年 1 月 - 英飞凌科技推出全新 AURIX TC4x 系列 28 奈米微控制器，扩展了 AURIX 微控制器系列，适用于下一代电动车、ADAS、汽车 E/E架构和经济实惠的人工智慧(AI )。 。应用。新系列为该公司的旗舰 AURIX TC3x MCU 系列提供了向上迁移的途径。配备下一代 TriCore 1.8 和 AURIX 加速器套件的可扩展效能增强功能。
  • 2021 年 4 月 - 新唐科技推出适用于汽车应用的 Arm Cortex-M0 NUC131U 32位元微处理器，透过 AEC-Q100 Grade 2 认证，整合控制器区域网路 (CAN) 2.0 B 接口，工作频率高达 50 MHz。一个新系列。配备丰富的周边，包括 6 组 UART、2 组 I2C、1 组 SPI 和 24 通道 100 MHz PWM，可实现驱动步进马达或 HVAC 压缩机的精确控制。 12 位元 ADC 提供高达 800 k SPS，用于感测汽车应用的电压、电流或温度感测器，从而减少外部外围组件的数量和最终产品的外形尺寸。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章 简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

  • 调查系统
  • 二次调查
  • 初步调查
  • 主要研究途径及主要受访者
  • 对资料进行三角测量并产生见解

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间的敌意强度
  • 价值链分析
  • 评估 COVID-19 对市场的影响
  • 技术简介

第五章市场动态

  • 市场驱动因素
    • 物联网 (IoT) 的出现
    • 电动车（EV）需求快速成长
    • 汽车资讯娱乐系统越来越受欢迎
  • 市场挑战/限制
    • 极端气候条件下的操作故障
    • 设计复杂性
  • 市场机会
    • 技术进步与创新

第六章市场区隔

  • 细分 - 按产品
    • 8位
    • 16位
    • 32位
  • 细分 - 按用途
    • 动力传动系统和底盘
    • 安全保障
    • 车身电子产品
    • 远端资讯处理和资讯娱乐
  • 细分 - 按车辆类型
    • 搭乘用内燃机车
    • 商用内燃机车
    • 试车
      • BEV
      • HEV
      • PHEV
      • FCEV
  • 细分 - 按地区
    • 北美洲
    • 欧洲
    • 亚太地区
    • 世界其他地区

第七章 竞争形势

  • 公司简介
    • Infineon Technologies AG
    • Microchip Technology Inc.
    • NXP Semiconductors
    • Renesas Electronics Corporation
    • STMicroelectronics
    • Texas Instruments Incorporated
    • Toshiba Electronic Devices &Storage Corporation
    • Analog Devices Inc.
    • ROHM Semiconductor
    • Broadcom Inc.

第八章投资分析

第9章市场的未来

简介目录
Product Code: 90778

The Global Automotive MCU Market size is estimated at USD 10.48 billion in 2024, and is expected to reach USD 16.05 billion by 2029, growing at a CAGR of 8.92% during the forecast period (2024-2029).

Global Automotive MCU - Market

An increased demand for devices designed for extreme operating conditions, providing real-time response and high reliability, even in extreme temperatures, and incorporating features for functional safety to meet automotive design challenges, is expected to offer lucrative opportunities for growth of the studied market.

Key Highlights

  • The rise in automation has generated a significant need for microcontrollers responsible for the automatic operation of vehicle functions. MCUs are being used in automobiles to perform automatic functions like keeping the exhaust system clean, distributing electricity to various vehicle components, and reducing fuel consumption. Further, the electrification of vehicles is creating a need for new and specialized MCUs that are optimized for the needs of electric vehicles (EVs). To cater to the upsurge in demand for EVs, companies in the market are innovating advanced products and investing in extensive R&D projects.
  • For instance, aiming to keep the impetus going for zonal architecture-related solutions, in February 2022, ST released Stellar E MCUs, a new offering optimized for software-defined EVs Built around 32-bit, 300 MHz Arm Cortex-M7 cores. The MCUs feature up to 2 MB of on-chip Flash and 16 Kbyte of cache per core. The new MCUs, an extension of the Stellar family, are meant to be powerful, centralized domain and zone controllers to simplify design and scalability for a zonal architecture automobile. Also, the new MCUs aim to allow for easy control of wide-bandgap power electronics, such as silicon carbide, which has become a mainstay for efficient power conversion in EVs.
  • Additionally, in July 2021, Sterling Gtake E-mobility Ltd, a manufacturer of motor control units for electric vehicles, announced that it had bagged an order worth INR 60 crore from a leading electric two-wheeler maker. The company said it is also in the advanced stages of discussions with over 20 electric vehicle (EV) manufacturers to supply motor control units (MCUs) for different vehicle types, including two-wheelers and three-wheelers passenger vehicles and commercial vehicles.
  • On the flip side, as the global automotive sector is recovering from a slump in sales caused by Covid-19, another crisis is dampening its revival. A global semiconductor shortage disrupts global automotive production and may cause a delay in the sales of new vehicles. Microcontrollers, a crucial component of electronic control units used in modern infotainment systems, anti-lock braking systems (ABS), advanced driver assist systems (ADAS), and other electronic stability systems are in short supply forcing carmakers to reduce output. Resultantly, the carmakers are selectively idling plants until the shortage eases. However, the market is expected to make quick progress in the near future.
  • Moreover, the possibilities of operational failure of the automotive MCUs in extreme climatic conditions, coupled with their design complexity, might hamper the growth of the studied market.

Automotive Microcontrollers Market Trends

Surging Demand for ADAS is Likely to Drive the Market Growth

  • According to World Health Organization (WHO), approximately 1.3 million people die each year due to road traffic crashes which cost most countries approximately 3% of their gross domestic product (GDP). Further, according to Safe International Road Travel, more than 46,000 people die in crashes on U.S. roadways every year. The U.S. traffic fatality rate is 12.4 deaths per 100,000 inhabitants. An additional 4.4 million are injured seriously enough to require medical attention. Road crashes are the leading cause of death in the U.S. for people aged 1-54. Also, the U.S. suffers the most road crash deaths of any high-income country, about 50% higher than similar countries in Western Europe, Canada, Australia, and Japan.
  • Vehicles installed with Advanced Driver Assistance Systems (ADAS) can detect and classify objects on the road and alert drivers according to the road conditions. Additionally, these systems can automatically decelerate vehicles, depending on the situation. A few essential safety-critical ADAS applications include pedestrian detection/avoidance, lane departure warning/correction, traffic sign recognition, automatic emergency braking, blind-spot detection, etc. These lifesaving systems are crucial to ensuring the success of ADAS applications, incorporating the latest interface standards, and running multiple vision-based algorithms to support real-time multimedia, vision co-processing, and sensor fusion subsystems.
  • According to National Safety Council, ADAS technologies have the potential to prevent 20,841 deaths per year, or about 62% of total traffic deaths. The emergence of advanced driver assistance systems (ADAS) is changing how designers use, specify, and manufacture microcontrollers (MCUs). The evolving and complex nature of ADAS is expected to offer several opportunities for innovation, collaborations, and technological breakthroughs in the studied market.
  • For instance, in April 2022, SemiDrive Technology Ltd., a Chinese smart car microchip designer, released its E3 series microcontrollers. The automotive microcontroller adopts a TSMC 22nm automotive grade which can be used in many automotive application fields such as chassis by wire, brake control, BMS, ADAS, LCD panel, HUD, streaming media system, and CMS, among others. It is designed to reach high stability and safety levels. Its vehicle specification is AEC-Q100 Grade 1, and the functional safety standard is ISO 26262 ASIL D.
  • Moreover, in March 2022, Renesas Electronics, a supplier of advanced semiconductor solutions, announced the expansion of its collaboration with Honda in the field of advanced driver-assistance systems (ADAS). Honda adopted Renesas' R-Car automotive system on a chip (SoC) and RH850 automotive MCU for its Honda SENSING Elite system. Honda SENSING Elite (featured in the Legend, which went on sale in March 2021) incorporates advanced technology that qualifies for Level 3 automated driving (conditional automated driving in limited areas). Further, Honda has selected R-Car and RH850 for use in the Honda SENSING 360 omnidirectional safety and driver assistance system, which builds on the knowledge and expertise gained through research and development work on the earlier technology.

The Asia Pacific Region is Expected to Witness a High Market Growth

  • The growing environmental concerns and rising government subsidy programs, coupled with factors such as better fuel economy, enhanced performance, and reasonable cost, are augmenting the penetration rate of hybrid electric vehicles in the Asia-Pacific region.
  • For instance, according to EV-Volumes.com, approximately 672.9 thousand plug-in hybrid electric vehicles (PHEVs) were sold across the Asia-Pacific region in 2021. This was a dramatic increase from 2020 when around 264.26 thousand plug-in hybrid electric vehicles were sold. The increasing demand for these vehicles is likely to boost the maker growth of automotive MCUs in the region.
  • Further, the Asia Pacific has emerged as a significant hub for manufacturing semiconductors and semiconductor-based devices. For instance, according to World Semiconductor Trade Statistics (WSTS) estimates, the semiconductor industry revenue in the Asia Pacific region (excluding Japan) was USD 257.88 billion in 2019 and USD 290.85 billion in 2021. The region is also home to prominent electronics and automotive manufacturing companies, thus, offering scope for the evolution of the studied market.
  • The future of automotive system design lies in a vehicle-centralized, zone-oriented E/E architecture, which heightens the need for automotive chips that address the challenges these innovative architectures create for future vehicle generations. The companies in the region are launching advanced solutions to cater to the needs of their consumers.
  • For instance, in November 2021, Renesas Electronics Corporation (Tokyo, Japan) introduced a powerful new group of microcontrollers (MCUs), the RH850/U2B MCUs, designed to address the growing need to integrate multiple applications into a single chip and realize a unified electronic control unit (ECU) for the evolving electrical-electronic (E/E) architecture. Delivering a combination of flexibility, high performance, freedom from interference, and security, the cross-domain RH850/U2B MCUs are built for the rigorous workloads required by vehicle motion in terms of hybrid ICE and xEV traction inverter, connected gateway, high-end zone control, and domain control applications.

Automotive Microcontrollers Industry Overview

The global automotive MCU market is moderately fragmented with the presence of prominent players like Infineon Technologies AG, Microchip Technology Inc., NXP Semiconductors, Texas Instruments Incorporated, etc. The competition, frequent changes in consumer preferences, and rapid technological advancements are expected to pose a threat to the market's growth during the forecast period.

  • January 2022 - Infineon Technologies announced the extension of its AURIX microcontroller family and the availability of the first samples of its new AURIX TC4x family of 28nm microcontrollers for next-generation eMobility, ADAS, automotive E/E architectures, and affordable artificial intelligence (AI) applications. The new family delivers an upward migration path for the company's leading AURIX TC3x MCU family. It features the next-generation TriCore 1.8 and scalable performance enhancements from the AURIX accelerator suite.
  • April 2021 - Nuvoton Technology Corporation launched a new series of Arm Cortex-M0 NUC131U 32-bit microcontrollers for automotive applications, running up to 50 MHz, qualified by AEC-Q100 Grade 2 and build-in Controller Area Network (CAN) 2.0 B interface. It is equipped with a rich peripheral comprising six sets of UARTs, two sets of I2Cs, 1 set of SPI, and 24 channels of 100 MHz PWM to make accurate control to drive both stepping motor or HVAC compressor. 12-bit ADC delivers up to 800 k SPS to sense voltage, current, or temperature sensors for automotive applications to reduce the number of external peripheral components and the form factor of the end product.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumption And Market Defination
  • 1.2 Scope of the study

2 RESEARCH METHODOLOGY

  • 2.1 Research Framework
  • 2.2 Secondary Research
  • 2.3 Primary Research
  • 2.4 Primary Research Approach And Key Respondents
  • 2.5 Data Triangulation And Insight Generation

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power Of Suppliers
    • 4.2.2 Bargaining Power Of Buyers
    • 4.2.3 Threat Of New Entrants
    • 4.2.4 Threat Of Substitutes
    • 4.2.5 Intensity Of Competitive Rivalry
  • 4.3 Value Chain Analysis
  • 4.4 Assessment of the Impact of Covid-19 on the Market
  • 4.5 Technology Snapshot

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Emergence of Internet of Things (IoT)
    • 5.1.2 Surge in demand for electronic vehicles (Evs)
    • 5.1.3 Increasing popularity of infotainment in automobiles
  • 5.2 Market Challenges/Restraints
    • 5.2.1 Operational failure in extreme climatic conditions
    • 5.2.2 Design Complexity
  • 5.3 Market Opportunities
    • 5.3.1 Technological Advancements and Innovations

6 MARKET SEGMENTATION

  • 6.1 Segmentation - By Product
    • 6.1.1 8-bit
    • 6.1.2 16-bit
    • 6.1.3 32-bit
  • 6.2 Segmentation - By Application
    • 6.2.1 Powertrain and Chassis
    • 6.2.2 Safety and Security
    • 6.2.3 Body Electronics
    • 6.2.4 Telematics and Infotainment
  • 6.3 Segmentation - By Vehicle Type
    • 6.3.1 Passenger ICE vehicle
    • 6.3.2 Commercial ICE vehicle
    • 6.3.3 Electric Vehicle
      • 6.3.3.1 BEV
      • 6.3.3.2 HEV
      • 6.3.3.3 PHEV
      • 6.3.3.4 FCEV
  • 6.4 Segmentation - By Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia-Pacific
    • 6.4.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Infineon Technologies AG
    • 7.1.2 Microchip Technology Inc.
    • 7.1.3 NXP Semiconductors
    • 7.1.4 Renesas Electronics Corporation
    • 7.1.5 STMicroelectronics
    • 7.1.6 Texas Instruments Incorporated
    • 7.1.7 Toshiba Electronic Devices & Storage Corporation
    • 7.1.8 Analog Devices Inc.
    • 7.1.9 ROHM Semiconductor
    • 7.1.10 Broadcom Inc.

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET