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市场调查报告书
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1548880

全球柔性混合电子 (FHE) 市场：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Flexible Hybrid Electronics (FHE) - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 125 Pages | 商品交期: 2-3个工作天内

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简介目录

全球柔性混合电子（FHE）市场规模预计2024年为1.8091亿美元，2029年达到4.2649亿美元，在预测期内（2024-2029年）复合年增长率为18，预计将增长71。

柔性混合电子 (FHE) 市场

这些电子元件的应用不断增加，例如穿戴式电子产品、性能监测系统、建筑结构安全监控、软机器人和阵列天线，预计将在预测期内推动市场成长。

主要亮点

  • 透过将大面积电子产品的灵活性、轻量、薄度和处理能力与半导体结合，混合电子产品可用于各种应用，包括物联网 (IoT)、智慧建筑、医疗保健、产品包装、零售，以及消费性电子开拓。
  • 灵活的混合电子产品还帮助产品设计人员以新的方式使用感测器来收集资料并提供可增强功能的可行见解。扩大市场开发和技术创新预计将彻底改变电子产业。随着物联网的出现，柔性混合电子有望为开发和整合可低成本日常使用的智慧系统和设备提供巨大的机会。汽车、军事、航太、医疗保健和显示器等行业正在其产品中使用灵活的混合感测器和穿戴式装置。
  • 印刷电子产品是使用网版印刷、喷墨印刷和凹版印刷等印刷製程在各种基板上创建电子电路和元件的过程。为了製造电子设备，将由银、奈米碳管和导电聚合物製成的导电墨水涂布在基板上。 RFID 标籤、软性显示器、印刷感测器、智慧包装和电子纺织品是印刷电子应用的一些例子。轻质、灵活的组件和可扩展、廉价的生产过程使其成为大规模应用的理想选择。与标准硅基装置相比，它们的电气性能有限，耐用性、可靠性和材料品质较差，阻碍了它们在苛刻情况下的性能。
  • 医疗、汽车和消费性电子等应用日益增加对轻质、机械灵活且经济高效的设备的需求。柔性混合电子设备在满足产业需求方面正在获得巨大的动力。软性电子产品具有透过使系统可以弯曲成任意形状来改变计算的潜力。
  • 政府资助支持研发活动，促进 FHE 的创新和技术进步。这种支援帮助克服了技术挑战、降低了成本并提高了 FHE 产品的性能和可靠性。政府资助了多项倡议，包括 NextFlex Project Call 4.0、Semi-Flex Tech Project 和 HiFES（混合整合式软性电子产品系统）计画。
  • 对研发 (R&D) 和基础设施的高要求是限制柔性混合电子 (FHE) 需求成长的一些挑战。由于研发和基础设施的初始成本较高，包括企业和消费者在内的潜在采用者对投资 FHE 技术犹豫不决。这种不情愿源自于对投资收益(ROI) 和初始部署负担能力的担忧。
  • 在经济扩张时期，对商业产品和服务的需求增加。公司经常投资柔性混合电子等技术，因为对轻质、柔性和共形设计不断增长的需求可以扩展各个行业的规模。例如，根据MOSPI的数据，2023财年，印度国内电子产品生产对GDP的贡献约为2.9%。预计 2026 财年这项贡献将增至 4.7%。电子产品生产的扩张预计将增加所研究市场的需求。

柔性混合电子 (FHE) 市场趋势

电子应用占据主要市场占有率

  • 柔性混合电子 (FHE) 市场范围中的感测器、显示器和照明等电子领域包括薄型指纹感测器、用于测试水盐度的印刷天线、印刷 LED 照明等。
  • 柔性混合电子 (FHE) 是软性电子产品和印刷电子的融合，包括用于原型製作的数位增材製造、灵活性和可拉伸性以及与R2R（卷对卷）生产的兼容性等优点，并且正在获得发展势头。 FHE 将硅基积体电路和印刷电子元件结合在软式电路板上。采用 Si CMOS 製程的着名主动元件包括微控制器、数位讯号处理器、高密度记忆体和射频 (RF) 晶片。
  • 柔性混合电子产品正在透过软性显示器、可捲曲萤幕、软性电池和电子纺织品彻底改变消费性电子产品。这些进步创造了更耐用和多功能的设备。消费性电子产品正在转向超高解析度，为高解析度显示器、柔性萤幕和设计复杂的 LED 照明铺平了道路。高解析度增强视觉吸引力和功能，丰富使用者体验。
  • 从地区来看，北美的电子产业可望快速成长。 2024 年 6 月，由美国国防部 (DoD) 和 FlexTech 联盟共同成立的 NextFlex联盟宣布获得 530 万美元的新资金筹措机会。该倡议旨在加速柔性混合电子（FHE）在美国的商业化。
  • 2024 年 5 月，NextFlex 宣布了 Project Call 9.0 (PC 9.0)，这是一项总额超过 1,100 万美元的资金筹措倡议。这使得 NextFlex 自成立以来对混合电子技术进步的总投资达到 1.43 亿美元。 PC 9.0 特别注重提高混合电子设备的效能和可靠性。
  • 随着 Micro-LED 等技术与 OLED 一起获得关注，柔性和可折迭显示器市场正在显着成长。虽然 Micro-LED 显示器具有卓越的品质，但其製造却面临挑战。据 DSCC 称，全球折迭式和旋转性智慧型手机市场收益激增，从 2020 年的 45 亿美元增至 55 亿美元。预计2020年至2025年复合年增长率将超过80%，到2025年将达到1,050亿美元以上。

亚太地区录得强劲成长

  • 亚太地区，包括中国大陆、台湾和日本等半导体中心，是许多由国内外供应商营运的纯晶圆代工厂的所在地。例如，中国成都拥有完善的产业丛集、先进的新材料生产技术、广大的消费市场以及强大的研发基础，特别是在高性能材料方面。
  • 该地区在全球连网型穿戴式装置需求中也占有很大份额，并且是成长最快的市场之一。中国、日本和新加坡等国家对灵活智慧型手机和家用电器的需求正在增加。日本电子市场正致力于透过灵活的混合电子产品实现产品小型化。
  • 因此，三星、LG 和苹果等公司专门在该地区推出灵活的智慧型手机。中国供应商正在与大学和研究机构合作进行创新。例如，清华大学的研究人员开发出厚度小于25微米的超薄柔性晶片，可以嵌入软式电路板上的各种材料。
  • 2023年12月，成都高新区与中国软性电子产品电子产业发展大会共同举办第四届「金熊猫」全球柔性软性电子产品产业创新创业大赛。本次活动旨在强化产业生态，推动成都FHE产业发展。成都高新利用产业投资基金，整合资本与产业链。到2027年，成都高新区计画部署3,000亿元人民币（4,137亿美元）的产业基金，并吸引多元化的产业合作者。柔性混合电子产品对于中国的独立性和技术力至关重要。 CDHT旨在建立FHE产业链技术与计划整合的交流平台。
  • 软性电子产品产业发展联盟指出，中国FHE产业已成为全球关注的焦点。要利用这一点，中国必须规划产业布局，建立「中国碳谷」基地，并专注于核心技术研究，加强顶层设计，发挥柔性混合电子人才的功能。

柔性混合电子 (FHE) 产业概览

弹性混合电子市场高度分散，主要参与者包括杜邦帝人薄膜公司、Domicro BV、通用电气公司、洛克希德马丁公司和美国半导体公司。市场公司正在采取联盟和收购等策略来增强其产品阵容并获得永续的竞争优势。

  • 2024 年 4 月：Brewer Science Inc. 推出创新智慧仓库监控系统，将彻底改变职场安全和生产力。这项先进的解决方案专为工业和仓储应用而设计，可提供即时资料，以确保员工安全、提高生产力并优化业务效率。
  • 2024 年 2 月：杜邦帝人薄膜在全球更名为Mylar 专门食品 Films。此次更名将影响美国、欧洲和亚洲的所有国际业务和办事处。新公司名称的选择是向Mylar品牌的传统致敬，该品牌于 20 世纪 50 年代作为开创性的双向拉伸 PET 薄膜推出。

其他好处

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 灵活的混合电子生态系分析
  • 产业吸引力－波特五力分析
    • 新进入者的威胁
    • 买家/消费者的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • 技术简介和 FHE蓝图

第五章市场动态

  • 市场驱动因素
    • 对轻质、机械灵活且具成本效益的产品的需求不断增长
    • 政府资助计划
  • 市场限制因素
    • 研究与发展 (R&D) 和基础设施所需的资金量
  • COVID-19后遗症和其他宏观经济趋势对市场的影响
  • 专利分析

第六章 政府支持的研究中心

  • NextFlex
  • Holst Centre
  • IMEC
  • VTT Technical Research Centre of Finland Ltd (VTT)
  • CPI
  • CEA Liten
  • Korea Institute of Machinery and Materials

第七章 市场区隔

  • 按用途
    • 电子产品
    • 健康工具
      • 应用概述和市场潜力
      • 使用案例
    • 安全标籤
    • 工业/环境监测
  • 按地区
    • 北美洲
    • 欧洲
    • 亚洲
    • 澳洲/纽西兰
    • 拉丁美洲
    • 中东/非洲

第八章 竞争格局

  • 公司简介
    • DuPont Teijin Films
    • Domicro BV
    • General Electric Company
    • Lockheed Martin Corporation
    • American Semiconductor Inc
    • Flex Ltd
    • Brewer Science Inc.
    • Integrity Industrial Inkjet Integration
    • Antenna Research Associates Inc.（SI2 Technologies）
    • Epicore Biosystems

第九章投资分析

第十章市场展望

简介目录
Product Code: 59142

The Flexible Hybrid Electronics Market size is estimated at USD 180.91 million in 2024, and is expected to reach USD 426.49 million by 2029, growing at a CAGR of 18.71% during the forecast period (2024-2029).

Flexible Hybrid Electronics (FHE) - Market

The increasing applications of these electronic components in wearable electronics, performance monitoring systems, structural health monitoring for constructions, soft robotics, and array antennas are expected to drive the market's growth during the forecast period.

Key Highlights

  • Hybrid electronics combine the flexibility, lightweight nature, thinness, and large-area electronics with the processing power of semiconductors to open a broad range of new applications across different end-use applications, such as the Internet of Things (IoT), smart buildings, healthcare, product packaging, retail, and consumer electronics.
  • Flexible hybrid electronics are also helping product designers use sensors in a new way to collect data and deliver actionable insights that enhance functioning. The growing development and innovations in the market are expected to revolutionize the electronics industry. With the advent of the IoT, flexible hybrid electronics are expected to provide massive opportunities to develop and integrate smart systems and devices for low-cost, everyday use. Industries like automotive, military, aerospace, healthcare, and displays are utilizing flexible and hybrid sensors and wearables in their products.
  • Printed electronics is the process of creating electronic circuits and components on various substrates using printing processes such as screen printing, inkjet printing, and gravure printing. To create electrical devices, conductive inks consisting of silver, carbon nanotubes, or conductive polymers are applied to substrates. RFID tags, flexible displays, printed sensors, smart packaging, and e-textiles are a few examples of printed electronics applications. Lightweight, flexible components and scalable and affordable production procedures make them ideal for large-scale applications. Limited electrical performance compared to standard silicon-based devices, inferior durability, dependability, and material qualities hinder performance in demanding situations.
  • There is an emerging need for lightweight, mechanically flexible, and cost-effective devices in medical, automotive, and consumer electronics applications. Flexible hybrid electronic devices have gained considerable momentum in catering to the industry's needs. Flexible electronics have the potential to transform computing by enabling bendable systems with arbitrary shapes.
  • Government funding boosts R&D activities, leading to innovations and technological advancements in FHE. This support helps overcome technical challenges, reduces costs, and enhances the performance and reliability of FHE products. The government provided funding for various initiatives, including NextFlex Project Call 4.0, the Semi-Flex Tech Project, and the HiFES (hybrid integrated flexible electronic systems) program.
  • The high requirement for research and development (R&D) and infrastructure poses several challenges restraining the demand growth for flexible hybrid electronics (FHE). The significant upfront costs of R&D and infrastructure development deter potential adopters, including businesses and consumers, from investing in FHE technologies. This reluctance stems from concerns over return on investment (ROI) and the affordability of initial deployment.
  • There is a greater need for business goods and services during economic expansion. Businesses frequently invest in technology like flexible hybrid electronics that can increase various industries because of this increase in demand for lightweight, flexible, and conformal designs. For instance, according to MOSPI, in the financial year 2023, the contribution of domestic electronics production value to the Indian GDP was about 2.9%. This contribution share was estimated to increase to 4.7% by the financial year 2026. Such possible expansion in electronics production is projected to increase demand in the market studied.

Flexible Hybrid Electronics (FHE) Market Trends

Electronics Application Segment Holds Significant Market Share

  • The electronics segment, including sensors, displays, and lighting, in the flexible hybrid electronics (FHE) market scope includes thin fingerprint sensors, printed antennas to test water salinity, and printed LED lighting.
  • Flexible hybrid electronics (FHE), a blend of flexible and printed electronics, is gaining momentum for its advantages, including digital additive manufacturing for prototyping, flexibility and stretchability, and compatibility with Roll-to-Roll (R2R) production. FHE merges printed electronics with silicon-based integrated circuits on a flexible substrate. Notable active components from Si CMOS processes include microcontrollers, digital signal processors, high-density memories, and radiofrequency (RF) chips.
  • Flexible hybrid electronics is revolutionizing consumer electronics with flexible displays, rollable screens, flexible batteries, and electronic textiles. These advancements lead to more durable and versatile devices. There's a shift in consumer electronics toward ultra-high resolution, paving the way for high-resolution displays, flexible screens, and intricately designed LED lighting. The heightened resolution enhances visual appeal and functionality, enriching the user experience.
  • By geography, North America is set for a surge in its electronics sector. In June 2024, the NextFlex consortium, a collaboration between the US Department of Defense (DoD) and FlexTech Alliance, unveiled a new funding opportunity of USD 5.3 million. This initiative aims to accelerate the commercialization of flexible hybrid electronics (FHE) in the United States.
  • In May 2024, NextFlex released Project Call 9.0 (PC 9.0), a funding initiative with a total value exceeding USD 11 million. This brings NextFlex's total investment in hybrid electronics advancements to a substantial USD 143 million since its inception. PC 9.0 specifically focuses on enhancing the performance and reliability of hybrid electronic devices.
  • The market for flexible and foldable displays is growing significantly, with technologies like micro-LEDs gaining prominence alongside OLEDs. While micro-LED displays offer exceptional quality, their manufacturing is challenging. According to DSCC, the global market for foldable and rollable smartphones witnessed a revenue surge, increasing from USD 4.5 billion in 2020 to USD 5.5 billion. Projections indicate a substantial uptick, with the market poised to exceed USD 105 billion by 2025, reflecting an impressive compound annual growth rate (CAGR) of over 80% from 2020 to 2025.

Asia-Pacific to Register Major Growth

  • The Asia-Pacific region, including semiconductor hubs like China, Taiwan, and Japan, hosts many pure-play foundries operated by domestic and international vendors. Chengdu, China, for instance, has a comprehensive industrial cluster, advanced technology for new material production, a vast consumer market, and a strong R&D foundation, especially for high-performance materials.
  • The region also holds a significant share of global demand for connected wearables and is one of the fastest-growing markets. Countries like China, Japan, and Singapore are seeing increased demand for flexible smartphones and consumer electronics. The Japanese electronics market is focusing on miniaturizing products with flexible hybrid electronics.
  • Consequently, companies like Samsung, LG, and Apple are launching flexible smartphones exclusively in the region. Chinese vendors are innovating by collaborating with universities and research institutes. For example, Tsinghua University researchers developed ultra-thin flexible chips, less than 25 micrometers thick, that can be embedded in various materials on flexible substrates.
  • In December 2023, Chengdu Hi-tech Industrial Development Zone (CDHT) hosted the China Flexible Electronics Industry Development Conference and the 4th 'Golden Panda' Global Flexible Electronic Industry Innovation and Entrepreneurship Competition. The event aimed to bolster industrial ecosystems and propel Chengdu's FHE sector. CDHT leverages industrial investment funds to integrate capital and industry chains. By 2027, CDHT plans to roll out RMB 300 billion (USD 413.7 billion) in industrial funds, attracting diverse industry collaborators. Flexible hybrid electronics are crucial for China's self-reliance and technological strength. CDHT aims to establish an exchange platform to consolidate technologies and projects in the FHE industry chain.
  • The Chinese FHE industry gained global prominence, as noted by the Flexible Electronic Industry Development Alliance. To capitalize on this, China must plan its industrial layout, establish the "China Carbon Valley" base, focus on core technology research, enhance top-level design, and leverage its flexible hybrid electronics talent.

Flexible Hybrid Electronics (FHE) Industry Overview

The flexible hybrid electronics market is highly fragmented with the presence of major players like DuPont Teijin Films, Domicro BV, General Electric Company, Lockheed Martin Corporation, and American Semiconductor Inc. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

  • April 2024: Brewer Science Inc. launched its innovative smart warehouse monitor system, a game-changer in workplace safety and productivity. This advanced solution engineered for industrial and warehouse applications provides real-time data, ensuring employee safety, enhancing productivity, and optimizing operational efficiency.
  • February 2024: DuPont Teijin Films globally rebranded to Mylar Specialty Films. This rebranding is expected to affect all international operations and offices in the United States, Europe, and Asia. The decision to adopt the new company name pays homage to the legacy of the Mylar brand, which was first introduced as the pioneering biaxially oriented PET film in the 1950s.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Flexible Hybrid Electronics Ecosystem Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Technology Snapshot and FHE Roadmap

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Emerging Need for Lightweight, Mechanically-flexible, and Cost-effective Products
    • 5.1.2 Government Funded Projects
  • 5.2 Market Restraints
    • 5.2.1 High Capital Requirement for Research and Development (R&D) and Infrastructure
  • 5.3 Impact of COVID-19 Aftereffects and Other Macroeconomic Trends on the Market
  • 5.4 Patent Analysis

6 GOVERNMENT SUPPORTED RESEARCH CENTRE

  • 6.1 NextFlex
  • 6.2 Holst Centre
  • 6.3 IMEC
  • 6.4 VTT Technical Research Centre of Finland Ltd (VTT)
  • 6.5 CPI
  • 6.6 CEA Liten
  • 6.7 Korea Institute of Machinery and Materials

7 MARKET SEGMENTATION

  • 7.1 By Application
    • 7.1.1 Electronics
    • 7.1.2 Health Performance Tool
      • 7.1.2.1 Application Summary and Market Potential
      • 7.1.2.2 Use-cases
    • 7.1.3 Security Tag
    • 7.1.4 Industrial and Environmental Monitoring
  • 7.2 By Geography
    • 7.2.1 North America
    • 7.2.2 Europe
    • 7.2.3 Asia
    • 7.2.4 Australia and New Zealand
    • 7.2.5 Latin America
    • 7.2.6 Middle East and Africa

8 COMPETITIVE LANDSCAPE

  • 8.1 Company Profiles
    • 8.1.1 DuPont Teijin Films
    • 8.1.2 Domicro BV
    • 8.1.3 General Electric Company
    • 8.1.4 Lockheed Martin Corporation
    • 8.1.5 American Semiconductor Inc
    • 8.1.6 Flex Ltd
    • 8.1.7 Brewer Science Inc.
    • 8.1.8 Integrity Industrial Inkjet Integration
    • 8.1.9 Antenna Research Associates Inc. (SI2 Technologies)
    • 8.1.10 Epicore Biosystems

9 INVESTMENT ANALYSIS

10 MARKET OUTLOOK