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市场调查报告书
商品编码
1624581

高性能铜箔：市场占有率分析、产业趋势/统计、成长预测（2025-2030）

High-end Copper Foil - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 100 Pages | 商品交期: 2-3个工作天内

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简介目录

高性能铜箔市场预计在预测期内复合年增长率将超过6%

高端铜箔-市场-IMG1

主要亮点

  • 电路基板应用占据市场主导地位，由于智慧型手机、个人电脑、平板电脑和其他医疗用电子设备产品等消费性电子产品的需求不断增长，预计在预测期内将出现适度增长。
  • 用于变压器和电网级能源储存的铜箔可能是一个机会。
  • 结晶石墨烯片作为铜箔替代品的开发预计将阻碍市场成长。
  • 亚太地区主导全球市场，最大的消费来自中国和印度等国家。

高性能铜箔市场趋势

电路基板需求增加

  • 大多数电子产品都使用印刷电路基板(PCB)。高品质的PCB製造技术使电子产品製造商能够生产更小、更复杂的产品。它掌握着当今充满活力且快速发展的电子创新的关键。
  • 用于製造印刷电路基板的基板是玻璃纤维增强环氧树脂层压板。环氧树脂的一侧或两侧粘合有铜箔。
  • 用于印刷基板的铜箔主要有两种类型：电解铜箔和轧延铜箔。这两种类型都有很多变体，其中电解铜箔提供了最多的选择。铜箔的特性对于高频电路至关重要。
  • 轧延铜箔广泛用于要求表面光滑的柔性电路基板。电解铜箔用于刚性和柔性电路。
  • 全球对智慧型手机、个人电脑、平板电脑和其他医疗用电子设备产品等消费性电子产品的需求正在迅速增长，印度和中国预计将继续保持市场成长的领先地位。印刷基板几乎用于所有电子产品，并可能在未来几年推动对高品质铜箔的需求。
  • 全球有2687家PCB工厂，中国占55%。自2020年以来，包括覆铜板在内的所有PCB材料价格均有所上涨，但PCB价格涨幅却没有那么快。因此，中国PCB产业正变得越来越无利可图。低利润的PCB产业可能会透过减少过剩产能而受益于停电。
  • 由于政府为 PCB 工厂提供巨大的奖励，超过 51% 的 PCB 是在中国製造的。中国也以极低的成本生产这些电路基板。结果，世界各地许多公司正在关闭其业务。
  • 过去十年英国有超过300家PCB工厂，但现在已不到35家。南非也同样受到原料和人事费用上涨的影响。
  • 根据IPC的数据，2022年11月来自北美的PCB出货量与去年同月相比成长了26.1%。 11月出货量较上月成长13.1%。
  • 所有上述因素都可能在未来几年推动高端铜市场的发展。

亚太地区主导市场

  • 由于中国和印度等国家生产活动的增加，亚太地区主导了全球市场占有率。
  • 超过50%的PCB是在中国製造的，部分原因是政府为PCB工厂提供了巨大的激励措施。
  • 印度储能联盟(IESA)表示，印度电动车市场将以36%的复合年增长率成长。据重工业部称，过去三年印度註册了 52 万辆电动车。电动车在 2021 年经历了强劲成长，部分得益于有利的政府立法和倡议。
  • 为了鼓励使用 e-2W，FAME-II 计划下的需求激励已从 10,000 印度卢比/千瓦时（122.60 美元/千瓦时）增加到 15,000 印度卢比/千瓦时（183.90 美元/千瓦时），上限为成本车辆的比例从20% 增加到近40%。此外，FAME-印度计画第二阶段已从 2022 年 3 月 31 日起再延长两年。这可能会推动预测期内研究市场的成长。
  • 目前，印度35%的PCB需求透过国内生产满足，其余65%依赖进口。印度目前生产人造 PCB 和裸 PCB。后者目前的市场规模约为12亿美元，其中30%产自印度。
  • 韩国PCB製造商拥有先进技术力，并有望受益高性能铜箔市场。这些厂商都获得了苹果的PCB订单。 TAESUNG 是苹果主要企业。
  • 根据KPCA（韩国印刷电路协会）统计，韩国占印刷基板市场的13%，位居全球第二，仅次于中国（49%）、台湾（12%）和日本（8%）。
  • 上述因素，加上政府的支持，导致预测期内该地区高性能铜箔消费需求增加。

高性能铜箔产业概况

高性能铜箔市场部分整合，五家主要企业占据了相当大的市场。主要企业包括（排名不分先后）三井金属矿业、古河电工、住友金属矿业、斗山公司、维兰德集团。

其他好处：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第一章简介

  • 调查先决条件
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场动态

  • 促进因素
    • 扩大印刷基板(PCB) 材料的应用
    • 交通和能源储存领域对锂离子电池的需求不断增加
  • 抑制因素
    • 开发结晶石墨烯片作为铜箔的替代品
  • 价值链分析
  • 波特五力分析
    • 供应商的议价能力
    • 消费者议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争程度

第五章市场区隔

  • 按类型
    • 轧延铜箔
    • 电解铜箔
  • 按用途
    • 电路基板
    • 电池
    • 太阳能和替代能源
    • 电器产品
    • 医疗用途
    • 其他用途
  • 按地区
    • 亚太地区
      • 中国
      • 印度
      • 日本
      • 韩国
      • 澳洲/纽西兰
      • 其他亚太地区
    • 北美洲
      • 美国
      • 加拿大
      • 墨西哥
    • 欧洲
      • 德国
      • 英国
      • 义大利
      • 法国
      • 俄罗斯
      • 其他欧洲国家
    • 南美洲
      • 巴西
      • 阿根廷
      • 南美洲其他地区
    • 中东/非洲
      • 沙乌地阿拉伯
      • 南非
      • 其他中东和非洲

第六章 竞争状况

  • 併购、合资、联盟、协议
  • 市场排名分析
  • 主要企业策略
  • 公司简介
    • Chang Chun Petrochemical Co. Ltd
    • Civen Metal Material（Shanghai）Co. Ltd
    • Doosan Corporation
    • Fukuda Metal Foil & Powder Co. Ltd
    • JX Nippon Mining & Metals Corporation
    • Mitsui Mining & Smelting Co. Ltd
    • Solus Advanced Materials
    • Sumitomo Metal Mining Co. Ltd
    • SH Copper Products Co. Ltd
    • The Furukawa Electric Co. Ltd
    • Targray Technology International Inc.
    • UACJ Foil Corporation
    • Wieland Group

第七章 市场机会及未来趋势

  • 变压器和电网级能源储存中的铜箔
简介目录
Product Code: 46374

The High-end Copper Foil Market is expected to register a CAGR of greater than 6% during the forecast period.

High-end Copper Foil - Market - IMG1

Key Highlights

  • Circuit board applications dominate the market and are expected to grow at a moderate rate during the forecast period, owing to the increasing demand for consumer gadgets like smartphones, PCs, tablets, and other medical electronics products.
  • Copper foils in transformer and grid-level energy storage are likely an opportunity.
  • The development of single-crystal graphene sheets as a substitute for copper foil is expected to hinder the market's growth.
  • Asia-Pacific dominated the market across the world, with the most significant consumption from countries such as China and India.

High-End Copper Foil Market Trends

Increasing Demand for Circuit Boards

  • Most of the electronics products manufactured contain printed circuit boards (PCBs). High-quality PCB manufacturing technology allowed electronics product manufacturers to produce smaller, more complex products. It is the key to today's dynamic and rapidly progressing electronic innovations.
  • The substrate used to manufacture printed circuit boards is fiberglass-reinforced epoxy laminate. Epoxy resin includes a copper foil bonded to one or both sides.
  • Two main types of copper foil are used in PCBs: electrodeposited and rolled copper foil. Both these types have many possible variations, with the most choices available for ED copper. Copper foil characteristics are essential for high-frequency circuits.
  • Rolled copper foil is used extensively for flexible circuit boards where a smooth surface is preferred. Electrodeposited copper foils are used in rigid, flexible circuits.
  • The demand for consumer gadgets, such as smartphones, PCs, tablets, and other medical electronics products, is rapidly increasing globally, with India and China expected to remain at the top of market growth. As printed circuit boards are deployed in almost all electronics products, it will likely drive the demand for high-quality copper foil in the coming years.
  • There are 2687 PCB plants worldwide, with China having 55%. Since 2020, the prices of all PCB materials, including copper-clad laminates, have been growing, while PCB prices have increased less sharply. It made the PCB sector in China increasingly unprofitable. The low-profit PCB sector may benefit from power cutbacks by reducing the surplus capacity.
  • Over 51% of the PCBs are manufactured in China, owing to the offering of huge incentives by the government to the PCB factories. China is also producing these circuit boards at a meager cost. As a result, many companies across the world are closing their operations.
  • The United Kingdom used to have over 300 PCB factories over the last decade, but it is now reduced to less than 35. South Africa is also experiencing the same effects due to increased raw materials and labor costs.
  • According to IPC, PCB shipments from North America increased by 26.1% while comparing November 2022 to the same month in the previous year. Shipments in November increased by 13.1% over the last month.
  • All the above factors are expected to drive the market for high-end copper in the coming years.

Asia-Pacific Region to Dominate the Market

  • The Asia-Pacific region dominated the global market share due to the increasing production activities in countries, including China and India.
  • More than 50% of PCBs are manufactured in China, owing to the huge incentives offered by the government to PCB factories.
  • According to the India Energy Storage Alliance (IESA), the Indian EV market would grow at a CAGR of 36%. According to the Ministry of Heavy Industries, 0.52 million EVs have been registered in India during the previous three years. EVs had strong growth in 2021, aided by the government's adoption of beneficial laws and initiatives.
  • For encouraging e-2W use, the demand incentive raised under the FAME-II scheme from INR 10,000/KWh (USD 122.60/KWh) to INR 15,000/KWh (183.90/KWh), with a cap rise from 20% to almost 40% of vehicle cost. Additionally, the FAME-India Scheme's Phase II was extended for an additional two years beginning on March 31, 2022. It would, in turn, promote the growth of the studied market during the forecast period.
  • Currently, 35% of India's PCB need is met by domestic production while being dependent on imports for the remaining 65%. India presently produces both populated and bare PCBs. The current market size for the latter is around US$ 1.2 billion, with 30% of that market's production occurring in India.
  • The PCB manufacturers in South Korea have advanced technical skills, which will likely benefit the high-end copper foil market. These manufacturers have won orders for PCB from Apple. TAESUNG is the leading company dealing with PCB for Apple manufacturing.
  • According to KPCA (Korean Printed Circuits Association), South Korea occupies 13% of the PCB market, which is the second largest in the world behind China (49%), followed by Taiwan (12%) and Japan (8%).
  • The factors above, coupled with government support, contribute to the increasing demand for high-end copper foil consumption in the region during the forecast period.

High-End Copper Foil Industry Overview

The high-end copper foil market is partially consolidated, with the top five players accounting for a considerable chunk of the market. The major companies include (not in any particular order) Mitsui Mining & Smelting Co. Ltd, Furukawa Electric Co. Ltd, Sumitomo Metal Mining Co. Ltd, Doosan Corporation, and Wieland Group, among others.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Drivers
    • 4.1.1 Growing Application as a Printed Circuit Board (PCB) Material
    • 4.1.2 Increasing Demand for Lithium Ion Batteries From Transportation and Energy Storage Sector
  • 4.2 Restraints
    • 4.2.1 Development of Single Crystal Graphene Sheet as a Substitute for Copper Foil
  • 4.3 Industry Value Chain Analysis
  • 4.4 Porter's Five Forces Analysis
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products and Services
    • 4.4.5 Degree of Competition

5 MARKET SEGMENTATION (Market Size in Value)

  • 5.1 Type
    • 5.1.1 Rolled Copper Foil
    • 5.1.2 Electrodeposited (ED) Copper Foil
  • 5.2 Application
    • 5.2.1 Circuit Boards
    • 5.2.2 Batteries
    • 5.2.3 Solar and Alternative Energy
    • 5.2.4 Appliances
    • 5.2.5 Medical
    • 5.2.6 Other Applications
  • 5.3 Geography
    • 5.3.1 Asia-Pacific
      • 5.3.1.1 China
      • 5.3.1.2 India
      • 5.3.1.3 Japan
      • 5.3.1.4 South Korea
      • 5.3.1.5 Australia & New Zealand
      • 5.3.1.6 Rest of Asia-Pacific
    • 5.3.2 North America
      • 5.3.2.1 United States
      • 5.3.2.2 Canada
      • 5.3.2.3 Mexico
    • 5.3.3 Europe
      • 5.3.3.1 Germany
      • 5.3.3.2 United Kingdom
      • 5.3.3.3 Italy
      • 5.3.3.4 France
      • 5.3.3.5 Russia
      • 5.3.3.6 Rest of Europe
    • 5.3.4 South America
      • 5.3.4.1 Brazil
      • 5.3.4.2 Argentina
      • 5.3.4.3 Rest of South America
    • 5.3.5 Middle-East and Africa
      • 5.3.5.1 Saudi Arabia
      • 5.3.5.2 South Africa
      • 5.3.5.3 Rest of Middle-East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
  • 6.2 Market Ranking Analysis
  • 6.3 Strategies Adopted by Leading Players
  • 6.4 Company Profiles
    • 6.4.1 Chang Chun Petrochemical Co. Ltd
    • 6.4.2 Civen Metal Material(Shanghai) Co. Ltd
    • 6.4.3 Doosan Corporation
    • 6.4.4 Fukuda Metal Foil & Powder Co. Ltd
    • 6.4.5 JX Nippon Mining & Metals Corporation
    • 6.4.6 Mitsui Mining & Smelting Co. Ltd
    • 6.4.7 Solus Advanced Materials
    • 6.4.8 Sumitomo Metal Mining Co. Ltd
    • 6.4.9 SH Copper Products Co. Ltd
    • 6.4.10 The Furukawa Electric Co. Ltd
    • 6.4.11 Targray Technology International Inc.
    • 6.4.12 UACJ Foil Corporation
    • 6.4.13 Wieland Group

7 MARKET OPPORTUNITIES AND FUTURE TRENDS

  • 7.1 Copper Foils In Transformer and Grid-level Energy Storage