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市场调查报告书
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1643138

光连接模组：市场占有率分析、产业趋势与统计、成长预测（2025-2030 年）

Optical Interconnect - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

光连接模组市场规模预计在 2025 年为 193.9 亿美元，预计到 2030 年将达到 359.7 亿美元，预测期内（2025-2030 年）的复合年增长率为 13.15%。

光互连市场-IMG1

由于 COVID-19 对各个行业都产生了负面影响，3M 等公司目前正在生产医疗产品，以帮助全球各相关人员应对 COVID-19。 3M 已在美国、亚洲和欧洲等全球各地的生产基地将 N95 口罩产量翻了一番，达到每年 11 亿隻。这导致光连接模组电缆产量下降。

然而，随着在家工作已成为绝对必要，新汉（台湾）等市场参与者计划帮助全球通讯供应商和资料中心虚拟和扩展容量。为了满足更快网路的需求，NC 220FMS3 模组提供了一个 PCIe3.0 x16 介面和两个 QSFP28 端口，每个端口支援 100Gb/s 乙太网路连接。此模组提供高速连接，无封包遗失。 100G 光收发器（传输 100Gb/s 乙太网路）、其外形类型和标准正在开发中，成本和功耗被视为互连市场发展的主要驱动力，从而有可能推动对光互连的需求。

主要亮点

  • 此外，直接调变的VCSEL阵列、平行光纤带和侦测器阵列正在被广泛应用来解决光学背板的容量问题。展望未来，光连接模组的新趋势预计将包含更强大的功能，包括光域中的交叉连接交换器和资料封包路由。
  • 预计通讯频宽需求的增加将推动市场的发展。各种通讯类型中大量新服务和加值营业单位的出现对频宽的需求不断增加。光连接模组相比电互连可以提供更大的频宽，在运算效能方面具有显着优势。
  • 未来十年，跨晶片通讯预计所需能量将低于0.5 pJ b1，而晶片外和其他通讯技术所需通讯将低于0.1 pJ b1。透过利用廉价行动资料的能力，预计未来多核心处理器系统的功耗和总成本将随着频宽的增加而降低。
  • 自 2020 年初以来，Ciena、Infinera、华为和诺基亚等供应商一直在突破现代光学技术的极限。华为 CloudFabric EVN 第 2 层 DCI 解决方案提供高度扩充性且高效的第 2 层互连，可在 IP WAN 上扩展到多达 32 个资料中心。与华为类似，Ciena 和 Infinera 等竞争供应商也致力于开发支援 800G 的相干解决方案，为下一代光学 DCI 平台动力来源。
  • 截至 2020 年第二季度，数百万人已转为在家工作，视讯消费量（占全球资料流量的 60%）达到了历史最高水准。关键服务受到影响，Wi-Fi网路基地台面临拥塞，FWA 受到限制，并且互连点紧张。
  • 这种状况也蔓延到了云端处理活动中，工业和企业领域的投资也大幅增加。所有这些因素，加上为扩展资料中心功能而采用的技术，导致了资料中心市场的蓬勃发展。预计这些趋势将进一步刺激该市场的成长。

光连接模组市场趋势

资料通讯通讯预计将刺激光连接模组的需求

  • 光互连的主要应用之一是资料通讯网络，例如资料中心网路、无线接取网路和有线接取网路。目前的资料中心网路是基于电子分封交换，由于云端运算的发展，网路流量正在迅速增加。光连接模组已成为一种很有前途的替代方案，具有高吞吐量、低延迟和低功耗的特性。
  • 据 IEEE Communications 称，全光纤网路可使资料中心节省高达 75% 的能源。在大型资料中心，尤其是企业使用的资料中心，使用节能、高频宽、低延迟的互连至关重要，并且人们对在这样的资料中心部署光互连非常感兴趣。
  • 目前，资料中心所采用的光纤技术仅限于点对点链路，与传统通讯网路（不透明网路）所使用的点对点光纤链路相同。然而，光开关互连仍处于研究阶段。

北美市场正在经历高速成长

  • 互联网的快速普及预计将推动该地区的市场成长。此外，根据Cisco的数据，预计 2021 年北美的云端流量将达到每年约 6,844 Exabyte，是其他任何地区中最高的。根据 2020 年 11 月版爱立信移动报告，预计到 2020年终北美约有 4% 的行动用户将支援 5G。因此，这种趋势将为市场创造空间，因为需要强大的互连来使手机讯号塔和其他应用能够适应 5G 传输。
  • 北美也有各种各样的参与者提供光连接模组产品和解决方案，其中一些参与者也热衷于创新新的解决方案，以大约低 10 倍的功率来提高互连频宽密度。例如，2020年3月，Ayar Labs宣布已获得洛克希德马丁创投公司的策略投资。这些资金将用于加速 Ayar Labs取得专利的的单片封装光学 I/O (MIPO) 解决方案的商业化，用于需要高频宽、低延迟和节能短距离互连的应用。
  • 此外，资料中心内的资料移动正成为一项关键功能，越来越多的新业务公司利用美国和加拿大的资料中心服务，这将推动更多的 M2M（机器对机器）流量。 IBM 专注于向资料中心提供光开关作为解决此问题的关键解决方案。 IBM 正致力于利用硅光子技术建构可重构光开关。一旦实现，该光学解决方案将会引领光连接模组市场的新潮流。
  • 2020 年 6 月，全球互连和资料中心公司 Equinix 宣布已同意以 7.5 亿美元全现金交易的方式从 BCE Inc. 手中收购遍布加拿大的 13 个资料中心组合。这 13 个资料中心（代表 25 个贝尔资料中心）预计年收益约 1.05 亿美元。

光互连行业概况

光互连市场是一个分散的市场，其特点是存在几家主要供应商和其他领先供应商。随着新的创新和收购，主要供应商越来越注重开发光连接模组并提高人们对其优势的认识。此外，全球供应商正在寻求透过策略联盟和投资来稳定市场。主要参与者包括 3M 和工业。

  • 2020年12月，康宁公司投资4.5亿美元扩建位于北卡罗来纳州康科德市卡巴勒斯县的光纤电缆工厂，创造475个新工作岗位，使其成为全球规模最大的光纤电缆工厂。
  • 2020 年 11 月：基于 Optical Network Principals 架构生产晶片解决方案的 Ayar Labs 在 B 轮融资中筹集了 3,500 万美元。根据该公司执行长介绍，这笔资金筹措将用于继续开发产品并致力于进一步商业化。该公司技术的主要应用是下一代运算，包括航太和政府应用、人工智慧和高效能运算、通讯和云端应用，以及自动驾驶汽车和其他自主系统的雷射雷达，以及大量资料传输的任何地方。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场动态

  • 市场概况
  • 市场驱动因素
    • 云端运算、人工智慧和 HPC 需求推动通讯频宽需求增加
    • 增加对资料中心互连和光纤通讯的投资
  • 市场限制
    • 光互连相关技术商业化延迟
  • 产业价值链分析
  • 产业吸引力-波特五力分析
    • 新进入者的威胁
    • 购买者/消费者的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争对手之间的竞争强度
  • COVID-19 市场影响评估

第五章 市场区隔

  • 按类型
    • 光收发器
    • 主动光缆 (AOC)
    • 嵌入式光学模组(EOM)
  • 按应用
    • 电讯
    • 资料通讯
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 德国
      • 英国
      • 法国
      • 其他欧洲国家
    • 亚太地区
      • 印度
      • 中国
      • 日本
      • 其他亚太地区
    • 拉丁美洲
    • 中东和非洲

第六章 竞争格局

  • 公司简介
    • 3M Company
    • Sumitomo Electric Industries Ltd
    • Molex LLC
    • Amphenol Corporation
    • TE Connectivity Ltd.
    • Go!Foton Inc.
    • II-VI Incorporated
    • Corning Incorporated
    • Cisco Systems Inc.
    • Huawei Technologies Co. Ltd

第七章投资分析

第八章 市场机会与未来趋势

简介目录
Product Code: 69940

The Optical Interconnect Market size is estimated at USD 19.39 billion in 2025, and is expected to reach USD 35.97 billion by 2030, at a CAGR of 13.15% during the forecast period (2025-2030).

Optical Interconnect - Market - IMG1

Due to the adverse effects of COVID 19 across industries, players such as 3M are currently manufacturing medical products to assist various stakeholders globally, to combat Covid-19. 3M has doubled production of N95 respirators to 1.1 billion per year at its global manufacturing facilities, including in the U.S., Asia, and Europe. This has led to reduced manufacturing for optical interconnect cables.

However, as the ability to work from home has become an absolute necessity, market players such as Nexcom (Taiwan) plans to help telecom providers and data centers across the world to virtualize and expand capacity. For meeting current network demands for faster speeds, the NC 220FMS3 module provides a PCIe3.0 x16 interface and two QSFP28 ports, each supporting 100Gb/s Ethernet connectivity. The module provides high-speed connectivity without any packet loss. The 100 G optical transceivers (providing 100Gb/s ethernet), their form factor type, and standard are developed according to the cost and power consumption, which are regarded as the main drive in the development for interconnect market, which potentially drives the demand of optical interconnect.

Key Highlights

  • Moreover, directly modulated VCSEL arrays, parallel fiber ribbons, along with detector arrays, are highly being applied to optical backplane capacity issues. In the future, additional higher functionality is highly expected as an emerging trend for optical interconnects, which includes features such as cross-connect switches and data packet routing in the optical domain.
  • The increasing demand for communication bandwidth is expected to drive the market. Due to the emergence of a large number of new services in different types of communications and their value-added entities, the demand for bandwidth has gone up more than ever before. Optical interconnect drive it possible in providing more bandwidth and bring great advantage to computing performance, compared to electrical interconnects.
  • With optics, over the next decade, it is believed that the energy-requiring for cross-chip communication would approach less than 0.5 pJ b1 and to 0.1 pJ b1 for communication, such as off-chip communication technology. By utilizing the ability to move data affordably, both the power consumption and the total cost for such future multicore processor systems are expected to be reduced with improving bandwidth.
  • Since the beginning of 2020, vendors, like Ciena, Infinera, Huawei, and Nokia, have been pushing the limits of modern optics. Huawei CloudFabric EVN Layer 2 DCI solution provides highly permits scalable, efficient layer 2 interconnection that allows expansion of up to 32 data centers across IP WANs. Like Huawei, competing vendors, like Ciena or Infinera, are also working on their 800G-capable coherent solutions, which may power next-generation optical DCI platforms.
  • By the second quarter of 2020, millions of people switched to work from home, and video consumption (which amounts to 60% of the global data traffic) was at an all-time high. Critical services were being impacted, and Wi-Fi access points were facing congestion; FWA witnessed limitations, and interconnect points were burdened.
  • These scenarios also surge the cloud computing activities, along with significantly increasing investments from the industrial and enterprises segment. All these factors made a massive boom in the data center market along with technologies incorporated to expand the capabilities of data centers. Such trends are expected to further stimulate the growth of the market studied.

Optical Interconnect Market Trends

Data Communication is Expected to Spur the Demand for Optical Interconnects

  • One of the major applications of optical interconnectivity is within data communication networks which include datacenter networks, wireless access networks, and wired access networks. Current data center networks, which are based on electronic packet switches, experiences an exponential increase in network traffic due to cloud computing development. Optical interconnects emerged as a promising alternative that offers high throughput, low latency, and reduced power consumption.
  • According to IEEE Communications, all-optical networks could provide up to 75% energy savings in the data centers. Especially in large data centers used in enterprises, the use of power efficient, high bandwidth, and low latency interconnects is of paramount importance, and there is significant interest in the deployment of optical interconnects in these data centers.
  • Currently, optical technology is utilized in data centers is only for point-to-point links, which is in the same way as point-to-point optical links that were used in older telecommunication networks (opaque networks). However, optically switched interconnects are still in the research phase.

North America To Witness High Market Growth

  • The rapid penetration of the internet is expected to raise the growth of the market in this region. Moreover, according to Cisco Systems, the cloud traffic in 2021 is estimated to be around 6844 exabytes per year in North America, which is highest in comparison to other regions. According to the November 2020 edition of the Ericsson Mobility Report, North America was expected to end 2020 with about 4% of its mobile subscriptions being 5G. Hence, such trends create scope for the market, as a powerful interconnect is required to enable cell towers and other applications to handle 5G transmissions.
  • Also, North America has various players that provide optical interconnect products and solutions, along with players who are also keen to innovate new solutions for the improvement in interconnect bandwidth density at around 10x lower power. For instance, in March 2020, Ayar Labs announced that it had received a strategic investment from Lockheed Martin Ventures, where the funds will be used to accelerate the commercialization of Ayar Labs' patented monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency, and power-efficient short-reach interconnects.
  • Moreover, data movement within the data center is becoming a critical feature, and the rise in the ample of new businesses leveraging data center services in the United States, and Canada will leverage more machine-to-machine (M2M) traffic. To overcome this problem, IBM focuses on providing optical switches in the data center as a key to resolve the problem. IBM is undertaking to build reconfigurable optical switches using silicon-photonic technology. If implemented, this optical solution becomes a new trend in the optical interconnect market.
  • In June 2020, Equinix Inc., the global interconnection and data center company, announced its agreement to purchase a portfolio of 13 data centers across Canada from BCE Inc for USD 750 million in an all-cash transaction. The 13 data center sites representing 25 Bell data center facilities are likely to generate approximately USD 105 million annualized revenue.

Optical Interconnect Industry Overview

The Optical Interconnect Market is fragmented in nature and is characterized by the presence of several key vendors and other prominent vendors. The key vendors are increasingly focusing on creating awareness about the optical Interconnect development courses and their benefits, along with new innovation and acquisitions. Further, global vendors are trying to stabilize themselves in the market, through strategic collaborations and investements. Key players are 3M, Sumitomo Electric Industries, etc.

  • December 2020 - Corning Inc. spent USD 450 million to expand its Cabarrus County fiber optic cable plant in Concord, N.C., generating 475 new jobs and making it the largest such facility in the world.
  • November 2020 - Ayar Labs, which makes chip solutions based on optical networking principal's architecture raised USD 35 million in a Series B round of funding. According to the company's CEO, the funding will be used to continue developing its product and working on further commercialization. The main application area for the company's technology is next-generation computing, anywhere that there is a massive movement of data, including aerospace and government applications, artificial intelligence and high-performance computing, telecoms and cloud applications, and lidar for self-driving car and other autonomous systems.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Increasing Demand for Communication Bandwidth Owing to Demand for Cloud Computing, AI, and HPC
    • 4.2.2 Increasing Investment in Data Centers Interconnect and Fiber Optic Communication
  • 4.3 Market Restraints
    • 4.3.1 Slow Commercialization of Optical Interconnection Related Technologies
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of Impact of Covid-19 on the Market

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Optical Transceivers
    • 5.1.2 Active Optical Cables (AOCs)
    • 5.1.3 Embedded Optical Modules (EOMs)
  • 5.2 Application
    • 5.2.1 Telecommunication
    • 5.2.2 Data Communication
  • 5.3 Geography
    • 5.3.1 North America
      • 5.3.1.1 United States
      • 5.3.1.2 Canada
    • 5.3.2 Europe
      • 5.3.2.1 Germany
      • 5.3.2.2 United Kingdom
      • 5.3.2.3 France
      • 5.3.2.4 Rest of Europe
    • 5.3.3 Asia Pacific
      • 5.3.3.1 India
      • 5.3.3.2 China
      • 5.3.3.3 Japan
      • 5.3.3.4 Rest of Asia Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 3M Company
    • 6.1.2 Sumitomo Electric Industries Ltd
    • 6.1.3 Molex LLC
    • 6.1.4 Amphenol Corporation
    • 6.1.5 TE Connectivity Ltd.
    • 6.1.6 Go!Foton Inc.
    • 6.1.7 II-VI Incorporated
    • 6.1.8 Corning Incorporated
    • 6.1.9 Cisco Systems Inc.
    • 6.1.10 Huawei Technologies Co. Ltd

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS