查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1687269

类比和混合讯号 IP：市场占有率分析、行业趋势和统计、成长预测（2025-2030 年）

Analog and Mixed Signal IP - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

模拟和混合讯号 IP 市场规模估计并预测在 2025 年将达到 2.2322 亿美元，预计到 2030 年将达到 4.5231 亿美元，在预测期内（2025-2030 年）的复合年增长率为 15.17%。

类比和混合讯号 IP-市场-IMG1

2020年初半导体市场的低迷，很大程度是由于新冠疫情对整个产业的影响。由于COVID-19在全球蔓延而实施的封锁不仅影响了设备的製造，也抑制了消费者需求。

美国消费科技协会数据显示，2020年美国消费性电子产业成长率下降2.2%，这是美国电子产业数年来首次出现成长率下滑。

主要亮点

  • 在过去的十年中，积体电路变得越来越复杂和昂贵。该产业已经开始采用新的设计和重用方法，统称为晶片系统(SoC)、封装系统 (SiP) 和板载系统 (SoB) 设计。随着向小型化的转变，采用此类解决方案的公司开始面临这种模式转移带来的重复使用和整合问题的挑战。为了解决这些问题，IP 阻止已成为工业终端用户最有希望的解决方案。
  • 在过去的十年中，积体电路变得越来越复杂和昂贵。该产业已经开始采用新的设计和重用方法，统称为晶片系统(SoC)、封装系统 (SiP) 和板载系统 (SoB) 设计。
  • 随着向小型化的转变，采用此类解决方案的公司开始面临这种模式转移带来的重复使用和整合挑战。为了解决这些问题，IP 阻止已成为工业终端用户最有希望的解决方案。
  • 可重复使用元件（也称为智慧财产权 (IP) 区块或 IP 核心）通常是可综合的暂存器传输级 (RTL) 设计（称为软性核心）或布局级设计（称为硬核心）。重用的概念可以在模组、平台和晶片层级实现，并要求IP具有足够的通用性、可配置性或可编程性，以便用于广泛的应用。

类比和混合讯号 IP 市场趋势

通讯预计将占很大份额

  • 通讯基础设施是推动市场发展的关键因素之一，这主要归因于4G和部分5G网路的出现。无线基础设施製造商，尤其是 4G 和 5G 网路製造商，正在不断减少新无线基础设施安装的规模和成本，同时保持高标准的效能、功能和服务品质。
  • 5G基础设施有望彻底改变宽频服务频谱并增强多个终端用户的垂直连接。据GSMA称，新的5G网路部署路线图将使城市覆盖率达到45%左右。中国、印度等国家也计划在2020年推出5G网络，而5G网络的发展需要对5G基础设施进行大量的资本投入。
  • 英特尔等主要参与者于 2019 年 1 月宣布推出专为下一代行动基地台设计的新型晶片系统(SoC)。同样，覆铜板 (CCL) 专家 Iteq 也期待来自中国的 5G 基础设施订单。中国政府正大力投资5G服务的开发与部署，华为等本土公司也积极参与。
  • 有线和无线广播和宽频通讯设备领先製造商 Jinwell 已将 MaxLinear 的 AirPHY 多Gigabit调变解调器技术和 jjPlus 最新的整合式类比混合讯号 IP 的 65W 磁谐振无线电源模组整合到其第三代 ZRA-003 设备中，能够透过传输达 20 公分的电力结构和资料。该解决方案预计将推动对类比和混合讯号 IP 整合的需求，以实现Gigabit速度的 4G/LTE 或 5G mmWave 无线宽频服务。

预计北美将占据最大市场占有率

  • 对类比/数位混合讯号 IP 的需求源于其作为这些产品的建构模组的日益广泛的应用。美国通讯业正在积极投资5G基础设施。该国的终端用户产业占全球5G技术消费的很大一部分。在北美，美国在投资、部署和应用方面占据区域5G市场的主导地位。
  • 5G无线网路的超高速特性预计将为电讯业放缓的成长提供急需的初步提振。美国电讯协会估计，到2025年，美国通讯业者将花费约1,040亿美元。预计通讯服务供应商将其现有的4G网路升级到即将到来的5G标准将成为当务之急，从而全面推出5G无线服务。
  • 2019 年 10 月，Analog 宣布推出 Analog Game Boy Pocket，这是復古游戏装置的现代版本。该公司推出的关键组件是第二个 FPGA（与用于影像处理的 FPGA 分开，用于在显示器上提供更高解析度的影像，其解析度是原始 Game Boy 的 10 倍）。第二块 FPGA 将使復古游戏社群能够建立和移植核心以在 Pocket 上运行其他游戏，类似于 MiSTER FPGA 设备的工作方式。
  • 预计加拿大将全额支出并资助其军事计划（包括服饰）。加拿大政府正专注于综合士兵系统计划，该项目将士兵的服装与电子设备、武器以及士兵在战场上移动时的通讯整合在一起。预计这将对该地区的市场成长产生积极影响。

类比和混合讯号 IP 产业概览

由于全球参与者致力于将讯号整合到消费性电子、汽车等各种应用中，类比和混合讯号 IP 市场高度分散，导致竞争对手之间的竞争非常激烈。主要参与者有Cadence设计系统公司、台湾半导体製造股份有限公司、格芯晶圆代工厂、三星电子等。

  • 2020 年 5 月－新思科技 (Synopsys, Inc.) 宣布推出采用台积电 5nm 製程技术的高效能运算系统晶片(SoC) 高品质 IP 组合。台积电製程上的DesignWare IP产品组合，包括最广泛使用的高速通讯协定的介面和基础IP，可加速高阶云端处理、AI加速器、网路和储存应用的SoC开发。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场动态

  • 市场概况
  • 产业价值链分析
  • 产业吸引力－波特五力分析
    • 新进入者的威胁
    • 购买者/消费者的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争对手之间的竞争强度
  • 市场驱动因素
    • 提高 AMS 区块的再生性
    • 无线通讯的兴起
  • 市场限制
    • 类比/混合讯号 (AMS) 设计的复杂性和敏感性
  • 评估新冠肺炎对产业的影响

第五章 市场区隔

  • 设计
    • 公司/软知识产权
    • 硬核IP
  • 产品
    • A2D 和 D2A 转换器
    • 电源管理模组
    • RF
    • 其他产品
  • 最终用户产业
    • 消费性电子产品
    • 通讯业
    • 车
    • 工业
    • 其他最终用户产业
  • 地区
    • 北美洲
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 中东和非洲

第六章 竞争格局

  • 公司简介
    • Cadence Design Systems Inc.
    • Silicon Creations LLC
    • VeriSilicon Holdings Co. Ltd
    • Renesas Electronics Corporation
    • Synopsys Inc.
    • ARM Holdings PLC
    • Xilinx Inc.
    • Intel Corporation
    • Analog Devices Inc.
    • Maxim Integrated Products Inc.
    • Texas Instruments Limited

第七章投资分析

第 8 章：市场的未来

简介目录
Product Code: 58979

The Analog and Mixed Signal IP Market size is estimated at USD 223.22 million in 2025, and is expected to reach USD 452.31 million by 2030, at a CAGR of 15.17% during the forecast period (2025-2030).

Analog and Mixed Signal IP - Market - IMG1

The semiconductor market's downturn at the start of 2020 is significantly owing to the COVID-19 pandemic's impact on the entire industry. The lockdowns that have been enforced by the spread of COVID-19 across the world have not only affected the manufacturing of devices but also reduced consumer's demand.

According to the Consumer Technology Association, the growth rate of the consumer electronics industry in the United States fell by 2.2% in 2020, which was the first decrease in the growth rate in the consumer electronics landscape of the United States after several years.

Key Highlights

  • Over the past decade, the integrated circuits have become increasingly complex and expensive. The industry started to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC), System-in-Package (SiP), and System-on-Board (SoB) design. With this shift toward miniaturization, the companies incorporating such solutions started facing the challenges for the re-usage and integration issues encountered in this paradigm shift. To solve such problems, IP blocks emerged as the most prominent solution for the industry end-users.
  • Over the past decade, integrated circuits have become increasingly complex and expensive. The industry started to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC), System-in-Package (SiP), and System-on-Board (SoB) design.
  • With this shift toward miniaturization, the companies incorporating such solutions started facing the challenges for the reusage and integration issues encountered in this paradigm shift. To solve such issues, IP blocks emerged as the most prominent solution for the industry end-users.
  • The reusable components, also called intellectual property (IP) blocks or IP cores are typically synthesizable register-transfer level (RTL) designs referred to as soft cores or layout level designs, referred to as hard cores. The concept of reusage can be carried out at the block, platform, or chip levels and involves making the IP sufficiently general, configurable, or programmable for use in a wide range of applications.

Analog & Mixed Signal IP Market Trends

Telecommunication is Expected Hold a Significant Share

  • Telecommunication infrastructure is one of the key factors driving the market, primarily owing to the advent of the 4G network and some parts of the 5G network. Manufacturers of wireless infrastructure, especially 4G and 5G networks, are continuously reducing the size and cost of their newly installed wireless infrastructure while holding towards the high standards of performance, functionality, and quality of service.
  • 5G Infrastructure is expected to revolutionize the domain of various broadband services and is expected to empower connectivity across multiple end-user verticals. According to GSMA, around 45% urban coverage level has been achieved for 5G networks in the new deployment trails. Countries like China and India are also planning to implement the 5G network by 2020, and the development of 5G networks requires large amounts of capital investment in 5G capable infrastructure.
  • Significant players like Intel have announced a new system on chip (SoC) designed specifically for next-generation mobile base stations in Jan 2019. Similarly, Copper-clad laminate (CCL) specialist Iteq expects orders for 5G infrastructure to pull in from China. The country is investing significantly in the development and deployment of 5G services with the government and local players like Huawei actively taking part
  • Zinwell, a leading manufacturer of wired and wireless broadcast and broadband communication equipment has integrated MaxLinear's AirPHY multi-gigabit modem technology with jjPlus's latest 65W magnetic resonant wireless power module integrated with analog mixed-signal IP into its 3rd generation ZRA-003 device, which can transfer power and gigabit data through glass windows or structural walls up to 20cm thick. The solution will enhance the demand of the analog mixed-signal IP integration as the solution will enable 4G/LTE or 5G millimeter wave wireless broadband service with gigabit speeds.

North America is Expected to Hold the Largest Market Share

  • The demand for the analog and digital mixed-signal IP is driven by the growing utilization of these products as building blocks. The telecommunication sector in the US has been actively investing in 5G infrastructure. The end-user industry in the country accounts for the significant portion of the global consumption of 5G technology. In the North American region, the US dominates the regional 5G market, regarding investment, adoption, and applications.
  • The nature of the 5G superfast wireless networks is expected to provide the needed primary impetus to the telecom industry, which has been experiencing slow growth. The US Telecom Association has estimated that the US telecom operators are expected to spend around USD 104 billion by 2025. It is expected to be essential for the telecom service providers to upgrade existing 4G networks to the upcoming 5G standards and, consequently, execute the full installation of 5G wireless services.
  • In October 2019, Analogue announced the launch of its Analogue Game Boy Pocket, which is a modern version of the retro-gaming device. The critical component the company has introduced is the second FPGA (apart from one for image processing to deliver high-resolution image on its 10X high-resolution display compared to the original Game Boy). This second FPGA enables the retro-gaming community to build and port their cores to run other games on the Pocket, similar to how the MiSTER FPGA device works.
  • Canada is expected to provide sufficient expenditure and funding for its military programs (including clothing). The Canadian government has been focusing on the Integrated Soldier System Project, which is assimilating the soldier suit with electronic devices, weapons, and feed communication among soldiers as they move through the battlefield. This is expected to impact the market's growth positively in the region.

Analog & Mixed Signal IP Industry Overview

The analog and mixed signal IP is quite fragmented as the global players are engaged in integrating the signal in various applications like consumer electronics, automotive, etc., which gives an intense rivalry among the competitors. Key players are Cadence Design Systems Inc., Taiwan Semiconductor Manufacturing Company Limited, Global foundries Inc., and Samsung Electronics Co. Ltd.

  • May 2020 - Synopsys, Inc. announced the broadest portfolio of high-quality IP on TSMC's 5nm process technology for high-performance computing system-on-chips (SoCs). The DesignWare IP portfolio on the TSMC process, encompassing interface IP for the most widely used high-speed protocols and foundation IP, accelerates the development of SoCs for high-end cloud computing, AI accelerators, networking, and storage applications.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Force Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Market Drivers
    • 4.4.1 Increasing Reusability of AMS Block
    • 4.4.2 Growing Prevalence of Wireless Communications
  • 4.5 Market Restraints
    • 4.5.1 Complexity and Sensitivity of Analog/Mixed-Signal (AMS) design
  • 4.6 An Assessment of the Impact of COVID-19 on the Industry

5 MARKET SEGMENTATION

  • 5.1 Design
    • 5.1.1 Firm/Soft IP
    • 5.1.2 Hard IP
  • 5.2 Product
    • 5.2.1 A2D and D2A Converter
    • 5.2.2 Power Management Modules
    • 5.2.3 RF
    • 5.2.4 Other Products
  • 5.3 End-user Industry
    • 5.3.1 Consumer Electronics
    • 5.3.2 Telecommunication
    • 5.3.3 Automotive
    • 5.3.4 Industrial
    • 5.3.5 Other End-user Industries
  • 5.4 Geography
    • 5.4.1 North America
    • 5.4.2 Europe
    • 5.4.3 Asia Pacific
    • 5.4.4 Latin America
    • 5.4.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Cadence Design Systems Inc.
    • 6.1.2 Silicon Creations LLC
    • 6.1.3 VeriSilicon Holdings Co. Ltd
    • 6.1.4 Renesas Electronics Corporation
    • 6.1.5 Synopsys Inc.
    • 6.1.6 ARM Holdings PLC
    • 6.1.7 Xilinx Inc.
    • 6.1.8 Intel Corporation
    • 6.1.9 Analog Devices Inc.
    • 6.1.10 Maxim Integrated Products Inc.
    • 6.1.11 Texas Instruments Limited

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET