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市场调查报告书
商品编码
1548919

表面黏着技术：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Surface Mount Technology - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 144 Pages | 商品交期: 2-3个工作天内

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简介目录

表面黏着技术（SMT）市场规模预计2024年为61.4亿美元，预计2029年将达到88.7亿美元，在预测期内（2024-2029年）复合年增长率为7.60%，预计将增长。

表面贴装技术市场

表面黏着技术(SMT) 是一种建构电子电路的方法，涉及将组件直接安装到印刷电路基板(PCB) 的表面上。这与传统的通孔技术形成鲜明对比，在传统的通孔技术中，元件被插入 PCB 上钻的孔中。 SMT 中使用的元件称为 SMD，具有小型金属片或端盖，可直接焊接到 PCB 表面。这样可以在单一 PCB 上安装更小、更轻和更多的元件。

受疫情影响，笔记型电脑和伺服器市场需求激增。印度电子与半导体协会 (IESA) 表示，随着在家工作并采用协作工具，将更多资料储存在云端。伺服器、资料中心和运算领域的需求激增。美国美光科技公司也报告称，由于远距工作经济、游戏和电子商务的增加，其资料中心的需求更加强劲。此外，根据 Cloudscene 的数据，截至 2024 年 3 月，美国有 5,381 个资料中心，比世界上任何其他国家都多。另外 521 个地点位于德国，514 个地点位于英国。

电子元件的小型化使得可以随身携带的小型便携式可携式电脑设备的生产成为可能。因此，现在市场上出现了体积更小、重量更轻、处理能力更高的设备。组件变得更加耐磨，因为它们可以轻鬆嵌入（例如放入衣服袋中）并长期携带。元件变得越来越小，对安装元件的印刷电路基板的设计提出了新的要求。 NCAB 集团坚定致力于 IPC 努力定义超高密度 Ultra HDI 印刷电路基板标准，并预计能够在 2023 年为客户提供这些标准。

表面黏着技术(SMT) 已成为现代电子製造的关键要素，以其众多优势超越了传统的通孔方法。 SMT 的一个显着优势是它显着减少了所需的 PCB 钻孔。製造商可以透过消除钻孔步骤来节省时间和成本，这对于复杂的高密度基板来说尤其有利。这一转变简化了生产，降低了人事费用和材料成本，并提高了製造过程的整体成本效益。

表面黏着技术透过生产更小、更有效率且更具成本效益的电子设备，彻底改变了电子製造业。然而，儘管 SMT 具有众多优点，但它并不适合所有应用。 SMT不适合高功率/高电压元件，例如变压器和电源电路。这些组件会产生热量并承载高电力负载，而 SMT 无法有效处理这些负载。

据美国预算办公室称，美国国防支出预计每年都会增加，直到 2033 年。 2023年美国国防支出将达7,460亿美元。同样的预测也预测，到 2033 年，国防支出将增加至 1.1 兆美元。

表面黏着技术（SMT）市场趋势

消费电子最终用户产业预计将占据主要市场占有率

  • 在汽车产业，SMT用于电控系统（ECU）、仪表板显示器、雷达和相机模组、电池管理系统（BMS）、安全辅助系统等。 SMT 已成为汽车应用中的关键製造流程。 SMT 以其效率、精度和可靠性而闻名，对于为 ADAS（高级驾驶辅助系统）、资讯娱乐系统和车辆控制系统等各种车载电子产品供电至关重要。
  • 在现代汽车中，车载控制系统充当汽车的“大脑”，监督和协调其电子元件的功能。车载控制系统对于从导航到音讯再到空调等一切设备的无缝运作至关重要。 SMT 技术对于这些控制系统的可靠性至关重要。此技术能够将微小电子元件精确安装在电路基板，确保系统高效可靠的运作。
  • 引擎控制单元 (ECU) 是汽车电子系统的核心，监督引擎性能、变速箱和煞车等关键操作。表面黏着技术(SMT) 对于将微晶片、电阻器、电容器和其他表面黏着技术元件组装到 ECU 中至关重要。
  • 此外，人工智慧技术预计将在汽车行业中得到更多采用。电子元件组装中表面黏着技术（SMT）的精度和效率将提高人工智慧晶片和处理器的生产。因此，汽车电子将增强自主决策能力，从而实现更智慧的驾驶和车辆自动化。
  • 正如国际能源总署所强调的那样，全球汽车产业正在经历重大变革时期，这对能源产业可能产生重大影响。据预测，到 2030 年，电气化的进步预计将消除每天 500 万桶石油的需求。
  • IEA报告也显示，电动车销量将大幅成长，2023年销量将比2022年增加350万辆，成长35%。值得注意的是，全年每週新增註册量超过 25 万人。到 2023 年，电动车将占总销量的约 18%，高于五年前的 2%，到 2022 年将占 14%。这些趋势表明，随着电动车市场的成熟，预计强劲成长将持续下去。此外，预计到 2023 年，电动车保有量的 70% 将由纯电动车组成。

亚太地区预计将经历最快的成长

  • 亚太地区，特别是日本、中国、韩国、台湾和东南亚等国家，已成为全球电子製造中心。该地区强大的製造基础设施、熟练的劳动力和支持性的政府政策正在吸引跨国公司并促进当地电子产业的成长。对平板电脑、智慧型手机和其他电子设备的需求持续成长，需要使用表面黏着技术的高效、大量生产能力。该公司预计，透过在当地实施SMT（表面黏着技术），付加将从目前的15%增加到25%。
  • 例如，2023年8月，印度政府宣布全球电子产业将提高在印度组装的产品的本地付加，目标是在未来5-10年内显着成长60-80%。为了实现这一目标，政府鼓励印度工业采用表面黏着技术（SMT）线等先进的生产方法。
  • 碳化硅（SiC）因其耐高温、良好的导电性和优异的能源效率而日益受到关注。随着工业 4.0 中对电动车 (EV)、太阳能板和先进电源管理的需求不断增加，碳化硅製造的重要性日益增加。由于需要最大限度地减少这些区域的功耗，宽能带隙导体是自然的选择。
  • 2024 年 2 月，大陆设备印度有限公司 (CDIL) 迈出了重要一步，运作了一条专用SiC表面黏着技术(SMT) 组件的新组装。这使得 CDIL 成为印度碳化硅零件製造领域的先驱。透过此增强，CDIL 现在能够生产各种汽车级装置，例如 SiC 肖特基二极体、SiC MOSFET、齐纳二极体、整流器、TVS 二极体等，以满足全球和国内市场的需求。
  • 2024 年 4 月，TDK 公司发布了 B40910 系列，这是一系列混合聚合物电容器，支援高达 4.6 A（100 kHz，+125 度C时）。这些表面黏着技术元件在室温下具有令人惊讶的低 ESR 值，分别为 17mΩ 和 22mΩ。
  • 与使用液体电解质的标准电解电容器不同，TDK 电容器的 ESR 随温度变化很小。它是一个小型 10 x 10.2 mm 或 10 x 12.5 mm (D x H) 元件，额定电压为 63 V，电容为 82 μF 至 120 μF。因此，SMT 製造商正在透过技术整合和创新来推动对该技术的需求。这些努力促进了表面黏着技术(SMT) 在各行业的广泛采用和发展。

表面黏着技术(SMT) 产业概览

由于跨国公司和中小企业的存在，表面黏着技术市场高度分散。该市场的主要企业包括富士公司、雅马哈汽车有限公司、Mycronic AB、ASMPT 和松下公司。该市场上的公司正在透过联盟和收购来加强其产品供应并获得竞争优势。

2024 年 3 月 - 诺信公司在墨西哥克雷塔罗设立了一个新的拉丁美洲技术中心，为该地区的製造商提供及时获取最适合其生产要求的装配液、组件、基板和流体涂布设备的机会。该实验室配备了 3D 列印机、秤和其他测量设备，可协助确定适合每位客户独特应用要求的正确流体涂布。

2024 年 1 月 -Yamaha Motor Co, Ltd.汽车宣布推出表面黏着技术YRM10，该机拥有同类产品中最快贴装性能的称号。凭藉52,000CPH的惊人速度，在1光束1头类别中压倒竞争对手。该装置结构紧凑、节省空间，提供广泛的组件相容性和多功能性，使其成为高速模组组装的下一代解决方案。

其他好处

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业价值链分析
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • COVID-19 对表面黏着技术市场的影响

第五章市场动态

  • 对技术小型化的需求不断增长
    • 与其他技术相比，需要在印刷基板钻孔较少
  • 市场挑战
    • SMT不适合大型、高功率、高电压元件或经常承受机械应力的元件。
    • 高初始成本和返工问题

第六章 市场细分

  • 按零件
    • 被动元件
      • 电阻器
      • 冷凝器
    • 主动元件
      • 电晶体
      • 积体电路
  • 按最终用户产业
    • 家用电子产品
    • 车
    • 工业电子
    • 航太/国防
    • 卫生保健
    • 其他最终用户产业
  • 按地区
    • 北美洲
    • 欧洲
    • 亚洲
    • 澳洲/纽西兰
    • 拉丁美洲
    • 中东/非洲

第七章 竞争格局

  • 公司简介
    • Fuji Corporation
    • Yamaha Motor Co. Ltd
    • Mycronic AB
    • ASMPT
    • Panasonic Corporation
    • Nordson Corporation
    • Juki Corporation
    • Hanwa Precision Machinery Co. Ltd
    • Zhejiang Neoden Technology Co. Ltd
    • Europlacer Limited
    • Viscom SE

第八章投资分析

第九章 市场机会及未来趋势

简介目录
Product Code: 71613

The Surface Mount Technology Market size is estimated at USD 6.14 billion in 2024, and is expected to reach USD 8.87 billion by 2029, growing at a CAGR of 7.60% during the forecast period (2024-2029).

Surface Mount Technology - Market

Surface mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). This contrasts with older through-hole technology, where components are inserted into holes drilled into the PCB. Components used in SMT, known as SMDs, have small metal tabs or end caps that can be soldered directly onto the PCB surface. This allows for using smaller, lighter, and more components on a single PCB.

After the effect of the pandemic, the market for laptops and servers is witnessing a surge in demand. According to the India Electronics and Semiconductor Association (IESA), more data is stored on the cloud as work-from-home increases and more collaboration tools are deployed. A surge in demand is witnessed in the server, data centers, and computing segments. US-based Micron Technology also reported a more robust demand from data centers due to the remote-work economy, increased gaming, and e-commerce activity. Additionally, as per Cloudscene, as of March 2024, there are 5,381 data centers in the United States, the most of any country worldwide. A further 521 are in Germany, while 514 are in the United Kingdom.

Miniaturization of electronic components has made it possible to build small portable and handheld computer devices that can be carried anywhere. As a result, smaller, lighter devices with high processing capacity are available on the market. They are becoming more wearable since components can be easily embedded (for example, in clothing bags) and carried for long periods. Components are shrinking, putting new demands on the design of the PCBs they are mounted on. NCAB Group is firmly committed to IPC's efforts in defining standards for ultra-dense Ultra HDI PCBs and anticipates being able to provide them to clients in 2023.

Surface mount technology (SMT) has emerged as a pivotal element in modern electronics manufacturing, eclipsing traditional through-hole methods with its myriad benefits. A standout advantage of SMT lies in its drastic reduction of necessary PCB drilling. Manufacturers slash both time and costs by sidestepping the drilling process, a notable boon for intricate, high-density boards. This shift streamlines production and trims labor and material expenses, bolstering the overall cost-effectiveness of the manufacturing process.

Surface mount technology has revolutionized the electronics manufacturing industry by enabling the production of smaller, more efficient, and cost-effective electronic devices. However, despite its numerous advantages, SMT is unsuitable for all applications. SMT is unsuitable for high-power and high-voltage components, such as transformers and power circuitry. These components generate heat and carry high electric loads, which SMT is not designed to handle effectively.

According to the US Congressional Budget Office, defense spending in the United States is predicted to increase yearly until 2033. Defense outlays in the United States amounted to USD 746 billion in 2023. The forecast predicts an increase in defense outlays up to USD 1.1 trillion in 2033.

Surface Mount Technology (SMT) Market Trends

Consumer Electronics End-user Industry Segment is Expected to Hold Significant Market Share

  • In the automotive industry, SMT is used in Electronic Control Units (ECU), dashboard displays, radar and camera modules, Battery Management Systems (BMS), safety assistance systems, and more. SMT has emerged as a pivotal manufacturing process in the automotive application. Renowned for its efficiency, precision, and reliability, SMT is crucial in bolstering various automotive electronic products, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control systems.
  • In modern cars, the on-board control system acts as the vehicle's 'brain,' overseeing and harmonizing the functions of its electronic components. The on-board control system is crucial in their seamless operation, from navigation to audio and air conditioning. Central to the reliability of these control systems is SMT technology. This technology enables the precise mounting of minuscule electronic components on circuit boards, ensuring the systems operate efficiently and reliably.
  • The Engine Control Unit (ECU) is the automotive electronic system's nucleus, overseeing critical operations like engine performance, transmission, and braking. Surface-mount technology (SMT) is essential in assembling microchips, resistors, capacitors, and other surface-mounted components onto the ECU.
  • Furthermore, Artificial Intelligence technology is poised to see increased adoption in the automotive sector. The precision and efficiency of Surface Mount Technology (SMT) in electronic assembly are set to bolster the production of AI chips and processors. Consequently, automotive electronic products will have enhanced autonomous decision-making abilities, advancing intelligent driving and vehicle automation.
  • As highlighted by the IEA, the global automotive industry is undergoing a significant transformation, with potentially far-reaching implications for the energy sector. According to projections, the rise of electrification is anticipated to result in a daily elimination of the need for 5 million barrels of oil by 2030.
  • The IEA's report also revealed a substantial increase in electric vehicle sales, with 3.5 million units sold in 2023 compared to 2022, marking a 35% growth. Notably, over 250,000 new registrations were recorded weekly, and over 250,000 new registrations were recorded weekly throughout the year. In 2023, electric vehicles accounted for approximately 18% of all vehicles sold, a significant increase from 2% five years ago and 14% in 2022. These trends indicate that solid growth is expected to persist as the electric vehicle market matures. Additionally, it was projected that 70% of the electric vehicle stock in 2023 would consist of battery electric vehicles.

Asia Pacific is Expected to Witness Fastest Growth

  • Asia-Pacific, particularly countries like Japan, China, South Korea, Taiwan, and Southeast Asia, has become a global hub for electronics manufacturing. The region's robust manufacturing infrastructure, skilled labor force, and supportive government policies attract multinational corporations and promote the growth of local electronics industries. Demand for tablets, smartphones, and other electronic devices continues to grow, necessitating efficient and high-volume production capabilities by surface mount technology. The company projects that by implementing SMT (Surface Mount Technology) locally, the value addition will increase to 25% from the current 15%.
  • For instance, in August 2023, the Indian government is actively engaging with global electronics firms to ramp up local value addition in products assembled in India, targeting a significant increase of 60-80% over the next five to ten years. To achieve this, the government is urging industries in India to adopt advanced production methods, like surface-mount technology (SMT) lines.
  • Silicon Carbide (SiC) is increasingly in the spotlight for its high-temperature resilience, superior electrical conductivity, and remarkable energy efficiency. As the demand for electric vehicles (EVs), solar panels, and advanced power management rises with Industry 4.0, SiC manufacturing's significance has heightened. Wide Band Gap conductors are a natural fit given the imperative for minimal power consumption in these sectors.
  • In February 2024, Continental Device India Limited (CDIL) took a significant step by inaugurating a new assembly line specifically for SiC Surface Mount Technology (SMT) components. This move positions CDIL as India's pioneer in SiC component manufacturing. With this enhancement, CDIL can now produce a range of auto-grade devices, such as SiC Schottky Diodes, SiC MOSFETs, Zeners, Rectifiers, and TVS Diodes, catering to both global and domestic markets.
  • In April 2024, TDK Corporation introduced the B40910 series, a line of hybrid polymer capacitors designed to handle up to 4.6 A (at 100 kHz and +125 °C). These surface mount components boast impressively low ESR values of 17 mΩ and 22 mΩ at room temperature.
  • Notably, unlike standard electrolytic capacitors with liquid electrolytes, the ESR of TDK's capacitors shows minimal variation with temperature. These compact components, measuring 10 x 10.2 mm or 10 x 12.5 mm (D x H), feature a rated voltage of 63 V and offer capacitances ranging from 82 µF to 120 µF. Thus, SMT manufacturers drive the need for the technology by integrating and innovating technologies. These efforts contribute to the widespread adoption and growth of surface mount technology (SMT) in various industries.

Surface Mount Technology (SMT) Industry Overview

Surface Mount Technology market is highly fragmented due to the presence of both global players and small and medium-sized enterprises. Some of the major players in the market are Fuji Corporation, Yamaha Motor Co. Ltd, Mycronic AB, ASMPT, and Panasonic Corporation. Players in the market are adopting partnerships and acquisitions to enhance their product offerings and gain competitive advantage.

March 2024 - Nordson Corporation introduced a new Latin America Tech Center based in Queretaro, Mexico, to allow manufacturers in the region to get timely feedback on the best fluid dispensing equipment for their assembly fluid, parts, substrates, and production requirements. The lab has a 3D printer, scales, and other measurement equipment to determine the correct fluid dispensing equipment for each customer's unique application requirements.

January 2024 - Yamaha Motor Co. Ltd announced the launch of YRM10, a surface mounter with the title of being the fastest in its class regarding mounting performance. With an impressive speed of 52,000 CPH, it outshines its competitors in the 1-Beam/1-Head category. This device is compact and space-saving and offers a range of component compatibility and versatility, making it a next-generation solution for high-speed modular assembly.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Bargaining Power of Suppliers
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Threat of New Entrants
    • 4.3.4 Threat of Substitutes
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Impact of COVID-19 on the Surface Mount Technology Market

5 MARKET DYNAMICS

  • 5.1 Rising Demand For Miniaturization of Technology
    • 5.1.1 Fewer Holes Required to Drill on PCBs Compared to Other Technologies
  • 5.2 Market Challenges
    • 5.2.1 SMT is Unsuitable for Any Large, High-Power and High-Voltage Parts and Parts Undergoing Frequent Mechanical Stress
    • 5.2.2 High Initial Cost and Rework Issues

6 MARKET SEGMENTATION

  • 6.1 By Component
    • 6.1.1 Passive Components
      • 6.1.1.1 Resistors
      • 6.1.1.2 Capacitors
    • 6.1.2 Active Components
      • 6.1.2.1 Transistors
      • 6.1.2.2 Integrated Circuits
  • 6.2 By End-user Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Automotive
    • 6.2.3 Industrial Electronics
    • 6.2.4 Aerospace and Defense
    • 6.2.5 Healthcare
    • 6.2.6 Other End-user Industries
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia
    • 6.3.4 Australia and New Zealand
    • 6.3.5 Latin America
    • 6.3.6 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Fuji Corporation
    • 7.1.2 Yamaha Motor Co. Ltd
    • 7.1.3 Mycronic AB
    • 7.1.4 ASMPT
    • 7.1.5 Panasonic Corporation
    • 7.1.6 Nordson Corporation
    • 7.1.7 Juki Corporation
    • 7.1.8 Hanwa Precision Machinery Co. Ltd
    • 7.1.9 Zhejiang Neoden Technology Co. Ltd
    • 7.1.10 Europlacer Limited
    • 7.1.11 Viscom SE

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS